COMPLETE TEARDOWN WITH:

• Detailed photos

• Precise measurements

• Material analysis

• Comparison between FLIR, Seek Thermal, Therm-App and Thermal Expert cameras

• Module manufacturing process flow

• Supply chain evaluation

• Manufacturing cost analysis

• Selling price estimation

• Comparison with previous generation

Thermal Expert Infrared Camera for Smartphones and i3system I3BOL384_17A Microbolometer

Title: Thermal Expert Infrared camera for Smartphones

Pages: 170 pages in 2 files

Date: August 2016

Format: PDF & Excel file

Price: Full report: EUR 3,490

Based on a high definition microbolometerfrom i3system, the Thermal Expert infraredca m e ra i s a h i g h - e n d p ro d u ct forsmartphones . A more conser vat ivetechnological choice, the microbolometer ism o r e ex p e n s i ve b u t o f fe r s b e tterperformance. The camera also embraces thequality approach with interchangeable

The highest resolution thermal camera for smartphones at 384 x 288 pixels, using a microbolometer with 17µm pixels from the South Korea’s i3system.

lenses for different uses. I3system targets the professional market andcompetes more in standard IR cameras than IR cameras for smartphones.

The Thermal Expert camera is very compact and compatible with Androidsmartphones via its micro-USB-OTG connector. The camera does not use abattery, with power being supplied by the smartphone. The camera isshutterless.

The thermal camera uses a new 17µm pixel design from i3system. TheI3BOL384_17A microbolometer features 384 x 288 pixel resolution, 6 timesthe resolution of the FLIR Lepton 3. The sensor technology in the i3systemcomponent is a titanium oxide microbolometer, technology which is notcovered by Honeywell patents. The I3BOL384_17A is the consumer version ofa military microbolometer.

This report presents a complete teardown analysis of the Thermal Expertcamera and its microbolometer. Based on this, it provides the bill-of-material(BOM) and manufacturing cost of the infrared camera. The report also offers acomplete physical analysis and manufacturing cost estimate of the infraredmodule, including the lens module and the microbolometer itself.

The report’s final component is a comparison between the characteristics ofthe FLIR One, Seek Thermal, Therm-App and Thermal Expert cameras andLepton, EXC001, PICO384P and I3BOL384_17A microbolometers. Thecomparison highlights differences in technical choices made by the companies.

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TABLE OF CONTENTS

Overview / Introduction

Company Profile and Supply Chain

Technology and Cost Comparison with Competitor Products (FLIR, Seek Thermal/Raytheon, OpgalTherm-App/Ulis)

Physical Analysis• Synthesis of the Physical Analysis• Physical Analysis Methodology• Ceramic Package Silicon window

• IR Sensor View, dimensions & marking Pixel area overview Contact Pixel details (active,

compensation pixels)• ROIC Die ROIC delayering and process

• IR Sensor Cross-Section Cross-section : ROIC Cross-section : arm Cross-section: microbolometer

Manufacturing Process Flow• Global Overview• IR Sensor Wafer Fabrication Unit• ROIC• Microbolometer Process Flows• Package Process Flows

Cost Analysis • Main Steps of Economic Analysis• Yield Hypotheses• ROIC Front-End Cost• Microbolometer Front-End Cost• IR Sensor Wafer and Die Cost• I3BOL384_17A Cost

Estimated Price Analysis • Main Steps of Economic Analysis• Yield Hypotheses

Thermal Expert IR Camera• Camera Disassembly• Lens Module Analysis• Electronic Board and Camera - Bill

Of Material and Material Cost• Electronic Board and Camera -

Assembly Cost • Manufacturing Cost and Selling

Price

ANALYSIS PERFORMED WITH OUR COSTING TOOLS IC PRICE+ AND MEMS COSIM+

IC Price+

MEMS CoSim+

System Plus Consulting offerspowerful costing tools toevaluate the production cost &selling price from single chip tocomplex structures.

IC Price+The tool performs thenecessary cost simulation ofany Integrated Circuit: ASICs,microcontrollers, memories,DSP, smartpower…

MEMS Cosim+It evaluates the cost of anyMEMS process or device.MEMS CoSim+ is a process-based costing tool where it ispossible to enter any MEMSprocess flow.

than 10 years of experience inthe Power Device manufacturingcosts analysis.

Sylvain Hallereau

Sylvain is in chargeof costing analysesfor IC, Power andLED. He has more

systems. He worked for LacroixElectronics where he was incharge of componentsdatabase.

David Le Gac

David is in chargeof reverse costingwith a focus onb o a r d s a n d

in chemical & physical technicalanalyses. He previously workedfor 25 years in Atmel NantesLaboratory.

Yvon Le Goff

Yvon is thelaboratorymanager. He hasdeep knowledge

AUTHORS:

FLIR One 2nd

Generation & FLIR

LEPTON 3 LWIR Core

Opgal Therm-App Infrared Camera & Ulis IR Microbolometer

Uncooled Infrared Imaging

Technology and Market

Trends 2016

Second generation FLIR ONE forAndroid and iOS platformsfeaturing a completely newLEPTON Core with 160 x 120 pixelsresolution and 12µm pixel size.

The highest resolution thermalcamera for smartphone, 384 x288 pixels using amicrobolometer with 17µm pixelfrom Ulis.

In a dynamic IR imaging marketwith ever more competitors,technologies and products,uncooled IR imager shipments areexpected to grow at 15.8% CAGRfrom 2016-2021.

Pages: 260Date: February 2016Full report: EUR 3,990*

Pages: 160Date: July 2015Full report: EUR 3,490*

Pages: 200+Date: August 2016Full report: EUR 5,990*

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