Testing of ABC130

1

Not to scale!

100n

F

Edge Sensor wired to A9, A10 ?

ABC-130

100n

F

100n

F

100n

F

NB graphic is not an exact match with“ABC_Pads_V5.2.pdf” – revision needed

Analogue MUX pads here???

PROVISIO

NAL

SAMTEC SAMTEC

Standard Probe card ends in 0.1” pitch header: add mezzanine PCB to adapt

to hybrid compatible SAMTEC

ABC130

“Baby” Sensor(optional)

HV

Propose companion single chip PCBwith identical SAMTEC pinout.This takes one ABC130 and

(optionally) a “baby” strip sensor

SAMTEC

Driver PCB

Functional Test

• Currents– Shunts and LDOs on and off???

• Digital Test Vectors• Analogue MUX

– DACs, references, ???

• Three Point Gain

• Driver needs extra circuitry over that needed for hybrids– Address & Enable lines – Route analogue signals to DVM– Analogue switches ???

5

Planning for ABC130 Hybrids – without HCC

• ABC130 and HCC submissions being done sequentially• Results in ABC130 arriving ~3(?) months before HCC

• Should plan for ABC130 evaluation without HCC• First at single chip level – followed by hybrid and then module• Important to confirm that ABC130 works as expected when attached to a sensor

• Propose using an FPGA in place of HCC• Acts as a ‘blank canvas’ – program to suit required configuration• Aim for modular system providing seamless migration from wafer probing up to module level

• Speeds up evaluation of ASIC(s) at all levels of testing as DAQ changes are minimised

• Will impact upon hybrid layout – not realistic to add FPGA to a hybrid• First hybrids will be exclusive of HCC • All ABC130 – HCC connectivity will now be brought to edge of hybrid

• Will firstly hook up to FPGA which is mounted external to hybrid to access digital I/O• Followed by HCC on plug-in

• For Plug-in candidate FPGA device identified – Xilinx Spartan 3AN series (XC3S50AN)• Single chip solution offering integrated configuration memory, 2 x DCMs, 50 diff I/O, LVCMOS

6

Testing ABC130s at different stages – without HCC

HSIODAQ

FPGA

Wafer Probing

Driver Board

Module Test

•Driver Board designed to connect directly to •Wafer probe card•Hybrid test panel (hybrids tested individually)•Module test frame without FPGA plug-ins

•FPGA plug-ins come later (if required)•If using Driver board would require 2 off for a module

Hybrids on Panel

Provides both digital and analogue

functionality – required for wafer probing

7

Testing modules – without HCC

Hybrid

Hybrid

To DAQ (only

required if plug-ins

used)

Samtec SFMH series 50 pin connector (1.27mm pitch)

40 x 60mm

Samtec FTSH series 50 pin connector

Symmetric Module

Future proof - replace Spartan with HCC

HCC

Drawn to scale to show that 2 plug-ins can fit adjacent to a module

Driver board(s) connect directly to frame (bypass plug-ins)