The Precision Company Corporate Presentation - … Accretech... · The Precision Company Corporate...
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30. Mai 2012 0 Strictly Confidential
Strictly Confidential
The Precision Company
Corporate Presentation
(May.2012)
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Key Corporate Facts!
Head Office: Tokyo, Japan.
Established: March, 1949.
Paid-in Capital: US$ 80 Million.
Sales 2009/2010: US$335 Million.
Sales 2010/2011: US$615 Million.
Sales 2011/2012: US$720 Million.
Exchange listing: Tokyo, Japan.
Securities code: 7729.
Employees: ~1600 (31/03/2012)
Key Business: Sales & Manufacture Capital
Equipment.
Managing Directors: Mr. Ota (President & CEO)
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Fast Fab to Market
Accretech Semiconductor
Accretech equipment
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Accretech - A Global Organisation!
Semiconductor Manufacturing Equipment
High Precision Measuring Instruments
Accretech (Europe) GmbH
Accretech (China) Co., Ltd.
Accretech (Malaysia) Sdn.Bhd.
Accretech (Singapore) Pte.Ltd.
Tokyo Seimitsu Co.,
Ltd., Japan
Accretech USA, Inc.
Accretech Vietnam Office Accretech Thailand Office
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Semiconductor
Business Unit
- Wafer Prober Systems
- Dicing Systems
- Polish Grinding systems
- Wafer Inspection
- Edge Grinding (Tosei)
Admin & Finance
Eckard Merz (Vice President)
Wolfgang Bonatz ( President & COO )
Established: 1989
Employees: 50
Headquarter: Munich
Board of Directors:
Mr. Ryuichi Kimura
Mr. Wolfgang Bonatz
Accretech (Europe) GmbH
Metrology
Business Unit
- Surface Measurement Systems
- Contour Measurement Systems
- Inline Gauges (Tosei)
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Sales
Daniel VERVIER
- Wafer Prober Systems
- Dicing Systems
- Polish Grinding systems
- Edge Grinding (Tosei)
Admin & Finance
Annick Lehnebach
Wolfgang Bonatz ( President )
Established: 1993
Employees: 7
Location: Crolles
Accretech (Europe) GmbH french office
Customer Support
- Grgoire MARECHAL (Supervisor)
- Francky DINH (Engineer)
- J-P SCOLARI (Engineer)
- Stphane LEPROVOST Engineer)
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Industry
First!
Industry
First!
Accretech - Key Products
PG-300-RM
Polish Grinding
(W-GM-5200) Edge Grinding
MAHOH
Laser Dicing
UF3000EX / UF3000EX-e
UF2000 / UF200R
(ChaMP)
(WIN-WIN 50)
Wafer
Inspection
Industry
First!
(HRG 300) Grindier
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Diced Frames
Mo
un
ted
Fra
me
s
Probed Frames
Probed Wafers High Yield
Thin Wafer Processing Complete Solution
Functional
Wafer Probe & Sort
Grind & Polish to 30m
Mount Wafers to Frames
Functionaly Probe
& Sort Framed Wafers
Dice Framed Wafers
Blade or Laser
Final Probe & Sort
of Diced Wafers Diced, Tested, Sorted
Framed Wafers
WIN-WIN 50 - UV Brightfield
Patterned Wafer Inspection
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Diced Frames
Mo
un
ted
Fra
me
s
Probed Frames
Probed Wafers High Yield
Thin Wafer Processing Complete Solution
Functional
Wafer Probe & Sort
Grind & Polish to 30m
Mount Wafers to Frames
Functionaly Probe
& Sort Framed Wafers
Dice Framed Wafers
Blade or Laser
Final Probe & Sort
of Diced Wafers Diced, Tested, Sorted
Framed Wafers
WIN-WIN 50 - UV Brightfield
Patterned Wafer Inspection
NEW FP3000 NEW FP3000
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Accretech Dicing Demo Center Munich
What can we offer to our customers?
Sample dicing
Dicing service
Process optimization
Dicing blade evaluation
Mahoh Laser dicing of
sensitive MEMS-Devices
.
Mahoh Laser Dicing
(Clean room class 1000)
Blade Dicing Tools
Laser dicer ML200
ML Separator
Measuring tools
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Thank You
Merci !