Toshiba's Ara Partnershiptoshiba.semicon-storage.com/content/dam/toshiba-ss/... · 2020-05-15 ·...
Transcript of Toshiba's Ara Partnershiptoshiba.semicon-storage.com/content/dam/toshiba-ss/... · 2020-05-15 ·...
SEMICONDUCTORS
Copyright 2014, Toshiba Corporation.
Toshiba’s Ara Partnership
2 Copyright 2014, Toshiba Corporation.
Agenda
• Toshiba Semiconductor Involvement in project Ara
• Bridge Chips Overview
• Reference Module plan
3 Copyright 2014, Toshiba Corporation.
Toshiba’s Involvement In Project Ara
• New and Exciting Game Changer concept for Smart Phones
• Toshiba’s opportunity to expand Mobile world
• Potential to expand concept beyond Smart Phones
• Interested in open platform environment lowering barrier to entry
• Alignment with Toshiba’s core competency
4 Copyright 2014, Toshiba Corporation.
Toshiba’s Involvement In Project Ara
• Two Bridge LSIs – AP Bridge:
AP/Camera/Display Bridge
– GP Bridge: General-Purpose Bridge
• And
– Switch IC
Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI. /M-PHY® is a trademark or registered trademark of MIPI Alliance, Inc.
Copyright 2014, Toshiba Corporation.
BRIDGE CHIPS OVERVIEW Toshiba is collaborating with project Ara team, by developing bridge LSIs
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Bridge Chips Overview - Two Bridge chips
• Application Processor • Display • Camera • Mic/Speaker • 2nd Display/Camera • etc
Equipped modules
• Wi-Fi®, Bluetooth®
• SIM • Modem • GPS • Memory Card • Mic/Speaker • etc
Equipped modules
CSI/DSI
CSI/DSI Host Bus Interface
I2C, I2S, GPIOs
2 La
ne M
-por
t U
niPr
oSM
L
ayer
CSI/DSI Tx0 4Lane D-PHY CSI/DSI Rx0
CSI/DSI Tx1 4Lane D-PHY CSI/DSI Rx1
HOST BUS I/F
AP/Camera/Display Bridge: AP Bridge
I2S master I2C master
GPIOs
Two types of bridges, “AP bridge” with CSI/DSI, and “GP bridge” w/o CSI/DSI
HSIC(HOST) SDIO(MASTER)
UART, I2C, I2S, EPM, GPIOs
2 La
ne M
-por
t
Uni
ProS
M L
ayer
HSIC 1.0 HOST
HSIC PHY
SDIO v2 master
UART I2S master I2C master
GPIOs EPM
General-Purpose Bridge: GP Bridge
Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license./UniProSM is a servicemark or registered servicemark of MIPI Alliance, Inc.
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Bridge Chips Overview - AP Bridge Functions:
• UniProSM Interface: MIPI® UniProSM version 1.6 compliant UniPort
• CSI-2 interface: Two links of MIPI® CSI-2 compliant (Ver. 1.01)
• DSI interface: Two links of MIPI® DSI compliant (Ver. 1.1)
• Host Bus Interface -1 (TBD, HSIC is assumed for now)
• Host Bus Interface -2 (TBD, Parallel memory interface)
• Embedded Microprocessor (CPU) [for chip internal data transfer control purpose only]
• I2C Master: Support for normal (100KHz), fast mode 400 KHz) and fast mode plus (1MHz, 100pf)
• I2S Master • EPM (Electro-permanent magnet systems) control • GPIO signals
Package: TBD
AP Bridge
MIPI®, M-PHY® and UniProSM are trademarks, servicemarks, registered trademarks or registered servicemarks of MIPI Alliance, Inc.
D - PHY x4
REFCLK 19.2MHz
PLL
PLL
Other Logic
UniProSM v1.60 (L1 - L4)
M - PHY® Tx (x2 )
M - PHY® Digital Logic
M - PHY® Rx(x2 ) PLL
CSI - 2/DSI RX
CSI - 2/DSI T X
D - PHY x4 PLL
CSI - 2/DSI RX
CSI - 2/DSI T X
HSIC Slave
HSIC PHY
CPU
Boot
SPI
IF Bridge
Buffer
Parallel Memory
I/F
I2C master
GPIO
I2S master
EPM
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Bridge Chips Overview - GP Bridge Functions:
• UniProSM Interface: MIPI® UniProSM version 1.6 compliant UniPort
• HSIC host: High-Speed Inter-Chip USB Electrical Specification V1.0 compliant (Sept. 2007), which supports all four data transfer types in USB2.0: control, isochronous, INT, and bulk transfers
• SDIO host: SDIO v2 host controller *SPI, not supported
• Embedded Microprocessor (CPU) [for chip internal data transfer control purpose only]
• I2C Master: Support for normal (100KHz), fast (400 KHz) and fast mode plus (1MHz, 100pf)
• I2S Master • UART • EPM (Electro permanent magnet) control • GPIO signals
Package: TBD
GP Bridge
CPU
UniProSM v1.60 (L1 - L4)
REFCLK 19.2MHz
HSIC1.0 Host
SDIO v2 host
PLL
Other Logic
I2C master
GPIO
Boot
SPI HSIC PHY
IF Bridge
PLL
M - PHY® Digital Logic
I2S master
UART
Buffer
EPM M - PHY® Tx (x2 ) M - PHY® Rx(x2 )
MIPI®, M-PHY® and UniProSM are trademarks, servicemarks, registered trademarks or registered servicemarks of MIPI Alliance, Inc.
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Bridge Chips Overview - Configuration variation
Basic configuration Feature-up configuration
Configuration can be varied when adapting much wideband data transferring modules as high spec cameras or displays
Wi-Fi is a registered trademark of Wi-Fi Alliance. / Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license. / LTE is a trade mark of ETSI. /M-PHY® is a trademark or registered trademark of MIPI Alliance, Inc.
Display
Application Processor
Camera
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Bridge Chips Overview - Configuration Variation
CSI Single use CSI Dual use DSI Single use DSI Dual use
CSI x1 / DSI x1 use on single AP bridge
CSI x2 / DSI x2 use on dual AP bridges
Close view of the previous page
AP Bridge
Camera Bridge Display Bridge
Display
Display
M-PHY® M-PHY® M-PHY®
M-PHY® M-PHY®
M-PHY® M-PHY®
Application Processor
Camera
Camera
Application Processor
M-PHY® is a trademark or registered trademark of MIPI Alliance, Inc.
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Bridge Chips Overview – Release Milestones
Q4
Q1
Q2
Q3
Engineering Samples
Data Sheet [Preliminary ver.]
Data Sheet
White paper [Product overview]
Toshiba Ara Bridge web-site starts*
Commercial Sample
2014
2015
Note: The schedules above mentioned are subject to change.
Copyright 2014, Toshiba Corporation.
REFERENCE MODEL IDEA Toshiba is planning to provide reference model or reference design of Ara modules to module vendors, by utilizing industry competitive elements with Toshiba bridge LSIs.
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Toshiba’s Plan Of Reference Modules for Project Ara
Toshiba plans to - supply Bridge LSIs and collaborate development with Ara team - provide reference design of modules to facilitate module makers’
developments
Ara Module
MDK
Support Request
Ara Phone & Module
Bridge Chips and Reference model
(=module)
Ara Store or
Retail seller Ara
Module Developer
Google is a trademark or registered trademark of Google Inc.
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Reference model (=module) Development Plan
• TransferJet™ Reference Module – GP Bridge + TransferJet™ : TC35420
• Activity meter Reference Module – GP Bridge + ApP Lite™ : TZ1011MBG
• Camera Reference Modules – AP Bridge + Computational Array Camera: TCM9518MD – AP Bridge + 13MP, FHD 240fps Camera: T4K82
TransferJet and TransferJet logos are licensed by the TransferJet Consortium. ApP Lite is a trademark of Toshiba Corporation.
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Depth Map Deep Focus Image
• Refocus • Size estimation • Extraction of any objects of
images • Gesture operation etc.
Computational array camera enables various apps
TCM9518MD
Dual 5 Mpix Cameras Preprocessor LSI
Application examples
“Computational Array Camera” Reference Module
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Preprocessor TC358842XBG
ISP AP Bridge
CSI-2 5MP RAW x2
CSI-2 13MP RAW + Depth MAP(VGA)
CSI-2 13MP YUV/JPEG + Depth MAP(VGA)
Dual 5MP camera Pre processing (Depth map)
Post processing
System Block Diagram
< 5mm
40mm
20mm
Module Design Image
18mm Pre- processor ISP AP Bridge
18mm
40mm
“Computational Array Camera” Reference Module Plan
TCM9518MD Module
Connector
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T4K82: 13MP image sensor, that is enabling “bright mode high quality slow motion video”
• 1/3” 13MP camera, 1.12um BSI pixels • High speed video: 240fps/1080i, 480fps/720i, 900fps/QVGA • x4 brighter images • Competitive low power consumption
13MP AF Camera
ISP AP Bridge
“13Mpix AF Camera” Reference Module Plan
T4K82 Module
Connector
Camera Module Design Image
Features
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“Close Proximity Wireless” Reference Module Idea
Easy operation Just touch, Data Transfer on w/o Internet connection
Close Proximity Radio 3cm distance Low Power transfer!
Ultra Fast Transfer Many pictures and Movie can be quickly transfer & share
Pictures few second transfer 30 pictures@3MByte
Movie few second transfer 100MByte video clip
Ultra fast Transfer
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“Close Proximity Wireless” Reference Module Idea
TransferJet is licensed by the TransferJet Consortium.
GP Bridge
OUTPUT 1.2
SDIO
1.8
Module Connector TransferJetTM
microSDIO Card TJM35420USQ
TransferJet™ module
μ-SD socket
20 Copyright 2014, Toshiba Corporation.
“Activity Meter” Reference Module Idea
TZ1011MBG
18mm
10mm
Module Design Image
Module Block Diagram Application Examples
Attach onto a wristband
TZ1011MBG ・ARM® Cortex®- M4F processor ・Bluetooth® Low Energy ・ 9 axis sensor
Jogging Calorie Consumption Light
exercise
Heavy Exercise Light exercise
No of steps : 9,123 steps (7.2km), TTL Power consumption 520kcal
ARM® and Cortex® are registered trademarks of ARM Limited in the EU and other countries. Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by Toshiba Corporation is under license.
Bluetooth®
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively
"Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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