TROITROI--7700HL7700HLColor 2D + 3D SPIColor 2D + 3D SPI

Key FeaturesKey Features

▪ 1. Real Color 3D Image

▪ 2. 2D + 3D Algorithm

▪ 3. Height Inspection range 0 ~ 450㎛

▪ 4. High speed by Linear Motor

▪ 5. Closed Loop Solution

▪ 6. Mounter Bad mark sync

▪ 7. 64bit window Operating System

▪ 8. User friendly SPC

▪ 9. Free software upgrade for lifetime

Why SPI?Why SPI?

TROI

More than 50% of defects are from screen printing process

Fast & AccurateFast & Accurate

In spite of the importance of the color image in the apparatus for measurement of the surface profile, the color camera has defects of being high in price and being low in capture speed rather than the black and white camera.

TROI systems are equipped with 4MP Black & White camera due to;

1.Faster Inspection Speed2.Higher Accuracy compare to Color Camera3.Competitive price for end users

Enhanced Color 3D Display

Pemtron Competitor

Competitor

PemtronPemtron

Competitor Competitor

Simultaneous 2D&3D / Shadow Free

PCB

(Solder)

2DLighting

Combination of 2D & 3D inspection eliminates common Shadow problem with SPI systems.

Camera grabs shapes of solder from simultaneous 2D and 3D LED light source.

Not only Dual Projection,2D LED approve to be recognized the exact solder field

Shadow Free

by

Dual Projection

Inspection Logic -2D & 3D Phase Shifting Technology

2D camera detects “Zero reference point” and inspects solder shape like smearing simultaneously.

Solder lands are higher or lower than PCB surface. Pemtron Phase Shifting technologies measure the height and volume deposition from the surface of the lands. Also SPI inspects the solder deposition shape.

2D inspection

3D inspection

ConceptConcept

▪ Height difference detected as image shifts.

▪ Moire Technology▪ Illuminate full field of view▪ No safety concerns▪ Multiple reflections filtered

▪ Laser Source Technology▪ Requires safety precautions▪ Multiple reflections▪ Susceptible to vibration

Mechanical DesignMechanical Design

X & Y Camera Head gantry system provides stable and precise inspection performance.

Standard 3 Stage Buffer Conveyor Load / Work / Exit Stage

Dual Lane configuration meets with various type of placement system

Obtains Bare Board data for accurate Obtains Bare Board data for accurate inspectioninspection

TROI SPI automatically recognizes all traces, silk print and land height in order to perform accurate inspection by scanning bare board in about 60 seconds.SPI measures the accurate solder height and volume by compensating traces and silk height, beside most of other systems are using PCB surface as “Zero reference point”

Captured image without bareboard teachingHeight Result = 164 um

Captured image with bareboard teachingHeight Result = 140 um

Analysis Editor (Color Mapping)Analysis Editor (Color Mapping)

Reference Point Recognition

Solder Paste Recognition

Reference Range (Reference Range (WarpageWarpage))

Wider range of reference point search area prevents less deviation of recognizing a zero reference point.

•Accurate height calculation•Compare other pads within ROI•Better repeatability

Good

Bad

Solder Paste

Reference

PCB

Solder Paste

Reference

PCB

Substances below 40um

Bottom & Substances Color

Inspection

Competitor’s models used the method which could only recognize solder higher than 40um, making it impossible for measurements below 40um height level.

Pemtron has solved this problem by using an Enhanced 3D Color Algorithm that can defines solder printed from a 0 reference point.

Accurate Inspection by 2D Color Algorithm

Advanced Accuracy & Advanced Accuracy & Reliability by 3D AlgorithmReliability by 3D Algorithm

Color 3D Algorithm can inspect from the bottom of PCB ,therefore PEMTRON can inspect the accurate PCB bottom, such as Hole, silk.

In conclusion, this 3D Algorithm makes it possible to find the exact solder field.

Gantry Type Gantry Type –– LinearLinear mmotorotor

1. Linear Motor – Accurate & Fast Inspection

2. Longer life time than Ball screw Type

3. Less maintenance

Maximize AccuracyMaximize Accuracy↑↑

Minimize Vibration Minimize Vibration ↓↓

PAD, FOV & Path Information

Import Gerber Data

TeachFiducial mark

Set Parameters

Inspection

Easy & Fast Gerber Programming Easy & Fast Gerber Programming

less than 10mins

RealReal Time Production StatusTime Production StatusMain ViewMain View

Main GUI PCB Image

JOB Data file name

Average Result

Colored Live Image of FOV

PCB position on conveyorOperation menu

Result in histogram

Easy to check the NG Status

Real time NG Pads Debugging

Rear Color View NG Status

Ease ControlEase Control NG View NG View

AccurateAccurate Pad Analysis ToolPad Analysis Tool

By selecting the Pad to Analyze, - Check the height by profiling function- Real time Color Display Pad image check including dust on the bottom - Analyzing in rotating by user

Color DistributionColor Distribution

Height of solder deposition is higher on left side of array

User changed pressure on printer todistribute solder evenly

Color Map View is capable to show the solder deposition data by Height, Volume & Area. It is easier to see the deposition condition and helps engineers tocheck screen printing ability.

Glue InspectionGlue Inspection

Combination of various LED makes possible to inspect glue (adhesive) on PCB.

Golden Finger Inspection (2D)Golden Finger Inspection (2D)

The system can detect solder splash on the golden finger. The minimum size of splash detection (18um resolution) is 50um in diameter. About 3 particle of solders are about 50um. 12um resolution system can detect as small as 40um of splash size.

<OK> <NG>

-Splash DefectParameter : 50umResult : 426um

-ContaminationParameter : 50umResult : 465um

SPCSPC

SPC Key FeatureSPC Key Feature

- Fast & accurate Reliable Database- Server & Client Network connection possible

SPC’ Introduction

Diverse Report ExportDiverse Report Export

User can select the time to export the real time report for productivity & NG.Available format : PDF, Word, HTML

SPC’ Introduction

SPI Monitoring System - Production Lines.

• Monitoring Production(Inspection) Status for entire Lines(SPI)

• CP/CPK/Histogram/Sigma/Yield/Defect type/Report

• Remote Control system

You can monitor multiple lines in from management server (extracted from RMC)

SPI Monitoring System - Production Lines.

• You can monitor production status based on CPK chart • Each board information will be saved and can check the board information • If some problem happens in out of CPK range,

user can leave the comment about the issue by user

BeforeAfterNG trends Red: NG

SPI Monitoring System - Production Lines.

From Histogram, operator can easily change which axis is offsetFrom Trend View, operator can decide which part should pressure more visually