Taiwan Semiconductor Manufacturing Company, Ltd. The Creator and Leader of the Foundry Industry.
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Transcript of Taiwan Semiconductor Manufacturing Company, Ltd. The Creator and Leader of the Foundry Industry.
Taiwan Semiconductor Manufacturing Company, Ltd.Taiwan Semiconductor Manufacturing Company, Ltd.
The Creator and Leader of the Foundry IndustryThe Creator and Leader of the Foundry Industry
TSMC Introduction
Market Overview
Technology Leadership
Capacity Leadership
Services Leadership
Introduction to TSMC -Introduction to TSMC -
TSMC Is The Creator And Leader of the IC Foundry Industry
We are committed to leadership in capacity, technology and service
Founded in 1987
“Our vision is to be the most reputable, service-oriented maximum-total-benefits silicon
foundry in the world, thereby earning the reward of also being the largest and most profitable
foundry. To this end, we maintain a consistent focus on our foundry business, concentrating
our commitment to being our customers’ “Virtual Fab”.
Dr. Morris Chang
Chairman
Taiwan Semiconductor Manufacturing Company, Ltd.Taiwan Semiconductor Manufacturing Company, Ltd.
TSMC Employee Growth TSMC Employee Growth
258586 809
13,138
7,455
5,9085,594
4,1173,412
2,6812,294
1,8931,5011,187
0
1,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
13,000
14,000
1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000
258586 809
13,138
7,455
5,9085,594
4,1173,412
2,6812,294
1,8931,5011,187
0
1,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
13,000
14,000
1987 1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000
TSMC RevenueTSMC Revenue
0
20,000
40,000
60,000
80,000
100,000
120,000
140,000
160,000
180,000
1988 1989 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000
1992-2000(
1992-2000(F
) CAGR = 50%
F) CAGR =
50%
4Q: NT$53.8 Bn
Year 2000 : NT$166.2 BnYear 2000 : NT$166.2 Bn
44QQ3Q3Q2Q2Q1Q1Q
NT $ M
Source: Dataquest, TSMCSource: Dataquest, TSMC
34.9
25.8
19.9
15.413.7
7.5
6.3
10.212.0
14.7
19.8
27.8
1999-2004 Foundry Wafer CAGR= 28%1999-2004 Foundry Market CAGR= 26%
Foundry Market DemandFoundry Market Demand
Foundry MarketFoundry Market
Foundry WaferFoundry Wafer
B US$B US$M 8” eq. WafersM 8” eq. Wafers
1999 2000 2001 2002 2003 20041999 2000 2001 2002 2003 2004
3535
3030
2525
2020
1515
1010
55
3535
3030
2525
2020
1515
1010
55
FoundryFoundry10-15%10-15%
IDM CaptiveIDM Captive85-90%85-90%
TSMCTSMC39%39%
UMCUMC24%24%
Chartered 8%Chartered 8%
IDM FoundryIDM Foundry20%20%
Anam 3%Anam 3%
Others 5%Others 5%
~ ~ U.S. $13.7 BillionU.S. $13.7 Billion
TSMC: The Market Share LeaderTSMC: The Market Share LeaderBy Revenue (WW Foundry Industry,2000)By Revenue (WW Foundry Industry,2000)By Revenue (WW Foundry Industry,2000)By Revenue (WW Foundry Industry,2000)
Source: IC Insights, TSMCSource: IC Insights, TSMC
Normalized to TSMC wafer shipment excluding memoryNormalized to TSMC wafer shipment excluding memory
TSMC Leadership in CommunicationsTSMC Leadership in Communications
Source: Company News, TSMC 2001/Q1Source: Company News, TSMC 2001/Q1
TSMCTSMC Competitor 1Competitor 1
11
56%56%
26%26%
Competitor 2Competitor 2
11
00
0%0%1%0%0%1%1%
36%40%
34%34%35%33%30%
64%65%66%65%66%69%
60%
Sales by Market SegmentSales by Market Segment
Net Sales 50.2 73.1 28.3 31.8 47.5 53.9 166.2(NT$Bn) Pre-merger)
% of Sales
System Co.System Co.IDMIDMFablessFabless
1998 1999 11998 1999 1QQ’’ 00 2Q 00 2Q’’ 00 3Q 00 3Q’’ 00 4Q 00 4Q’’ 00 00 20002000
80%80%
60%60%
40%40%
20%20%
0%0%
Based on Quantity Sold at 8”equivalentBased on Quantity Sold at 8”equivalent
Sales by ApplicationSales by Application Based on Quantity Sold at 8”equivalent
11%
33%
16%
4%36%
2000 2000 3,4083,408KK
20%
29%
14%
4%
33%
44Q’00 Q’00 1,001K1,001K
33%3%
17%
35%
12%
33Q’00 Q’00 942K942K
CommunicationsCommunications ConsumerConsumer OthersOthers MemoryMemory ComputerComputer
TSMC Leads in VDSM (0.25um & below)Wafer Shipment in 2000TSMC Leads in VDSM (0.25um & below)Wafer Shipment in 2000
0
0.2
0.4
0.6
0.8
1
TSMC Nearest Competitor
0
0.2
0.4
0.6
0.8
1
TSMC Nearest Competitor
Normalized to TSMC Wafer shipmentNormalized to TSMC Wafer shipment
Source: Company News, TSMCSource: Company News, TSMC
Industry’s Leading Portfolio of Process Technologies
Logic Processes to 0.13um
Embedded Non-Volatile Memory to 0.18um
Mixed Signal & RF Processes
High Voltage Processes to 0.25um
Image Sensor Technology to 0.35um
Embedded DRAM to 0.25um
Copper and Low-K Dielectric Processes
TSMC Is the Technology Leader TSMC Is the Technology Leader
0
500
1,000
1,500
2,000
2,500
3,000
3,500
4,000
1992 1993 1994 1995 1996 1997 1998 1999 20000
500
1,000
1,500
2,000
2,500
3,000
3,500
4,000
1992 1993 1994 1995 1996 1997 1998 1999 2000
TSMC: The R&D Investment Leader
CAGR 54%
CAGR 54%
CAGR 54%
CAGR 54%
R&DR&D
R&D expense between 1992 and 1997 have not been restated under the current definitionR&D expense between 1992 and 1997 have not been restated under the current definition
NT $ M
TSMC RoadmapTSMC RoadmapLeading Foundry vs. SIA RoadmapLeading Foundry vs. SIA Roadmap
Minimum Feature Size of Production
TSMCTSMC
SIASIARoadmapRoadmap
’’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’0395 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03
11
0.50.5
0.40.4
0.30.3
0.20.2
0.10.1
Excellent yield (lot average>92%) demonstrated for 4Mb
6T SRAM vehicle
More than a dozen customer tape-outs (LV,G,LP)
First in offering 0.13um CyberShuttle (Nov.00)
5 customers received functional devices in 1st
silicon (CPU,communications & FPGA)
First in starting 0.13um risk production (multiple customer
products-WIP greater than 3,000 wafers)
Deploying 0.13um manufacturing to 2 fabs in 2001,and to 6 fabs in 2002 (incl. 300 fabs) with ample capacity to meet customer demand
0.130.13um Technology Leadershipum Technology Leadership 0.130.13um Technology Leadershipum Technology Leadership
TSMC Logic Technology Features(Front End)
1414202028.628.638386161Gate delay ( ps/gate )Gate delay ( ps/gate )
1717AA2020AA3232AA5050AA7070AAGate oxide thicknessGate oxide thickness
STISTISTISTISTISTISTISTILOCOSLOCOSIsolationIsolation
SSRSSRSSRSSRSSRSSRR wellR wellDiffused wellDiffused wellWell formationWell formation
YesYesYesYesYesYesNoNoNoNoPSMPSM
ArFArFDUV-ScannerDUV-ScannerDUV-ScannerDUV-ScannerDUV-stepperDUV-stepperI-LineI-LineLithographyLithography
1.01.0V, 2.5VV, 2.5V1.21.2V, 3.3VV, 3.3V1.8, 3.31.8, 3.3VV2.5, 3.3, 52.5, 3.3, 5VV3.3, 53.3, 5VVI/O VoltageI/O Voltage
1.01.0VV1.21.2VV1.81.8VV2.52.5VV3.33.3VVCore VoltageCore Voltage
8877665544# # of metal layersof metal layers
Q4, 2000*Q4, 2000*Q1, 2000Q1, 2000Q1, 1999Q1, 1999Jan., 1998Jan., 1998Nov., 1996Nov., 1996Risk ProductionRisk Production
CL013CL013CL015CL015CL018CL018CL025CL025CL035CL035
0.13 0.13 umum0.15 0.15 umum0.18 0.18 umum0.25 0.25 umum0.35 0.35 umumTechnologyTechnology
* For CL013G
TSMC Logic Technology Features(Back End)
2.43 2.43 umum223.42 3.42 umum224.65 4.65 umum227.56 7.56 umum2215.25 15.25 umum22
Emb 6T SRAM cellEmb 6T SRAM cell
CuCuAlCu/CuAlCu/CuAlCu/CuAlCu/CuAlCuAlCuAlCuAlCuMetal SchemeMetal Scheme
CuCuW CMP / CuW CMP / CuW CMP / Cu W CMP / Cu W CMPW CMPW E.B.W E.B.Via FillVia Fill
low K <= 2.9~3.6low K <= 2.9~3.6low K <= 3.6low K <= 3.6low K <= 3.7low K <= 3.7Undoped OxUndoped OxUndoped OxUndoped OxInter Metal DielectricInter Metal Dielectric
CoSiCoSi22CoSiCoSi22CoSiCoSi22TiSiTiSi22TiSiTiSi22SilicideSilicide
8877665544# # of metal layersof metal layers
Q4, 2000Q4, 2000Q1, 2000Q1, 2000Q1, 1999Q1, 1999Jan., 1998Jan., 1998Nov., 1996Nov., 1996Risk ProductionRisk Production
CL013CL013CL015CL015CL018CL018CL025CL025CL035CL035
0.13 0.13 umum0.15 0.15 umum0.18 0.18 umum0.25 0.25 umum0.35 0.35 umumTechnologyTechnology
TSMC Industry Leading Capacity (by Fab)
1,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
’90 ’92 ’94 ’96 ’98 ’00 ’02 ’04
Fab23Fab22
Fab21Fab20
Fab19Fab18Fab17
Fab16Fab15
Fab14Fab12
300PLSSMCWT
VISFab8
Fab7Fab6Fab5
Fab4Fab3
Fab2Fab1
Note : Fab-1/2 : 6" Wafer Fab-3/4/5/6/7/8/VIS/WT/SSMC: 8" Wafer Fab12~23 and 300PL: 12" Wafer 2000-2005 Installed Capacity Plan
Unit: K pcs, 8" Equivalent Wafer
374 528 680 8441,2061,212
16399 228
ActualOutput
1,838
5,873
7,329
9,166
11,460
12”Fab
8”Fab
6”Fab
1990-1999 Actual Output,
4,520
3,409
InstalledPlan
TSMC Is The Capacity Leader
In 2001 TSMC will continue to be the foundry industry’s
largest manufacturer of wafers
But leadership is more than planned capacity
Flexibility
Timely expansion
Consistency across fabs
The company has one 300mm pilot line running and
three full scale 300mm fabs under construction
TSMC Industry Leading Capacity Plan (by Technology)
ActualOutput
InstalledPlan
=0.07um
=0.10um
=0.13um
=0.15um
=0.18um
<=0.25um
<=0.35um
<=0.5um
0.6um
0.8um
>=1.0um
>=2.0um99 163 228 374 528 680 844
1,206 1,212
7,329
5,873
9,166
11,460
’90 ’91 ’92 ’93 ’94 ’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03 ’04 ’05
1,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
Unit: K pcs, 8" Equivalent Wafer
1,838
3,409
4,520
Capacity by Fabs TSMC & Affiliates
Installed Capacity:Installed Capacity: Annual (Monthly)Annual (Monthly)
FABFAB 19981998 19991999 20002000
(8” (8” equiv, k)equiv, k)
FAB-1FAB-1
FAB-2FAB-2
FAB-3FAB-3
FAB-4FAB-4
FAB-5FAB-5
FAB-8AFAB-8A
Total Installed CapacityTotal Installed Capacity
Annual Growth RateAnnual Growth Rate
FAB-8BFAB-8B
WaferTechWaferTech
SSMCSSMC
VISVIS
FAB-6FAB-6
FAB-7AFAB-7A
FAB-7BFAB-7B
233.0233.0 (19.6)(19.6)
943.0943.0 (79.0)(79.0)
455.0455.0 (39.0)(39.0)
348.0348.0 (31.0)(31.0)
222.0222.0 (28.0)(28.0)
1,8951,895
15%15%
154.0154.0 (20.3)(20.3)
0.00.0
205.0205.0 (17.1)(17.1)
936.0936.0 (77.5)(77.5)
524.0524.0 (45.0)(45.0)
426.0426.0 (36.0)(36.0)
417.0417.0
334.0334.0
3,4093,409
80%80%
77.077.0
282.0282.0
0.40.4
184.0 184.0
(39.0)(39.0)
(31.0)(31.0)
(17.0)(17.0)
(28.0)(28.0)
(32.0)(32.0)
( 0.4)( 0.4)
(22.0)(22.0)
26.026.0 366.0366.0 (44.0)(44.0)(10.0)(10.0)
0.00.0 0.00.0
0.00.0
0.00.0
252.0252.0 (21.2)(21.2)
940.0940.0 (79.0)(79.0)
478.0478.0 (41.0)(41.0)
353.0353.0 (31.0)(31.0)
116.0116.0 (13.0)(13.0)
1,6441,644
38%38%
0.00.0
0.00.0
0.00.0
26.026.0 (8.0)(8.0)
0.00.0
0.00.0
30.030.0 (9.0)(9.0)
158.0158.0
Total Installed CapacityTotal Installed Capacity
Annual Growth RateAnnual Growth Rate
TSMC Emerging As Capacity Leader
Year 2001Year 2001
WW Total 88M Wafers (8”eq.)WW Total 79M Wafers (8”eq.)
Year 2000Year 2000
Source: Semico, SICAS, Dataquest, TSMCSource: Semico, SICAS, Dataquest, TSMC
3.43.4M(4.3%)M(4.3%) TSMC TSMC ▲▲4.5M(5.2%)4.5M(5.2%)
5.15.1M(6.5%)M(6.5%) Hyundai Hyundai ▲▲5.4M(6.1%)5.4M(6.1%)
3.73.7M(4.7%)M(4.7%) Intel Intel ▲▲4.5M(5.1%)4.5M(5.1%)
4.14.1M(5.3%)M(5.3%) Toshiba Toshiba ▲▲4.3M(4.9%)4.3M(4.9%)
3.93.9M(5.0%)M(5.0%) Samsung Samsung ▲▲4.3M(4.8%)4.3M(4.8%)
3.83.8M(4.8%)M(4.8%) NEC NEC ▲▲4.0M(4.6%)4.0M(4.6%)
2.52.5M(3.2%)M(3.2%) STM STM ▲▲3.4M(3.9%)3.4M(3.9%)
3.73.7M(4.7%)M(4.7%) Hitachi Hitachi ▲▲3.8M(4.3%)3.8M(4.3%)
3.13.1M(4.0%)M(4.0%) Philips Philips ▲▲3.1M(3.6%)3.1M(3.6%)
2.42.4M(3.0%)M(3.0%) UMC UMC ▲▲2.8M(3.2%)2.8M(3.2%)
2.52.5M(3.1%)M(3.1%) Motorola Motorola ▲▲2.7M(3.0%)2.7M(3.0%)
15.215.2M(19.3%)M(19.3%) Others Others 16M((▼ 18.1%)16M((▼ 18.1%)
TSMC Is The Foundry IndustryService Leader
The Industry’s Leading Design Service Alliance
The Industry’s Leading Prototype Service, CyberShuttle
The Industry’s Award Winning Quality Assurance Program
The Industry’s Leading Mask Making Service
Turnkey Assembly and Test Services
The Industry Leader in Internet Services via eFoundry Suite
………………….
TSMC Design ServicesTSMC Design Services
EDA Alliances Technology Files, Design Kits
Library / IP Alliances Library, Embedded Memory Service
EDA Alliances Reference Flow
IC Design Alliances Implementation Service
Design Service Portal
Prototype Verification Service
Fab 1 Fab 2 Fab 3 Fab 4 Fab 5 WaferTech
Fab 6 Fab 7 Fab 11
Pure Foundry Service
your Virtual Fab - Technology, Capacity, Service
3rd PartyAlliances
TSMCServices
eFoundry™ Suite eFoundry™ Suite
Close Collaboration in Design, Engineering and LogisticsClose Collaboration in Design, Engineering and Logistics
eFoundry™Suite
TSMC-Online
TSMC-Direct
TSMC-YES
TSMC-Internet Layout Viewer
TSMC-eJobView
Logistics Collaboration
Engineering Collaboration
Design Collaboration
Design Collaboration
Design Collaboration
Engineering Collaboration
Logistics Collaboration
Engineering Collaboration
eFoundry™ --- Your Virtual FabeFoundry™ --- Your Virtual Fab
TSMC-Online
E-Commerce center for logistics, engineering and design collaboration
TSMC-Direct
System-to-system integration for collaborative planning and engineering data sharing
TSMC-YES
Collaborative yield enhancement effort between customers and TSMC engineering
community
TSMC-Internet Layout Viewer
Web-based pre-tapeout design layout review between TSMC and customers
TSMC-eJobView
Web-based post-tapeout mask data inspection between TSMC and customers
CyberShuttle ServiceCyberShuttle Service
Reduced prototyping costs by as much as 10-fold.
Shorter prototyping time through expedited lot processing.
In-house backend ceramic packaging and bare die dicing service available
per customers’ request.
Broad spectrum of leading edge technologies with
frequent launches:0.25um down to 0.13um technology and derivatives such as RF,
mixed-signal, and embedded-flash technologies.
Frequent launches and dependable schedule announced in advance.
Fast prototyping and shared cost :
TSMC Quality PolicyTSMC Quality Policy
TSMC will strive to provide superior semiconductor
manufacturing services for worldwide customers and establish
mutually beneficial, long-term partnership.
TSMC will spread the dedication to quality throughout every facet of the company and achieve a culture of continual improvement to assure customer satisfaction. There is only one ultimate goal: Zero defect - in everything we do.
TSMC will adopt expedient containment programs to shield our customer from any insufficiency until each has been permanently corrected. We are responsible for and to each other regarding this goal.
Reliability AssuranceReliability Assurance
Process Monitor
Process Qualification
Build in Reliability
All new technologies are developed according to “TSMC technology development methodology” which includes manufacturability verification (Cp/Cpk study), T0 pre-qualification plan and T1 qualification plan.
All new technologies will be qualified prior to the mass production.
Every released mature process will be monitored and reported on monthly basis to ensure TSMC wafers quality and reliability. Continuous improvement activities will be conducted as well.
Technology SupportConsult and support on reliability related design and application issue.
Quality and Reliability OverviewQuality and Reliability Overview
ManufacturingTechnologyDevelopment
ProductQuality Gating
CustomerSatisfaction
Build InReliability
TechnologyRelease
Qualification
IncomingQualityControl
ProcessReliabilityMonitor
In-ProcessQuality Control
OutgoingQuality
Assurance
Backend Quality
Assurance
CustomerSatisfaction
MeasurementProgram
CustomerCorrective
ActionResponse
ProductReliabilityMonitor
FailureAnalysis
SupplierQuality
Assistance
StatisticalProcessControl
CustomerFeedback
CustomerSatisfaction
Advisory Board
LAB
Total Quality Management
Develop and integrate leading edge and cost effective wafer,
test and assembly technologies.
Assembly & Test Assembly & Test Services Strategy
Provide a seamless communication and data link throughout
the entire assembly and test operation.
Continuous quality and service improvement through
internal monitoring and sound supplier management
methodology.
Quality & Engineering
Assembly & Test Assembly & Test Customer Benefits
Single point responsibility from order to unit shipmentComplete WIP visibility throughout the entire processCompetitive cycle times from wafer start to unit shipProven drop ship system through fab, sort, assembly, and final test
Competitive pricingReduced inventory cost
Advanced manufacturing services include mask making, wafer sort, assembly, and final testTSMC extends QRA / test engineering / product engineering support to cover assembly and final testResponsible for yield improvement and failure analysisA single contact for engineering, quality, and reliability issues
Service
Cost
Assembly
Assembly & Test CapabilitiesAssembly & Test Capabilities
Test
Alliance with leading assembly housesMainstream and high-performance IC packagingReliability Qual Capability
Digital, Mixed Signal, and Memory TestIn-House Wafer Sort and Probe Card Making and MaintenanceAlliance with Leading Test Subcontractors for Final Test ServicesTest Program Correlation and Conversion
Taiwan Semiconductor Manufacturing Company
www.tsmc.com