TC-5021 & TC-5022 Product and Application...
Transcript of TC-5021 & TC-5022 Product and Application...
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TC-5021 & TC-5022 Product and Application Training
August, 2005
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• Thermally Conductive Greases• TC-5021/TC-5022 Properties and Design
Considerations• Process – Screen Printing• Testing - How Customers Evaluate Grease
Content
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Thermal Interface Materials• Function
– To enhance heat transfer across the interface between a heat source and heatsink
• Characteristics– High thermal conductivity– Easy to process and apply– Usually electrically isolating– Often reworkable/bondable– Maintain properties
• Types of Interface Materials– Grease– Adhesives– Phase Change– Gel– Pads– Films– Tapes
• Market driven by growth of semiconductor devices that require thermal management (>2W power dissipation)
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DCC Thermally Conductive Compounds
TC-5021, TC-5121, TC-5022
SE-4490CVPastes
SC4476CV, SC4477CV
SC4471CVSC-102,CN-8870
340, SH-340Greases
>2.52.0-2.51.5-2.01.0-1.50.5- 1.00.2-0.5
Thermal Conductivity (W/mK)
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TIM 2 Application
Flip Chip BGA
LidLid Seal
Substrate
TIM 2Heat Sink
Flip ChipTIM 1
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Intel CPU Power Consumption Trend
0
20
40
60
80
100
120
140
TDP
(Wat
t)
386486586Pentium ProPentium IIPentium IIIPentium IVPentium D
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TC-5021/TC-5022 Properties and Design Considerations
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Positioning and Value
TC-5022• 10-15% Better Thermal
Performance• Excellent Value Performance
Superior Reliability Performance
TC-5021• Comparable Performance &
Lower Price• Excellent Reliability
Performance
Competitor BTC-5021
Ther
mal
Per
form
ance TC-5022
Competitor A
10-15% Improvement at
lower price
Price
Comparable Performance at
Lower Price
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TC-5021 Dispensable/Printable Silicone Grease
• Economic Version• Excellent Wetting Characteristics• Thermal Resistance = 0.16 cm2C/W• Stable and Reliable Performance
Room Temperature StorageSamples now available
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TC-5022 Dispensable/Printable Silicon Grease
• Low Thermal Resistance = 0.069 cm2C /W• Excellent Wetting Characteristics• Optimized Filler Technology• Thin Bond Line at Low Pressures • Pressure Independent• No Pump Out, No Bleed Out
Room Temp StorageSamples now available
23.83.850.06923//100,000GreaseTC-5022
kW/mkc-cm2/Wumcp
Dielectric Constant@1kHz
Thermal Conductivity
Thermal ResistanceBLTCure
ViscositySystemProduct
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Critical Thermal Grease Properties
21 cc
TIM
TIM RRk
BLTR ++=
Effective thermal resistance of a device, RTIM.
• BLT = Bond Line Thickness• kTIM = Thermal Conductivity• Rc = Contact Resistance between the TIM and the two surfaces.
Key Goal Minimize RTIM• Increase TIM thermal conductivity (kTIM).• Reduce Bond Line Thickness (BLT).• Reduce contact resistances (Rc) .
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TIM Technology Development
Thermal Resistance
Bond Line ThicknessFiller Technology
Process-abilityReliability
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Primary Components of Thermal Greases:• Filler:
– Size– Type – Loading
• Polymer:– Filler dispersion– Filler compatibility– Silicones
• Temperature Stability• Low Surface Energy
Thermal Grease Design Considerations
TIM Thermal conductivity (kTIM)Line Thickness (BLT)
Wetting, viscosity and maximum loadingHandling and processing
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Measurement of Thermal Resistance by Guarded Hot Plate at Dow Corning
Heat Flux
Boundary condition control
Thermal sensor array
Boundary condition control
Thermal sensor array
Thermally conductivematerial
Weight
2.5mm
10mm
Heater Axis Cooler Axis
Calculate T.R. fromdifference of Temp.
Tem
pera
ture
Sample SurfaceHeater
Cooler
Test Condition: 50C, with 1cm X 1cm surface
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TC-5021 ReliabilityThermal Cycle
• Thermal reliability is an important aspect of TIM performance.• Steady thermal resistance indicates a good thermal reliability.
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Screen ThicknessEmulsion ThicknessPaste ViscositySqueegee PressureSqueegee SpeedScreen Gap
Thickness
Important Screen Printing Parameters
Substrate
Gap
Aluminum Frame
Screen
SqueegeePressure Angle HardnessSpeed
Screen ThicknessEmulsion Thickness
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Effect of the Screen Thickness
a. Types of screen material: PET or Nylon or stainless steelb. Screen thickness is decided by the thread diameter (nomenclature:
S, T, HD) c. Generally, the smaller the mesh number, the thicker the mesh.
Therefore, under the same printing condition, using a small meshnumber screen can get a thick printed film
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Squeegee Angle and Pressure
45o
Suggested start angleToo steepGood for
high viscosity grease
Should keep CONSTANT pressure, angle, and speed when pass through the patterned area
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Effects of the Squeegee Hardness
80
70
60
Hardness
(45o squeegee but 30o at tip)
TC-5021
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Screen Gap
Depend on the screen tension General speaking, 1~ 3 mm
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Screen Gap (cont’d)
When the squeegee travels over the screen, the screen peel away immediately behind the squeegee
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Screen Gap (cont’d)- Printing Defect
Insufficient gap causes grease separates from screen difficultly
If the screen gap is too big, a high pressure is needed for printing
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Printing Deviation (cont’d)
The pad-to-pad weight difference can be controlled within 5%
g
0.44
0.45
0.46
0.47
0.48
0.49
0.5
0.51
0.52
0.53
80 mesh, 34x34 mm2 pad sizeSqueegee Blade Hardness = 70Screen Gap = 1.2mm
1 2 3 4 5 6 Group of Printing
TC-5021
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Single-pass vs. Multi-pass
Pad-to-pad variation
*assume density = 3.4
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Printing Defect
Overflow Backside Contamination
Cleaning backside of the screen periodically
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Summary
• Suggest starting with 80 mesh screen, hardness 70 squeegee, 1~3 mm screen gap, and 45o squeegee angle
• Less than 5% pad-to-pad variation can be achieved by optimizing the printer parameters
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How Customers Evaluate Thermal Greases
• System Level– System fans combined
with ducting and venting
• Component Level–Active heat sink –Passive heat sink
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Thermal Specifications
• Thermal Design Power (W)
• Maximum T case (oC) • Internal Chassis
temperature – < 38oC (Intel, 90nm)– < 45oC (Intel, 0.13um)
CPU TDPFMB 1.0 S478 Willemette, Northwood Core P4 89WFMB 1.5 S478 Prescott Core P4 103WFMB 2.0 LGA 775 P4 & P5 115W
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Thermal Resistance Measurement
θca = θcs+ θsa = (Tc – TA)/PDwhere:θca = Thermal resistance from case to local ambient (oC /W)TC = Processor case temperature TA = Local ambient temperature in chassis around processor (oC)PD = Process power dissipation
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Example
Thermal Test Vehicle (TTV) thermal coupler
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What I should question about
Socket
Fan
different BLT ?compare with?
same heatsink?variable speed fan?
thermal coupler position?
Others?well printed pad ?
grease mixed well?Intel/AMD?
TDP (Power)?dummy die/TTV?
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Do you know what they are?
PCI
PCI Express
Chipset
Socket
VoltageRegulator
PCI Express x 16
DIMM Socket