Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design,...
Transcript of Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design,...
Embedded Power forBusiness-Critical Continuity
SXX06E Rev. 08.01.06 Page 1 of 2
Rev. 04.25.11SIL/SMT80C2
1 of 20
Technical Reference Note
SIL/SMT80C280 Amp
Total Power: 400 WInput Voltage: 4.7 - 13.8 VDC# of Outputs: Single
Special Features
• 80Acurrentrating• Inputvoltagerange: 4.7-13.8 V• Outputvoltage:0.8375-5.1 V• Currentsharing• Industryleadingvalue• Costoptimizeddesign• Excellenttransientresponse• Outputvoltageadjustability• Pathwayforfutureupgrades• Supportssiliconvoltage
migration• Reduceddesign-inand qualification time• Over-temperatureprotection• RoHScompliant
SafetyDesignedtomeet: • UL, cUL 60950-1 • (EN60950)
Product Family: SIL/SMT80C2 SeriesFunction: Single In-Line PowerUsage: LEDs, ASIC, Memory, FPGAs, Telecom and Networking Equipment, Servers, Industrial Equipment, POL Regulation
Definition:TheSIL/SMT80C2isanewhighdensityopenframenon-isolatedconverterseriesforspace-sensitiveapplications.Eachmodelhasa wide input voltage range (4.7 - 13.8 V) and offers a wide 0.8375 -5.1Voutputvoltagerangewitha80Aload.Anexternalresistoradjuststheoutputvoltagefromitspre-setvalueof0.8375Vtoanyvalueuptothemaximumallowedvalueforthatmodel.TheSIL/SMT80C2offersremoteON/OFFandover-currentprotectionas standard.
Electrical DescriptionTheSIL/SMT80C2isimplementedusingamulti-phasesynchronousbucktopology.AblockdiagramoftheconverterisshowninFigure1. Theoutputisadjustableoverarangeof0.8375-5.1Vbyusingaresistorfromthetrimpinto-trimpin,orbydrivingtheTRIMpinwithavoltage.
Theconvertercanbeshutdownviatheenablepin.Thisinputisrunwithpositivelogicthatiscompatiblewithpopularlogicdevices.Positivelogicimpliesthattheconverterisenablediftheinputishigh(orfloating),anddisabledifitislow.
Outputismonitoredforovercurrentandshort-circuitconditions.WhenthePWMcontrollerdetectsanovercurrentcondition,itforcesthemoduleintohiccupmode.
AtypicalapplicationisshowninFigure2.
Wide Operating Temperature RangeTheSIL/SMT80C2'sabilitytoaccommodateawiderangeofambienttemperaturesistheresultofitsextremelyhighpowerconversionefficiencyandresultantlowpowerdissipation,combinedwiththeexcellentthermalperformanceofthePCBsubstrate.Maximumoutputpowerthatthemodulecandeliverdependsonanumberofparameters,primarily:
• Input voltage range• Outputloadcurrent• Air velocity (forced or natural convection)• MountingorientationoftargetapplicationPCB,i.e.,vertical/horizontalmount,ormechanicallytied
down (especially important in natural convection conditions).• TargetapplicationPCBdesign,especiallygroundplanes.Thesecanbeeffectiveheatsinksforthecon-
verter.
TheSIL/SMT80C2modulehasanoperatingtemperaturerangeof0°Cto85°Cwithsuitablederatingand/or forced air cooling.
Ilimit
Lout V out
GNDRemoteON/OFF
PWRGD
Trim
Vout
Vin
Phase 1
Phase 2
Upper G/Drive
Upper G/Drive
Lower G/Drive
Lower G/Drive
1
∩∩∩
∩∩∩Lout2
Phase 3Upper G/Drive
Lower G/Drive∩∩∩Lout3
Phase 4Upper G/Drive
Lower G/Drive∩∩∩Lout4
SIL80C2
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
General Description
Figure1-ElectricalBlockDiagram
Figure 2 - Standard Application Drawing
5
12-14
9 15,16,18,20,22,24
10
SIL80C2
Enable On/Off
Vin
GND
RtrimCin
RLOAD
Vout
Cout
1
11+Sense
-Sense
Ruvlo
Ishare 6 4 Power Good
GND
3,7,8,17,19,21,23
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Output Voltage AdjustmentTheoutputvoltageonallmodelsisadjustablefrom0.8375-5.1V.
Undervoltage LockoutThedefaultundervoltagelockoutissetat4.7V.
Current Limit and Short-Circuit ProtectionTheSIL/SMT80C2modelhasabuilt-innon-latchingcurrentlimitfunctionandcontinuousshort-circuitprotection.Whenanovercurrentconditionoccurs,themodulegoesintohiccupmode,whereitattemptstopowerupperiodicallytodetermineiftheproblempersists.
Notethatnoneofthemodulespecificationsareguaranteedwhentheunitisoperatedinanovercurrentcondition.
EnableTheenablepinallowsexternalcircuitrytoputtheSIL/SMT80C2converterintoalowdissipationstandbymode. Positive logic enable pin is available as standard.
Theunitisturnedoniftheenablepinishigh(orfloating).Pullingthepinlowwilldisabletheunit.Toguaranteeturn-on,theenablevoltagemustbeabove1.25V. Todisable,theenablevoltagemustbepulled below 0.7 V.
Figures3and4showvariouscircuitsfordrivingtheEnablefeature.TheEnableinputcanbedriventhroughadiscretedevice(i.e.abipolarsignaltransistor)ordirectlyfromalogicgateoutput.Theoutputofthelogicgatemaybeanopen-collector(oropen-drain)device.
Features and Functions
Figure 3 - Enable Input Drive Circuit for Non-Isolated Biopolar
SIL80C2
Ground
Trim
Vin
Enable
Vout
5 VSIL80C2
Ground
Trim
Vin
Enable
Vout
Figure 4 - Enable Input Drive Circuit for Logic Driver
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
Power GoodTheSIL/SMT80C2moduleshaveapowergoodindicatoroutput.Thisoutputpinusespositivelogicandisopencollector.Also,thepowergoodoutputisabletosink1mA.Thepowergoodsignalshouldnotbepulledanyhigherthan5.1V.
Whentheoutputofthemoduleiswithin±10%ofthenominalsetpoint,thepowergoodpincanbepulledhigh.
Overtemperature Protection (OTP)TheSIL/SMT80C2isequippedwithnon-latchingovertemperatureprotection.AtemperaturesensormonitorsthetemperatureofthePCBnearonethemainFETs.Ifthetemperatureexceedsathresholdof150°C(typical)theconverterwillshutdown,disablingtheoutput.Whenthesubstratetemperaturehasdecreasedby10°Ctheconverterwillautomaticallyrestart.
Theconvertermightexperienceovertemperatureconditionsduringapersistentoverloadontheoutput.Overloadconditionscanbecausedbyexternalfaults.OTPmightalsobeenteredduetoalossofcontroloftheenvironmentalconditions(e.g.anincreaseintheconverter’sambienttemperatureduetoafailingfan).
Features and Functions
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
Output Voltage AdjustmentTheoutputofthemodulecanbeadjusted,ortrimmed,from0.8375Vto5.1V.ThisisaccomplishedbyconnectinganexternalresistorbetweentheTrimpinand-TrimasshowninFigure5orwithavoltageasshowninFigure6.ExtremelyhighaccuracysetpointscanbeachievedwiththeuseofapotentiometerasshowninFigure7.
Vt
Enable
Vout
SIL80C2
Trim
Vin
-Trim
Rtrim
Rtrim
2
1
Enable
Vout
SIL80C2
TrimVin
-Trim
Rtrim1Rtrim2
Rpot1
Figure5-OutputVoltageTrim Figure6-OutputVotlageTrim-withVoltageSource
Figure7-OutputVoltage-withPotentiometer
1
10
100
1000
10000
100000
1000000
0 1 2 3 4 5
DESIRED OUTPUT VOLTAGE SETPOINT (V)
RE
QU
IRE
D T
RIM
RE
SIS
TOR
(OH
M)
Figure 8 - Typical Trim Curves
Application
Enable
Vout
SIL80C2
Trim
Vin
-Trim
Rtrim
Technical Reference Note
Output Voltage Adjustment (cont'd)ThetrimequationforthebasicconfigurationshowninFigure5is:
Rtrim(kΩ)= 1.675 Vout - 0.8375
WhereVoutisthedesiredoutputvoltage,RtrimistheresistancerequiredbetweenTrimand -Trim.
ThetrimequationfortheexternalvoltageconfigurationshownFigure6is:
Rtrim2(kΩ)= Rtrim1 (1.2 - 2Vt) Rtrim1 (Vout - 0.8375) - 1.675
WhereVoutisthedesiredoutputvoltage,Rtrim1andRtrim2aretheresistorsinFigure6 andVtistheappliedexternalvoltage.
ThetrimequationforthepotentiometerconfigurationsshowninFigure7is:
Vout= 0.8375 (Rtrim2 + Rpot)Rtrim1
X (2Rtrim2 + 2Rpot + Rtrim1Rtrim2 + Rtrim1Rpot + 2Rtrim1)
WhereVoutisthedesiredoutputvoltage,Rtrim1andRtrim2aretheresistorsinFigure7 andRpotistheresistanceofthepotentiometer.
Undervoltage LockoutTheSIL/SMT80C2hasbuilt-inundervoltagelockouttoensurereliableoutputpower.Thelockoutpreventstheunitfromoperatingwhentheinputvoltageistoolow.TheUVLOfortheSIL/SMT80C2canbeadjust-edwiththefollowingequation:
Thetrimequationfortheundervoltagelockoutis: Ruvlo (kΩ) = 124.8 + Vturn_on 10 Vturn_on - 42.06
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Embedded Power forBusiness-Critical Continuity
Application(cont'd)
Technical Reference Note
Remote Sense CompensationTheremotesensecompensationfeatureminimizestheeffectofresistanceinthedistributionsystemandfacilitatesaccuratevoltageregulationattheloadterminalsoranotherselectedpoint.Theremotesenselineswillcarryverylittlecurrentandhencedonotrequirealargecross-sectionalarea.However,ifthesenselinesareroutedonaPCB,theyshouldbelocatedclosetoagroundplaneinordertominimizeanynoisecoupledontothelinesthatmightimpaircontrolloopstability.Themodulewillcompensateforamaximumdropof400 mV.Rememberthatwhenusingremotesensecompensationalltheresist-ance,parasiticinductanceandcapacitanceofthedistributionsystemareincorporatedintothefeedbackloopofthepowermodule.Thiscanhaveaneffectonthemodulescompensationcapabilities,affectingits stability and dynamic response.
Parallel OperationParalleloperationofmultipleconvertersisavailablesincetheSIL/SMT80C2hasacurrentsharingoption.Theconverterwillsharetowithin±10%offullload.Tocurrentshare,Pin6ofeachmoduleshouldbeconnected.Also,theremotesenselinesshouldbeconnectedatthesamepoint.Figure9showsthetypicalcurrentsharingapplication.
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Embedded Power forBusiness-Critical Continuity
Figure 9 - Parallel Application
Vin 12-14 VoutSIL80C2
Trim
-TrimIshare 6
GND
11 Sense-
10 Sense+
Vin 12-14 VoutSIL80C2
Trim
-TrimIshare 6
GND
11 Sense-
10 Sense+
RLOAD
Cload
Application(cont'd)
Technical Reference Note
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical Continuity
Output CapacitanceTheSIL/SMT80C2hasoutputcapacitorsinsidetheconverter.Nooutputcapacitanceisrequiredforstableoperation.Whenpoweringloadswithlargedynamiccurrentrequirements,improvedvoltageregulationisobtainedbyinsertinglowESRcapacitorsascloseaspossibletotheload.LowESRceramiccapacitorswillhandletheshortdurationhighfrequencycomponentsofthedynamiccurrentrequirement.Inaddition,highervaluesofelectrolyticcapacitorsshouldbeusedtohandlethemid-frequency components.
Itisequallyimportanttousegooddesignpracticeswhenconfiguringthedcdistributionsystem.LowresistanceandlowinductancePCBlayouttracesshouldbeutilized,particularlyinthehighcurrentoutputsection.RememberthatthecapacitanceofthedistributionsystemandtheassociatedESRarewithinthefeedbackloopofthepowercapabilities,thusaffectingthestabilityanddynamicresponseofthemodule.Notethatthemaximumratedvalueofoutputcapacitancevariesbetweenmodelsandforeachoutputvoltagesetpoint.Astabilityvs.LoadCapacitancecalculator,(seeyoursalesrepresentative),detailshowanexternalloadcapacitanceinfluencesthegainandphasemarginsoftheSIL/SMT80C2.
SMT Reflow GuidelinesForaSnPbprocess:Padsshouldbeabove183C(liquidus)for90secondsmax(60-75secondstypical)withapeaktemperatureof225C.ForaleadfreeSAC305process:padsshouldbeabove217C(liquidus)for90secondsmax(60-75secondstypical)withapeaktemperatureof250C.
Water WashingNot recommended.
Application(cont'd)
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
Parameter Test Conditions Min Typ Max Units
Absolute Maximums
Input Voltage 0 13.8 V
Enable Voltage 0 5 V
OperatingAmbientTemperature 0 85 ˚C
Non-OperatingAmbientTemperature -40 125 ˚C
Input Specifications
Input Voltage 4.7 13.8 Vdc
Input Current (No Load) Vin(min) - Vin(max), enabled 500 mA
Input Current (quiescent) Converter disabled 10 mA
Input Capacitance (Internal) Internal to converter 176 uF
InputCapacitance(External) Recommend customer added capacitance 47 uF
Output Specifications
OuputVoltage 0.8375 5.0 V
OutputSetpointAccuracy -1.0 +1.0 %
OutputRegulation(Line) -0.2 +0.2 %
OutputRegulation(Load) -0.5 +0.5 %
OutputCurrent(continuous) 0 80 A
OutputCurrent(shortcircuit) 0.9, 2.5, 5.1 Vout 130 140 A
OutputCapacitance(Internal) 500 uF
OutputCapacitance(External) 12 Vin, 0.9 Vout (Startup capacitance) 0 63,000 uF
12 Vin, 2.5 Vout (Startup capacitance) 0 30,000 uF
12 Vin, 5 Vout (Startup capacitance) 0 11,000 uF
OutputRipple/Noise(Peak/Peak) 5 Vin, 0.9 Vout, 0 uF Cout 20 mV
12 Vin, 2.5 Vout, 0 uF Cout 20 mV
12 Vin, 5 Vout, 0 uF Cout 20 mV
Efficiency 5.1 Vin, 0.9 Vout, 80 Aout 82.2 %
12 Vin, 2.5 Vout, 80 Aout 89.1 %
12 Vin, 5 Vout, 80 Aout 93.3 %
DynamicLoadResponse(PeakDeviation) 12 Vin, 0.9 Vout,50-75%loadat10A/us 95 mV
Dynamic Load Response (Setting Time) 12 Vin, 0.9 Vout,50-75%loadat10A/us 30 us
DynamicLoadResponse(PeakDeviation) 12 Vin, 2.5 Vout,50-75%loadat10A/us 150 mV
Dynamic Load Response (Setting Time) 12 Vin, 2.5 Vout,50-75%loadat10A/us 30 us
DynamicLoadResponse(PeakDeviation) 12 Vin, 5 Vout,50-75%loadat10A/us 150 mV
Dynamic Load Response (Setting Time) 12 Vin, 5 Vout,50-75%loadat10A/us 30 us
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
Parameter Test Conditions Min Typ Max Units
Turn On Specifications
TurnOnDelay(withVin) 2.7 3 ms
TurnOnDelay(withEnable) 3 12 ms
OutputRiseTIme 10%-90% 1.8 2 ms
Enable Specifications
SignalLow(UnitOff) 0 0.7 V
Signal Low Current 12 Vin 0 1.2 mA
SignalHigh(UnitOn) 12 Vin 3.4 V
SignalHighCurrent 1.0 µA
Protection Specifications
OverCurrentProtection HiccupMode 108 A
Input Under Voltage (Rising) 4.7 V
Input Under Voltage (Falling) 4.0 V
General Specifications
MTBF Telcorida SR-332 3.7 MHrs
Weight 45.36 g
SwitchingFrequency PerPhase 500 kHz
Coplanarity TBD
Material Ratings
Flammability UL94V-0
Material Type FR4 PCB
0.9 V Setpoint
Figure10:ThermalDeratingCurve5.5Vin Figure11:ThermalDeratingCurve12Vin
Figure12:Effiiciency0.9V
Figure13:ControlOn/Off(Channel1:OutputVoltage,Channel3:Enable)
Figure14:TypicalRippleOutput
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
0
10
20
30
40
50
60
70
80
30 40 50 60 70 80
Ambient (C)
Load
Cur
rent
(A)
200 LFM300 LFM400 LFM500 LFM600 LFM
0
10
20
30
40
50
60
70
80
30 40 50 60 70 80
Ambient (C)
Load
Cur
rent
(A)
200 LFM
300 LFM
400 LFM
500 LFM
600 LFM
Figure11A:Thermalderatingcurve4.7Vinand13.8Vin
0
10
20
30
40
50
60
70
80
90
25 30 35 40 45 50 55 60 65 70 75 80 85
Load
(A
)
Ambient temp (ºC)
Thermal derating - 600LFM minimum airflow
4.7Vin, 0.84Vout13.8Vin, 5.1Vout13.8Vin, 5.0Vout
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
Figure16:ShortCircuitCharacteristic(Channel1:OutputCurrentat50A/div,
Channel4:OutputVoltage)
0.9 V Setpoint
Figure15:TransientResponse75%-100%(Channel3:CurrentStepat10A/div,Channel4:OutputVoltageDeviation)
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
2.5 V Setpoint
Figure17:ThermalDeratingCurve5.1Vin Figure18:ThermalDeratingCurve12Vin
Figure19:Efficiency2.5V Figure20:ControlOn/Off(Channel1:OutputVoltage,Channel3:Enable)
Figure21:TypicalRippleOutput Figure22:TransientResponse75%-100%(Channel3:CurrentStepat10A/div,Channel4:OutputVoltageDeviation)
0
10
20
30
40
50
60
70
80
30 40 50 60 70 80
Ambient (C)
Load
Cur
rent
(A)
200 LFM300 LFM400 LFM500 LFM600 LFM
0
10
20
30
40
50
60
70
80
30 40 50 60 70 80
Ambient (C)Lo
ad C
urre
nt (A
)
200 LFM300 LFM400 LFM500 LFM600 LFM
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
Figure23:ShortCircuitCharacteristic(Channel1:OutputCurrentat50A/div,
Channel4:OutputVoltage)
2.5 V Setpoint
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
5.0 V Setpoint
Figure24:ThermalDeratingCurve12Vin Figure25:Efficiency5.0V
Figure26:ControlOn/Off(Channel1:OutputVoltage,Channel3:Enable)
Figure27:TypicalOutputRipple-ADDTESTCONDITIONS
Figure28:TransientResponse75%-100%(Channel3:CurrentStepat10A/div,Channel4:OutputVoltageDeviation)
Figure29:ShortCircuitCharacteristic(Channel1:OutputCurrentat50A/div,
Channel4:OutputVoltage)
0
10
20
30
40
50
60
70
80
30 40 50 60 70 80
Ambient (C)
Load
Cur
rent
(A) 200 LFM
300 LFM400 LFM500 LFM600 LFM
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
MechanicalDrawingsSIL80C-00SADJ-VJ
Footprint
2.5421 PLACES
1.27.050
.100 TYP
2.300 58.42
.050 TYP1.27
APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM
D
C
B
AA
B
C
D
SCALE: 3 = 2
SIZE
CAD FILE:
DWG. NO.
BSHEET 1 OF 2
TLA DRAWINGAPPROVALS
DRAWN
ENGINEER
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES
.03
MATERIAL
FINISH
-
-
12345678
8 7 6 5 4 3 2 1
ARTESYN TECHNOLOGIESEDEN PRAIRIE, MN 55433PH. 952-941-1100
REV.
PROJECT USED ON:
7091259-0000
TITLE:
A
UPPERCUT 80THIRDANGLEPROJECTION
DATE
.015 1
HOLE TOLERANCE: .005
M. HENNIES
M. HENNIES
20JUN06
20JUN06
DETACHED LIST
7001259-J000
NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.
.040 1.02 58.932.320
1.160 29.46
31.751.250
60.962.400
.050 TYP1.27(23X)
±.002 0.64SQ PINS
17.53 MAX.690
1.57.062REF
2.79.110REF
±0.05REF .025
.140 TYP3.56
PART NUMBER REV DESCRIPTION DRAFT DATE
7091259-0000 A RELEASE TO PRODUCTION M. HENNIES 03/08/07
REVISION RECORD
Pin 1
00 0.
51.0
201.
78.0
70
6.86
.270
9.40
.370
11.9
4.4
70
14.4
8.5
70
17.0
2.6
70
19.5
6.7
70
22.1
0.8
70
24.6
4.9
70
27.1
81.
070
29.7
21.
170
32.2
61.
270
34.8
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37.3
41.
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39.8
81.
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42.4
21.
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44.9
61.
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47.5
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50.0
41.
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52.5
82.
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4.32
.170
55.1
22.
170
60.2
02.
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61.9
82.
440
00
61.4
72.
420
3.30.1304.88.192
.242 6.15
.730 18.54
FOOTPRINTKEEP OUT AREA
PCB OUTLINE
THROUGH HOLE.040" DIA (23X)
Ø 0.45 ±.003 [1.14 ±0.08]
23x
Rev. 04.25.11SIL/SMT80C2
17 of 20
Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
MechanicalDrawingsSIL/SMT80C2-00SADJ-HJ/H3J
Footprint
00 0.
51.0
20
6.86
.270
9.40
.370
11.9
4.4
70
14.4
8.5
70
17.0
2.6
70
19.5
6.7
70
22.1
0.8
70
24.6
4.9
70
27.1
81.
070
29.7
21.
170
32.2
61.
270
34.8
01.
370
37.3
41.
470
39.8
81.
570
42.4
21.
670
44.9
61.
770
47.5
01.
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50.0
41.
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52.5
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1.78
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57.6
62.
270
60.2
02.
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61.4
72.
420
61.9
82.
440
000.51.0201.78.070
31.241.2301.270 32.261.290 32.77
FOOTPRINT
THROUGH HOLE.040" DIA (25X)
KEEP OUT AREA
PCB OUTLINE
D
C
B
AA
B
C
D
SIZE
DWG. NO.
BSHEET 2 OF 2
FOOTPRINT
12345678
8 7 6 5 4 3 2 1
REV.
TITLE:
7091259-0100 A
Ø 0.45 ±.003 [1.14 ±0.08]
25X
.050 1.27
1.1602X 29.46
58.422.300
.040 1.02 2.320 58.93
.100 TYP 2.5421 PLACES
22JUN06
DETACHED LIST
7001259-J100
D
C
B
AA
B
C
D
SCALE: 3 = 2
SIZE
CAD FILE:
DWG. NO.
BSHEET 1 OF 1
TLA DRAWINGAPPROVALS
DRAWN
ENGINEER
UNLESS OTHERWISE SPECIFIED
THIRD
DIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES
.03
MATERIAL
FINISH
-
-
12345678
8 7 6 5 4 3
PH. 952-941-1100
REV.
PROJECT USED ON:
7091259-0100
TITLE:HOLE TOLERANCE:
2 1
ARTESYN TECHNOLOGIESEDEN PRAIRIE, MN 55433
PROJECTION
A
UPPERCUT 80ANGLE
DATE
.015 1
.005
M. HENNIES
M. HENNIES
22JUN06NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.
2.400 60.96
31.751.250
.050 TYP1.27(23X)
APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM
2.79
REF
.110
.125
REF
3.18 TYP
18.03 MAX
.062
MAX
1.57
.710
REF .120 3.05
PART NUMBER REV DESCRIPTION DRAFT DATE
7091259-0100 A RELEASE TO PRODUCTION M. HENNIES 03/06/07
Pin 1
Model L Dimension
SIL80C2-00SADJ REF .120 [3.05]
SIL80C2-00SADJ-H3J REF .138 [3.50]
L - See Table
Rev. 04.25.11SIL/SMT80C2
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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
MechanicalDrawingsSMT80C-00SADJ-VJ
Footprint
.050 1.27.100 TYP 2.54
21 PLACES
2.300 58.42
.040 1.02
8
8 7 6 5 4 3 2 1
ARTESYN TECHNOLOGIES
PROJECTION
DATE
.015 1
.005
M. HENNIES
M. HENNIES
22JUN06
22JUN06
DETACHED LIST
D
C
7
B
AA
B
C
D
SCALE: 3 = 2
SIZE
CAD FILE:
DWG. NO.
BSHEET 1 OF 2
TLA DRAWINGAPPROVALS
DRAWN
ENGINEER
UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES
.03
MATERIAL
EDEN PRAIRIE, MN 55433
6
PH. 952-941-1100
REV.
PROJECT USED ON:
7091259-0300
TITLE:
A
ANGLE
FINISH
-
-
1
UPPERCUT 80THIRD
2345
HOLE TOLERANCE:
7001259-J300
APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM
.050(23X)
TYP1.27
2.400 60.96
.040 TYP1.02(2X)1.315 33.40
2.480 62.99
DETAIL A
.280 7.11.065 1.65
NOTE: OUTSIDE SUPPORT IS HIDDEN TO SHOW PIN DIMENSIONS.A
.062 1.57REF
REF .110 2.79
17.20.677
.610 REF15.49
PART NUMBER REV DESCRIPTION DRAFT DATE
7091259-0300 A RELEASE TO PRODUCTION M. HENNIES 03/06/07
REVISION RECORD
Pin 1
0 0.040 1.02.135 3.43.140 3.56.155 3.94.217 5.51
.440 11.18
.445 11.30
.670 17.02
.752 19.10
00
.060
1.52
.110
2.79
.140
3.56
.200
5.08
.240
6.10
.340
8.64
.440
11.1
8
.540
13.7
2
.640
16.2
6
23.8
8.9
40
.840
21.3
4
26.4
21.
040
28.9
61.
140
66.5
52.
620
1.24
031
.50
1.34
034
.04
1.44
036
.58
1.54
039
.12
1.64
041
.66
1.74
044
.20
1.84
046
.74
1.94
049
.28
2.04
051
.82
2.14
054
.36
2.24
056
.90
2.42
061
.47
2.44
061
.98
2.51
063
.75
2.56
065
.02
.740
18.8
0
REV.
TITLE:
7091259-0300
D
C
B
AA
B
C
D
SIZE
DWG. NO.
BSHEET 2 OF 2
FOOTPRINT
12345678
8 7 6 5 4 3 2 1
A
PCB OUTLINE
KEEP OUT AREA.300X.040" (23X)SMT PAD
VERT SMT STAND OUTLINE
FOOTPRINT
Rev. 04.25.11SIL/SMT80C2
19 of 20
Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
MechanicalDrawings(cont'd)SMT80C2-00SADJ-J
Footprint
.050 1.27.100 TYP 2.54
21 PLACES
2.300 58.42
.040 1.022.320 58.93
2X 1.160 29.46
22JUN06
DETACHED LIST
7001259-J200
D
C
B
AA
B
C
D
SCALE: 3 = 2
SIZE
CAD FILE:
DWG. NO.
BSHEET 1 OF 2
TLA DRAWINGAPPROVALS
DRAWN
ENGINEER
UNLESS OTHERWISE SPECIFIED
THIRD
DIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES
.03
MATERIAL
FINISH
-
-
12345678
8 7 6 5 4 3
PH. 952-941-1100
REV.
PROJECT USED ON:
7091259-0200
TITLE:HOLE TOLERANCE:
2 1
ARTESYN TECHNOLOGIESEDEN PRAIRIE, MN 55433
PROJECTION
A
UPPERCUT 80ANGLE
DATE
.015 1
.005
M. HENNIES
M. HENNIES
22JUN06
NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.
2.400 60.96
31.751.250
TYP1.27.050(23X)
.040 TYP1.02(2X)
APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM
1.57.062REF
REF .110 2.79
.710[18.03] MAX
.125 3.18
PART NUMBER REV DESCRIPTION DRAFT DATE
7091259-0200 A RELEASE TO PRODUCTION M. HENNIES 03/06/07
REVISION RECORD
Pin 1
0 0.020 0.51.040 1.02
1.195 30.351.270 32.261.290 32.77
00
.020
0.51
.048
1.21
.248
6.29
.348
8.83
.448
11.3
7
.548
13.9
1
.648
16.4
5
.748
18.9
9
.848
21.5
3
.948
24.0
7
1.04
826
.61
1.14
829
.15
1.24
831
.69
1.34
834
.23
1.44
836
.77
1.54
839
.31
1.64
841
.85
1.74
844
.39
1.84
846
.93
1.94
849
.47
2.04
852
.01
2.14
854
.55
2.24
857
.09
2.34
859
.63
2.42
061
.47
2.44
061
.98
FOOTPRINT D
C
B
AA
B
C
D
SIZE
DWG. NO.
BSHEET 2 OF 2
FOOTPRINT
12345678
8 7 6 5 4 3 2 1
REV.
TITLE:
7091259-0200 A
KEEP OUT AREA
PCB OUTLINE
SMT PAD.045X.070" (25X)
OrderingInformation
PinChartPin AssignmentsSingleOutput1 Trim2 No Pin3 Ground4 Power Good5 (-) Trim6 Ishare7 Ground8 Ground9 Enable
Pin AssignmentsSingleOutput14 Vin15 Vout16 Vout17 Ground18 Vout19 Ground20 Vout21 Ground22 Vout
10 Rem Sense (-)11 Rem Sense (+)12 Vin13 Vin
23 Ground24 Vout25 *MechSupport26 *MechSupport
*Horizontalversiononly
Rev. 04.25.11SIL/SMT80C2
20 of 20
Thisisapreliminarydatasheet.EmersonNetworkPowerreservestherighttomakechangestotheinformationcontainedhereinwithoutnoticeandassumesnoliabilityasaresult of its use or application.
Embedded Power forBusiness-Critical ContinuityTechnical Reference Note
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RoHs Compliance(9)
RoHS ComplianceJ=Pb-free(RoHS6/6compliant)
CustomOptions
CustomOptionsBlank=3.05mmpin3=3.50mmpin
Rated Output Current
Rated Output Current80=80A
Performance
PerformanceC=CostOptimized
Generation
Generation2=Increased Current Density
Input Voltage
Input Voltage00=4.7-13.8V
Output Voltage
Output VoltageSingle AdjustableOutput
Product Family
Product FamilySIL=SingleInLine
Rated Output Current
Rated Output Current80=80A
Performance
PerformanceC=CostOptimized
Generation
Generation2=Increased Current Density
Input Voltage
Input Voltage00=4.7-13.8V
Output Voltage
Output VoltageSingle AdjustableOutput
Mounting Option
Mounting OptionBlank=HorizontalV=Vertical
Product Family
Product FamilySMT=SurfaceMount
SMT 80 C 2 - 00 SADJ - X X J
RoHs Compliance(9)
RoHS ComplianceJ=Pb-free(RoHS6/6compliant)
CustomOptions
CustomOptionsBlank=3.05mmpin3=3.50mmpin
Mounting Option
Mounting OptionBlank=HorizontalV=Vertical
SIL 80 C 2 - 00 SADJ - X X J