Zg-3 Zero Gauss Chambers - EMI Electromagnetic Interference Shielding
Tatsuta EMI Shielding Solutions - ECTC EPS TATSUTA EMI...Tatsuta EMI Shielding Solutions May 30,...
Transcript of Tatsuta EMI Shielding Solutions - ECTC EPS TATSUTA EMI...Tatsuta EMI Shielding Solutions May 30,...
Tatsuta EMI Shielding Solutions
May 30, 2019
Mike Sakaguchi
TATSUTA ELECTRIC WIRE & CABLE Co., Ltd
Conductive Materials Division
5-1,6chome,Kunimidai,Kizugawa city
Kyoto, Japan, TEL 0774-66-5551 FAX0774-66-5556
http://www.tatsuta.com
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No. TATSUTA ECTC 2019-2
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1 Company Profile
2 Products Lineup
EMI Shielding Conductive Paste
EMI Shielding Film
3 Equipment
EMI Shielding Process Equipment
EMI SE Measurement Equipment
4 Dry Process Printed Electronics Solutions
5 5G/6G EMI Shielding & Thermal Management Solutions
6 Roadmap
Company Profile
OTHERS
Electric Wire&Cable
Electronic Materials
Functional Materials
Fine Wire
Conductive Paste
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FPC EMI Shielding Film
Bonding Film
Free GND Film
RA Cu Foil
6N Cu Ingot
Cu Target
Cu Powder
PKG EMI Shielding Paste
LCP Via Filling Paste
Antenna Printing Paste
Au, Ag, Cu Wire
LCP FCCL
LCP Nugget
LCP FCCL
#1 Market Share
EMI Shielding
Film
Sendai Works
Kyoto Works Technical Center Kizugawa WorksMalaysia
USA
Shanghai
Suzhou Support Center
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HQ
Company Profile
Products Lineup in System Electronic Division
・ Gold bonding wire
・ Copper bonding wire
・ Silver bonding wire
・ EMI Shielding film
(Thermosetting, Thermoplastic, PSA type)
・ Free Grounding film
・ Bonding film
(Conductive , Non-Conductive type)
・ Masking film for reflow process
・ EMI Shielding
(Conformal & Compartment Shielding)
・ Via filling
(Electric conductive & Thermal Conductive)
・ Circuitry / Electrode (Solderable)
・ SMT(Low Temp. Curing)
・ Water Leakage Sensor
・ Medical Sensor
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Segment Application
PCB
FPC
Semiconductor
PCB
FPC
Multilayer
Build up
Multilayer
LCP
Automotive
Mobile
PKG
SMT
Other
HPC
Consumer/IOT
Paste Lineup for PCB/FPC and Semiconductor
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EMI Shielding
(Conformal)
EMI Shielding
(Compartment)
SMT
(Low Temp.)
Circuity, Antenna
(Low Temp.)Via Filling
(Thermal Conductive)
Via Filling
(TLPS)
Gap Control SMT
Paste Lineup for PCB/FPC and Semiconductor
EMI Shielding Film Road Map with Signal Environment
2015 2016 2017 2018 2019FPC Length = 100mm
2.Keeping Wave form Quality
Important Functional Property
1. Expand Needs to Intra EMC
FPC Roadmap for Mobile Smartphone1. EMC / GND Strength2. Total Thickness3. Smaller4. High Frequency etc..
We have solution line up above design Issue.
SF-PC5600
Standard
SF-PC5900
Ultra Thin
SF-PC8600
StandardMore Shielding
SF-PC8900
Ultra ThinMore
Shielding FGF-series
GND-Strength
SF-PC3300/3500-P2
High Frequency
High Shielding
SF-PC3100
High Frequency
Best Shielding
M-PHY(C-phy)D-PHY v1.1
USB3.2USB3.2
5G- 5G+
D-PHY v1.2
SF-PC6000-U1(N)
High Step
2020
Shie
ldin
g e
ffec
tive
nes
s
Frequency band
EMI Shielding Film Lineup for FPC
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Nordson Asymtek Ultrasonic Systems Protec
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EMI Shielding Process Equipment in Tatsuta
Chip1 Chip2
Vacuum Printing
Toray ENG
Conformal
Coating
Compartment Trench Filling
Conformal Spray Coating
Compartment
Trench Filling
Dispensing & Jetting
Nordson Asymtek
Spray
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EMI SE Measurement Equipment in Tatsuta
Radio Isolation Room
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EMI SE Measurement Equipment in Tatsuta
KEC Method ( Max 1GHz)
Coaxial Tube Method ( Max 10GHz)
Next
28GHz SE
Measurement
Equipment
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RDL Antenna
FMV
Thermal Via
Dry Process Printed Electronics Solutions
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Sputter/Spray
5G/6G EMI Shielding & Thermal Management Solutions
IC PKG
Small Size
Spray & Jetting
SiP & Entire Board
Large Size
Thermal Release + EMI Shielding
ProcessStress Free Spray Coating for Wide Area
Paste Filling in Narrow Trench and Micro FMV
Low Temperature Curing
MaterialThin & High SE Hybrid Metal Formulation
High Peeling Strength Resin Formulation
2010
2020
2005
Shielding
NF2000EX
Via filling
AE series
TH connect
TH9980
Via filling
MP series
2015
Solderable for pad
& trace
EMI Shielding
Spray type
SMT for passive
components
SMT for active
components
Via filling
FMV
High heat
resistant for
SIC,IGBT
EMI Shielding
Spray type
Low temp. cureStress Relaxation for
MLCC electrode
Silver coated
copper
Copper
Metallizing/TLPS
Copper inlay
Bendable type
Silver and Copper
Hybrid
EMI shielding
Spray type
5G/6G
Via filling
LCP
EMI shielding
Spray type
Low frequency
Roadmap