All information and data contained in this document remains the intellectual property of

Winslow Adaptics Ltd – Strictly Confidential – Subject to Non-Disclosure

14/01/2016 1

Winslow Adaptics Ltd

Unit 11

Brecon Enterprise Park

Brecon

Powys

LD3 8BT

Product Training and Realisation Manual

To Complement the Product Capability Panel

Author: Jonathan Warfield Product Development Manager Tel: 01874 620248 Email: jon@winslowadaptics.com Date: 14 January 2016 Issue: 1

Phone:

0044 1874 625555

Fax:

0044 1874 625500

E-mail:

sales@winslowadaptics.com

All information and data contained in this document remains the intellectual property of

Winslow Adaptics Ltd – Strictly Confidential – Subject to Non-Disclosure

14/01/2016 2

Note: The product capability panel containing a sample of product that is either off the shelf, sold through distribution or customer manufactured to order. All custom products are assigned a unique part number and assigned to the customer themselves. Only that customer can purchase the product (or a nominated company on their behalf). The product capability panel is required to follow the description in this document. To obtain a product capability panel please contact sales@winslowadaptics.com for details.

All information and data contained in this document remains the intellectual property of

Winslow Adaptics Ltd – Strictly Confidential – Subject to Non-Disclosure

14/01/2016 3

Prototyping Adapter The assembly marked W9501, is probably the fastest moving products sold from the Winslow range. It converts a 8 pin SOIC to a 8 pin DIL package. The DIL is a standard 0.1” footprint which can be soldered to a vero board for prototyp-ing. This is especially useful as the customer can develop their product using the pack-age that they require. If the adapter was not available they could only prototype in the DIL or other pinned packages. The W9501 is a simple single PCB solution, fitted with the Winslow press fit pin technology. The PCB finish is ENIG which is standard across our range (other finishes are available). For an idea of cost and revenue, one customer required this adapter in volumes of 15k per week. Winslow manufac-tured the product (with device mounted) and shipped as a fully functional unit. The project lasted for 10 weeks and brought revenue of over $75,000. This customer now uses Winslow as a second source as component allocation is still an issue. The second assembly marked BGA TEST, is a test adapter specifically designed to break the signals out from a BGA device. The signals are pinned out on a 0.1” PGA matrix to enable the customer to prototype on vero board or simi-lar. Winslow can also mount the component to the adapter PCB for customer ease.

Footprint Convertor These adapter board convert a semiconductor footprint to another footprint. The other footprint can be anything that the customer desires, which is usually what the customer has designed on their original target PCB. The top component is selected to match the original component in functionality and can be of any package. The first assembly—W12948, is a QFP to QFP adapter conversion. The customer was using a 208 pin package that became obsolete, a replacement was a 160 TQFP package. The adapter was built using edge castellations to repli-cate the original 208 pin QFP package. This technology is not dissimilar to an LCC package where the assembly sol-ders flat to the customers target board. In this instance the customer was concerned about via clash and Winslow proposed 2 options, multilayer PCB with blind vias to keep the underside free of copper or the cheaper option of adding a thin layer of Kapton tape for insulation. This gives an idea of the options that may arise from different con-cerns, it is ultimately up to the customer to agree and choose the best option for their application—the customer is the best to give this information as only they know their system and application. In this case the application was high vibration and harsh environment—military aerospace. The second assembly is a QFP to PGA conversion. Two PCBs are required as the footprints for the QFP and PGA clash when sat on top of each other. The offending signals are moved to the centre portion of the PCB where there is room to track. The signals are connected to the bottom PCB where the signals are then carried back to their original position. The pins used in the assembly are Winslow proprietary information and manufactured on site in the UK The third footprint convertor is something more legacy that is used in a commer-cial aircraft environment. A TO3 can type device went obsolete, the replacement that was found was a SMT device that required some peripheral components to achieve form fit and function. The design again uses Winslow's press fit pin technology.

All information and data contained in this document remains the intellectual property of

Winslow Adaptics Ltd – Strictly Confidential – Subject to Non-Disclosure

14/01/2016 4

ASIC / FPGA Replacement The more complex adapters are contained in the centre of the test panel. These adapters were borne from customer specific applications, where the original device used (ASIC) were made obsolete and required a more in depth solution. The first adapter marked W14006, is actually a second generation adapter. The adapter was required as the original PGA ASIC was not available. The functionality was recreated by using a FPGA and associated components. The first adapter was created using a Xilinx Spartan 1 series and this was designed and manufactured in the early 1990’s. It was used until 2010 when the Spartan 1 device was also made obsolete. Winslow proposed creating a new adapter using a current market FPGA, this required some firmware writing due to the differences in early and modern FPGA cod-ing. The adapter now uses a modern FPGA but still working in the origi-nal package. The application was high reliability industrial equipment. This future proofs the customer design and enables the same technology to be utilised on future designs.

The second adapter W12771, is a PLCC replacement adapter. The PLCC device ac-tually sat inside a PLCC socket on the customers target PCB, which they still wanted to use. As Winslow manufacture a range of PLCC spacers, this was the base of the adapter. The PLCC spacer is then soldered to a PCB which contains the electronics required to meet the demands of the original device. A FPGA and associated com-ponents is used in this design. The application was commercial sound recording equipment.

The W12885 adapter is a single PCB solution, which utilises a 6 layer PCB. The contacts are edge castellation to replicate a 208 QFP footprint. The top of the assembly contains the FPGA, power supply (to reduce from 5V to 3.3V) and other associated components including JTAG for in circuit programming. The applica-tion for this assembly is Military radio and was used in quite high volumes. The last adapter in the row is the W12878 adapter. This unit was actually designed within a set of 3. It was designed to overcome an obsolete CPLD, where the product range was made obsolete by the manufacturer. There were 3 different device package types used on the target PCB, which meant 3 different PCB designs. This particular design used a PGA type package, so again uses Winslow press fit pin technology. It also uses 2 x 1.6mm thick PCBs to overcome footprint clash issues. The PCBs are multilayer which included GND and VCC planes. However, there has been a design change to the assembly recently, where the customer was concerned regarding a potential contamination issue between the two PCBs that make up the overall assembly. The resulting investigation was to implement a new process to effectively bond the two individual PCBs together to create a single PCB assem-bly. The pins that carry the signals between the footprints, were encapsulated in the bonding process to achieve a single PCB solution (in effect). This assembly is used in harsh environment, where salt water spray could be an issue. The process change was a new development to Winslow Adaptics, but through thor-ough investigation proved to be a vital change and one that will be used for future harsh environment projects using the 2 PCB type technology.

All information and data contained in this document remains the intellectual property of

Winslow Adaptics Ltd – Strictly Confidential – Subject to Non-Disclosure

14/01/2016 5

Test Products Winslow offer a variety of sockets and connectors and can cross refer from all of the larger manufacturers. The offering ranges from simple 1.27mm pin headers and strip sockets, to 2.54mm box headers and everything in between. Production and test IC sockets to match standard footprints are available (often off the shelf) and even to the more complex custom packages can be offered to match. Leadtimes for custom sockets are typically in the 4-week range. Other special test products include solder down product. Where a break out product is required to test on board. Winslow offer standard solutions for DIL, PLCC, QFP and many more. The adapters are soldered to the existing land pattern and the PCB carries the signals to physical test points. Custom solutions are also available, these development tools can be a simple SMT footprint to test points or something more complex. Connectors can be added for easy interface with the device, and PWR / GND ports can be easily accommodated. A PCB can be designed specifically for the device to be tested - typically in 3-4 weeks delivered. Test points can be added for probing either PTH or SMT pads. The device could also be enclosed into a custom built socket to enable multi-ple use testing on the same package type.

Special Adapters Winslow are contacted for all manner of design and supply issues. Some range from simple connectors to legacy components. The LED assembly marked W12959RC, was designed to overcome an obsolescence issue with an intelligent hexadecimal LED display. The design used a small FPGA and boot IC to control the display, the top side contained 20 x 0402 size SMT LEDs and numerous resistors. The unit was designed specifically for a large multina-tional media company, to be used in telephone exchanges. The two small PCB assemblies marked W12999-xx-xxRC, were designed to replace legacy Micro Q capacitors that sat underneath a DIL package. The original micro Q device was made obsolete in the 1980’s. The PCBs were made from a thin piece of FR4 substrate and contained a ceramic ca-pacitor on the top side. The units were installed as per the previous design. The ap-plication was again Military and used on legacy equipment.

Also available from Winslow Adaptics are cost effective, time saving solutions to test, obsolescence, supply problems and upgrades. OEMs can upgrade equipment with custom Adaptics utilising addi-tional logic, often saving considerable cost and time on re-design. If lead-time becomes an issue con-tact us for a suitable package converter. We specialise in conversion of all package lead-frames. For further information please contact your nearest sales office

Solutions to Component Leadtime and Obsolescence