Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design,...

20
Embedded Power for Business-Critical Continuity Rev. 04.25.11 SIL/SMT80C2 1 of 20 Technical Reference Note SIL/SMT80C2 80 Amp Total Power: 400 W Input Voltage: 4.7 - 13.8 VDC # of Outputs: Single Special Features • 80 A current rating • Input voltage range: 4.7-13.8 V • Output voltage: 0.8375-5.1 V • Current sharing • Industry leading value • Cost optimized design • Excellent transient response • Output voltage adjustability • Pathway for future upgrades • Supports silicon voltage migration • Reduced design-in and qualification time • Over-temperature protection • RoHS compliant Safety Designed to meet: UL, cUL 60950-1 (EN60950) Product Family: SIL/SMT80C2 Series Function: Single In-Line Power Usage: LEDs, ASIC, Memory, FPGAs, Telecom and Networking Equipment, Servers, Industrial Equipment, POL Regulation Definition: The SIL/SMT80C2 is a new high density open frame non-isolated converter series for space-sensitive applications. Each model has a wide input voltage range (4.7 - 13.8 V) and offers a wide 0.8375 - 5.1 V output voltage range with a 80 A load. An external resistor adjusts the output voltage from its pre-set value of 0.8375 V to any value up to the maximum allowed value for that model. The SIL/SMT80C2 offers remote ON/OFF and over-current protection as standard.

Transcript of Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design,...

Page 1: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

Embedded Power forBusiness-Critical Continuity

SXX06E Rev. 08.01.06 Page 1 of 2

Rev. 04.25.11SIL/SMT80C2

1 of 20

Technical Reference Note

SIL/SMT80C280 Amp

Total Power: 400 WInput Voltage: 4.7 - 13.8 VDC# of Outputs: Single

Special Features

• 80Acurrentrating• Inputvoltagerange: 4.7-13.8 V• Outputvoltage:0.8375-5.1 V• Currentsharing• Industryleadingvalue• Costoptimizeddesign• Excellenttransientresponse• Outputvoltageadjustability• Pathwayforfutureupgrades• Supportssiliconvoltage

migration• Reduceddesign-inand qualification time• Over-temperatureprotection• RoHScompliant

SafetyDesignedtomeet: • UL, cUL 60950-1 • (EN60950)

Product Family: SIL/SMT80C2 SeriesFunction: Single In-Line PowerUsage: LEDs, ASIC, Memory, FPGAs, Telecom and Networking Equipment, Servers, Industrial Equipment, POL Regulation

Definition:TheSIL/SMT80C2isanewhighdensityopenframenon-isolatedconverterseriesforspace-sensitiveapplications.Eachmodelhasa wide input voltage range (4.7 - 13.8 V) and offers a wide 0.8375 -5.1Voutputvoltagerangewitha80Aload.Anexternalresistoradjuststheoutputvoltagefromitspre-setvalueof0.8375Vtoanyvalueuptothemaximumallowedvalueforthatmodel.TheSIL/SMT80C2offersremoteON/OFFandover-currentprotectionas standard.

Page 2: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

Electrical DescriptionTheSIL/SMT80C2isimplementedusingamulti-phasesynchronousbucktopology.AblockdiagramoftheconverterisshowninFigure1. Theoutputisadjustableoverarangeof0.8375-5.1Vbyusingaresistorfromthetrimpinto-trimpin,orbydrivingtheTRIMpinwithavoltage.

Theconvertercanbeshutdownviatheenablepin.Thisinputisrunwithpositivelogicthatiscompatiblewithpopularlogicdevices.Positivelogicimpliesthattheconverterisenablediftheinputishigh(orfloating),anddisabledifitislow.

Outputismonitoredforovercurrentandshort-circuitconditions.WhenthePWMcontrollerdetectsanovercurrentcondition,itforcesthemoduleintohiccupmode.

AtypicalapplicationisshowninFigure2.

Wide Operating Temperature RangeTheSIL/SMT80C2'sabilitytoaccommodateawiderangeofambienttemperaturesistheresultofitsextremelyhighpowerconversionefficiencyandresultantlowpowerdissipation,combinedwiththeexcellentthermalperformanceofthePCBsubstrate.Maximumoutputpowerthatthemodulecandeliverdependsonanumberofparameters,primarily:

• Input voltage range• Outputloadcurrent• Air velocity (forced or natural convection)• MountingorientationoftargetapplicationPCB,i.e.,vertical/horizontalmount,ormechanicallytied

down (especially important in natural convection conditions).• TargetapplicationPCBdesign,especiallygroundplanes.Thesecanbeeffectiveheatsinksforthecon-

verter.

TheSIL/SMT80C2modulehasanoperatingtemperaturerangeof0°Cto85°Cwithsuitablederatingand/or forced air cooling.

Ilimit

Lout V out

GNDRemoteON/OFF

PWRGD

Trim

Vout

Vin

Phase 1

Phase 2

Upper G/Drive

Upper G/Drive

Lower G/Drive

Lower G/Drive

1

∩∩∩

∩∩∩Lout2

Phase 3Upper G/Drive

Lower G/Drive∩∩∩Lout3

Phase 4Upper G/Drive

Lower G/Drive∩∩∩Lout4

SIL80C2

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General Description

Figure1-ElectricalBlockDiagram

Figure 2 - Standard Application Drawing

5

12-14

9 15,16,18,20,22,24

10

SIL80C2

Enable On/Off

Vin

GND

RtrimCin

RLOAD

Vout

Cout

1

11+Sense

-Sense

Ruvlo

Ishare 6 4 Power Good

GND

3,7,8,17,19,21,23

Page 3: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Output Voltage AdjustmentTheoutputvoltageonallmodelsisadjustablefrom0.8375-5.1V.

Undervoltage LockoutThedefaultundervoltagelockoutissetat4.7V.

Current Limit and Short-Circuit ProtectionTheSIL/SMT80C2modelhasabuilt-innon-latchingcurrentlimitfunctionandcontinuousshort-circuitprotection.Whenanovercurrentconditionoccurs,themodulegoesintohiccupmode,whereitattemptstopowerupperiodicallytodetermineiftheproblempersists.

Notethatnoneofthemodulespecificationsareguaranteedwhentheunitisoperatedinanovercurrentcondition.

EnableTheenablepinallowsexternalcircuitrytoputtheSIL/SMT80C2converterintoalowdissipationstandbymode. Positive logic enable pin is available as standard.

Theunitisturnedoniftheenablepinishigh(orfloating).Pullingthepinlowwilldisabletheunit.Toguaranteeturn-on,theenablevoltagemustbeabove1.25V. Todisable,theenablevoltagemustbepulled below 0.7 V.

Figures3and4showvariouscircuitsfordrivingtheEnablefeature.TheEnableinputcanbedriventhroughadiscretedevice(i.e.abipolarsignaltransistor)ordirectlyfromalogicgateoutput.Theoutputofthelogicgatemaybeanopen-collector(oropen-drain)device.

Features and Functions

Figure 3 - Enable Input Drive Circuit for Non-Isolated Biopolar

SIL80C2

Ground

Trim

Vin

Enable

Vout

5 VSIL80C2

Ground

Trim

Vin

Enable

Vout

Figure 4 - Enable Input Drive Circuit for Logic Driver

Page 4: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Power GoodTheSIL/SMT80C2moduleshaveapowergoodindicatoroutput.Thisoutputpinusespositivelogicandisopencollector.Also,thepowergoodoutputisabletosink1mA.Thepowergoodsignalshouldnotbepulledanyhigherthan5.1V.

Whentheoutputofthemoduleiswithin±10%ofthenominalsetpoint,thepowergoodpincanbepulledhigh.

Overtemperature Protection (OTP)TheSIL/SMT80C2isequippedwithnon-latchingovertemperatureprotection.AtemperaturesensormonitorsthetemperatureofthePCBnearonethemainFETs.Ifthetemperatureexceedsathresholdof150°C(typical)theconverterwillshutdown,disablingtheoutput.Whenthesubstratetemperaturehasdecreasedby10°Ctheconverterwillautomaticallyrestart.

Theconvertermightexperienceovertemperatureconditionsduringapersistentoverloadontheoutput.Overloadconditionscanbecausedbyexternalfaults.OTPmightalsobeenteredduetoalossofcontroloftheenvironmentalconditions(e.g.anincreaseintheconverter’sambienttemperatureduetoafailingfan).

Features and Functions

Page 5: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Output Voltage AdjustmentTheoutputofthemodulecanbeadjusted,ortrimmed,from0.8375Vto5.1V.ThisisaccomplishedbyconnectinganexternalresistorbetweentheTrimpinand-TrimasshowninFigure5orwithavoltageasshowninFigure6.ExtremelyhighaccuracysetpointscanbeachievedwiththeuseofapotentiometerasshowninFigure7.

Vt

Enable

Vout

SIL80C2

Trim

Vin

-Trim

Rtrim

Rtrim

2

1

Enable

Vout

SIL80C2

TrimVin

-Trim

Rtrim1Rtrim2

Rpot1

Figure5-OutputVoltageTrim Figure6-OutputVotlageTrim-withVoltageSource

Figure7-OutputVoltage-withPotentiometer

1

10

100

1000

10000

100000

1000000

0 1 2 3 4 5

DESIRED OUTPUT VOLTAGE SETPOINT (V)

RE

QU

IRE

D T

RIM

RE

SIS

TOR

(OH

M)

Figure 8 - Typical Trim Curves

Application

Enable

Vout

SIL80C2

Trim

Vin

-Trim

Rtrim

Page 6: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

Technical Reference Note

Output Voltage Adjustment (cont'd)ThetrimequationforthebasicconfigurationshowninFigure5is:

Rtrim(kΩ)= 1.675 Vout - 0.8375

WhereVoutisthedesiredoutputvoltage,RtrimistheresistancerequiredbetweenTrimand -Trim.

ThetrimequationfortheexternalvoltageconfigurationshownFigure6is:

Rtrim2(kΩ)= Rtrim1 (1.2 - 2Vt) Rtrim1 (Vout - 0.8375) - 1.675

WhereVoutisthedesiredoutputvoltage,Rtrim1andRtrim2aretheresistorsinFigure6 andVtistheappliedexternalvoltage.

ThetrimequationforthepotentiometerconfigurationsshowninFigure7is:

Vout= 0.8375 (Rtrim2 + Rpot)Rtrim1

X (2Rtrim2 + 2Rpot + Rtrim1Rtrim2 + Rtrim1Rpot + 2Rtrim1)

WhereVoutisthedesiredoutputvoltage,Rtrim1andRtrim2aretheresistorsinFigure7 andRpotistheresistanceofthepotentiometer.

Undervoltage LockoutTheSIL/SMT80C2hasbuilt-inundervoltagelockouttoensurereliableoutputpower.Thelockoutpreventstheunitfromoperatingwhentheinputvoltageistoolow.TheUVLOfortheSIL/SMT80C2canbeadjust-edwiththefollowingequation:

Thetrimequationfortheundervoltagelockoutis: Ruvlo (kΩ) = 124.8 + Vturn_on 10 Vturn_on - 42.06

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Application(cont'd)

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Technical Reference Note

Remote Sense CompensationTheremotesensecompensationfeatureminimizestheeffectofresistanceinthedistributionsystemandfacilitatesaccuratevoltageregulationattheloadterminalsoranotherselectedpoint.Theremotesenselineswillcarryverylittlecurrentandhencedonotrequirealargecross-sectionalarea.However,ifthesenselinesareroutedonaPCB,theyshouldbelocatedclosetoagroundplaneinordertominimizeanynoisecoupledontothelinesthatmightimpaircontrolloopstability.Themodulewillcompensateforamaximumdropof400 mV.Rememberthatwhenusingremotesensecompensationalltheresist-ance,parasiticinductanceandcapacitanceofthedistributionsystemareincorporatedintothefeedbackloopofthepowermodule.Thiscanhaveaneffectonthemodulescompensationcapabilities,affectingits stability and dynamic response.

Parallel OperationParalleloperationofmultipleconvertersisavailablesincetheSIL/SMT80C2hasacurrentsharingoption.Theconverterwillsharetowithin±10%offullload.Tocurrentshare,Pin6ofeachmoduleshouldbeconnected.Also,theremotesenselinesshouldbeconnectedatthesamepoint.Figure9showsthetypicalcurrentsharingapplication.

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Figure 9 - Parallel Application

Vin 12-14 VoutSIL80C2

Trim

-TrimIshare 6

GND

11 Sense-

10 Sense+

Vin 12-14 VoutSIL80C2

Trim

-TrimIshare 6

GND

11 Sense-

10 Sense+

RLOAD

Cload

Application(cont'd)

Page 8: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

Technical Reference Note

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Output CapacitanceTheSIL/SMT80C2hasoutputcapacitorsinsidetheconverter.Nooutputcapacitanceisrequiredforstableoperation.Whenpoweringloadswithlargedynamiccurrentrequirements,improvedvoltageregulationisobtainedbyinsertinglowESRcapacitorsascloseaspossibletotheload.LowESRceramiccapacitorswillhandletheshortdurationhighfrequencycomponentsofthedynamiccurrentrequirement.Inaddition,highervaluesofelectrolyticcapacitorsshouldbeusedtohandlethemid-frequency components.

Itisequallyimportanttousegooddesignpracticeswhenconfiguringthedcdistributionsystem.LowresistanceandlowinductancePCBlayouttracesshouldbeutilized,particularlyinthehighcurrentoutputsection.RememberthatthecapacitanceofthedistributionsystemandtheassociatedESRarewithinthefeedbackloopofthepowercapabilities,thusaffectingthestabilityanddynamicresponseofthemodule.Notethatthemaximumratedvalueofoutputcapacitancevariesbetweenmodelsandforeachoutputvoltagesetpoint.Astabilityvs.LoadCapacitancecalculator,(seeyoursalesrepresentative),detailshowanexternalloadcapacitanceinfluencesthegainandphasemarginsoftheSIL/SMT80C2.

SMT Reflow GuidelinesForaSnPbprocess:Padsshouldbeabove183C(liquidus)for90secondsmax(60-75secondstypical)withapeaktemperatureof225C.ForaleadfreeSAC305process:padsshouldbeabove217C(liquidus)for90secondsmax(60-75secondstypical)withapeaktemperatureof250C.

Water WashingNot recommended.

Application(cont'd)

Page 9: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

Parameter Test Conditions Min Typ Max Units

Absolute Maximums

Input Voltage 0 13.8 V

Enable Voltage 0 5 V

OperatingAmbientTemperature 0 85 ˚C

Non-OperatingAmbientTemperature -40 125 ˚C

Input Specifications

Input Voltage 4.7 13.8 Vdc

Input Current (No Load) Vin(min) - Vin(max), enabled 500 mA

Input Current (quiescent) Converter disabled 10 mA

Input Capacitance (Internal) Internal to converter 176 uF

InputCapacitance(External) Recommend customer added capacitance 47 uF

Output Specifications

OuputVoltage 0.8375 5.0 V

OutputSetpointAccuracy -1.0 +1.0 %

OutputRegulation(Line) -0.2 +0.2 %

OutputRegulation(Load) -0.5 +0.5 %

OutputCurrent(continuous) 0 80 A

OutputCurrent(shortcircuit) 0.9, 2.5, 5.1 Vout 130 140 A

OutputCapacitance(Internal) 500 uF

OutputCapacitance(External) 12 Vin, 0.9 Vout (Startup capacitance) 0 63,000 uF

12 Vin, 2.5 Vout (Startup capacitance) 0 30,000 uF

12 Vin, 5 Vout (Startup capacitance) 0 11,000 uF

OutputRipple/Noise(Peak/Peak) 5 Vin, 0.9 Vout, 0 uF Cout 20 mV

12 Vin, 2.5 Vout, 0 uF Cout 20 mV

12 Vin, 5 Vout, 0 uF Cout 20 mV

Efficiency 5.1 Vin, 0.9 Vout, 80 Aout 82.2 %

12 Vin, 2.5 Vout, 80 Aout 89.1 %

12 Vin, 5 Vout, 80 Aout 93.3 %

DynamicLoadResponse(PeakDeviation) 12 Vin, 0.9 Vout,50-75%loadat10A/us 95 mV

Dynamic Load Response (Setting Time) 12 Vin, 0.9 Vout,50-75%loadat10A/us 30 us

DynamicLoadResponse(PeakDeviation) 12 Vin, 2.5 Vout,50-75%loadat10A/us 150 mV

Dynamic Load Response (Setting Time) 12 Vin, 2.5 Vout,50-75%loadat10A/us 30 us

DynamicLoadResponse(PeakDeviation) 12 Vin, 5 Vout,50-75%loadat10A/us 150 mV

Dynamic Load Response (Setting Time) 12 Vin, 5 Vout,50-75%loadat10A/us 30 us

Page 10: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

Parameter Test Conditions Min Typ Max Units

Turn On Specifications

TurnOnDelay(withVin) 2.7 3 ms

TurnOnDelay(withEnable) 3 12 ms

OutputRiseTIme 10%-90% 1.8 2 ms

Enable Specifications

SignalLow(UnitOff) 0 0.7 V

Signal Low Current 12 Vin 0 1.2 mA

SignalHigh(UnitOn) 12 Vin 3.4 V

SignalHighCurrent 1.0 µA

Protection Specifications

OverCurrentProtection HiccupMode 108 A

Input Under Voltage (Rising) 4.7 V

Input Under Voltage (Falling) 4.0 V

General Specifications

MTBF Telcorida SR-332 3.7 MHrs

Weight 45.36 g

SwitchingFrequency PerPhase 500 kHz

Coplanarity TBD

Material Ratings

Flammability UL94V-0

Material Type FR4 PCB

Page 11: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

0.9 V Setpoint

Figure10:ThermalDeratingCurve5.5Vin Figure11:ThermalDeratingCurve12Vin

Figure12:Effiiciency0.9V

Figure13:ControlOn/Off(Channel1:OutputVoltage,Channel3:Enable)

Figure14:TypicalRippleOutput

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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

0

10

20

30

40

50

60

70

80

30 40 50 60 70 80

Ambient (C)

Load

Cur

rent

(A)

200 LFM300 LFM400 LFM500 LFM600 LFM

0

10

20

30

40

50

60

70

80

30 40 50 60 70 80

Ambient (C)

Load

Cur

rent

(A)

200 LFM

300 LFM

400 LFM

500 LFM

600 LFM

Figure11A:Thermalderatingcurve4.7Vinand13.8Vin

0

10

20

30

40

50

60

70

80

90

25 30 35 40 45 50 55 60 65 70 75 80 85

Load

(A

)

Ambient temp (ºC)

Thermal derating - 600LFM minimum airflow

4.7Vin, 0.84Vout13.8Vin, 5.1Vout13.8Vin, 5.0Vout

Page 12: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Figure16:ShortCircuitCharacteristic(Channel1:OutputCurrentat50A/div,

Channel4:OutputVoltage)

0.9 V Setpoint

Figure15:TransientResponse75%-100%(Channel3:CurrentStepat10A/div,Channel4:OutputVoltageDeviation)

Page 13: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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2.5 V Setpoint

Figure17:ThermalDeratingCurve5.1Vin Figure18:ThermalDeratingCurve12Vin

Figure19:Efficiency2.5V Figure20:ControlOn/Off(Channel1:OutputVoltage,Channel3:Enable)

Figure21:TypicalRippleOutput Figure22:TransientResponse75%-100%(Channel3:CurrentStepat10A/div,Channel4:OutputVoltageDeviation)

0

10

20

30

40

50

60

70

80

30 40 50 60 70 80

Ambient (C)

Load

Cur

rent

(A)

200 LFM300 LFM400 LFM500 LFM600 LFM

0

10

20

30

40

50

60

70

80

30 40 50 60 70 80

Ambient (C)Lo

ad C

urre

nt (A

)

200 LFM300 LFM400 LFM500 LFM600 LFM

Page 14: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Figure23:ShortCircuitCharacteristic(Channel1:OutputCurrentat50A/div,

Channel4:OutputVoltage)

2.5 V Setpoint

Page 15: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

5.0 V Setpoint

Figure24:ThermalDeratingCurve12Vin Figure25:Efficiency5.0V

Figure26:ControlOn/Off(Channel1:OutputVoltage,Channel3:Enable)

Figure27:TypicalOutputRipple-ADDTESTCONDITIONS

Figure28:TransientResponse75%-100%(Channel3:CurrentStepat10A/div,Channel4:OutputVoltageDeviation)

Figure29:ShortCircuitCharacteristic(Channel1:OutputCurrentat50A/div,

Channel4:OutputVoltage)

0

10

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30

40

50

60

70

80

30 40 50 60 70 80

Ambient (C)

Load

Cur

rent

(A) 200 LFM

300 LFM400 LFM500 LFM600 LFM

Page 16: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

MechanicalDrawingsSIL80C-00SADJ-VJ

Footprint

2.5421 PLACES

1.27.050

.100 TYP

2.300 58.42

.050 TYP1.27

APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM

D

C

B

AA

B

C

D

SCALE: 3 = 2

SIZE

CAD FILE:

DWG. NO.

BSHEET 1 OF 2

TLA DRAWINGAPPROVALS

DRAWN

ENGINEER

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES

.03

MATERIAL

FINISH

-

-

12345678

8 7 6 5 4 3 2 1

ARTESYN TECHNOLOGIESEDEN PRAIRIE, MN 55433PH. 952-941-1100

REV.

PROJECT USED ON:

7091259-0000

TITLE:

A

UPPERCUT 80THIRDANGLEPROJECTION

DATE

.015 1

HOLE TOLERANCE: .005

M. HENNIES

M. HENNIES

20JUN06

20JUN06

DETACHED LIST

7001259-J000

NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.

.040 1.02 58.932.320

1.160 29.46

31.751.250

60.962.400

.050 TYP1.27(23X)

±.002 0.64SQ PINS

17.53 MAX.690

1.57.062REF

2.79.110REF

±0.05REF .025

.140 TYP3.56

PART NUMBER REV DESCRIPTION DRAFT DATE

7091259-0000 A RELEASE TO PRODUCTION M. HENNIES 03/08/07

REVISION RECORD

Pin 1

00 0.

51.0

201.

78.0

70

6.86

.270

9.40

.370

11.9

4.4

70

14.4

8.5

70

17.0

2.6

70

19.5

6.7

70

22.1

0.8

70

24.6

4.9

70

27.1

81.

070

29.7

21.

170

32.2

61.

270

34.8

01.

370

37.3

41.

470

39.8

81.

570

42.4

21.

670

44.9

61.

770

47.5

01.

870

50.0

41.

970

52.5

82.

070

4.32

.170

55.1

22.

170

60.2

02.

370

61.9

82.

440

00

61.4

72.

420

3.30.1304.88.192

.242 6.15

.730 18.54

FOOTPRINTKEEP OUT AREA

PCB OUTLINE

THROUGH HOLE.040" DIA (23X)

Ø 0.45 ±.003 [1.14 ±0.08]

23x

Page 17: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

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MechanicalDrawingsSIL/SMT80C2-00SADJ-HJ/H3J

Footprint

00 0.

51.0

20

6.86

.270

9.40

.370

11.9

4.4

70

14.4

8.5

70

17.0

2.6

70

19.5

6.7

70

22.1

0.8

70

24.6

4.9

70

27.1

81.

070

29.7

21.

170

32.2

61.

270

34.8

01.

370

37.3

41.

470

39.8

81.

570

42.4

21.

670

44.9

61.

770

47.5

01.

870

50.0

41.

970

52.5

82.

070

55.1

22.

170

1.78

.070

57.6

62.

270

60.2

02.

370

61.4

72.

420

61.9

82.

440

000.51.0201.78.070

31.241.2301.270 32.261.290 32.77

FOOTPRINT

THROUGH HOLE.040" DIA (25X)

KEEP OUT AREA

PCB OUTLINE

D

C

B

AA

B

C

D

SIZE

DWG. NO.

BSHEET 2 OF 2

FOOTPRINT

12345678

8 7 6 5 4 3 2 1

REV.

TITLE:

7091259-0100 A

Ø 0.45 ±.003 [1.14 ±0.08]

25X

.050 1.27

1.1602X 29.46

58.422.300

.040 1.02 2.320 58.93

.100 TYP 2.5421 PLACES

22JUN06

DETACHED LIST

7001259-J100

D

C

B

AA

B

C

D

SCALE: 3 = 2

SIZE

CAD FILE:

DWG. NO.

BSHEET 1 OF 1

TLA DRAWINGAPPROVALS

DRAWN

ENGINEER

UNLESS OTHERWISE SPECIFIED

THIRD

DIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES

.03

MATERIAL

FINISH

-

-

12345678

8 7 6 5 4 3

PH. 952-941-1100

REV.

PROJECT USED ON:

7091259-0100

TITLE:HOLE TOLERANCE:

2 1

ARTESYN TECHNOLOGIESEDEN PRAIRIE, MN 55433

PROJECTION

A

UPPERCUT 80ANGLE

DATE

.015 1

.005

M. HENNIES

M. HENNIES

22JUN06NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.

2.400 60.96

31.751.250

.050 TYP1.27(23X)

APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM

2.79

REF

.110

.125

REF

3.18 TYP

18.03 MAX

.062

MAX

1.57

.710

REF .120 3.05

PART NUMBER REV DESCRIPTION DRAFT DATE

7091259-0100 A RELEASE TO PRODUCTION M. HENNIES 03/06/07

Pin 1

Model L Dimension

SIL80C2-00SADJ REF .120 [3.05]

SIL80C2-00SADJ-H3J REF .138 [3.50]

L - See Table

Page 18: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

Rev. 04.25.11SIL/SMT80C2

18 of 20

Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

MechanicalDrawingsSMT80C-00SADJ-VJ

Footprint

.050 1.27.100 TYP 2.54

21 PLACES

2.300 58.42

.040 1.02

8

8 7 6 5 4 3 2 1

ARTESYN TECHNOLOGIES

PROJECTION

DATE

.015 1

.005

M. HENNIES

M. HENNIES

22JUN06

22JUN06

DETACHED LIST

D

C

7

B

AA

B

C

D

SCALE: 3 = 2

SIZE

CAD FILE:

DWG. NO.

BSHEET 1 OF 2

TLA DRAWINGAPPROVALS

DRAWN

ENGINEER

UNLESS OTHERWISE SPECIFIEDDIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES

.03

MATERIAL

EDEN PRAIRIE, MN 55433

6

PH. 952-941-1100

REV.

PROJECT USED ON:

7091259-0300

TITLE:

A

ANGLE

FINISH

-

-

1

UPPERCUT 80THIRD

2345

HOLE TOLERANCE:

7001259-J300

APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM

.050(23X)

TYP1.27

2.400 60.96

.040 TYP1.02(2X)1.315 33.40

2.480 62.99

DETAIL A

.280 7.11.065 1.65

NOTE: OUTSIDE SUPPORT IS HIDDEN TO SHOW PIN DIMENSIONS.A

.062 1.57REF

REF .110 2.79

17.20.677

.610 REF15.49

PART NUMBER REV DESCRIPTION DRAFT DATE

7091259-0300 A RELEASE TO PRODUCTION M. HENNIES 03/06/07

REVISION RECORD

Pin 1

0 0.040 1.02.135 3.43.140 3.56.155 3.94.217 5.51

.440 11.18

.445 11.30

.670 17.02

.752 19.10

00

.060

1.52

.110

2.79

.140

3.56

.200

5.08

.240

6.10

.340

8.64

.440

11.1

8

.540

13.7

2

.640

16.2

6

23.8

8.9

40

.840

21.3

4

26.4

21.

040

28.9

61.

140

66.5

52.

620

1.24

031

.50

1.34

034

.04

1.44

036

.58

1.54

039

.12

1.64

041

.66

1.74

044

.20

1.84

046

.74

1.94

049

.28

2.04

051

.82

2.14

054

.36

2.24

056

.90

2.42

061

.47

2.44

061

.98

2.51

063

.75

2.56

065

.02

.740

18.8

0

REV.

TITLE:

7091259-0300

D

C

B

AA

B

C

D

SIZE

DWG. NO.

BSHEET 2 OF 2

FOOTPRINT

12345678

8 7 6 5 4 3 2 1

A

PCB OUTLINE

KEEP OUT AREA.300X.040" (23X)SMT PAD

VERT SMT STAND OUTLINE

FOOTPRINT

Page 19: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

Rev. 04.25.11SIL/SMT80C2

19 of 20

Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

MechanicalDrawings(cont'd)SMT80C2-00SADJ-J

Footprint

.050 1.27.100 TYP 2.54

21 PLACES

2.300 58.42

.040 1.022.320 58.93

2X 1.160 29.46

22JUN06

DETACHED LIST

7001259-J200

D

C

B

AA

B

C

D

SCALE: 3 = 2

SIZE

CAD FILE:

DWG. NO.

BSHEET 1 OF 2

TLA DRAWINGAPPROVALS

DRAWN

ENGINEER

UNLESS OTHERWISE SPECIFIED

THIRD

DIMENSIONS ARE IN INCHESTOLERANCES:2 PLACE 3 PLACE ANGLES

.03

MATERIAL

FINISH

-

-

12345678

8 7 6 5 4 3

PH. 952-941-1100

REV.

PROJECT USED ON:

7091259-0200

TITLE:HOLE TOLERANCE:

2 1

ARTESYN TECHNOLOGIESEDEN PRAIRIE, MN 55433

PROJECTION

A

UPPERCUT 80ANGLE

DATE

.015 1

.005

M. HENNIES

M. HENNIES

22JUN06

NOTE: 1. 9300161-0000 PACKAGING AND MATERIAL HANDLING PROCEDURE. 2. COSMETIC AND WORKMANSHIP PER 9300152-0000. 3. LABELS SHOWN FOR PLACEMENT REFERENCE ONLY.

2.400 60.96

31.751.250

TYP1.27.050(23X)

.040 TYP1.02(2X)

APPLY LIQUI-BOND BETWEEN HEATSINK AND PCB. ADJUST APPLICATION STENCIL TO KEEP EXCESS LIQUI-BOND TO A MINIMUM

1.57.062REF

REF .110 2.79

.710[18.03] MAX

.125 3.18

PART NUMBER REV DESCRIPTION DRAFT DATE

7091259-0200 A RELEASE TO PRODUCTION M. HENNIES 03/06/07

REVISION RECORD

Pin 1

0 0.020 0.51.040 1.02

1.195 30.351.270 32.261.290 32.77

00

.020

0.51

.048

1.21

.248

6.29

.348

8.83

.448

11.3

7

.548

13.9

1

.648

16.4

5

.748

18.9

9

.848

21.5

3

.948

24.0

7

1.04

826

.61

1.14

829

.15

1.24

831

.69

1.34

834

.23

1.44

836

.77

1.54

839

.31

1.64

841

.85

1.74

844

.39

1.84

846

.93

1.94

849

.47

2.04

852

.01

2.14

854

.55

2.24

857

.09

2.34

859

.63

2.42

061

.47

2.44

061

.98

FOOTPRINT D

C

B

AA

B

C

D

SIZE

DWG. NO.

BSHEET 2 OF 2

FOOTPRINT

12345678

8 7 6 5 4 3 2 1

REV.

TITLE:

7091259-0200 A

KEEP OUT AREA

PCB OUTLINE

SMT PAD.045X.070" (25X)

Page 20: Technical Reference Note Business-Critical Continuity Rev ... file• Target application PCB design, especially ground planes. These can be effective heatsinks for the con-verter.

OrderingInformation

PinChartPin AssignmentsSingleOutput1 Trim2 No Pin3 Ground4 Power Good5 (-) Trim6 Ishare7 Ground8 Ground9 Enable

Pin AssignmentsSingleOutput14 Vin15 Vout16 Vout17 Ground18 Vout19 Ground20 Vout21 Ground22 Vout

10 Rem Sense (-)11 Rem Sense (+)12 Vin13 Vin

23 Ground24 Vout25 *MechSupport26 *MechSupport

*Horizontalversiononly

Rev. 04.25.11SIL/SMT80C2

20 of 20

Thisisapreliminarydatasheet.EmersonNetworkPowerreservestherighttomakechangestotheinformationcontainedhereinwithoutnoticeandassumesnoliabilityasaresult of its use or application.

Embedded Power forBusiness-Critical ContinuityTechnical Reference Note

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Whileeveryprecautionhasbeentakentoensure accuracyandcompletenessinthisliterature,EmersonNetworkPowerassumesnoresponsibility,anddisclaims allliabilityfordamagesresultingfromuseofthis information or for any errors or omissions.

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RoHs Compliance(9)

RoHS ComplianceJ=Pb-free(RoHS6/6compliant)

CustomOptions

CustomOptionsBlank=3.05mmpin3=3.50mmpin

Rated Output Current

Rated Output Current80=80A

Performance

PerformanceC=CostOptimized

Generation

Generation2=Increased Current Density

Input Voltage

Input Voltage00=4.7-13.8V

Output Voltage

Output VoltageSingle AdjustableOutput

Product Family

Product FamilySIL=SingleInLine

Rated Output Current

Rated Output Current80=80A

Performance

PerformanceC=CostOptimized

Generation

Generation2=Increased Current Density

Input Voltage

Input Voltage00=4.7-13.8V

Output Voltage

Output VoltageSingle AdjustableOutput

Mounting Option

Mounting OptionBlank=HorizontalV=Vertical

Product Family

Product FamilySMT=SurfaceMount

SMT 80 C 2 - 00 SADJ - X X J

RoHs Compliance(9)

RoHS ComplianceJ=Pb-free(RoHS6/6compliant)

CustomOptions

CustomOptionsBlank=3.05mmpin3=3.50mmpin

Mounting Option

Mounting OptionBlank=HorizontalV=Vertical

SIL 80 C 2 - 00 SADJ - X X J