ThM Driving Differentiated Solutions with FD-SOI final (1)
Transcript of ThM Driving Differentiated Solutions with FD-SOI final (1)
Driving Differentiated Solutions with FD-SOI for Demanding MarketsDr. Thomas Morgenstern | SVP and General Manager, GLOBALFOUNDRIES Dresden
We are facing new levels of complexity in our world and in our industry
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2D2D3D3D
Our dimensions of innovation are 3D as well
Differentiated Silicon
Scaling at the Bleeding Edge
System Level Differentiation
FinFET Nanowire Vertical FETEUV
Power Analog Mixed Signal
RF SOI & SiGe
FD-SOI
ASICS
Si Photonics
Embedded Memory
Adv Pkg (2.5/3D)
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Source: Gary Patton, Semi ISS, January 2017
The dimensions of innovation … and today’s focus
Differentiated Silicon
Scaling at the Bleeding Edge
System Level Differentiation
FinFET Nanowire Vertical FETEUVSi Photonics
Embedded Memory
Adv Pkg (2.5/3D)
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Source: Gary Patton, Semi ISS, January 2017
Power Analog Mixed Signal
RF SOI & SiGe
FD-SOI
ASICS
Welcome to GLOBALFOUNDRIES Fab 1 in Dresden
Former AMD Fab From 180 to 65nm Single product & technology: CPU
From 45 to 28 to 22nm SoCs Multiple products & technologies Focus on Computing &
Communication
Lead site for FDX Tech. Platform Integration of RF, eNVM,
mmWave, etc. for Automotive,IoT, Security, SME
1996 - 2009„More Moore“
> 2017„More thanMoore (andmuch more)“
2010 – 2017Still „More Moore“
Some Facts & FiguresEurope’s largest 300mm fab> 50k m2 clean room> USD 12Bill investment 1996 to 2017> 3 Mio 28nm Wafer shipped> 3,000 employees from 50 nations
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Exciting Growth Markets for Differentiated Silicon
NETWORKSConnect
COMPUTATIONLearn
‘SMART’THINGS
Sense & Act
STORAGERemember
Mobility
$173B(2%)
$450B Devices
Semiconductor content
Wireless Infrastructure
$9B(4%)
$54B Equipment
Semiconductor content
AR/VR
$7B(42%)
$32B Hardware
Semiconductor content
Data Centers
$88B(13%)
$149B Complete platforms
Semiconductor content
Automotive
$61B(10%)
$207B Electronics
Semiconductor content
IoT
$48B(23%)
$708B Endpoints
Semiconductor content
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All TAMs refer to 2022 and CAGRs (in parentheses) to 2017-2022. Data centers assumed to include 50% of storage, routers, and switches, and 100% of servers. Mobility includes only mobile phones, laptops, tablets, and other wireless communications (such as portable radios). Sources: (1) AR/VR: GF estimates from Prescient Strategic Intelligence June 2018 AR/VR system data and Gartner Q1 2018 AR/VR system and semiconductor data. (2) IoT: Gartner Jan and Dec 2017 data. (3) All Others: Average of IHS June 2018 and Gartner July 2018 forecasts.
FDX: The ideal platform for IoT and AI/ML
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Application Tiers
• IoT: ARM™, RISC-V processors for NB-IoT and AI – ML functions• RF: <6GHz connectivity (BLE/15.4, Wi-Fi, Zigbee), cellular (3G, 4G LTE, 5G)• Automotive: ADAS / vision, infotainment, body electronics MCU, radar
Technology Capabilities
• Lower dynamic and leakage power
• Logic: 80% lower total power vs. 40nm; operation down to 0.4V• Memory: 1pA cell standby & 0.28V retention voltage
• High performance RF/LDMOS, mmWave, analog capability (>400GHz) • Body-bias driven power management• eMRAM for non-volatile memory
Value
• Single chip solution, balance of power, performance and cost• Ability to integrate value added solutions• Fab 1, Dresden is offering value added solutions
FDX competitive performance
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At lower cost and process complexity
0,2
0,4
0,6
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1,0
1,2
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PERFORMANCE
0102030405060708090
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MASK COUNT
FinFET performance & power
Superior Analog/RF Performance on demand
40% fewer masks than 10LPP
66% more development learning cycles
FDX platform differentiation: automotive, RF, mmWave
FDX™ can save at least 50% power consumption for mmWave frequencies.
0,0E+00
5,0E+11
1,0E+12
1,5E+12
2,0E+12
2,5E+12
3,0E+12
3,5E+12
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1,E-02 1,E-01 1,E+00 1,E+01 1,E+02 1,E+03
Fmax
*gm
/I (H
z/V)
I/w (uA/um)
mmWave Performance Comparison
22FDX
FinFET
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Fab 1, Dresden, Germany
22FDX Early Production• 500MHz at 0.4V
• Highest Ft/Fmax for 5G/mmWave
• Lowest power consumption for 5G & 77GHz Radar
12FDX Tech Development• Full node scaling benefit
• Client applications, edge-node AI, AR/VR, 5G, & ADAS
RFmmWave
eNVM
RFmmWaveeMRAM
22FDX®
12FDX™
28nm40 / 55nm
22FDX auto qualified, ready for production
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Dresden, Fab 1 automotive certified
22FDX fully qualified for automotive Grade 2
AEC Q-100; with ambient temp up to 105°C
Prototyping ongoing, automotive production tapeout
22FDX and Arbe Robotics 77GHz high resolution radar chipset
Features high voltage, eNVM auto grade, RF, mmWave
Q1 2018
Q3 2018
ADAS & Autonomous - Enabled by A Full Range of GLOBALFOUNDRIES Technologies
© 2018 GLOBALFOUNDRIES 11
22FDX® - SiGe Long Range RadarDresden / Burlington
CMOS - SiGe - LIDARDresden / Singapore / Burlington
28-22FDX CameraDresden
40nm-22FDX Short Range RadarSingapore / Dresden
Processor
22FDX – ADAS ProcessorDresden
14LPP - Autonomous ProcessorMalta
What perceptions have changed since 2016
• GF’s roadmap strategy is resonating with the industry
• IP availability is richer and more mature
• Designers are embracing FD-SOI as a complementary technology to FinFET
What clients are saying about FD-SOI: then vs. now
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Source: VLSI Research 2016 & 2018; FD-SOI / 22FDX Customer Survey
Performance
Power
RF
Better RF / MXSL integration
Fmax > 350GHz
ULV lo Vdd-Vmin
Body biasing
BB dynamic power
BB: wide range of Vdd corners
RF MM wave
Body biasing oversold
0 20% 40% 60%
2016
2018
Top product reasons to use FD-SOI
Marketplace validation of 22FDX
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>$2B design revenue, with >50 client DWINs around the world
IoT (Wireless,Cellular) 18 6 5 5 2
Industrial/Consumer 7 4 1 2
Auto 3 1 2
Networking (5G, AI/ML, Optical) 10 1 5 3 1
A&D 4 1 3
Cryptocurrency 7 1 1 5
Mobile (AP/WiFi/5G) 1 1
DWINs
22FDX Productization in Fab 1 – Proto Run Rate for Time to Market
Turbo Proto on customer demand
STD Proto w/ different complexity
Split FEOL/BEOL TOOn customer demand
- 0.65 dpml possible on customer demand- Std proto pending on complexity (mask number, device suite) ~0.95 dpml- Monthly shuttle and customer shuttle in 2018- Q4-2018 new modules RF/mmWAVE enabled via TD test chips
22FDX Product Yield Summary
▪ Product yields across a wide range of voltage, die size, and memory and logic content
GLOBALFOUNDRIES Confidential
High product yields confirming good test chip results across application rangeAuto, RF, Network, dense SRAM heavy, w/ and w/o ABB
• Cryptocurrency• ~95% yield
(D0 0.04)• [email protected]• Using ABB• Fab 1 C4/SORT
• Cryptocurrency• w/ 144Mb
SRAM HD P110• 89% yield • OSAT SLT
• Cryptocurrency• ~97% Yield, (D0
0.04)• [email protected]• OSAT SLT
• Auto MCU• ~84% yield
(D0 0.04)• Fab 1 C4/SORT
Product A Product B Product C Product D
• Mobile/RF <6GHz• Chip functionality
verified at blind-build module level
• OSAT SORT.
Product EIn ramp
• Network Processor
• Chip functional, runs at 800MHz
• OSAT SORT
Product FIn ramp
…
Fab Readiness for 22FDX
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Fab1 delivering rapid production ramp with best-in-class manufacturing control benefits
Rapid capacity ramp
Delivering benchmarkmanufacturingvariability control
FD-SOI is a technology with strong European roots
17© 2018 GLOBALFOUNDRIES
We are advancing European value chains with FD-SOI
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Industry Auto Energy Security Aerospace Logistics
GlobalFoundries’ China strategy
Intensify focus on differentiated offerings for China customers
• Growing demand on 5G connectivity, IoT, auto, AI in China
• 22FDX is power and cost optimized for these high-growth applications
Creating a global and China FDSOI ecosystem to accelerate 22FDX market development
• Enable IP, EDA and design services
• Support unique ecosystem for China design teams
• Continue strong partnership with Chengdu to drive 22FDX market adoption
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We are working with our Chinese partners to extend the success of 22FDX
DresdenDresden ChengduChengdu
DesignServices
EmbeddedSoftware
EDATest
IP
SystemIP
OSAT
Ecosystem partners are here for our FDX
ASIC
Universities
FD-SOI ecosystem growth:
7 47 752016 Q3 2018 Q2 2018 Q4
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Take-away on FD-SOI
• It‘s time has finally come as new markets begin to demand energy efficient, highly performant and cost sensitive solution
• Our FD-SOI platform allows even more differentiation with VAS (RF, mmWave, HV, etc)
• GF Fab 1 Dresden is on its way with 22FDX The Technology is ready
The Fab is ready
The Market is ready
• The value proposition is gaining momentum
… and we are only beginning
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