Tool category - Rlabadviser.nanolab.dtu.dk/images/8/8a/Techforum_2020_1.pdf–EMI reduction near...

DTU NanolabMarch 10th 2020 Techforum 2020 #1

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DTU Nanolab

Tool category - R

• “R” for “Reserved” or “Nanolab Research”

• Maintenance by research group

• Not available for general use

• Used by others through research collaboration

• Visible to everyone in LabManager

• Cost of “0” kr/hour

Examples• Raith E-Line

• Nanoscribe 2PP system

• All tools in Phoeneex Lab

DTU Nanolab

Tool category - P

• “P” for “Prep” -307/314

• Decouple tools from “F” category

• Available for general use after proper training

• Visible to everyone in LabManager

• Cost like Cat-A for commercial, waiting for price calculations

Examples• Nanomill

• Quorum coater

• Softmatter sample prep


User Activity Report

user and project administration

5

User usage lifecycle:

Contact to NLAB Registration Usage Usage … Expired access ???

User Activity Report:

Monthly PDF sent to active users

Includes info about equipment usage, cleanroom access and supervised users.

Our goal: To help users get an overview AND receive info back if no longer true

Project administration:

-We will de-activate projects when not used for > 12 months.


Scheduled for decommissioning

• Noble Furnace – Has left the cleanroom

• Dielectric Evaporator – Has left the cleanroom

• Jipelec RTP – Hot swap

• Black Magic

• LEO-SEM/ELPHY (Re-located to building 425)

• KS Aligner

• Laurell Spinner

6


B307 basement Soft Matter Lab

• Soft Matter lab for:

– Sample preparation

– Cryo SEM and TEM

– No Cell Growth !!!

• Key requirements include:

– Temperature stability 1oC P-P/24hrs

– Humidity as low as 20% 100m2 (901,905,907)

• Technical Room in 909 for ventilation

access

Idea Users Funds Tender Contract FAT SAT Manual Released


NEW EQUIPMENT


New FIB System

Key Features we are looking at are :

– Automation for higher throughput and

consistency:

• TEM lamella liftout with Pick and

Place

• Auto Atom and Nano-probe

– Machine learning

– Auto alignment “CRITICAL”

– Extreme resolution for the Electron

beam at low kV


Example of a possible candidate


Cluster-Sputtering system from Kurt J LeskerRobotic cluster tool including new functionalities:

- 2 x PRO Line PVD75 sputter systems (PC1 & PC3)

- Separation: Metal oxides / Metal nitrides

- PC1: 6 x 3” magnetrons, DC/RF/pulsed DC/HiPIMS

- PC3: 1 x 4” + 2 x 3” magnetrons: DC/RF/pulsed DC/HiPIMS

- Distribution chamber (Genmark robot)

- Cassette station (10 wafer cassette)



Sputter-System Metal-Oxide (PC1)/Sputter-System Metal-Nitride (PC3)

11

6 sources (all 3’’)

PC1

3 sources (3’’,3’’ and 4’’)

PC3


Sputter-System: Front side + Load-lock (Operator)

12

Chip 4-inch wafer 6-inch wafer

Cassette station

(Up to 10 wafers)

Operation area Load lock with Cassette


Recipe name Material Pressure(mTorr) Power (W) Deposition rate

(nm/min)

Uniformity (%)

On 6-inch wafer

Comments

MD PC1 Src1 RF Upstream SiO2 3 140(RF) 2.3 0.5

MD PC1 Src2 RF Upstream SiO2 3 140(RF) 2.6 3

MD PC1 Src3 DC Upstream Ni 3 500(DC) 23.3 2.5

MD PC1 Src4 DC Upstream Cu 3 500(DC) 52.2 2.2

MD PC1 Src5 DC Al 3 200(DC) 7.9 3.2

MD PC1 Src5 Pulse DC

Downstream with Reactive O2 gas

Al2O3 (Al) 3 500(PDC)Frequency: 100Hz

Revers time: 2µs

1.7 3.4 Ar flow:50 sccmO2 flow:15 sccm

MD PC1 Src6 Pulse DC Upstream ITO 3 140(PDC)Frequency: 100Hz

Revers time: 2µs

11 4.5


Downstream with Reactive O2 gas

ITO 3 140(PDC)Frequency: 100Hz

Revers time: 2µs

11.3 - Ar flow:50 sccmO2 flow: 2 sccm

MD PC1 Src1 RF Upstream Si 3 120(RF) 1.8 -


Downstream with Reactive N2 gas

AlN (Al) 3 900(PDC)Frequency: 100Hz

Revers time: 2µs

29 3.2 Ar flow:50 sccmN2 flow:15 sccm

Sputter-System: Starting recipes / materials


Sputter-System Metal-Nitride (PC3): AlN sputtering

14

O1s

N1s

Al2p

Oxygen level below 1.5%

O1s

Surface oxidation

Bulk sample

XPS data of AlxNy by reactive pulsed-DC sputtering: (x,y) = (0.53 , 0.47)


Cu deposition using HiPIMS on Si trench (200 nm) Co-deposition of Cu (HiPIMS) and Ni (DC) on

structured 6’’ wafer (thickness 20 nm)

Sputter-System: High-Power Pulsed Magnetron Sputtering (HiPIMS)


Target

size

Available target material

3 inch Al

Au

Ag

Cu

Ni

Ti

Ge

Si

SiO2ITO

Cr

BaTiO3NbTi

4 inch Al

Contact Thinfilm group ([email protected]) to help creating the film that fits your needs.

Available Target Materials


PVD-200 ProLine Sputter Lesker system (bought used)

Stand alone sputter system:

- First installation: Primo 2018

- 4 x 4” magnetrons, DC/RF/pulsed DC

- Setup for ITO & Ni deposition

- Up to 8” wafer transfer

- Setup done by Lesker-US (Pittsburgh)



Twin-Pegasus

Pegasus 3

DRIE (Si) – 6”

High-throughput

Cassette-Cassette

”Workhorse”

Pegasus 4

DRIE (Dielectrics) – 6”

Reconfigure (Dielectrics)

High-throughput

Cassette-Cassette

”Workhorse”

Installation on-going

CPX Platform

twin vacuum cassette cluster (Brooks handler)

- Main issues:

Same handler problem as Peg-3

Gas manifold for H2/CF4 –

Waiting for spare parts

/ gas-install

- Main issue:

Robot-handler (Aligner)

“Sort of working” –aligner off


Pegasus 3 process development in progress

Some recipes being transferred from Pegasus 1 to Pegasus 3:‘Conventional’ recipes like Poly.SOI.4a: 25 cycles on silicon wafer with DUV lithography pattern

• ‘DREM’ types with picoscope process monitoring require much more optimizationbut the whole setup is ready.

• Do you need any specific processes to be available – please let us know!!

• Working on the alignment issues at the same time

Poly.SOI.4a DEP Etch

Duration (s) 2.5 5

Pressure (mtorr) 10 10

C4F8 (sccm) 50 10

SF6(sccm) 0 70

O2(sccm) 0 5

Power (Cl/Pl) 600/0 400/1@1,

1@100

Temperature (oC) 20

Peg 1: 100 mm waferPeg 3: 150 mm wafer



Standard RTP system Jipelec JetFirst 200C (ECM)

Jipelec JetFirst 200C (ECM)

Purpose/specs:

Replacing current Jipelec system (semi-swap)

- Cold-wall system (water cooled stainless steel)

- Temp range: ambient to 1000 C (1200 C for 1 min)

- Temperature control: TC & Pyrometer

- 3 gas lines (MFCs) + purge line

- Dry pump (nXDS6i scroll)

Status: Delivered 9 March


Characterization in 346 basement

DTU NanolabMarch 10th 2020 Techforum 2020 #1 22


XPS-2: Thermo Scientific Nexsa

Specs:

Measuring techniques: XPS (ARXPS), UPS (ARUPS), ISS,

REELS, Raman spectroscopy

Highly automatic, user friendly, high throughput

Status: Commisioning starting 10 March



Powder XRD outside cleanroom

”Mini Tender”: Aeris Benchtop XRD from

Malvern Panalytical

Powder XRD

• Dedicated for powder analysis

• Crystal structure analysis: phase identification,

crystallinity, piezoelectricity, mechanical strength, conductivity

• Incl. 6 pos. Sample changer (various holders) + Hi Temp stage (500 C)

• Easy to use

• Located in ”Hawaii Lab” (XPS room in 346)



HF vapour phase etch• Isotropic oxide etch

• Aluminium/polysilicon as mask

• Tool installed and accepted

• Need external F gas sensor – portable for now

• Expected ready Q2 2020



Aligner: Maskless 03 (MLA3)

• Chips, 2, 4, 6 inch – no 8 Inch

• Only 405 nm – no 375 nm

• Only pneumatic focus – no optical focus

• 1.0 µm lines in 0.5 µm resist

• BSA ca. +/- 1 µm

• 4” wafer: ca. 10 min

• Fast, less accurate supplement to MLA3

• Not suitable for nLOF and SU-8

• Open for training



Increased capacity for stepper resist and developer

• Upgrade 1 liter resist canisters to 3.8 litres (1 gallon)

– New canisters

– New chemical cabinet

– All-Süss solution

– Under installation

– Ready next week

• Upgrade TMAH tanks to autofill

– Only autofill system from Süss

– 200 litre TMAH supply station

needs design

– Ready Q42020


FACILITY


Light rail

28

• Very good news

– Vibration damping near cleanroom, -12 dB

– EMI reduction near cleanroom (Siemens patent), -66% => max ca. 550 nT

• Still need larger EMI cancellation system for e-beam

• Still need cancellation systems for SEMs

• But challenge is getting easier

• A million thanks to ”Light Rail Laila”


UPS on the entire B346

29

or

• CapEx: 6.5 mill DKK

• OpEx: Ca. 125.000 DKK/yr (loss+service)

• 2 x 35 m2 in basement

• CapEx: 11.8 mill DKK

• OpEx: Ca. 375.000 DKK/yr (loss+service)

• 105 m2 new building in P-space

• Funds provided by Nanolab and CAS

• Will be carried out in Q42020 or later


FFU

30

• 3 candidates

– 2 refurbishment solutions

– 1 new FFU

• Power savings

• Interesting noise measurements

• Next step: Install the 3 candidates in F-2 (”SEM City”)

• Aim for stepwise FFU exchange – if possible

• Maybe late in 2020


Shelf space

31

• 350-400 cleanroom

users

• User shelves filled up

• No space for more

shelves


Many users/groups are no longer active in the cleanroom

32


Two years ago: Users ”cleaned up” themselves

33


The shelf space challenge

34

• Increasing number of users in decreasing space

• Many users/groups fail to clean up their shelves

• Many “wafer tombs”

• Cleanroom shelves are only for work in progress

• A solution is urgently needed


Suggestion – Shelf space per user

35

• Shelf section for

dedicated user

• When user expires the

section is emptied by

Facility

• Not enough dedicated

space for all users

• 3 weeks students don’t

need shelves

• Other ideas?


Take home messages

36

• Expanded characterization capabilities outside

cleanroom

• Activity reports

• The shelves will become tidy

Tool category - Rlabadviser.nanolab.dtu.dk/images/8/8a/Techforum_2020_1.pdf–EMI reduction near...

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