Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina...
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![Page 1: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/1.jpg)
Temperature Sensitive Micro-electro-mechanical
Systems
Amy KumpelRichard Lathrop
John SlaninaHaruna Tada
Tufts UniversityTAMPL REU 1999
![Page 2: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/2.jpg)
Overview
• Background information of T-MEMS– current project goals
• Experimental Setup– recent modifications
– how it works
• Experimental Results– imaging
– numerical model
• Conclusion and future work
![Page 3: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/3.jpg)
An Introduction to T-MEMS
• Measurement and characterization– mechanical properties of micro-scale devices– thermal properties of device materials under
high temperatures
• Application to rapid thermal processing (RTP)
![Page 4: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/4.jpg)
Composition of T-MEMS
• Tri-layered cantilever beams• 1.03 m SiO2, 0.54 m poly-Si
• 0.19 m SiO2 (thin, protective coat)
0.19 m SiO2
1.03 m SiO2
0.54m poly-Si
Si substrate
![Page 5: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/5.jpg)
Composition of T-MEMS
• Tri-layered cantilever beams• 1.03 m SiO2, 0.54 m poly-Si
• 0.19 m SiO2 (thin, protective coat)25 m well etched into Silicon substrate
![Page 6: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/6.jpg)
• Beams are processed at 840°C– initial experimental condition is room temperature
• Upward room temperature curvature– due to differences in th of poly-Si and SiO2
(beams bend downward when heated)
• Initial curvatures vary with material and/or deposition rate– typical curvatures range from 5 to10 m for a
100m poly-Si beam
Fabrication Process
SiO2
Poly-Si
![Page 7: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/7.jpg)
Our Goals
• Modify the experimental setup to decrease system error
• Collect curvature data from poly-Si beams• Determine Young’s Modulus, E(T), and the
coefficient of thermal expansion, (T), of thin films (poly-Si, SiNx) at high temperatures
• Improve method for curve fitting and resolution analysis
![Page 8: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/8.jpg)
CCD camera
collimatedlight sourcebeam splitter
Al reflector
quartz plate
W-halogen lamp and housing sample
thermocoupleSi wafer
quartz rod
Experimental Setup
![Page 9: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/9.jpg)
Modifications
• Fixed Mounting– CCD camera, beam splitter, collimated light source
• Leveling– all surfaces with mounting plates or rods– the system is leveled to the Silicon wafer (sample)
• Alignment– collimated light source to beam splitter – CCD camera to beam splitter
• light source centered in the IMAQ image when aligned
![Page 10: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/10.jpg)
Experimental Setup with Modifications
![Page 11: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/11.jpg)
Experimental Procedure
• Center sample to CCD camera• Heat T-MEMS (slowly) to ~800°C using W-
halogen lamp then gradually cool to room temperature
• Save the beam image every ~20-30 seconds during the run
• Set LabVIEW SCXI program to record temperature vs. time data
![Page 12: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/12.jpg)
Imaging Results
0
100
200
300
400
500
600
700
800
900
1000
0 60 120 180 240 300 360
tem
per
atu
re (
°C) 120 sec
180 sec0 sec
210 sec
270 sec
300 sec
60 sec
240 sec
time (seconds)
![Page 13: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/13.jpg)
Imaging Results
Deflection vs. Temperature
-10
-8
-6
-4
-2
0
2
4
6
8
10
0 100 200 300 400 500 600 700 800 900
Temperature (deg C)
Def
lect
ion
(m
icro
ns)
![Page 14: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/14.jpg)
Determining E(T) and (T)
• Two material properties approximate beam
curvature for both Poly-Si and SiO2
– Young’s Modulus (E)
– Coefficient of Thermal Expansion ()
• Estimate E(T) from previous publications
• Find a best fit (T) using a numerical model
of the thin film poly-Si layer
![Page 15: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/15.jpg)
Preliminary Results for (T) of Poly-Si
0.E+00
2.E-06
4.E-06
6.E-06
8.E-06
1.E-05
0 200 400 600 800
Temperature (°C)
Co
eff
icie
nt
of
Th
erm
al
Ex
pa
ns
ion
![Page 16: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/16.jpg)
Conclusion
• Modified setup for increased accuracy
• Acquisition of data with new setup
• Used numerical method for determining the thermal properties
![Page 17: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/17.jpg)
Future Work
• Create x-y-z stage for easy movement of sample
• Take more data with new setup
• Modify numerical method for thermal properties
• Get more values for E(T) and (T)
• Modify LabVIEW programs
• Help Haruna with her thesis
• MACIS or MANTIS?
![Page 18: Temperature Sensitive Micro-electro-mechanical Systems Amy Kumpel Richard Lathrop John Slanina Haruna Tada Tufts University TAMPL REU 1999.](https://reader036.fdocuments.us/reader036/viewer/2022081603/56649f115503460f94c23c1a/html5/thumbnails/18.jpg)
Any Questions
For Us?