THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G....
-
date post
20-Dec-2015 -
Category
Documents
-
view
213 -
download
0
Transcript of THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G....
![Page 1: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/1.jpg)
THERMODYNAMICS OF LEAD FREE THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Bi-Sn SOLDER ALLOYS WITH Ni and
CuCu
S. Amore, S. Delsante, E. Puzo, G. Borzone
Department of Chemistry and Industrial Chemistry (DCCI)
University of Genoa (Italy)
![Page 2: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/2.jpg)
IntroductionIntroduction
• Interactions between Pb-free solder alloys and substrates
Final Meeting COST Action 531 Vienna 17-18 May 2007
Solder system
Bi-SnBi-Sn
Solder system
Bi-SnBi-Sn
Substrates
Ni, CuNi, Cu
Substrates
Ni, CuNi, Cu
Study of the interfacial reaction between Bi-Sn alloy and Ni, Cu substrate
Study of the wetting properties (contact angle and interfacial reaction) of Bi-Sn system on Cu and Ni
Comprensive understanding of the phase equilibria and thermodynamic properties
Measurments of partial Measurments of partial enthalpy at infinite dilution of enthalpy at infinite dilution of solid Ni and Cu in liquid Bi-Snsolid Ni and Cu in liquid Bi-Sn
On going On going
@IENI-CNR @IENI-CNR GenovaGenova
Literature Literature worksworks
This workThis work
![Page 3: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/3.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
ExperimentalExperimental
Dissolution Calvet CalorimeterDissolution Calvet Calorimeter
•Pure Ar flux (6l/h)
•Graphite crucible
•Ta getter
•Real time acquisition of Heat Flow, calorimeter temperature (S-type thermocouple) and room temperature (K-type thermocouple); scan rate 1s
SamplesSamples
•Pure elements mechanically a chemically cleaned
•Mass of bath about 20g
•After each experiment thermodynamic equilibrium checked by SEM-EDS analysis
Appropriate software in LabView environment
![Page 4: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/4.jpg)
Bi-Sn-X (X=Ni,Cu) systemBi-Sn-X (X=Ni,Cu) system
Final Meeting COST Action 531 Vienna 17-18 May 2007
Ni-SnBi-Sn
Bi-Ni Cu-Sn
H. Ipser, et al, J Mater Sci: Mater Electron (2007) 18:3–17
TB Massalski Binary Alloy Phase Diagrams vol 1,2
![Page 5: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/5.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
Literature DataLiterature Data
H. Ipser, H. Flandorfer, Ch. Luef, C. Schmetterer,U. Saeed, J Mater Sci: Mater Electron (2007) 18:3–17
Integral enthalpy of mixing Sn-Ni systemIntegral enthalpy of mixing Sn-Ni system
Partial Enthalpy of mixing of Ni in liquid Sn at T=773
K approx -60kJ/mol
![Page 6: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/6.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
Bi-Sn-Ni experimental resultsBi-Sn-Ni experimental results
T= 820 K
x(Ni)
0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.020
solH
° [k
J/m
ol]
-40
-20
0
20
40
x(Ni)
0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.020
solH
° [k
J/m
ol]
-40
-20
0
20
40
Nominal composition of the bath Bi-57at%Sn
Drop of Ni with 0.01g<mNi<0.03g
0<x(Ni)<0.015
4 different runs in same conditions
Partial enthalpy of mixing at infinite dilution for Ni in liquid Bi-57at%Sn alloyPartial enthalpy of mixing at infinite dilution for Ni in liquid Bi-57at%Sn alloy
( 20.4 1.0) /solH kJ mol
![Page 7: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/7.jpg)
Bi-Sn-Ni experimental resultsBi-Sn-Ni experimental results
Final Meeting COST Action 531 Vienna 17-18 May 2007
Calorimetric sample after measure at T= 820 K
Bi36at%-Sn63at%-Ni1at%
Change of the composition due to the
evaporation of Bip0
Bi (T=800K) ≈ 4 10-8 atmp0
Sn (T=800K) ≈ 4 10-10 atm
NiNi33SnSn44
Eutectic at 57at%SnEutectic at 57at%Sn
![Page 8: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/8.jpg)
Bi-Sn/Ni interfacial reactionBi-Sn/Ni interfacial reaction
Final Meeting COST Action 531 Vienna 17-18 May 2007
J. Wang, H.S. Liu, Z.P. Jin, J. Electronic Materials 35 (2006) 10
T=423K
Bi-91at%Sn
Bi-64at%Sn
Bi-43at%Sn
![Page 9: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/9.jpg)
Bi/Ni interfacial reactionBi/Ni interfacial reaction
Final Meeting COST Action 531 Vienna 17-18 May 2007
V.I. Dybkov, K. Barmak, w. Lengauer, P. Gas, Journal of Alloys and Compounds 389 (2005)
T=423K
Pure liquid Bi in contact with solid
Ni
Formation of the NiBi3 phase
![Page 10: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/10.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
Bi-Sn-Ni experimental resultsBi-Sn-Ni experimental results
“Calorimetric” sample after measurement at T= 820 K
NiBiNiBi33
NiNi33SnSn44
Bi36at%-Sn63at%-Ni1at%
![Page 11: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/11.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
Bi-Sn-Ni experimental resultsBi-Sn-Ni experimental resultsSample annealed at 820 K and then quenched in cold water
NiNi33SnSn44
Primary cristalsPrimary cristals
Bi37at%-Sn62at%-Ni1at%
Change of the composition due to the
evaporation of Bip0
Bi (T=800K) ≈ 4 10-8 atmp0
Sn (T=800K) ≈ 4 10-10 atm
![Page 12: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/12.jpg)
x(Cu)
0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.020
solH
[kJ/
mol
]
-40
-20
0
20
40
Final Meeting COST Action 531 Vienna 17-18 May 2007
Bi-Sn-Cu experimental resultsBi-Sn-Cu experimental results
x(Cu)
0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.020
solH
[kJ/
mol
]
-40
-20
0
20
40
T= 820 K
•Bi-57at%Sn + Cu
•4 different runs in same conditions
•0<x(Cu)<0.018
(8.9 1.0) /solH kJ mol
Partial enthalpy of mixing at infinite dilution for Cu in liquid Bi-57at%Sn alloyPartial enthalpy of mixing at infinite dilution for Cu in liquid Bi-57at%Sn alloy
![Page 13: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/13.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
Bi-Sn-Cu literature dataBi-Sn-Cu literature data
H. Ipser, H. Flandorfer, Ch. Luef, C. Schmetterer,U. Saeed, J Mater Sci: Mater Electron (2007) 18:3–17
Integral enthalpy of mixing Bi-Sn-Cu systemIntegral enthalpy of mixing Bi-Sn-Cu system
The literature data of the integral enthalpy of mixing confirm the endothermic value of the partial enthalpy of mixing of Cu in liquid Bi-Sn at a composition near to the eutectic
8000
6000
4000
2000
0
so
lH°[
kJ/m
ol]
1.00.80.60.40.20.0x(Cu)
![Page 14: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/14.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
Bi-Sn-Cu experimental resultsBi-Sn-Cu experimental results
“Calorimetric” sample after measurement at T= 820 K
-phase Cu-phase Cu66SnSn55
Eutectic at 57at%SnEutectic at 57at%Sn
Bi36at%-Sn62.5at%-Cu1.5at%
Primary cristalsPrimary cristals
![Page 15: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/15.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
Bi-Sn-Ni experimental resultsBi-Sn-Ni experimental resultsPartial enthalpy of mixing at infinite dilution for Ni and Cu in liquid Bi-61at%Sn alloyPartial enthalpy of mixing at infinite dilution for Ni and Cu in liquid Bi-61at%Sn alloy
x(Ni,Cu)
0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.018 0.020
solH
[kJ/
mol
]
-40
-20
0
20
40
Cu
Ni
(8.9 1.0) /solH kJ mol
( 20.4 1.0) /solH kJ mol
![Page 16: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/16.jpg)
Final Meeting COST Action 531 Vienna 17-18 May 2007
ConclusionsConclusions
ResultsResults Exothermic partial enthalpy of mixing of Ni in liquid Bi-Sn at composition near to the eutectic
Endothermic partial enthalpy of mixing of Cu in liquid Bi-Sn at composition near to the eutectic
DifficultiesDifficultiesChange of the composition due to the evaporation of Bi during the experiment
Future WorkFuture Work
Measurements of the partial enthalpy of mixing for Bi-Sn-X (X=Cu,Ni) at different temperatures
Study of wetting behaviour of Bi-Sn alloys on Cu and Ni substrates
![Page 17: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/17.jpg)
Prof. Gabriella BorzoneProf. Gabriella Borzone – Group leader
Dr. Nadia Parodi – Senior Scientis
Dr. Simona Delsante – Post Doc
Stefano Amore – Ph.D.
Enrico Puzo – SEM EDS technician
Università di GenovaDepartment of Chemistry and Industrial Department of Chemistry and Industrial
ChemistryChemistry
![Page 18: THERMODYNAMICS OF LEAD FREE Bi-Sn SOLDER ALLOYS WITH Ni and Cu S. Amore, S. Delsante, E. Puzo, G. Borzone Department of Chemistry and Industrial Chemistry.](https://reader035.fdocuments.us/reader035/viewer/2022062516/56649d4e5503460f94a2e944/html5/thumbnails/18.jpg)
Thank you for your Thank you for your attentionattention