Trends and Challenges for Data Centers iNEMI...
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Trends and Challenges for Data Centers – iNEMI Roadmap
Transcript of Trends and Challenges for Data Centers iNEMI...
Trends and Challenges for Data Centers – iNEMI Roadmap
Trends and Challenges
Context – what's happening in the market and in the industry
Changes – new technology developments
Challenges – what is needed for the future
Collaboration – Reduces risk and accelerate transformation
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What is iNEMI?
International Electronics Manufacturing Initiative
(iNEMI) is an industry-led consortium of over 90 global
manufacturers, suppliers, industry associations,
government agencies and universities. A Non Profit
Fully Funded by Member Dues; All Funding is Returned
to the Members in High Value Programs and Services;
In Operation Since 1994.
www.inemi.org
Forecast and Accelerate improvements in the
Electronics Manufacturing Industry for a
Sustainable Future
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Roadmap
Technical plan
Research
Collaborative Projects
Forums & Workshops
• Anticipate technology requirements
• Identify gaps
• Focus R&D priorities
• Eliminate gaps
• Deliver learning & critical data
• Leverage efforts & resources of participants
• Share solutions & best practices
• Prioritize key challenges
• Network with customers & suppliers
iNEMI Industry Value
Identify Business Opportunities via Roadmaps
• iNEMI roadmaps the future technology requirements of the
global electronics industry, identifies and prioritizes
technology and infrastructure gaps.
Statics of 2015 Roadmap
• > 500 participants
• > 280 companies/organizations
• > 20 countries
• >7 man years of resources
• 19 Technology Working Groups (TWGs)
• 6 Product Emulator Groups (PEGs)
• Nearly 2000 pages of information
• Roadmaps the needs for 2015-20255
iNEMI Scope
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Software Solutions
Marketing Design ManufacturingOrder
Fulfillment
Supply Chain ManagementInformation Technology
LogisticsCommunications
Business Practices
Build toOrder
Materials
Components
Customer
Equipment
MaterialsTransformation
Collaborative Design
Lifecycle SolutionsSoftware
Solutions
Context
It is all about Data!
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The number of connected devices has increased dramatically leading
to a concept commonly called the IoT (Internet of Things).
.
What Type of Data ?
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The amount of data with the fast growing elements that are unstructured with
the demand for analytics and fast movement of data is also accelerating.
Expected Internet Traffic by 2016 (Source: Cisco VNI)
• 130 Exabytes run-rate of global data traffic
– 130x the amount of data generated in 2000
– Mobile internet traffic CAGR 78% from 2011 to 2016
• 22% of mobile/wireless data will be offloaded to WiFi
• Generating the mobile data traffic:
– Asia/Pacific 40%, Western Europe 22.56%, North America 18.18%, ROW 19.26%
– Smartphones 48.3%, laptops/notebooks 24.2%, tablets 10%
– 60% of mobile users (~3B people) will generate >1GB of mobile data
traffic/month, compared to just 0.5% of the mobile users today.
– Cloud-based and Machine-to-Machine mobile traffic
• By Application:
– Mobile video 70.5%
– Web/data 20.0%
– Machine-to-Machine 4.7%
– Mobile File Sharing, Mobile Gaming, Mobile VOIP 4.8%
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Data Center Markets
Data centers are the infrastructure for the Cloud
Growth - $7B in 2015 to $22B in 2025
Proliferation of datacenters across the world
Growth of non traditional players
Increasing awareness of Data Security demands
Data bandwidth is demanding faster interconnect speeds
Power demand is creating challenges
Rate of innovation is high, helped by open source concepts
of hardware and software
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More Data Sources with more complex
requirements
Smart, Connected Medical Microelectronics Miniaturized Connected Delivering therapy
Larg
e s
yste
ms fo
r Thera
py, D
iagnostic
s,
Sto
rage a
nd C
om
munic
atio
ns
Port
able
, patient
sid
e,
dia
gnostic a
nd
monitoring
Cochlear
Vagus Nerve & Spinal
Urinary
Implant
Gastric
Retinal
Cardiac
Brain
Changes
What's been happening?
• Deployment of Datacenters across the world
– Both technical and geo political reasons
– Leverage use of renewable energy
– Growth in datacenter management
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2013 Regional Revenue (M$) Americas Asia-Pacific EMEA Japan
Total High-End Systems 35,317 65,801 35,888 25,274
Data Centers 2,960 1,990 2,008 313
What's been happening?
• Pure horse power is no longer the No.1 driver within the
server industry. Power has moved to the forefront of
demands.
• In the growing world of data centers and cloud build-out,
servers must be efficient, use less power, and take up less
space, all while meeting the specific workloads that the IoT
requires.
• Now systems availability required 100% of time – achieved
through redundancy and more monitoring
• Growth of density optimized servers or micro-servers
• IHS projects that the micro-server will be nearly 20% of the
total server market by 2019.15
What's been happening?
• Thermal Management
– Advent of new cooling techniques
• Chip
• Board
• Rank
• System level
• HPC data center, based in NREL’s
• Energy Systems Integration Facility (ESIF),
• (PUE) rating of 1.06 or better.
Need collaboration/co design between
the building designers, system integrator and
OEMs to optimize the thermal solution for the
entire installation16
Hewlett-Packard Development Company
Thermal solutions that add to the platform power are not attractive
What's been happening?
• Modularization
• Higher density at chip level
– Trend of move to specialty cores to do certain tasks
– Integration of more on-chip cooling
• Adoption of new packaging technologies
– Through Silicon Via (TSV)
– System in Package (PoP)
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Potential Solution:
2.5D/3D Photonic Co-integrated SiP
Silicon Substrate with TSV interconnects and Si Waveguides
Photonic engine CMOS logic
Memory controller
DRAMDRAM
DRAM
DRAM
Power
ControllerMemory controller
DRAMFlash memory
DRAM
Flash memory Flash memoryFlash memory
Photonic/electronic Circuit Board
Electronics, Photonics and
Plasmonics on an SOI
Substrate
Multiple voltage regulators
to match power delivery to each
component to the work in process
TSV memory stack, direct
bonding interconnect,
PCB with electronic and
photonic signals with embedded
components
Large on-package memory
cache
Optical Data Communications
• Optical methods require up to 75% less power and the cables are
typically 75% smaller than copper cable with the same data
capacity.
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Challenges
Paradigm Shifts
• Cloud connected digital devices have the potential to enable major disruptions across the industry:
– Major transition in business models
– New Power Distribution Systems for Data Centers
– Huge data centers operating more like utilities (selling data services)
– Local compute and storage growth may slow (as data moves to the cloud)
– “Rent vs. buy” for software (monthly usage fee model)
• Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more
• Sensors everywhere – MEMS and wireless traffic!
• “More Moore” (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - “More Than Moore”
• Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2-D & 3-D):
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Challenges
• Managing data as “cost effectively” as possible in as
sustainable manner as possible
– Bandwidth
– Power
– Thermal
– Environmental
– Many of these will be addressed by improving performance of
system components such as high speed chips, optical packaging
& interconnect, optical backplanes and high performance PCBs
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Chip Level Solutions
• Continue Moore’s Law Scaling
• Reduce leakage currents
– Transistors are less than 10% of IC power today and going down
• Reduce on-chip Interconnect power by:
– Improved conductor conductivity
– Decrease capacitance
• Reduce interconnect length
• Reduce operating frequency
• Reduce operating voltage
– Voltage regulator per core
• Reduce high speed electrical signal length
– Move photons closer to the transistors
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Board Level Solutions
Increased density on the PCBs
Ultra Loss Loss Materials
Smoother copper traces
Embedded Optical traces
Optical Connectors
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Collaboration
Strategic Concerns
• Restructuring from vertically integrated OEMs to multi-firm supply chains
– Resulted in a disparity in R&D Needs vs. available resources
• Arrival of New players
• Critical needs for R&D
– Middle part of the Supply Chain is least capable of providing resources
• Industry collaboration
– Gain traction at University R&D centers, Industry consortia, “ad-hoc” cross-company R&D teams
• The mechanisms for cooperation throughout the supply chain must be strengthened.
– Cooperation among OEMs, ODMs, EMS firms and component suppliers is needed to focus on the right technology and to find a way to deploy it in a timely manner
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Consumer Segment had been driving Technology
Changes
• Smart phones dominated unit volume growth for portable products, and the overall market volume growth has been driving other areas:
– Increased focus on shrinking form factor and low power
– High level of integration (SoC, SiP)
– 3D packaging and Embedded Die market leaders
• Significant focus on sustainability, eco-design and recycling
• The MEMS/sensor technology for unleashing entertainment, medical, and security as well as perceptual computing
• Convergence of Entertainment, Computing, Communication drives integration
– The world of OS and applications and middleware challenges, will drive major shifts and consolidations to enable seamless computing and interoperability
– The pace of product enhancements is growing rapidly.27
Other important areas for collaboration
Data Security
Counterfeit Products
Rare Earth and Conflict Materials
Carbon foot printing
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Invitation to get involved in the future
Benefits of Roadmapping:
Assessment of where the whole ecosystem is at
Identification of where we/industry want to be
Comparison of various technology paths
Clarification on what is needed to get there
Visibility to what is happening – the sooner the better
Communication to the industry and along the supply chain is enhanced
Define where collaboration and/or innovation is necessary
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www.inemi.orgNorth America:
Bill Bader
Europe:
Steve Payne
Asia Pacific:
Haley Fu
