Tesglo Semiconductor Adhesive Tapes - Product Catalogue
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Transcript of Tesglo Semiconductor Adhesive Tapes - Product Catalogue
7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue
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Model Name AP90-CB AUD1 AUD2 AU105-HA
StructureBase Film PVC PVC PVC Ployolefn
Adhesive Acryl Acryl Acryl Acryl
Thickness
(µm)
TotalBase Film
90±580
90±580
90±580
105±5100
Adhesive 10 10 10 5
Protection Film 38±2 38±2 38±2 38±2
Physical
Property
Tensile Strength
(N/m2)25~35 25~40 25~40 20~30
Elogation(%) 200~400 400~600 400~600 500~700
Adhesion
(g/25mm)
Beore UV
irradiation200 300 500 500
Ater UV
irradiation~15 15~25 5~15
Application
Non-UV type
Expandable
UV type
Expandable
UV type
Expandable
UV type
Expandable
* REMARK : Film thickness & adhesion variation depends on the customer’s request & quantity..
Test Conditions :
- Test Method : JIS Z 0237 / KS A 1107
- Note) The Product could be modifed by customer’s request.
- Sample : 25mm × 350mm, 4ea
- Substrate : Sus Plate (#280 polished)
- Laminating Pressure : 1cycle with 2kg Rubber Roller
- Remove Speed : 300mm/min- Peeling Angle : 180C
7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue
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Model Name AU120-SC AU170-HC AUG1 AUG2
StructureBase Film Ployolefn Ployolefn PET PET
Adhesive Acryl Acryl Acryl Acryl
Thickness
(µm)
TotalBase Film
120±5120
170±5150
130±5100
155±5125
Adhesive 20 20 30 30
Protection Film 38±2 38±2 38±2 38±2
Physical
Property
Tensile Strength
(N/m2)20~30 20~30 200~300 200~300
Elogation(%) 30~50 500~700 100~150 100~150
Adhesion
(g/25mm)
Beore UV
irradiation1,300 1,700 1,500 1,300
Ater UV
irradiation10~40 10~40 10~40 5~15
ApplicationNon-UV type
Non- Expandable
UV type
Expandable
UV type
Non- Expandable
UV type
Non- Expandable
* REMARK : Film thickness & adhesion variation depends on the customer’s request & quantity.
Test Conditions :
- Test Method : JIS Z 0237 / KS A 1107
- Note) The Product could be modifed by customer’s request.
- Sample : 25mm × 350mm, 4ea
- Substrate : Sus Plate (#280 polished)
- Laminating Pressure : 1cycle with 2kg Rubber Roller
- Remove Speed : 300mm/min
- Peeling Angle : 180C
7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue
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Model Name AP130-SC AP210-SC AU130-SC
StructureBase Film Ployolefn Ployolefn Ployolefn
Adhesive Acryl Acryl Acryl
Thickness
(µm)
TotalBase Film
130±5110
210±5180
130±5110
Adhesive 20 30 20
Protection Film 38±2 38±2 38±2
Physical
Property
Tensile Strength
(N/m2)20~30 20~30 20~30
Elogation(%) 500~700 500~700 500~700
Adhesion
(g/25mm)
Beore UV
irradiation130 125 330
Ater UV
irradiation10~40
ApplicationNon-UV type
Non-Expandable
Non-UV type
Non-Expandable
UV type
Non-Expandable
* REMARK : Film thickness & adhesion variation depends on the customer’s request & quantity.
Test Conditions :
- Test Method : JIS Z 0237 / KS A 1107
- Sample : 25mm × 350mm, 4ea
- Substrate : Sus Plate (#280 polished)
- Laminating Pressure : 1cycle with 2kg Rubber Roller
- Remove Speed : 300mm/min
- Peeling Angle : 180C
7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue
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Item Decover 25 BR350A Test Method
Colour White Transparent Yellow
Total Thickness 0.055 mm 0.085 mm Thickness Dial
Gauge (1/1000mm)
Adhesion Strength 850 g/25mm 17.5 N/25mm180o peel
KS A-1107
Tensile Strength 12 kg/25mm 126 N/cm KS A-1107
Elongation 120 % 127% KS A-1107