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A PRESENTATION ON IN-PLANT TRAINING
SIEMENS LTD, VERNA GOABy
Aniket Pawar
AT
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CONTENTS
ABOUT THE COMPANY
METHODOLOGY
PRODUCTION DEPARTMENT
WAREHOUSE AND LOGISTICS
RESEARCH AND DEVELOPMENT CENTER
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ABOUT THE COMPANY
Siemens Energy and Automation Verna, Goa is a Greenfield factory with an investment of around Rs. 200 crores.
This factory produces a range of products for power distribution of industries, power plants, infrastructure and cities.
The products include medium voltage gas-insulated switchgears of up to 36k, numerical protection relays, tele-control devices for smart grids.
The factory has its own in-house Research and Development unit.
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ABOUT THE COMPANY(CONT.)
This factory is built as green factories with features such as ground water recharging, rain water harvesting, water conservation through low flow fixtures, energy conservation through energy efficient lighting & HVAC, use of solar technology for street lighting and water efficient landscaping.
The Energy Automation factory is the first such factory outside Europe and third in the Siemens World, after Germany and United Kingdom.
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METHODOLOGYR & D
DEPARTMENT MANAGEMENT
PRODUCTION DEPARTMENT
SMT LINE AOI & MANUAL INSPECTION
THT MOUNTING & WAVE SOLDERING
INSPECTION & TESTING
DEBUG & REWORK
Packing & LabellingDEVICE ASSEMBLY
ELECTROMECHANICAL ASSEMBLY 1
ELECTROMECHANICAL ASSEMBLY 2
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PRODUCTION DEPARTMENT
•SMT PRODUCTION LINE
•AOI (AUTOMATIC OPTICAL INSPECTION)
• THT PRODUCTION LINE
• FINAL MOUNTING and Testing
•STENCIL CLEANING
•DEVICE ASSEMBLY
•Packing - Packing Material
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SMT PRODUCTION LINE
PCBs
PCBs
PRINTER PLACEMENTSTAGE 1
PLACEMENTSTAGE 2
PLACEMENTSTAGE 2REFLOW SOLDERING
LOADER
UNLOADER
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SMT PLACEMENT EQUIPMENT
SMT component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board.
They are used for high speed, high precision placing of broad range of electronic components, like capacitors , resistors , integrated circuits onto the PCBs which are in turn used in computers.
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COMPONENT FEEDERS
•Surface mount components are placed along the front and back faces of the machine.
• Most components are supplied on paper or plastic tape, in tape reels that are loaded onto feeders mounted to the machine.
•Larger integrated circuits are sometimes supplied arranged in trays which are stacked in a compartment.
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REFLOW SOLDERING
There are usually four stages, called "zones", each having a distinct thermal profile:
•PREHEAT•THERMAL SOAK•REFLOW•COOLING
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REFLOW SOLDERING
•Preheat: The preheat zone is often the lengthiest of the zones. Here the solvent in the paste begins to evaporate.
•Thermal soak: thermal soak, is typically a 60 to 120 second exposure for removal of solder paste volatiles and activation of the fluxes, where the flux components begin oxide reduction on component leads and pads.
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REFLOW SOLDERING(CONT.)
•Reflow: It is the part of the process where the maximum temperature is reached. Temperature limit is determined by the component on the assembly with the lowest tolerance for high temperatures.
•Cooling: The last zone is a cooling zone to gradually cool the processed board and solidify the solder joints. Proper cooling inhibits excess inter-metallic formation or thermal shock to the components.
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AOI (AUTOMATIC OPTICAL INSPECTION)
A Small Scale AOI Machine
Types: Stand-alone and inline AOI systems, Closed- and open-top AOI systems, AOI and combined AOI/AXI systems.
LOADER AOI MACHINE UNLOADER
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AOI (AUTOMATIC OPTICAL INSPECTION)
A machine vision or an AOI system can acquire millions of data points (pixels) in a fraction of a second.
These data points are used for visual inspection and precision measurement. AOI visually scans the surface of the PCB.
The board is lit by several light sources and observed by a scanner or by a number of high definition cameras.
This enables the monitoring of all areas of the board, even those hidden in one direction by other components.
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THT PRODUCTION LINE
PCBS
PCBs for Testing
MOUNTING CELL
MANUAL INSPECTION
WAVE SOLDERING
MANUAL INSPECTION
FINAL MOUNTING
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THT PRODUCTION LINE
HOLE
The mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines
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WAVE SOLDERING
Wave soldering is used for both through-hole printed circuit assemblies, and surface mount.
Different Zones:
FluxingPreheating
SolderingCooling
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WAVE SOLDERING(CONT.)
PROCESS:The basic equipment used during the process is a conveyor
that moves the PCB through the different zones, a pan of solder used in the soldering process.
A pump that produces the actual wave, the sprayer for the flux and the preheating pad.
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WAVE SOLDERING(CONT.)
FLUXING:The primary objective is to clean the components that are
to be soldered, principally any oxide layers that may have formed.There are two types of flux, corrosive and noncorrosive.
Noncorrosive flux requires pre-cleaning and is used when low acidity is required. Corrosive flux is quick and requires little pre-cleaning, but has a higher acidity.
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WAVE SOLDERING(CONT.)
PREHEATING:The preheating zone consists of convection heaters which
blow hot air onto the PCB to increase its temperature. For thicker or densely populated PCBs, an upper pre-heater might be used.
Preheating is necessary to activate the flux, and to remove any flux carrier solvents. Preheating is also necessary to prevent thermal shock.
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WAVE SOLDERING(CONT.)
SOLDERING:The tank of molten solder has a pattern of standing waves
on its surface. When the PCB is moved over this tank, the solder waves
contact the bottom of the board, and stick to the solder pads and component leads via surface tension.
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WAVE SOLDERING(CONT.)
SOLDERING (CONT.):This process is sometimes performed in an inert nitrogen
(N2) atmosphere to increase the quality of the joints. The presence of N 2 also reduces oxidization known as solder dross.
Solder dross, its reduction and elimination, is a growing industry concern as lead soldering is being replaced by lead-free alternatives at significantly higher cost.
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WAVE SOLDERING(CONT.)
CLEANING:Some types of flux, called "no- clean" fluxes, do not
require cleaning; their residues are benign after the soldering process.
Others, however, require a cleaning stage, in which the PCB is washed with solvents and/or de-ionized water to remove flux residue.
FINISH AND QUALITY:Quality depends on proper temperatures when heating
and on properly treated surfaces.
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FINAL MOUNTING
This includes various processes depending on different PCB models. This include
Hot melt adhesiveSolderingDisplay mounting
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FINAL MOUNTING(CONT.)
HOT MELT ADHESIVE (HMA):
Also known as hot glue, is a form of thermoplastic adhesive that is commonly supplied in solid cylindrical sticks of various diameters, designed to be melted in an electric hot glue gun.
The gun uses a heating element to melt the plastic glue, which may be pushed through the gun by a mechanical trigger mechanism, or directly by the user.
The glue is tacky when hot, and solidifies in a few seconds to one minute.
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FINAL MOUNTING(CONT.)
Hot melt adhesive (HMA)
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FINAL MOUNTING(CONT.)
SOLDERING:
Filler materials are available in many different alloys for differing applications.
In electronics assembly, the eutectic alloy of 63% tin and 37% lead (or 60/40, which is almost identical in melting point) has been the alloy of choice.
There are three forms of soldering soft soldering, which originally used a tin-lead alloy as the filler metal, silver soldering, which uses an alloy containing silver, brazing which uses a brass alloy for the filler.
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TESTING
Additional hardware includes:Cameras to test for presence and correct orientation of
components Photo detectors to test for LED color and intensity External timer counter
BED OF NAILS TESTERA bed of nails tester is a
traditional electronic test fixture which has numerous pins inserted into holes which are aligned using tooling pins to make contact with test points.
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TESTING(CONT.)
Flying probe testing uses electro-mechanically controlled probes to access components on printed circuit assemblies (PCAs). Commonly used for test of analog components, analog signature analysis and short/open circuits.
They provide an alternative to the bed-of-nails technique for contacting the components on printed circuit boards.
FLYING PROBE TESTERFlying probe test systems are
often used for only testing basic production, prototypes, and boards that present accessibility problems.
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STENCIL CLEANING
PROCESSES
Ultrasonic Stencil Cleaning is one of the preferred methods for removing trace levels of solder paste from stencil openings.
Spray-In-Air C8882 WASH / C8882 RINSE Cybersolv® C8882 is a solvent-based stencil cleaning fluid
specifically designed to clean wet solder paste, SMT adhesive and flux residue from stencils (conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees.
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DEVICE ASSEMBLY
Outer AssemblyContact leads are placed and connected to the former with
the help of screws.
Housing Box AssemblyIt is associated with the mounting of whole structure in a
metallic box.
RivetingA rivet is a permanent mechanical fastener. Before being
installed, a rivet consists of a smooth cylindrical shaft with a head on one end. The end opposite the head is called the buck-tail. On installation the rivet is placed in a punched or drilled hole.
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DEVICE ASSEMBLY(CONT.)
Front Panel AssemblyHere, the front panel assembly for the various devices is
done. These include PCBs with control buttons, LCD screens and status LEDs, etc.
PCBA(PCB Assembly):After the printed circuit board is completed, electronic
components must be attached to form a functional printed circuit assembly or PCA.
WiringWires are attached from PCB components to input and
output ports and power supply points.
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DEVICE ASSEMBLY(CONT.)
Inner Block AssemblyFinal and one of the last inner blocks are assembled and a
manual inspection is made.
TestingTesting is commonly done to maintain quality control in
this stage of PCB manufacturing. While the power is off, analog signature analysis, power-off
testing is done. While the power is on, in-circuit tests, where physical
measurements (for example, voltage) can be done. While the power is on, functional test, just checking if the
PCB does what it had been designed to do.
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PACKING
BAGS & PACKETSPaper bagsClear plastic bags Zipper bagsGreaseproof bags
PROTECTIVE PACKAGINGAir bubble wrap Corrugated Kraft (SFK)
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PACKING(CONT.)
CORRUGATED CARTONSSingle wallDouble Wall
SELF ADHESIVE TAPESStationery tapeDouble sided film tape Double sided foam tapeMasking tapePoly-prop TapeColored PVC Tape
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THANK YOU