Thermal Warpage System - Akrometrix
Transcript of Thermal Warpage System - Akrometrix
1-404-486-0880
• PCBs• Wafers• StackedDie
• IndividualDie• PopulatedBoards• Components• FanoutWafers
ON VIRTUALLY ANY SUBSTRATE
PS600SThermal Warpage SystemForFastThermalSurfaceTopography• Accommodates substrates
upto600mmx600mm• Field of View Measurement
in2seconds• With z resolutiondownto
0.85micron• Runs on the Akrometrix
StudioSoftwareSuite
PS600S Technical Specifications
VisionMeasurementTechnology ShadowMoiré
MaximumFieldofView(FOV)(mm) 600x600
MinimumFieldofView(FOV)(mm) 348x260
MaximumSampleSize(mm) 600x600
MinimumSampleSize(mm) 10x10
MaximumMeasuredSurfaceCoplanarity 4000microns
Resolution,Z-axis(verticaldisplacement) 3microns
Accuracy,Z-axis(verticaldisplacement) 2.5microns/3%
MaximumMeasurementPointsperAcquisition 1,447,680
MaximumMeasurementDensity(pointspermm²) 16
MinimumMeasurementDensity(pointspermm²) 4
ThermalProcessingTechnology RadiantIR
MaximumTemperature 300°C
MaximumHeatingRate°C/sec(from50°Cto250°C)* 2
MaximumCoolingRate°C/sec(from250°Cto125°C)* 1
Software AkrometrixStudio
DataExportFormats .dat,.txt,.png
SampleSet-uptime,typical 2minutes
Samplepreparationmethod,typical none
DataAcquisition(Measurement)Time,approximate 2seconds
DataAnalysisTimeperAcquisition,approximate 2seconds
1-404-486-0880
MaximumThermalProfiles Unlimited
MaximumThermalCyclesTime Unlimited
MaximumAcquisitionsperCycle Unlimited
AutomatedDataCollection yes
BatchDataAnalysis yes
AppromixateDepth,Width,Height(mm) 1214x1438x2154
AppromixateWeight(kg) 635
ElectricalRequirements 480VAC,1phase,50/60Hz,20ARating,21AFullLoad
AirRequirements N/A
OtherUtilities exhaust2800lpm
*ThermalRampratesbasedon27x27x1.4mmsubstratessample