System Plus Consulting - Advanced RF SiP for Cellphones...©2017 System Plus Consulting | RF Modules...
Transcript of System Plus Consulting - Advanced RF SiP for Cellphones...©2017 System Plus Consulting | RF Modules...
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Advanced RF SiP for CellphonesReverse Costing Review: Reverse Engineering & Cost Estimations
RF report by Stéphane ELISABETHNovember 2017
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 2
Table of ContentsOverview / Introduction 3
o Executive Summary
o Methodology
Company Profile 6
o Skyworks Solution, Murata, Qorvo, TDK-Epcos, Broadcom
o Major Customers
o Smartphones Teardown :
o Huawei P10
o Samsung Galaxy S8
o Apple iPhone 8 Plus
o Components Summary
Market Analysis 38
o Supported Band History
o Market Forecast
o Supply Chain
Physical Analysis 42
o Physical Analysis Methodology
o Skyworks Solution 44
o Front-End Module & RF Components
Package View & Dimensions
Package Opening
Component Repartition
Package Cross-Section:
Substrate, Dimensions, Lid, Wire Bonding
Package Summary
o Murata 57
o Front-End Module & RF Components
o TDK-Epcos 70
o Front-End Module & RF Components
o Qorvo 83
o Front-End Module & RF Components
o Broadcom 96
o Front-End Module & RF Components
Comparison Analysis 109
o Area Repartition, Footprint, Silicon repartition, Substrate, Lid
Manufacturing Process 115
o Synthesis of the main parts
o Process & Fabrication Unit
o Substrate Process Flow
Cost Analysis 124
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses 126
o Dies Cost Estimation 128
Filter Die Cost
Active Die Cost
o RF SiP Packaging 131
RF SiP Packaging Cost
RF SiP Packaging Cost per steps
Packaging Component Cost
o Component 136
Component Cost
Estimated Selling Price 138
Company services 144
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 3
Overview / Introductiono Executive Summaryo Methodology
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• In addition to Yole Développement RF SiP Packaging 2017 Market report, this comparative technologyreview has been conducted to provide insight on structure, technology and costing for RF SiP packaging onFront-End Modules in Smartphones. The report includes the study of at least 8 Front-End Modules found inthree high-end flagships smartphones (Huawei P10 Plus, Samsung Galaxy S8, Apple iPhone 8 Plus) wherefive major suppliers (Skyworks Solution, Murata, TDK-Epcos, Qorvo and Broadcom) are sharing the market.
• After a teardown of three high-end smartphones, the main RF modules have been extracted and analyzedin detail. Sizes and technologies are studied to provide a large panel of OEM’s technical and economicalchoices and an overview of the packaging market. Major players remain Broadcom/Avago, Qorvo,Skyworks Solution, Murata, Epcos/TDK and have been analyzed.
• The report includes a description of each component, major data (type of substrate, silicon proportion,Line/Space, …), comparisons for all front-end modules under analyses and a manufacturing cost estimationof the System-in-Package. Wifi and Bluetooth modules are not covered in this report.
• Note: Wifi and Bluetooth Module analyses are not included in this report
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 4
Overview / Introduction
Company Profileo Skyworks Solutiono Muratao TDK-Epcoso Qorvoo Broadcom
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks 2017 Major Customers
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 5
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysiso Market History & Forecast
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
RF Components Market Forecast
Courtesy of Yole Development
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 6
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks RF FEM SiP Components Summary
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 7
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Packages View & Dimensions
Package Top View Package Side ViewPackage Bottom View
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 8
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Opening
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 9
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Components Repartition
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 10
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Cross-Section
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 11
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Cross-Section
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 12
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Cross-Section – Dimensions
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 13
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Cross-Section – Dimensions
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 14
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Cross-Section – Metal Lid
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 15
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Cross-Section – PCB
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 16
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Cross-Section – Wire Bonding
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 17
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis o Synthesiso Package Viewo Package Openingo Chips Repartitiono Package Cross-Sectiono Package Summary
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks SkyOne® Solution – Package Summary
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 18
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysiso Area Repartitiono Footprint Comparisono Silicon Repartitiono Substrate Comparisono Protective Layers
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Comparison – Footprint statistics
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 19
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flowo Global Overviewo Packaging Processo Substrate Process
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 20
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flowo Global Overviewo Packaging Processo Substrate Process
Cost Analysis
Selling Price Analysis
About System Plus
Skyworks Packaging Process
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 21
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Die Costo Packaging & BE Costo Component Cost
Selling Price Analysis
About System Plus
RF SiP Packaging Cost
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 23
COMPANYSERVICES
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 24
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Related Reportso Company serviceso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 System Plus Consulting | RF Modules & Components Review in Smartphones 25
Overview / Introduction
Company Profile
Smartphone Teardown
Market Analysis
Skyworks SiP Physical Analysis
Murata SiP Physical Analysis
TDK-Epcos SiP Physical Analysis
Qorvo SiP Physical Analysis
Broadcom SiP Physical Analysis
Comparison Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Related Reportso Company serviceso Feedbackso Contacto Legal
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