The Effect of Conditioner Design on Pad Texture...Pad Texture Morgan Advanced Ceramics ... Final...
Transcript of The Effect of Conditioner Design on Pad Texture...Pad Texture Morgan Advanced Ceramics ... Final...
Morgan Technical CeramicsInnovation in Innovation in
Materials TechnologyMaterials Technology
The Effect of Conditioner Design on Pad Texture
Morgan Advanced CeramicsDiamonex® Products Division
David SlutzJuly 17, 2008
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Slide 2
Phoenix® CMP Pad Conditioner
Fine Medium Coarse
CVD Diamond Coated Diamond Grit
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Slide 3
Phoenix® edge CMP Pad Conditioner
Design A
Design B
Design C
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Pad Texture Results
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Slide 5
Phoenix Medium Grit Conditioner- Interferometry
Inner Middle OuterSurface Height (microns)
403020100
-10
-20
-30
-40 Numerous large asperities, source of wafer defects.
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Slide 6
Pad Texture (Medium Grit)
0
2
4
6
8
10
12
Phoenix(Medium Grit)
Sinusoidal SweepConditioner
Surf
ace
Text
ure
(λ)
Inner Diameter Middle Outer Diameter
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Slide 7
Phoenix Fine Grit - Interferometry Line 2
Inner Middle Outer
Surface Height (microns)
403020100
-10
-20
-30
-40
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Slide 8
Pad Texture
0
2
4
6
8
10
12
Phoenix(Medium Grit)
Sinusoidal Sweep
Phoenix (Fine Grit)
Sinusoidal SweepConditioner
Surf
ace
Text
ure
(λ)
Inner Diameter Middle Outer Diameter
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Slide 9
2x2 mm image
Groove
Groove
Phoenix edge pad Conditioner - Interferometry
Inner(2.75”) Middle(5.125”) Outer(7.50”)
Groove
Groove
Groove
Groove
Fewer large asperities, more uniform surface. Increased contact area, reduced defects.
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Slide 10
Pad Surface Texture Comparison
0
2
4
6
8
10
12
Phoenix(Medium Grit)
Sinusoidal Sweep
Phoenix (Fine Grit)
Sinusoidal Sweep
Phoenix edge B Phoenix edge A
Conditioner
Surf
ace
Text
ure
(λ)
Inner Diameter Middle Outer Diameter
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Slide 11
Interferometry DataS
urfa
ce H
eigh
t (m
icro
ns)
40
30
20
10
0
-10
-20
-30
-40
Phoenix Phoenix PhoenixMedium Fine edge
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Pad Texture Result
for Copper Process
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Slide 13
– Wafer• 200-mm blanket copper wafer
– Pad• IC1020 M groove
– Slurry• 200 ml of Fujimi PL-7103 slurry + 800
ml of DI H2O + 33 grams of 30% ultra pure H2O2
– Rinse• DI H2O flow rate 2,000 ml/min
for 30 seconds.
Experiment Conditions
– Pad Conditioning• Morgan Diamond Discs
• Phoenix Fine grit• Phoenix Medium grit• Phoenix Coarse grit• Phoenix edge Design C (2 runs)
• In-situ pad conditioning = 6 lbf
• Tweaked optimized sweep• 2nd Phoenix edge- sinusoidal sweep
– Wafer Polishing • Polishing pressure = 2 PSI• Platen sliding velocity = 42 RPM• Polishing time = 60 seconds
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Slide 14
Composite Topography Images
Phoenix Coarse Grit
Phoenix Medium Grit
Phoenix Fine Grit
Phoenix edge-Run 1
Phoenix edge-Run 2
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Slide 15
Phoenix MediumPhoenix Coarse Phoenix Fine
Phoenix edge-Run 1 Phoenix edge- Run 2
Summit Height Distributions
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Slide 16
15
16
17
18
19
20
21
22
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Mea
n As
perit
y He
ight
(µ)
0%
10%
20%
30%
40%
50%
60%
70%
% A
sper
ity H
eigh
t >20
µ
Mean Asperity Height (µ) % Asperity Height >20 µ
Asperity Height (Mean & >20um)
Edge CuttingPoint Cutting
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Slide 17
Surface Height Probability Density Functions
0.00001
0.0001
0.001
0.01
0.1
1
-50 -40 -30 -20 -10 0 10 20 30
Surface Height (um)
Surf
ace
Hie
ght P
roba
bilit
y De
nsity
(1/u
m)
Phoenix Coarse Grit
Phoenix Medium Grit
Phoenix Fine Grit
Phoenix edge-Run 1
Phoenix edge-Run 2
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Slide 18
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
% A
perit
y H
eigh
t >20
µ
4
5
6
7
8
9
10
Pad
Text
ure
(Å)
% Asperity Height >20 µ Pad Texture (Å)
Pad Texture and % Asperity Heights >20µ
Edge CuttingPoint Cutting
Decreasing number of large asperitiesi.e. smoother pad surface texturewith decreasing diamond size
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Slide 19
Phoenix edge-Run 1
Phoenix Fine
Sharp
Phoenix MediumPhoenix Coarse
Phoenix edge- Run 2
Summit Sharpness
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Slide 20
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Mea
n Su
mm
it Sh
arpn
ess
(µ-1
)
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
% S
umm
it Sh
arpn
ess
>1 µ
-1
Mean Aperity Sharpness (µ-1) % Sharp Asperities >1 µ-1
Summit Sharpness (Mean & Sharp)
Edge CuttingPoint Cutting
Decreasing asperity sharpness with decreasing diamond size
Edge cutting is a different mechanism
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Slide 21
Phoenix Coarse Grit- Image 8
Contour atz=14.0 µm
50 µm
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Slide 22
Phoenix Coarse Grit- Image 8 at 2 psi
50 µm
Contact Area Shape is mostly round
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Slide 23
Phoenix Medium Grit- Image 5 at 2 psi
50 µm
Contact Area shapes are round and elongated
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Slide 24
Phoenix Fine Grit- Image 3 at 2 psi
50 µm
Contact Area shapes are mostly elongated
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Slide 25
Phoenix edge- Image 12 at 2 psi
50 µm
Contact area shapes are elongated and curled
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Slide 26
Composite Contact Area Images
Sliding Direction
Phoenix Coarse Grit
Phoenix Medium Grit
Phoenix Fine Grit
Phoenix edge-Run 1
Phoenix edge-Run 2
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Slide 27
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
Competitors PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Mea
n C
onta
ct A
rea
(%)
0
100
200
300
400
500
600
700
800
900
Mea
n C
onta
ct D
ensi
ty (#
/mm
2 )
Mean Contact Area (%) Mean Contact Density (#/mm2)
Contact Area decreases with decreasing diamond size
Contact Area Percentage & Point Density
Edge CuttingCVD Diamond Point CuttingSingle Crystal Point
Cutting
The CVD Diamond on the single crystal diamond produces a pad surface with much higher contact area than bare diamond
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Slide 28
Mean Contact Pressure
0
2000
4000
6000
8000
10000
12000
14000
16000
18000
Competitors PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Mea
n C
onta
ct P
ress
ure
(psi
)
Sing
le C
ryst
al P
oint
Cut
ting
Edge CuttingCVD Diamond Point Cutting
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Slide 29
Contact Area Size Distribution
Phoenix edge- Run 1 Phoenix edge- Run 2
Phoenix FinePhoenix MediumPhoenix Coarse
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Slide 30
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Mea
n C
onta
ct A
rea
Size
(µ2 )
0.0%
0.5%
1.0%
1.5%
2.0%
2.5%
3.0%
3.5%
% C
onta
ct A
rea
Size
>10
0 µ2
Mean Contact Area Size (µ2) % Contact Area >100 µ2
Contact Area Size (Mean & Large)
Edge CuttingPoint Cutting
Size of the contact areas decreases with decreasing diamond size in particular the number of largest areas
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Copper Process Data Results
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Slide 32
Copper Removal Rate & Non-Uniformity
0
1000
2000
3000
4000
5000
6000
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Mea
n C
oppe
r Rem
oval
Rat
e (Å
/min
)
0%
10%
20%
30%
40%
50%
60%
Mea
n Un
iform
ity (%
)
Mean Copper Removal Rate Mean Uniformity (%)
~50% Increase In Copper Removal Rate
Edge CuttingPoint Cutting
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Slide 33
2000
2500
3000
3500
4000
4500
5000
0.42 0.44 0.46 0.48 0.50 0.52 0.54 0.56 0.58 0.60
Coefficient of Friction
Cop
per R
emov
al R
ate
(Å/m
in)
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Copper Removal Rate vs. COF
Point Cutting
Edge Cutting
~42% Increase In Copper Removal Rate @ Same COF
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Slide 34
2000
2500
3000
3500
4000
4500
5000
25.6 25.8 26.0 26.2 26.4 26.6 26.8 27.0 27.2 27.4
Pad Temperature (ºC)
Cop
per R
emov
al R
ate
(Å/m
in)
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
~42% Increase In Copper Removal Rate @ Same Temperature
Copper Removal Rate vs. Pad Temperature
Point Cutting
Edge Cutting
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Slide 35
Pad Cut Rates
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
PhoenixCoarse Grit
PhoenixMedium Grit
PhoenixFine Grit
Phoenix edgeRun 1
Phoenix edgeRun 2
Nor
mal
ized
Pad
Cut
Rat
e
Edge CuttingPoint Cutting
Decreasing Pad cut rate with decreasing diamond size
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Slide 36
Summary-Edge Cutting verses Point Cutting
Pad Texture Edge cutting produces a smoother pad texture with fewer large asperitiesEdge cutting produces asperity shapes with a sharpness in the mid range of point cutting. However, for point cutting the number of sharp asperities decreases with diamond size. Edge cutting produces smaller elongated curled contact area shapes as opposed to larger round contact regions for point cutting.Edge cutting produces less contact area, fewer number of contacts, and fewer large contact regions.
Copper ProcessEdge cutting resulted in ~50% increase in copper removal rate over point cutting.Edge cutting resulted in comparable non-uniformityEdge cutting resulted in vastly reduced pad cut rate over point cutting
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Slide 37
Final Thoughts
What causes the increase in copper removal rate?COF & pad temperature can not explain the increase in MRR for edge cuttingPad surface features and interaction with wafer
•No one pad feature shows a direct relationship to MRR.•Combination of pad features might explain the increase in MRR
Slurry flow and mixing due to the geometric design of the spiralconditioner is a strong possibility.
Future Work: Continue work to find any correlation between Pad texture and MRRInvestigate the effect of conditioner geometry on MRR Marathon study to determine Phoenix edge conditioner life, stability of process, and defectivity
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Slide 38
Acknowledgements
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Thank You