The SLHC

14/09/2007

The SLHCThe SLHC

Cartigny, le 14 Septembre 2007 SLHC, Didier 1

Centre de rencontre de CartignyD. Ferrère, 14 septembre 2007

Team: G. Barbier, A. Clark, D. Ferrère, D. Lamarra, S. Pernecke, E. Perrin, M. Pohl

14/09/2007

“The LHC will be the energy frontier machine for the foreseeable future, maintaining European leadership in the field; the highest priority is to fully exploit the physics potential of the LHC, resources for completion of the initial program have to be secured such that machine and experiments can operate optimally at their design performance. A subsequent major luminosity upgrade (SLHC),

motivated by physics results and operation experience, will be enabled by focused R&D; to this end, R&D for machine and detectors has to be vigorously pursued now and centrally organized towards a luminosity upgrade by around

2015.”

Draft Strategy Document Initiatives:

http://council-strategygroup.web.cern.ch/council-strategygroup/

The European Strategy for Particle PhysicsThe European Strategy for Particle Physics


SLHC status:• R&D towards a realistic Upgrade scenario is active (Machine and Detectors) • SLHC is not approved yet!• Exact time schedule is unknown• Machine scenarios exist but not frozen

14/09/2007

The ATLAS ID current status at LHCThe ATLAS ID current status at LHC


All services (pipes, cables, fibers,..) Installed

TRT barrel & Endcap cabled and connected - 1.8% problematic channels out of 105K, noise figure as on surface – Cosmics collected in M4 runs

SCT barrel and Endcap signed off on surface - < 0.3% problematic channels out of 6.3 M, >99% efficiency on cosmics. Commissioning in Progress, ongoing delays due to cooling and environmental gas.

Pixel signed off on surface and installed and waiting for connection and tests

… towards the end …December 07: End of the ATLAS InstallationJan-Feb 08: Overall ATLAS commissioningMarch/April 08: Close Access

14/09/2007

Machine and ScenariosMachine and Scenarios


3 phases considered:

Phase 0: Push the machine to its maximum performance without hardware changeLuminosity of 2.3x1034 cm-2s-1. and ultimate energy 7.54 TeV (dipole field @ 9T)

Phase 1 (SLHC): Interaction Region (IR) quadrupoles life expectancy < 10 years Modify the insertion quadrupoles and their layout *

Phase 2: Rebuild the SPS with superconducting magnets, the transfer line to inject into LHC at 1 TeV and new 15T dipoles proton energy of 12.5 TeV

ParametersLHC SLHC - Phase1

Nominal Ultimate Scenario 1 Scenario 2

Bunch spacing [ns] 25 25 50 25

Proton/bunch Nb[1011] 1.15 1.7 4.9 1.7

* at IP1&5 [m] 0.55 0.5 0.25 0.08

Longitudinal profile Gaussian Gaussian Flat Gaussian

Rms bunch length z[cm] 7.55 7.55 11.8 7.55

Peak luminosity [1034 cm-2s-1] 1 2.3 10.7 15.5

Effective luminosity (5h) [1034 cm-2s-1] 0.56 1.15 3.5 3.6

Peak events per crossing 19 44 403 294

CommentsWire comp. Crab + D0

(+ Q0)

NB: Original scenario of 12.5 ns excluded since exceed the max local cooling capacity

Ba

se

lin

e

Alt

ern

ati

ve

Far future

14/09/2007

Physics BenchmarksPhysics Benchmarks


The future observations at LHC should drive physics investigations at SLHCThe future observations at LHC should drive physics investigations at SLHC •Higgs:

- H couplings to bosons and fermions- WW scattering and resonances

• SUSY spectroscopy:- mass reconstruction, sparticle ID, BR measurements, …- performances for heavy SUSY (> 2 TeV) – impact and statistics

• EW physics:- Boson self-couplings: focus on those for which the sensitivity is close to ILC

• Super-heavy stuff:- Multi-TeV region: light Higgs decay to new gauge bosons Z’, W’

Ideally it is desired to increase the luminosity and get a better

detector performance

Luminosity should be 10 times higher & Upgrade is considered for the detectors

14/09/2007

ATLAS UpgradeATLAS Upgrade


Due to increase of radiation level, pile-up, background Due to increase of radiation level, pile-up, background each sub-detectors has to think of the consequences in each sub-detectors has to think of the consequences in term of detector performance, aging, radiation hardness!term of detector performance, aging, radiation hardness!

Inner Detector (ID):Completely new design and detectors – No TRT, more pixel and strips: New detector and ASICs technologies to withstand the radiation level Simulations drive optimal geometry (Strawman layers) and occupancies

LAr Calorimeter:FCAL: To be replaced with smaller gap size and special cooling close to the beam pipe.HEC: Cold electronics may have to be replaced (no need to get HEC wheels apart)Others: More R&D require about the Ion buid-up

Tile Calorimeter:Front-end electronics and Low Voltage Power Supplies

Muon System:MDT: Chambers and readout electronics are radhard at LHC or can stand 10 times the max nominal flux but further studies need to be performed in SLHC environment

2008: detail upgrade plan based on some tests and R&DTGC: Thick GEMs can possibly replace forward chambers due to high occupancy.

Focus

14/09/2007

Radiation Background in ATLAS at SLHCRadiation Background in ATLAS at SLHC


1 MeV equivalent neutron fluences assuming an integrated luminosity of 3000fb-1 and 5cm of moderator lining the calorimeters (reduces fluences by ~25%)

•With safety factor of two, design short microstrip layers to withstand 1015neq/cm2 (50% neutrons)

•Outer layers up to 4×1014neq/cm2 (and mostly neutrons)

Thermal management and shot noise. Silicon looks to need to be at ~ -25oC (Thermal runaway).Si power: 1W @ -20°C

4W @ -10°C10W @ 0°C

High levels of activation will require careful consideration for access and maintenance.

IssuesIssues

Simulation using FLUKA2006

14/09/2007

Inner Detector Upgrade - LayoutInner Detector Upgrade - Layout


The goal for b-layer replacement is fall 2012Actual b-layer is expected to survive 3 years at LHC design luminosity

(~300fb-1)The Upgrade of the entire tracker should take place in 2016

14/09/2007

Silicon SensorsSilicon Sensors


Choice of adequate material thanks to RD50 collaboration

Pixel and Strips: n-in-p (planar technology)

No type inversion, full depletion is on structured side

Collection of electrons (faster than p-in-n)

0 20 40 60 80 100 120eq [1014 cm-2]

0

5000

10000

15000

20000

25000

sign

al [e

lect

rons

]

3D FZ Si, 235 m, (laser injection, scaled!), pad [Da Via 2006]n-FZ Si, 280 m, (-10oC, 40ns), n-in-n pixel [Rohe et al. 2005]p-FZ Si, 280 m, (-30oC, 25ns), strip [Casse 2004]p-MCZ Si, 300 m, (-30oC, s), pad [Bruzzi 2006]n-epi Si, 150 m, (-30oC, 25ns), pad [Kramberger 2006]n-epi Si, 75 m, (-30oC, 25ns), pad [Kramberger 2006]sCVD-Diamond, 770m, (RT, s), [RD42 2006] (preliminary data, scaled)pCVD-Diamond, 500m, (RT, s), strip, [RD42 2002-2006] (scaled)SiC, n-type, 55 m, (RT, 2.5s), pad [Moscatelli et al. 2006]

M.Moll 2007

Pixel b-layer: 3D technology is an option(should be ready for b-layer replacement in 20012)

electrons swept away by transversal field holes drift in

central region and diffuse towards p+

contact

Exist in single and double column type

n+-columns

ionizing particle

p-Si

3D FZ 235m

P-FZ 280m

Still ~15000e- at 1.1015 cm-2s-1 (FZ or MCZ)

14/09/2007

Electronics for StripsElectronics for Strips


ABC-N Readout architecture

Minimum requirements:

Implementation of an on-chip shunt regulation to allow any powering scheme (Serial or DC-DC)

Increased data bandwidth of 160 Mb/s

Compatibility with existing ATLAS SCT DAQ ROD hardware

Front-end for two signal polarities, 3 to 12 cm long silicon strips

Minimum power circuit techniques

Delay adjustment for control and data signals

Similar “core” functionality as for the present silicon strip tracker: signal amplification, discriminator, binary data storage for L1 latency, readout buffer with compression logic, and data serializer.

Goal: Prepare a design of the FE ASIC in deep submicron radiation tolerant.Design and evaluation with 250 nm towards 130 nm technology

• Daniel La Marra, Sebastien Pernecker, Geneva University• Wladek Dabrowski, Krzysztof Swientek, AGH-Cracow• Jan Kaplon, Karolina Poltorak, Francis Anghinolfi, CERN• Mitch Newcomer, Pennsylvania University

Design team:

14/09/2007

Module IntegrationModule Integration


Focus on the most challenging modules with Short-Strips, 80 chips (24W), 4 hybrids, 160MHz clocking to FE chips, and readout by group of 10 modules.

3 flavors are considered: Staves, Super-Modules, Modules

Service bus

TTC, Data & DCS fibers

PS cable

DCS env. IN

Cooling

Opto

BGT

DCSinterlock

SMC

Module #1 Module #2 Module #10

14/09/2007

Power DistributionPower Distribution


Services are clearly an issue for the material budget as well as for the system design

Tracker Upgrade should leave with the existing ID services and optimize the power distribution: Serial Powering or DC-DC (Individual Powering is abandoned)

SCT - 4mW/ch 24 kW (excl. cable losses)Strip Upgrade - 2mW/ch 90 kW only for FE (45 Mch)

1 2 3 4 5 6 n-1 n

SPIPS=IH=4.2AVPS=nVABCN=24V

PPg= GAINDC-DC=20IPS=n/g.IH=2AVPS=gVABCN=24 V

Short-Strip Super-Module configuration

n is hybrid number = 20; VH (0.13m)=1.2V

NB: Here only 2 cables/SM needed but for IP it would be 40 cables

14/09/2007

CoolingCooling


Cooling System is one of the key points for ID operationHeat density is 4-7 times higher than the current SCT module

Detector thermal runaway impose to operate the silicon wafer below -20ºCTsensor = Tcoolant + THeat_Path

Coolant: Less than -30 C is considered for the pipe temperature Module design and choice of material is critical – Thermal FEA

3 candidates for the cooling:• CO2 (~100 bar)• C2F6 (Low pressure)• C3F8 (Low pressure)

1g of evaporation @ -30ºC ~280 J(Where for C3F8 it is 100 J/g)

CO2Enthalpy [kJ/kg]

Pre

ss

ure

[b

ar]

Existing pipes are considered:-SCT & Pixel (ok for C2F6, C3F8)-TRT (ok for CO2 but limited number)

14/09/2007

Status in the various working groupsStatus in the various working groups


Pixel:3D sensors:

-ATLAS geometry evaluated: Laser and capacitance measurements- proton and neutron irradiations will soon come- H8 TB will be in September/October 2007

Readout chips: Prototyping activity in 0.13 m technology – chip FE 14 Powering: Promising results for SP – Using current ATLAS Pixel modules

Strips:Sensors: 10X10 cm2 short strip sensors ordered (15 units for UniGe) Readout chips ABC-n: Specification document created and under design. The submission is foreseen at the beginning of 2008Powering: Promising results for SP – Using current ATLAS SCT modules on

staves and with individual modules. DC-DC is also investigated!Module Integration:

- Concept proposed and some Thermal FEA showed- Prototypes with ABC-n and new n-in-p sensors in 2008- TB and irradiation will follow

Structure and Services: On going discussions and specifications expected soon

14/09/2007

UniGe InvolvementsUniGe Involvements


Asics: Digital Architecture & Simulation: pipeline, Derandomizer, Data Compression Logic, Readout Logic and Control; Check after place and route!

250nm submission January 2008 130nm design from January 2008

Detectors: 135 sensors of size10X10cm2 ordered to HamamatsuUniGe ordered 15 sensors: 12 p-stop and 3 p-spray Sensor characterization will be made and compared with other institutes

Module Concept: UniGe investigated 2 concepts module directly mounted on barrel or mounted on an intermediate local support!

UniGe operates 3D Thermal FEA to evaluate and optimize the designStrategy is to make prototype modules in 2008 with above detectors and Asics

DCS: Involvement in the strategy and decision for the detector safety. DCS will be part of the system design to optimize the service and resource issues.

Mechanical Engineering: Involvement in the structure and service design.

14/09/2007

Important Milestones DraftedImportant Milestones Drafted


1. Beam off – start decommissioning 1/7/2014 (18 month for installation) 2. Ready for beam: 1/1/2016

• Straw man Layout - December 2006 (Modification/changes to be made in

term of performance /Risk/Cost etc.)• TDR - Feb/2010• Cooling PRR April/2010 • Mechanical Support Design complete Oct/2010• Sensor PRR July/2010• FE-electronics Sept/2010• Surface Assembly March/2012

B-Layer replacement • Ready for Installation August/2014• Barrel Installation Feb/2015• B-layer/beam pipe August/2015

Conceptual Design R&D

Prototypes

Pre-Series

Production

Assembly & Installation

14/09/2007

ConclusionsConclusions


SLHC is clearly in the continuity of the machine and detector operation Phase 1 will be to increase the luminosity up to a factor 10 (1035 cm-2s-1 ) ATLAS and CMS are considering options to Upgrade the detectors in 2016 The ATLAS Inner Tracker will be completely renewed (no TRT) and is in a design and specification phase The B-layer replacement is foreseen already in 2012 using 3-D sensors The major challenges are: Service and material reductions, Cooling, Powering scheme The time scale is short and there is almost no time for R&D Working groups start smoothly to grow and to be active UniGe involved in various topics and keep an eye on the B-layer replacement activities Next events:

• Pixel Upgrade Workshop 28-29 September at CERN• ID Upgrade Workshop 12-14 Dec 2007 in Valencia

14/09/2007

Back-up slidesBack-up slides


14/09/2007

Appendix - Tracker Organizational StructureAppendix - Tracker Organizational Structure


14/09/2007 Cartigny, D. Ferrere 20

new upgrade bunch structures

25 ns

50 ns

nominal

25 ns

ultimate& 25-ns upgrade

50-ns upgrade,no collisions @S-LHCb!

50 ns

50-ns upgradewith 25-ns collisionsin LHCb

25 ns

new alternative!

new baseline!


25 ns scenario 50 ns scenario

Merits •Negligible long-range collisions,•No geometric luminosity loss,•No increase in beam current beyond ultimate

•No elements in detector,•No crab cavities,•Lower chromaticity,•Less demand on IR quadrupoles (NbTi possible)

Challenges •D0 dipole deep inside detector (~3 m from IP),•Q0 doublet inside detector (~13 m from IP),•Crab cavity for hadron beams (emittance growth),•4 parasitic collisions at 4-5s separation,•“Chromatic beam-beam” Q’eff~sz/(4pb*sd),•Poor beam and luminosity lifetime ~b*

•Operation with large Piwinski parameter unproven for hadron beams, •High bunch charge,•Beam production and acceleration through SPS,•“Chromatic beam-beam” Q’eff~sz/(4pb*sd),•Larger beam current,•Wire compensation (almost etablished)

Two scenarios Luminosity UpgradeTwo scenarios Luminosity Upgrade


Heat loadPer GrafstromCERN


B-Layer Replacement


B-Layer Replacement & Tracker UpgradeB-Layer Replacement & Tracker Upgrade

• ATLAS considers to have a B-layer replacement after ~3 year of integrated full LHC luminosity (2012) and replace completely the Inner Tracker with a fully silicon version for SLHC (2016).

• The B-layer replacement can be seen as an intermediate step towards the full upgrade. Performance improvements for the detector (here some issues more related to FE chip):– Reduce radius and design for > 1034cm-2s-1 luminosity Improve radiation

hardness ( 3D sensor, p-type bulk materials)– Reduce pixel cell and architecture related dead time ( deign FE for

higher luminosity)– Reduce material budget of the b-layer (~3% X0 <2.5% X0) stave

replaces module as the basic building block.– increase the module live fraction ( increase chip size, > 1214 mm2),

optimize inactive chip periphery, use “active edge” technology in the sensor.– Use faster R/O links, move MCC at the end of stave– FE chip technology will use 0.13 µm 8 metal CMOS.

• The B-layer for the upgrade will push even more technological/ design/ architectural issues of the FE chip radiation hardness (1015 1016 neq/cm2) and detector occupancies ( 15)


Half barrel

10-Module Structure

Reference (r, Z) + fixation

Barrel end

Reference (r+ alignment

Intermediate support bracket+ insertion guide

End view

LSR on BarrelLSR on Barrel(UniGe Concept)(UniGe Concept)


SS disks

SS+LS disks

EC disks – Petal optionEC disks – Petal option

C. Lacasta


Data Transmission


0

2

4

6

8

10

12

-60 -40 -20 0 20 40

T [°C]

p [

ba

ra]

-35

1.1 bara

7.6 bara

C3F8

Low evaporation pressure limit

• Limit from return line impedance and compressor suction pressure.

• Mostly of concern for C3F8

– TRT pipes would give ~70% more flow → return pipe Δp would have to increase (α ~P2),

– Heaters/HEXs (diameter) need to be bigger, – Alternative pev control: cold condenser

(needs development),– Surface condensers to reduce compression

ratio → allows to reduce suction p.– Mix with C2F6:

• Allows to tailor saturation properties,• Lower HTC to wall (~50%),• Mixture control by measurement of vsound.

SCT return p budget Δp [bar]

Heaters & HEXs ~0.2

Return pipes ~0.1

Back pressure regulators ~0.5

Compressor suction p p ~ 0.7

Total p ~ 1.5


Run conditions @ -35C

C3F8 C2F6

Pevaporation 1.1 bar 6 bar

ΔT for ΔP=+-0.1bar +2 C / -2 C

ΔT for ΔP=+-1.0bar +20 C / ~-44 C

ΔH for evaporation 100 J/g 100 J/g

Flow for 100 W 1.0 g/s 1.0 g/s

Volume flow 0.6 cm3/s 0.6 cm3/s

HTC [W/cm2/K] 3000 W/cm2/K

Major difference for CO2 with respect to C3F8 cooling is the increase by a factor of 10 of the evaporation pressure for T=-35C.

CO2

12 bar

+0.2 C / -0.2 C

+1.8 C / -1.9 C

280 J/g

0.4 g/s

0.4 cm3/s

8000 W/cm2/K

Advantages….

Coolant propertiesCoolant properties

The SLHC

Documents

Transcript of The SLHC