Telink Semiconductor Smart Lighting Solutions
Transcript of Telink Semiconductor Smart Lighting Solutions
Telink Confidential 1
Telink Semiconductor Smart Lighting SolutionsHigh Performance, Ultra-Low-Power Connectivity Solutions
Telink Confidential 2
Telink’s Lighting Solution Has Been Adopted by Tier 1 Lighting Companies
Technology Innovation
Solution Maturity
Customer Recognition
Telink proprietary BLE Mesh technology enters MP two years before SIG Mesh standards
Mature solution developed with key features, protected by patents worldwide
Telink solution adopted by Tier 1 Customers worldwide
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Telink’s Flexible Smart Lighting Product Offering
Telink’s multi-standard ultra-low-power IC features flexible configuration variations that are tailored to meet the diverse requirements of clients’ lighting products in a cost-effective way. These variations offer different options for supported protocols, memory size, number of PWM channels, and operating temperature range.
Clients who are looking for simple BLE Mesh applications may choose our 8253 or 8273 chip, which feature the most cost-effectivesolution. Those who want their products to be compatible with multiple protocols may choose the more advanced 8258 or 8278 chip.
On Telink’s latest B91 platform, aka the TLSR9 Series, the SIG Mesh SDK incorporates keyword spotting and command recognition algorithm. It features quick response to voice commands and low latency, especially suitable for devices with simple control.
Part Number Protocol SRAM FLASH PWM Temperature
TLSR8258F1KET32 BLE Mesh + Zigbee + HomeKit 64K 1M 6 -40℃~+85℃
TLSR8258F512ET32/AT32 BLE Mesh + Zigbee + HomeKit 64K 512K 6ET32: -40℃~+85℃AT32: -40℃~+125℃
TLSR8253F512ET32/AT32 BLE Mesh 48K 512K 6ET32: -40℃~+85℃AT32: -40℃~+125℃
TLSR8278F1KET48 BLE Mesh + Zigbee 64K 1M 6 -40℃~+85℃
TLSR8273F512ET48 BLE Mesh 64K 512K 6 -40℃~+85℃
TLSR921xBLE Mesh + Zigbee + HomeKit
+ Local Keyword Spotting and Command Recognition256K 1M 6 -40℃~+85℃
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Performance
Telink’s solutions deliver great RF performance, ultra-low power consumption, and exceptional protocol flexibility, which are fundamental to lighting manufacturers to build products that win out in a competitive market.
The Telink DifferenceTelink is built upon four central pillars that underpin our commitment to helping clients achieve their goals: performance, BOM cost, complete solutions, and innovation.
Complete Solutions
From evaluation kits and reference designs to local field application engineer support, Telink’s clients get more than high-performing, low-cost chips. They get a robust support infrastructure that helps them address development issues quickly, accelerating their time-to-market.
Innovation
Telink continue to invest in supporting the latest versions of the most popular technologies so our clients are able to produce the high-functioning lighting products consumers demand. This includes expanding our capabilities to deep integration into major ecosystems and to location based services.
BOM Cost
Telink’s highly-integrated SoCsreduce the number of external components manufacturers need to include in their lighting products, significantly lowering total system costs. Further, because we own our protocol stack, we don’t pay any licensing fees — savings we pass on to our clients.
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Exceptional RF Performance
Telink’s chips support a link budget of over 105dBm
Maximum Tx output power 10dBm
Rx sensitivity -96dBm @ BLE 1Mbps
Great connection range and stability
BOM savings generated by the lack of need for a dual antenna
Telink Link Budget
Tran
smis
sion
Pow
er
Con
nect
or L
oss,
etc
.
Ant
enna
gai
n
Ant
enna
gai
n
Con
nect
or L
oss,
etc
.
Rec
eivi
ng P
owerFree Space Path Loss and Fading
Receiver Sensitivity
P(dBm)
-100
0
10Tx
Rx
TLSR82xx
TLSR82xx
Pillar #1: Performance
typical connection range greater than 100 meters*
Notes:*see Appendix II for details
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Performance Competitive Analysis
Pillar #1: Performance
PERFORMANCE Competitor R Competitor C Competitor S TLSR825x TLSR827x
Standard BLE Mesh BR / BLE Mesh BLE Mesh / Zigbee BLE Mesh/Zigbee/HomeKit BLE Mesh/Zigbee
BLE 5.0 5.0 5.0 5.0 5.1
Core Spec 32bit M4F 32bit M4 32bit M4 32bit Telink MCU 32bit Telink MCU
SRAM 160K 512K 64K 64K 64K
Flash 2M 1M 512K 512K (upgradable to 1M) 512K (upgradable to 1M)
Package QFN48 / QFN40 QFN40 QFN48 / QFN32 QFN48 / QFN32 / QFN24 QFN48 / QFN32 / QFN24
GPIO 34 16 31 32 32
PWM 8 6 4 6 6
ADC 12bit 10bit 12bit 14bit 14bit
Tx output power 4dBm 4dBm 19dBm 10dBm (max) 10dBm (max)
Rx sensitivity -97dBm -95.5dBm -94.8dBm -96dBm -96dBm
Power Supply 1.8 ~ 3.6V 1.9 ~ 3.63V 1.8 ~ 3.8V 1.8 ~ 3.6V 1.8 ~ 3.6V
Whole chip Rx power w/ DCDC 6.8mA 5.9mA 9,5mA 5.3mA 4.6mA
Whole chip Tx Power@0dBm w/ DCDC 8.4mA 5.6mA 8.5mA 4.8mA 4.9mA
Operating Temperature -40℃~+105℃ -30℃~+85℃ -40℃~+125℃ -40℃~+125℃ -40℃~+85℃
Telink Advantage
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Multiple Levels of BOM Savings
Pillar #2: BOM Cost
Telink chips minimize BOM costs for lighting solutions:
Due to their smaller die size (1), manufacturing costs for Telink products are much lower than costs for competitors’ products at the same process node
Unique architecture and system-level design optimization
Fewer external BOM components (2) than the industry average due to high level of on-chip integration and system-level design methodology
Integrated RF matching components
On-chip 32 kHz RC oscillator
Embedded DCDC and LDO
Integrated PA loading inductor
Inductorless operation in LDO only mode
External
Components
PCB
IC
(2)
(1)
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Providing the Support to Accelerate Time-to-Market
Pillar #3: Complete Solutions
To that end, Telink’s support infrastructure includes:
A sprawling repository of SDKs, datasheets, application notes, user guides, and reference design schematics – all available on Telink wiki
A Technical Forum where clients can raise technical questions and get answers from fellow developers and/or Telink employees
A force of local field application engineers who are available to answer clients’ technical questions
A set of fully customizable protocol stack, which makes it easy for us to help clients with customizations
Telink’s goal is to not only provide the hardware and protocol stack for high-performing mesh/lighting products, but to remove any development obstacles our clients may face to accelerate their time-to-market.
Voice Remote, Smart Lighting, etc…
LL/MAC Firmware + RF Driver
RF Transceiver
Modem
Telink Protocol Stack
ApplicationAPI
MAC/LLAPI
MAC orLL/PHY
PHY/RF
ZHA/ZLLZRC/MSO
BLE Profiles Thread
ZigbeePro/RF4CE
BLE Stack 6LoWPAN
Interrupt FIFO/DMA Registers
LL/MAC Hardware
Baseband IP
HardwareDrivers
(PWM, ADC, 12C, SPI, USB,
etc.)
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One-Stop Support Throughout the Entire Product Development Cycle
Pillar #3: Complete Solutions
TechnologyEvaluation Prototyping Product
DevelopmentCompliance Certification
Trial Production
Mass Production
Demo kit
Telink generic dev kit
PCB references
PCB design guide and consultation
Telink SDK and binary
Telink SDK
Development and debug tools
Android/Linux platform adaptation source code
iOS/Android mobile apps source code
Compliance test tuning guide and consultation
Manufacturing JIG
PC software tool
Consultation and troubleshooting
Troubleshooting
FA and RMA
FW OTA update
Additional Telink Resources:
FAE and solution partner
Developer’s section and technical forum
Documentations (datasheets, application notes, handbooks, user guides)
Telink Resources for Entire Development Cycle:
Field application engineers and solution partners
Developer’s wiki site and technical forum
Documentations (datasheets, application notes, handbooks, user guides)
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Telink Smart Lighting Ecosystems
Pillar #3: Complete Solutions
Telink reference hardware/stack/firmware
Module schematic and PCB (Easy interface to all types of LED drivers)
Remote control schematic and PCB
Zigbee/BLE/2.4Ghz stack, profiles, and UIs
Free Android and iOS App references
IDH and LED System Providers
Light control modules based on Telink reference
Remote control ID and PCBA based on Telink reference
Gateway: Integrated solution with Telink Zigbee/BLE/2.4Ghz RF SoCs
Free Android and iOS Apps
Android/iOS Phones/Pads
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Lighting SDK Roadmap
Pillar #4: Innovation
2014 2015 2016 2017 2018 2019 2020
Zigbee
Routing-based Mesh
BLE Mesh
Flooding Mesh
Apple HomeKit
Thread
CHIP
2021
Telink Proprietary
Mesh
Zigbee Pro Zigbee 3.0 +ZHA/ZLL
SIG Mesh SIG Mesh +Tmall/ Mi-Eco, Indoor
Positioning
Direct Forwarding
Zigbee 3.0 +Greenpower
BLE Mesh +Zigbee Dual-mode Selection
BLE/Zigbee Concurrent,
WWAH
HomeKit R9 HomeKit R10 HomeKit R14 HomeKit R15
OpenThreadv1.0.0
CHIP Initial SDK and Demos
ADK Native Support
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Multi-Mode Support
Pillar #4: Innovation
Since day one, Telink has led the charge on IoT connectivity technology innovation. Depending on a client’s product needs, Telink’s multi-mode hardware can be configured with different types of firmware during the software preprogramming and manufacturing process, including SIG Mesh, Telink Mesh, Zigbee, HomeKit, or Thread. Telink’s chips can also be used to produce the following three types of multi-mode devices:
Dual-boot mode:
Both types of firmware are burned at different sections for Flash during manufacturing (e.g. SIG Mesh and Zigbee)
Boot settings determine which image to boot from, and the device can switch to the other protocol after reboot
External triggers such as special key combinations can be used to initiate reboot
Dual-pair mode:
Devices are shipped from the factory with support for both protocols in unified firmware (e.g. BLE and Zigbee)
When powered up, the device automatically searches for either protocol to pair with
Once paired, the device works in the paired mode until it is factory reset
Concurrent mode:
Devices are shipped with unified firmware
When powered up, devices can pair with a BLE device and can also join another network (e.g. Zigbee)
Devices can maintain BLE connection and perform other tasks at the same time*
Notes:*see Appendix III for supported concurrent modes
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Telink supports innovative application cases like positioning via Mesh
Positioning beacon interleaved with Mesh traffic
AoA/AoD packets interleaving with Mesh traffic
The next generation of Telink ICs will also feature High Accuracy Distance Measurement
A Smarter Lighting System
Telink partners with industry leaders to provide solutions featuring voice control and interaction
Telink can provide customized SDKs to those qualified clients, enable products to connect to the ecosystems
Major IoT ecosystems includes Amazon, Google, Alibaba, Mi, etc
Telink also can provide SIG Mesh + Local Keyword Spotting and Voice Command solution featuring low latency control
Telink partners with industry leaders to provide energy harvesting solutions for sensors and low-power devices within a Mesh network
Prototype is ready for early customer evaluation
Reference design is also available
Pillar #4: Innovation
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Incorporate the Local Voice Control Algorithm to Deliver Better User Experience
Pillar #4: Innovation
Voice control the smart lighting/home system via cloud is the most popular way at present. However, there are a few shortcomings such as relatively long delay and complicated voice commands.
As a supplementary solution, local voice control can simplify the way of voice control and improve user experience.
On Telink’s latest B91 platform, aka the TLSR9 Series, the SIG Mesh SDK incorporates keyword spotting andcommand recognition algorithm.
One Keyword + 8 ~ 20 command words: standard reference provided, customized keyword and command word can be trained with NRE cost
No extra hardware needed
Works with single mic, extensible to 2 mics with noise reduction
Features quick response to voice commands and low latency, especially suitable for devices with simple control
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Add Location Services to the Smart Lighting System
Pillar #4: Innovation
For years, location services solutions have played an important role in driving efficiencies for a range of global facilities, tracking key assets and staff for manufacturers, hospitals, and warehouses.
Location services also supported new proximity marketing tools for retailers and are being used to enhance security in commercial and industrial environments.
The ready smart lighting system is very suitable for integrating location services
Location Services offers following exciting features:
Asset Management
Personnel Tracking
Access Control
Shopping Mall Interior Navigation
Proximity Marketing
Car Finding
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To Get Started: Mesh Starter KitTelink offers ready-to-use Mesh demo kits for immediate evaluation:
TLSR8258F512ET48/TLSR8258F512ET32
Generic Development Board
Multiple USB dongles for emulating mesh nodes or gateways
Remote control PCBA for emulating remote controller and wall switch and for demonstrating group controls
FCC certification
Contact Telink sales or reps for ordering information
Reference Design is also available on Telink Wiki site
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WE BUILD CHIPS FOR A SMARTER IOT
Get in touch:
Email: [email protected]
Website: www.telink-semi.com