TS-BSC-HW-0211-I2.pdf

8/11/2019 TS-BSC-HW-0211-I2.pdf

http://slidepdf.com/reader/full/ts-bsc-hw-0211-i2pdf 1/16

TS-BSC-HW-0211 – Minimum HW Requirements for BSC RG40 Release - /16 © Nokia Solutions and Networks 2014Version 2.0Confidential

Technical Support Note

TS-BSC-HW-0211

Minimum HW Requirements for BSCRG40 Release

Radio Control lers

Mult icontrol ler BSC, Mult icontrol ler TC, Flexi BSC,BSC3i, TCSM3i, TCSM2S16, S16.1, S16_2

Approval date: (06-Mar-2014)

This document contains followingtype of information

Informative X

Preventive

Corrective

Additional categorization

Urgent

Security

Release Upgrade

SW Update

Parameterization

Information is classified as

Internal

Public X

Customer Specific

Nokia Solutions and Networks is continually striving to reduce the adverse environmental effects of itsproducts and services. We would like to encourage you as our customers and users to join us in workingtowards a cleaner, safer environment. Please recycle product packaging and follow the recommendations forpower use and proper disposal of our products and their components.

If you should have questions regarding our Environmental Policy or any of the environmental services weoffer, please contact us at Nokia Solutions and Networks for additional information.

8/11/2019 TS-BSC-HW-0211-I2.pdf


8/11/2019 TS-BSC-HW-0211-I2.pdf



PurposeThis document contains generic information about products. These can be instructions thatexplain problem situations in the field, instructions on how to prevent or how to recover fromproblem situations, announcements about changes or preliminary information as requirementsfor new features or releases.

1. VALIDITY

This document is valid for BSC3i, Flexi BSC, Multicontroller BSC, TCSM2, TCSM3i andMulticontroller TC product configurations with RG40 / S16_2 SW release

2. COMPATIBILITY / DEPENDENCIES TO OTHER PRODUCTS

None.

3. KEYWORDS

BSC, BSC3i, Flexi BSC, Multicontroller BSC, TCSM2, TCSM3i, Multicontroller TC, minimum,S16_2, RG40, CPU, PCU, memory, hard disk, application software

4. EXECUTIVE SUMMARY

This Technical Support Note describes minimum HW requirements together withrecommended memory amounts for BSC SW release S16_2 providing support for RG40release. This Technical Support note covers the RG40 SW release.

5. DETAILED DESCRIPTION

Multicontroller BSC, Flexi BSC, BSC3i, TCSM3i, Multicontroller TC and TCSM2 products aresupported with S16_2 / RG40.

Minimum memory configurations for Flexi BSC CPU units are 2GB in all functional units (sameas RG30EP1). Minimum memory configurations for BSC3i 1000/2000 CPU units are 2GB in allfunctional units (changed from RG30EP1). Minimum memory configurations for BSC3i 660CPU units are 1GB in all functional units (same as RG30EP1).

However Nokia recommends upgrade all BSC3i 660 units to 2GB and all BSC3i 1000/2000and Flexi BSC units to 4GB. Recommended amounts are also maximum capacity which canbe equipped. CP816-xx and CP1D-A units in Flexi BSC and BSC3i 1000/2000 maximumequipment is 4x 1GB. CP710-xx units in BSC3i 660 maximum equipment is 4x 512MBmemory modules. Equipping recommended amounts will remove all possible further upgradeneeds in the future.

All Flexi BSC deliveries will include 4GB memory per CP1D-A as default starting frombeginning of November 2014.

There are no new memory configuration specific HW requirements for Multicontroller BSC andMulticontroller TC in S16_2 / RG40 when compared to Multicontroller BSC and MulticontrollerTC configurations in RG20 / RG30 / RG30EP1. Additionally HW requirements for new

Application Software features are presented.

8/11/2019 TS-BSC-HW-0211-I2.pdf



Central processor and minimum memory requirements

Allowed Central Processing Unit (CPU) types:

CPU type Micro-processor

ClockFrequency, MHz

BSC Product

CP710-A/-AB/AC Pentium III 800 BSC3i 660

CP816-A/AC Pentium M 1000-1800 BSC3i 660/1000/2000Flexi BSC (S14/RG10)

CP1D-A Penryn 1600-2260 Flexi BSC (S15/RG20)

Below are the requirements for minimum memory amounts in BSC3i 660 product

configurations with S16_2 / RG40 SW release:

Computerunit

BSC3i 660 S16.1 /RG30 EP1Memory amount,Mbytes

BSC3i S16_2 /RG40Memory amount,Mbytes

RecommendedMemory amount,Gbytes

OMU 1024 1024 2

MCMU 1024 1024 2

BCSU 1024 1024 2

Below are the requirements for minimum memory amounts in BSC3i 1000/2000 productconfigurations with S16_2 / RG40 SW release:

Computerunit

BSC3i 1000/2000BSC3i S16.1 /RG30 EP1Memory amount,Mbytes

BSC3i S16_2 /RG40Memory amount,Mbytes

RecommendedMemory amount,Gbytes

OMU 1024 2048 4

MCMU 1024 2048 4

BCSU 1024 2048 4

Below are the requirements for minimum memory amounts in Flexi BSC product configurationswith S16_2 / RG40 SW release:

Computerunit

Flexi BSC S16.1 /RG30 EP1Memory amount,Mbytes

Flexi BSC S16_2 /RG40Memory amount,Mbytes

Recommended /Delivered Nov 2014onwards,Gbytes

OMU 2048 2048 4

MCMU 2048 2048 4

BCSU 2048 2048 4

CP710 CPU models memory bank can consist of either 256MB or 512MB memory modules.Existing CP710 CPU model configurations are equipped either 256MB or 512MB. Totalmemory amounts required for CP710 CPU models:

4 pcs of 256MB memory module MR256M C103756 or

2 pcs of 512MB memory module MR512M C103757

8/11/2019 TS-BSC-HW-0211-I2.pdf



CP816 CPU models memory bank can consist of 512MB modules or 1GB modules. Totalmemory amounts required for CP816 CPU models:

4 pcs of 512MB memory module MRD512A C109053 or

4 pcs of 512MB memory module MRD512B C111692 or

2 pcs of 1GB memory module MRD1GBA C109054 or

2 pcs of 1GB memory module MRD1GBB C111693

CP1D-A CPU models memory bank are equipped with one 1GB as standard. Total memoryamounts required for CP1D-A CPU models:

2 pcs of 1GB memory module MRA2B01 C111696

New memory modules can be ordered with following BSC Sales Items:

BSC3172 contains 1pcs of 512MB (MR512M) C103757 module for CP710

BSC3224 contains 1pcs of 1GB (MRD1GBB) C111693 module for CP816

BSC3313 contains 1pcs of 1GB (MRA2B01) C111696 module for CP1D-A

Detailed memory update instructions are presented in Instructions chapter in this document.

Hard disk size requirements

The minimum disk space requirement is 18GB. All BSC3is have been originally delivered withat least 18GB size hard disks. Flexi BSCs have been delivered with at least 73 GB hard disks.No need for any disk upgrades.

There are no new hard disk size specific HW requirements for Multicontroller BSC andMulticontroller TC in S16_2 / RG40 when compared to Multicontroller BSC and MulticontrollerTC configurations in RG20 / RG30 / RG30EP1.

PCU hardware requirements

All existing PCU units PCU1, PCU2 can be used with the basic S16_2 supporting RG40release. As with earlier SW releases the PCU Basic SW (BSW) is controlled by license keys.PCU1 and PCU2 have different BSW each having own sales item.

HW requirements for new Application Software products

As for previous software releases, certain software products set requirements for the BSChardware. All new Packet Switched related features require PCU2 hardware units orMulticontroller BSC. New application SW features introduced with RG40 / S16_2 SW releasedo not require any other additional new HW. Application SW products might also require someother application SW product, which has hardware requirements.

HW requirements for existing Application Software products

Hardware requirements for software features introduced in earlier software releases should bereviewed separately.

8/11/2019 TS-BSC-HW-0211-I2.pdf



O&M Link Capacity Requirements

As BSC SW releases have introduced new functionality with increasing number of radionetwork objects and measurement data, more O&M link capacity may be needed.

O&M link capacity of the BSC is mainly dependent on Base Station TRX amount connected tothe BSC. Minimum link capacity for the each 1000 TRX is about 500 kbit/s. Recommended linkcapacity for the 1000 TRX connectivity is about 1 Mbit/s.

Please note that figures presented here are only calculated estimates. Please also note thatdeviations to the figures might exist due to the implications such as number of managedobjects under BSC, activated features, customer-specific data collection settings or workprocesses.

LAN based O&M connection is currently recommended and most powerful link option method.LAN based interfaces are available as standard HW in all BSCs. Alternatively digital X.25connection is still feasible when multiple 64 kbit/s timeslots are used for less than 1024 kbit/sdata link needs with BSC3i and Flexi BSC products with optional HW. Analog X.25connections with limited link capacity cannot be used anymore.

With Multicontroller BSC only LAN based O&M connection is supported.

6. SOLUTION / INSTRUCTIONS

This procedure explains how to do memory upgrade in case if not done already earlier.

Memory modules are very sensitive. Use always an antistatic mat, tools and wristband whenhandling CPUs and memory modules. See how to take care ESD issue properly from BSCProduct Documentation (ESD and handling of electrostatic sensitive units).

To minimize risk of incompatibility between different memory modules it is recommended touse same manufacturer of memory modules and same manufacturer’s module type insideeach CPU. This is possible if during memory upgrade you remove all memory modules andinstall only new modules to first CPU. You can use the removed modules in another CPU.

All modules inside each CPU must be same general type e.g. MRD512A and MRD512Bcannot be mixed in same CPU.

8/11/2019 TS-BSC-HW-0211-I2.pdf



Procedure for CP710-A, CP710-AB and CP710-AC memory upgrade

There are two different layouts of CP710-A/AB/AC. Memory module equipping is similar forboth layouts models.

Insert first memory module to the slot 1, closest to front panel.

Equipping order of memories is: 1 - 2 - 3 – 4 (Sockets)

8/11/2019 TS-BSC-HW-0211-I2.pdf



SDRAM-memory size

total

Socket 1 Socket 2 Socket 3 Socket 4

1 GB MR256M MR256M MR256M MR256M

1 GB MR512M MR512M - -

2 GB MR512M MR512M MR512M MR512M

8/11/2019 TS-BSC-HW-0211-I2.pdf



Procedure for CP816-A and CP816-AC memory upgrade

There are three different layouts of CP816-A/AC.Please select appropriate CPU unit based on instructions and pictures below:

ADVANTECH CP816:

Possible equipping options:

DIMM-memory size

total

Socket

A1

Socket

B1

Socket

A2

Socket

B2

1 GB - - MRD512A MRD512A

1 GB - - MRD512B MRD512B

1 GB - - MRD1GBA -1 GB - - MRD1GBB -

2 GB MRD512A MRD512A MRD512A MRD512A

2 GB MRD512B MRD512B MRD512B MRD512B

2 GB - - MRD1GBA MRD1GBA

2 GB - - MRD1GBB MRD1GBB

4 GB MRD1GBA MRD1GBA MRD1GBA MRD1GBA

4 GB MRD1GBB MRD1GBB MRD1GBB MRD1GBB

8/11/2019 TS-BSC-HW-0211-I2.pdf



FORCE CP816:


DIMM-memory size

total

Socket

P10

Socket

P12

Socket

P11

Socket

P13



1 GB - - MRD1GBA -

1 GB - - MRD1GBB -

2 GB MRD512A MRD512A MRD512A MRD512A2 GB MRD512B MRD512B MRD512B MRD512B





8/11/2019 TS-BSC-HW-0211-I2.pdf



RADISYS CP816:


DIMM-memory size

total

Socket

J11

Socket

J12

Socket

J13

Socket

J14



1 GB - - - MRD1GBA

1 GB - - - MRD1GBB

2 GB MRD512A MRD512A MRD512A MRD512A2 GB MRD512B MRD512B MRD512B MRD512B





8/11/2019 TS-BSC-HW-0211-I2.pdf



Procedure for CP1D-A memory upgrade

The CP1D-A has two vendors that differ in layout.

Advantech CP1D-A:

8/11/2019 TS-BSC-HW-0211-I2.pdf



Radisys CP1D-A:

Both have similar memory equipping:

DIMM-memory size

total

Socket

11/J11

Socket

01/J12

Socket

10/J13

Socket

00/J14

2 GB - - MRA2B01 MRA2B01

4 GB MRA2B01 MRA2B01 MRA2B01 MRA2B01

8/11/2019 TS-BSC-HW-0211-I2.pdf



With Advantech CP1D-A (serial start with AT) it is recommended to support the plug-in unitwhen installing memory modules.

Material requirement:Bakelite pad (plastic cement), size 100mm x 270mm.

Picture 3 The pad which comes under the board.

It is possible to use also some other soft material which support the board that it does notbend during memory module assembly.

Place the pad (ESD material) under the PWB during memory module assembly (picture 4).

Insert the Memory modules gently having the pad under the PWB.

Picture 4 Location of the pad under the board

In Advantech interchangeability Dxx onwards there is a built in support plate.

8/11/2019 TS-BSC-HW-0211-I2.pdf



If the Advantech CP1D-A is interchangeability Dxx or newer, there is no need to use extra pad.

Picture 5 The new built in support plate on the board.

7. NOTE

All modules inside each CPU must be same general type e.g. MRD512A and MRD512Bcannot be mixed in same CPU.

Memory modules are very sensitive. Use always an antistatic mat, tools and wristband whenhandling CPUs and memory modules. See how to take care ESD issue properly from BSCProduct Documentation (ESD and handling of electrostatic sensitive units).

8. REFERENCES

Technical Support Note 0201 Minimum HW Requirements for BSC RG30 EP1 ReleaseTechnical Support Note 0208 The end of the availability of small memory modules

8/11/2019 TS-BSC-HW-0211-I2.pdf



Disclaimer

The information in this document applies solely to the hardware/software product (“Product”) specifiedherein, and only as specified herein.

This document is intended for use by Nokia Solutions and Networks' customers (“You”) only, and it maynot be used except for the purposes defined in the agreement between You and Nokia Solutions andNetworks (“Agreement”) under which this document is distributed. No part of this document may be used,copied, reproduced, modified or transmitted in any form or means without the prior written permission ofNokia Solutions and Networks. If you have not entered into an Agreement applicable to the Product, or ifthat Agreement has expired or has been terminated, You may not use this document in any manner andYou are obliged to return it to Nokia Solutions and Networks and destroy or delete any copies thereof.

The document has been prepared to be used by professional and properly trained personnel, and You

assume full responsibility when using it. Nokia Solutions and Networks welcome Your comments as part ofthe process of continuous development and improvement of the documentation.

This document and its contents are provided as a convenience to You. Any information or statementsconcerning the suitability, capacity, fitness for purpose or performance of the Product are given solely onan “as is” and “as available” basis in this document, and Nokia Solutions and Networks reserves the rightto change any such information and statements without notice. Nokia Solutions and Networks has made allreasonable efforts to ensure that the content of this document is adequate and free of material errors andomissions, and Nokia Solutions and Networks will correct errors that You identify in this document. But,Nokia Solutions and Networks' total liability for any errors in the document is strictly limited to the correctionof such error(s). Nokia Solutions and Networks does not warrant that the use of the software in the Productwill be uninterrupted or error-free.

NO WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO

ANY WARRANTY OF AVAILABILITY, ACCURACY, RELIABILITY, TITLE, NON-INFRINGEMENT,MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, IS MADE IN RELATION TO THECONTENT OF THIS DOCUMENT. IN NO EVENT WILL NOKIA SOLUTIONS AND NETWORKS BELIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO SPECIAL, DIRECT, INDIRECT,INCIDENTAL OR CONSEQUENTIAL OR ANY LOSSES, SUCH AS BUT NOT LIMITED TO LOSS OFPROFIT, REVENUE, BUSINESS INTERRUPTION, BUSINESS OPPORTUNITY OR DATA THAT MAY

ARISE FROM THE USE OF THIS DOCUMENT OR THE INFORMATION IN IT, EVEN IN THE CASE OFERRORS IN OR OMISSIONS FROM THIS DOCUMENT OR ITS CONTENT.

This document is Nokia Solutions and Networks’ proprietary and confidential information, which may not bedistributed or disclosed to any third parties without the prior written consent of Nokia Solutions andNetworks.

Nokia is a registered trademark of Nokia Corporation. Other product names mentioned in this document

may be trademarks of their respective owners, and they are mentioned for identification purposes only.

Copyright © 2014 Nokia Solutions and Networks. All rights reserved.

TS-BSC-HW-0211-I2.pdf

Documents

Transcript of TS-BSC-HW-0211-I2.pdf