Versum Materials Confidential

THE DEVELOPMENT OF FORMULATED CLEANS FOR ENABLING PACKAGING PROCESSES IN HETEROGENEOUS INTEGRATION

Tianniu Rick Chen, Ph.D.

General Manager

Global SP&C (Surface Preparation & Cleans) Business

Business of Cleans ConferenceApr. 1st, 2019

Versum Materials Confidential© Versum Materials 20192

❑ Market Drivers and Changes for Formulated Packaging Cleans

❑ Challenges & Advancements of Formulations Development

❑ Summary

Versum Materials Confidential© Versum Materials 20193

❑ Market Drivers and Changes for Formulated Packaging Cleans

❑ Challenges & Advancements of Formulations Development

❑ Summary

Versum Materials Confidential

PACKAGING INDUSTRY VALUE CHAIN*

*Source: Yole.

Packaging(Assembling)/Testing❑ Sales ~ $56 B in 18’, ~ 80% packaging/assembling vs. ~ 20% testing❑ Growing at a CAGR of 3.0 % (‘11-18’)❑ Increasing OSATs (Outsourced Assembling & Testing) presence (03’ – 18’)

2018

2008

2003

OSATFoundryFabless

IDM

CAGR = 3.0%

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Versum Materials Confidential

INDUSTRY VALUE CHAIN*

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Packaging Materials (including ceramic and flexible)❑ Sales ~ $21 B in 18’❑ ~ 42 % of total microelectronics materials sales in 18’❑ Growing at a CAGR of 7.7 % (‘16-18’)❑ Core to SEMI Innovation and Productivity

*Source: IC Insights; SEMI, Techcet & Linx consulting.

Versum Materials Confidential

WHAT DRIVES FORMULATED PACKAGING CLEANS?

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Industry Volume Growth❑Silicon MSI/Wafer Starts

▪ 10% CAGR of MSI (17’ – 23’)❑Revenue growth

▪ 27% CAGR of revenue (18’ – 23’)

Source: Yole Development, 2017/2019

Versum Materials Confidential© Versum Materials 20197

❑ Market Drivers and Changes for Formulated Packaging Cleans

❑ Challenges & Advancements of Formulations Development

❑ Summary

Versum Materials Confidential

Technology Changes

New Heterogenous Architectures

❑ 2.X/3D integrations▪ More options & more materials

SWIFT®/ 2.1/2.3D?; INFO®/ 2.XD?;SLIM®/2.5D? CoWoS®/2.5D?

FoCoS®/ 2.1/2.3D? EMIB®/2.5D?

Source: Raja Swaminathan, Intel, ECTC (Electronic Components and Technology Conference), 2018.

GREATER NEEDS FOR INNOVATION

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Image source: Intel

Electronic/Photonic SiP through Heterogeneous Integration

Versum Materials Confidential

ROADMAP OF PACKAGING CLEANS

ApplicationTargeted materials

Type of materials OfferingsSingle chip

packaging cleans

Advanced Packaging cleans

2.5X D 3D

PERRs (Post Etch Reside

Removers)

/PARRs (Post Ash Reside

Removers)

Photoresists

(PRs)

Polymers

(Acrylic, et. al.)

Fluorinated residue

ACT® XT1100 Series

ACT® NE Series

Dynastrip® DL9150

TFRRs

(Thick Films Resists

Removers)

Photoresists

(PRs)

Polymers

(Acrylic, et. al. )

ACT® VFS Series

Dynastrip® AP7880T

Dynastrip® AP7900C

Dynastrip® AP1050

Temporary Bond Clean

(Device and Carrier)Adhesives

Polymers

(Silicone, polyimide, et. al.)Dynasolve®219

Selective Si etching Substrate Silicon ACT® VSE Series

Surface cleaning Interconnects Al, Cu, et. al. BPS100/106/600

BPS 729A/B

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HVM adopted

Customer-site qualified

Developmental offerings

Versum Materials Confidential

OUR COMMITMENT TO SAFER AND ENVIRONMENTALLY-FRIENDLY PRODUCTS

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Our Principles Our Values Our Strategy

Versum Materials Confidential

GREATER NEEDS FOR INNOVATION SELECTIVE PACKAGING CLEANS

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t = 40 minsT = 60 C

(TOK CE5000)

Compatible with RDLs/µbumps/pillars/PBO

Dynastrip® 7990T

Dynastrip® DL9150

Compatible with RDLs/µbumps/pillars/PI/PBO

Cu seed (300 nm)Ph

oto

resi

st

(20

–1

50

m

)

Si substrate

Ti barrier (50 nm)

Cu seed (300 nm)

Si substrate

Ti barrier (50 nm)

b

um

pC

u/N

i/Sn

Ag

Pre-

Post-

Versum Materials Confidential

* Image source: 3M

PER

Rem

oval

Bo

schEtch

ing

TSV via holefabrication

Plasmadie singulation

PER

Rem

oval

Bo

schEtch

ing

GREATER NEEDS FOR INNOVATION SELECTIVE PACKAGING CLEANS

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Versum Materials Confidential

t = 0 min

Top Middle Bottom

F (at.%)by AES

0.5(1) 0.7(2) 0.2(1)

Top Middle Bottom

F (at.%)by AES

ND* ND* ND*

POST ETCH RESIDUE (PER) CLEANS IN PACKAGING PROCESSES

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Top Middle Bottom

F (at.%)by AES

0.2(0) 0.6(2) 0.1(1)

Dynastrip® DL9150

Dynastrip® AP7880C

t = 60

min

sT = 7

0 C

ND: Non-Detected

Compatible with RDLs/µbumps/pillars/PI/PBO

t = 1

min

T =

30 C

t = 60

min

sT = 7

0C

Versum Materials Confidential

t = 0 min

Top Middle Bottom

F (at.%)by EDX

0.6(1) ND ND

ACT® VSE

t = 1 m

inT = 3

0 C

EDX Top

EDX Middle

EDX Bottom Compatible with Sn/SiO2/Dicing tape

EDX Top

EDX Middle

EDX Bottom

Top Middle Bottom

F (at.%)by EDX

2.2(5) 6.9(5) 1.5(1)

t = 1 m

inT = 3

0 C

* Janet Hopkins, “Optimizing Surface Chemistry After Plasma Dicing”, SemiconEuropa. 2018.

ND: Non-Detected

POST ETCH RESIDUE (PER) CLEANS IN PACKAGING PROCESSES*

14© Versum Materials 2019

Versum Materials Confidential© Versum Materials 201915

❑ Market Drivers and Changes for Formulated Packaging Cleans

❑ Challenges & Advancements of Formulations Development

❑ Summary

Versum Materials Confidential

CRITERIA FOR SUCCESS AS WE APPROACH THE 2020S

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Customer Relationships

Diversified Portfolio

Innovation Capabilities and Intellectual Property

Global Infrastructure and Reliable Supply

SEMI Next Generation

Formulated Packaging CleansSupplier

Versum Materials Confidential

Air Products and Chemicals acquired Ashland Specialty

Chemical Company's electronic chemicals unit.

Air Products foundedin Detroit, Michigan, based on Leonard Pool’s revolutionary on-site gas supply concept.

Acquired Dynaloy LLC, a leading supplier of formulated cleaning

solutions from Eastman Chemical Company (NYSE: EMN).

Air Products’ EMD (Electronic Materials Division) spun off

As Versum Materials on October 4, 2016

2003 2016 Increase 80%1940 2017 Sustained Growth into 2020s

MATERIAL SUPPLIERS ARE CONSOLIDATING

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THANK YOU !

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