TM Burn-in & Test Socket Workshop · Rubbing two non conducting materials together. BITS 2005...
Transcript of TM Burn-in & Test Socket Workshop · Rubbing two non conducting materials together. BITS 2005...
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Burn-in & TestSocket Workshop
ARCHIVE
March 6-9, 2005Hilton Phoenix East / Mesa Hotel
Mesa, Arizona
TM
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Burn-in & Test SocketWorkshop
COPYRIGHT NOTICE• The papers in this publication comprise the proceedings of the 2005
BiTS Workshop. They reflect the authors’ opinions and are reproducedas presented , without change. Their inclusion in this publication doesnot constitute an endorsement by the BiTS Workshop, the sponsors,
BiTS Workshop LLC, or the authors.
• There is NO copyright protection claimed by this publication or theauthors. However, each presentation is the work of the authors and
their respective companies: as such, it is strongly suggested that anyuse reflect proper acknowledgement to the appropriate source. Anyquestions regarding the use of any materials presented should be
directed to the author/s or their companies.
• The BiTS logo and ‘Burn-in & Test Socket Workshop’ are trademarksof BiTS Workshop LLC.
TM
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Burn-in & TestSocket Workshop
tm
Hot Topics SessionTuesday 3/08/05 3:30PM
CONTROLLING ESD“Methods Of Preventing ESD In Module Testing”
Zen Podpora – IBM Microelectronics Qifang (Michelle) Qiao – IBM Microelectronics Patrick Rafter – IBM Microelectronics
“New ESD Control Polymers”Naomitsu Nishihata – Kureha Chemical Industry Co., Ltd.
Technical Program
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METHODS OF PREVENTING ESD IN
MODULE TESTING
2005 Burn-in and Test Socket Workshop
Zen PodporaMichelle QiaoPatrick Rafter
Contacting Systems EngineeringIBM Microelectronics
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BITS 2005 Methods of preventing ESD in module testing.
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Objectives
• ESD overview
• Impact of ESD on module test
• Methods of ESD prevention
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Agenda
• What is static electricity• Causes of static charge buildup• Impact of ESD on product and test
equipment• Conventional ESD prevention methods and
their deficiencies• IBM ESD socket design
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What is Static Electricity?
• Simply electricity at rest– No current flowing
• Surface phenomenon– Static charge is dependent on surface area
• Coulomb's law; F = k (Q1 X Q2) / d2
– Electric force between charges at rest
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Static Charge Buildup
• Electric phenomenon in which intimate contact transfers charged particles from one body to another
Rubbing two non conducting materials together
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Static Charge Buildup
• Only insulative materials build up static charge– Insulative material surface resistivity
> 1012 ohms / sq
• Socket components comprise insulative materials– Static charge build up from module insertion into
socket
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Static Charge Buildup in Socket
insulator
Electrostatic charge build up during module insertion
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Electrostatic Discharge [ESD]
• Common ESD events– Lightning– Walk across the rug
and reach doorknob
• Module test events– Charged operator
reaching IC module– Charged socket
discharging thru the tester
Discharge of build up of static electricity
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Common Causes of ESD Damage
• Human Body Model (HBM) <0.10%– Improper grounding– Faulty personal protective equipment– Not following ESD procedures
• Charged Device Module (CDM) >99.9%– ESDS transportation– Air blow-off operations– IC handling equipment
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Impact of ESD
• Electrostatic Discharge (ESD) destroys electronic hardware – Immediate failures - distractive damage
• Direct-current resulting in junction burnout, shorts, dielectric breakdown, and metallization melt
– Latent failures (field failures), days, weeks, months later
• ESD creates problems which cost industry billions of dollars per year
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Conventional ESD Prevention• Grounding
– Personnel– Equipment
• Ionization– Ionizing units neutralize charged particles
• Use of resistive materials – Surface resistivity 106<->109 ohms (carbon mix)
• Humidity control– Relative humidity greater than 50% will minimize
ESD problems
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Problems with Conventional ESD Prevention
• Resistive materials• Non uniform carbon distribution (hot pockets)• Leakage currents
• Humidity control• Condensation problem at low temp test
• Grounding• Operators bypass ESD procedures
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IBM ESD Socket
insulator
conductor
No static charge buildup at module insertion
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IBM ESD Socket• Alignment plate frame
– Made from conductive material [< 104 ohms/sq]
– Will not store electric charge
• Alignment plate grid– Made from insulative
material [> 1012 ohms/sq]
– Will not cause leakage currents
conductor
insulator
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ESD Facts
• CMOS chips damage <> as little as 50V• If you feel a ‘shock’ <> at least 3kV• Walking across a carpet <> 1.5kV to 35kV • Brushing your hair <> 1.2kV to 27kV
• Not getting ZAPPED <> priceless
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Reference Materials
• Basics of Static Electricity by Ron Kurtus (revised 28 August 2004
– www.school-for-champions.com
• The Most Common Causes Of ESD Damage by Roger J.
Peirce, ESD Technical Services
– http://www.evaluationengineering.com/default.asp
• WHAT IS STATIC ELECTRICITY? by SCIENCE MADE SIMPLE
– http://www.sciencemadesimple.com/index.html
• What is ESD ? By Research Machines plc
– http://www.rm.com/
• ESD Is Shocking Experience for Electronics by Ron Brewer,
Instrument Specialties, P.O. Box 650, Delaware Water Gap, PA 18327, (570) 424-8510.
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New ESD Control Polymers
2005 Burn-in and Test Socket WorkshopMarch 6 - 9, 2005Burn-in & Test
Socket Workshop
TM
Naomitsu Nishihata
Kureha Chemical Industry Co., Ltd.
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Agenda
• What is ESD• Material for socket• Technology review• New technology• Sample preparation• Characterization• Conclusion
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What is ESD
An ESD occurrence requires all three events:
Charge generation
Charge accumulation
Rapid discharge
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What is ESD
Human Body Model: Discharged from operators
Charged Device Model: Device charged up and pins contact ground.
Machine Model: Discharge from machine members
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Material for socket
• Temperature considerations– Test: -55oC to 150oC?
• Machinability• Leakage current threshold• ESD control properties
106-1011 ohms/sq.Strictly controlled resistance
• CleanlinessLow out-gassingLow metal contamination
• Wear properties
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Technology review of materials
Conventional Materials
• Carbon material-filled compound • Metal filled-compound• Antistatic agent added polymer• Antistatic polymer blend
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Technology review of materials
PoorLimited useLimited useAntistatic
polymer blend
PoorPoorLimited useAntistatic agent
GoodLimited useUnstableMetal
GoodGoodUnstableCarbon
Heat and
chemical
resistance
CleanlinessESD control
properties
Technology
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New Technology
• Combine a special carbon material having moderately conductive resistance with a polymer.
• Optimize production process
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Sample preparation
• Polyetheretherketone resin (PEEK) • Special carbon with resistivity of 107 108 and 109
ohms/sq. • PAN-based carbon fiber
Raw Materials
• Raw material blend• Extrusion • Injection molding• Characterization
Procedure
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Characterization
• Resistance vs carbon content• Resistance fluctuation • Resistance change against applied voltage• Resistance of inner layer• Static decay time vs resistance• Residual peak voltage vs resistance• Peak current analysis on ESD• Leak current analysis of a socket• Other properties
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Resistance of Composites
1.E+00
1.E+02
1.E+04
1.E+06
1.E+08
1.E+10
1.E+12
1.E+14
10 15 20 25 30 35 40
Carbon content (%)
Sur
face
resi
stan
ce (
ohm
s)
PEEK/Special Carbon
PEEK/CF
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Resistivity Fluctuation
Diameter of guide electrode : 9mmApplied voltage : 10V, 100V, 500V
100mm
1 2 3
4 5 6
7 8 9
GATE
3mm
electrode
electrodeCurrent measure part
64mm
ESD-STM11.11
9 mm
Small type
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Resistivity Fluctuation
1.E+05
1.E+07
1.E+09
1.E+11
1.E+13
1 2 3 4 5 6 7 8 9Position
Su
rfac
e re
sist
ance
(o
hm
s)
PEEK/Special Carbon
PEEK/CF
Applied voltage: 100V
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Resistivity vs Voltage
1.E+05
1.E+07
1.E+09
1.E+11
1.E+13
1.E+15
1 10 100 1000
Applied voltage (V)
Su
rfac
e re
sist
ance
(o
hm
s)
PEEK/Special Carbon
PEEK/CF
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Resistivity of Inner Layer
1.E+00
1.E+02
1.E+04
1.E+06
1.E+08
1.E+10
0 0.5 1 1.5Machined amount (mm)
Su
rfac
e re
sist
ance
(o
hm
s)
PEEK/Special Carbon
PEEK/CF
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Static decay time
SDT measurement using Charged Plate Monitor
Static decay time•The static decay time from 1000V to 5V was measured using charged-plate monitor.
1000V electric source + monitor
ground+ sample
clip
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Resistance vs Voltage
0
400
800
1200
1600
2000
1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13Surface resistance (ohms)
Sta
tic D
ecay
Tim
e(m
s)
1000V to 10V
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Hot spot voltage test
sample
Charged Plate Monitor
+
sample
Surface electrometer
Hot spot voltage
• To search insulative spots on the surface
• To evaluate homogeneity by measuring residual voltage after discharging.
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Hot spot voltage
0
200
400
600
800
1.E+05 1.E+07 1.E+09 1.E+11 1.E+13Surface resistance (ohms)
Res
idua
l pea
k vo
ltage
(V
)
PEEK/Special Carbon
PEEK/CF
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Peak current analysis
1000V
+
Power supplyOscilloscope
•Generated current on ESD provides a serious damage to devices.
•Magnitude of peak current on ESD is estimated by monitoring wave form during discharging.
sample
Charged Plate Monitor
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Peak current analysis
0
200
400
600
800
1000
1200
1400
1.E+02 1.E+04 1.E+06 1.E+08 1.E+10
Surface resistance (ohms)
Pea
k cu
rren
t (m
A)
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pA
InsulatorSpecimen
Pin-Probe
Hi Resistance Meter 4439B5V
0.56mm
0.8mm
Measurement point
Schematic of Current analysis
321 2 3Row number
Col
umn
num
ber
Leak current analysis
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Leak current analysis
1 5 10 15 20 25 30Column number
Lea
k cu
rren
t(n
A)
0.1
101st row
10th row
0.001
1
0.01
20th row
×× × ××
××
××
×××× ××
△
×
△△△ △△ △△ △ △ △
△△△ △
△
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Other properties
1.51.51.5-Coefficient of linear thermal expansion 30ºC-140ºC
280305305ºCHeat deflection temperature 1.82MPa
125125125M scale
Rockwell hardness
135
1.31
EKH-SS09
110140MpaTensile strength
1.311.33-Specific gravity
EKH-SS11
EKH-SS07
UnitsProperties
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Other properties
0.170.210.22Dielectric loss tangent 1MHz
5.36.67.9-Dielectric constant 1MHz
260260260ºCContinuous service temperature
107-9
2
EKH-SS09
109-11106-7ohmsSurface resistance
5-kV/mmDielectric strength
EKH-SS11
EKH-SS07
UnitsProperties
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Conclusion
• The ESD control materials having the surface resistivityat specific levels within a range of 106 to 1011 ohms were obtained by using the technology.
• The surface resistance fluctuation was very small and the surface resistance change against applied voltage was small.
• The suitable surface resistance range of ESD protection for socket was estimated in the range of 108
to 1011 ohms from various ESD characterization.