Symposium on Global ICT Environmental...

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©2009 Nan Ya Plastics Corporation

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Symposium on GlobalICT Environmental Initiatives

Brussels 27-28 October 2009

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©2009 Nan Ya Plastics Corporation Symposium on Global ICT Environmental Initiatives

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Agenda• Indicators and Trends towards environment-

friendly Laminates• Availability• Reliability, Processability• Price

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friendly Laminates

„Driving Forces of Halogen free Materials“

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Current legal situation• Directive of the European Parliament RoHS

doesn‘t concern TBBPA• NGOs proposing European Parliament revising

RoHS

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European Environmental Bureau143 member organisations in 31 countries

International Chemical Secretariatstrives to brigde the gap between industry, NGOs

and policy circles

Clean Production ActionUS based environmental NGO

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Draft Position Paper on RoHS revision

• consider both the direct impact of substances and the impacts of transformation products at end of life

• thereby supporting a general phase-out of brominated and chlorinated organic substances in Electrical and Electronic Equipment (EEE)

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Furan

O

H2C O OC

CH3

CH3

CH2CH H2C CH2HCO OC

CH3

CH3

OH

CH2CHH2C H2C CH2HC

O

O OC

CH3

CH3

OH

Br Br

Br Br

Br

HO C

CH3

OH

CH3

Br

Br

BrBr O Br

Br O Br

Br O Br

Br BrTBBPA

Dioxin

Brominated Flame Retardents can form Dioxins and Furans if burned under sub-optimal conditions

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Greenpeace

http://www.greenpeace.org/international/campaigns/toxics/electronics/how-the-companies-line-up

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Halogen Free means „Low Halogen Content“

IEC 61249-2-21*

JPCA-ES-01-1999

10 iNEMI members*

maximum Br: 900 ppmmaximum Cl: 900 ppmmax. Br + Cl: 1500 ppm*

IPC-4101B*

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Projected Timeline for Halogen Free ElectronicsYear

Application 2006 2007 2008 2009

Japanese OEMs

Notebook*

LCD TV

Hard Disk Drive

Game Console*

Camcorder/DSC

Mobile Phone*

DVD Player

European OEMs

Notebook & Desktop*

Automotives

Mobile Phone

N. American OEMs

Notebook & Desktop

Mobile Phone

Chip Processor

Hard Disk Drive*converted before 2006

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Halogen free spec Bromine and Chlorine LimitBr, Cl ≤ 900ppm

Br+Cl ≤ 1500ppm

Br or Cl ≤ 900ppm

xxxx

Br or Cl ≤ 900ppm

xxxxxx

NokiaSony-EricssonLenovoDellLGSonySamsungToshibaWistronAppleHPIntel

Deadlineall products by 2008

all models on market after 1st January 2008

alle products from 2009

all new products lauched after Jan. 1, 2010

all products from 2010

new models by end of 2010

all new models from Jan. 2010

all remaining uses of BFRs in notebook PCs by 2009

evaluation started at Q3 2008

all products beginning 2008

new computing products launched in 2009

45 nm FC from 2008

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PCB Laminate Market 2008 by Material Type

Standard FR-445,2 %

FR-4 Halogen Free8,5 %

FR-4 High-Tg15,8 %

Paper 11,0 %

Composite 5,7 %

Special 13,3 %RCC, other

0,5 %

Source Prismark total $ 8,0 Bn

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Halogen Free Market 2008

Matsushita Electric28,8 %

Nan Ya Plastics24,1%

Hitachi Chemical 12,6 %

Shengyi Sci. Tech11,7 %

Elite Materials10,2 %

ITEQ 4,5 %

others 8,1 %

Source and Graph Prismark total 24,6 Mio. m²

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Copper Foil Glass Cloth Resin Matrix Filler

Electric Circuit Dimensional Stability Heat Resistance Flammability

Signal line Low CTE x/y Bonding Low CTE z

Grounding Low Warpage Flammability High Stiffness

Heat Dissipation High Stiffness Dielectric Properties Heat Dissipation

High TgLow Moisture Absorption

Composition of Laminates and their

Functions

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2 x CH2CHH2C

O

H2C CH2HC

O

O OC

CH3

CH3

+

O OC

CH3

CH3

CH2CHH2C

O

H2C CH2HCO OC

CH3

CH3

OH

CH2CHH2C H2C CH2HC

O

O OC

CH3

CH3

OH

Br Br

Br Br

General BFRs use di-functional epoxy as reactant

Brominated Epoxy Resin

HO

Br

C

CH3

CH3

OH

Br

Br

Br

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Phosphorous Based Epoxy

+

O

H3COG

H3COG

n

H3COG

CH2 CH2

B =

P

H

O O

P

O

OOH

n

H3CCH2 CH2

OX

A =

X = A or B

Phosphorous based epoxy must use multifunctional typeto keep Tg and thermal resistance

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higher heat resistancebut more brittle

toughness but lower heat resistance

multifunctionaldi-functionalEpoxy

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NAN YA Performance ComparisonUnit / Condition NPG NPGN-150

Resin System Halogen Free Halogen Free

Curing Agent Dicy PN

Peel Strength N/mm 1,54 1,66

Tg (DSC) °C 153

Impact Test kJ/m² 65 82

Tg (TMA) °C 143 140

α1 45 49

α2 227 221

% 50°C~260°C 3,08 3,04

Water Absorption % 0,295 0,254

288 °C solder dipping 4‘ ~ 4’30“ 6‘

Water Absorption % 0,439 0,348PCT 2 h

288 °C solder dipping 2‘ ~ 2’30“ 4‘

Flame Resistance UL-94 V-0 V-0

PCT ½ h

CTE / TE

Test sample: laminate 1,6 mm

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Expansion ppm/K Standard FR-4

High-Tg phenolic

filled

High-Tghalogen free

CTE xCTE y

15~1815~18

13~1513~15

45260

11~1311~13

CTE z before TgCTE z after Tg

58287

35210

Thermal Expansion Properties

Test sample: laminate 1,6 mm

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Material A condition pre-condition6 x reflow 245 °C

pre-condition6 x reflow 260 °C

Standard FR-4 162-247 150-266 142-227

Mid-TgPN / filled

> 1000 > 1000 800-900

Hi-TgPN / filled

> 1000 > 1000 > 1000

Halogen Free > 1000 > 1000 > 1000

TCT Performance by HATS Tester12-layer test vehicle, - 40°C / + 145°C

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Properties of Fillers

Natural SiO2 Fused SiO2 Mg(OH)2 Al(OH)3

Density [g/cm³] 2,50 2,50 2,36 2,40

2,7Diameter [µm] 1,6 2,0 1,9

Fused SiO2Natural SiO2 Mg(OH)2 Al(OH)3

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Performance Properties of Nan Ya Halogen Free Materials

NP-140 NP-155F NPG NPGN-150 NPG-170

BrEpoxy

Halogen Free

Dicy

170

2,3

>60

>20

359

4,42

0,012

PN

150

3,4

>60

>40

Td (°C, TGA) 310 351 350 360 360 367 370

Dk @ 1GHz 4,50 4,58 4,60 4,50 4,53 4,82 4,40

Df @ 1GHz 0,016 0,017 0,012 0,013 0,013 0,015 0,013

NPGN-170 NPG-180 NPG-200

Resin system Br Epoxy

Halogen Free

Halogen Free

Halogen Free

Halogen Free

Halogen Free

Curing agent Dicy Dicy PN PN PN PN

Tg (°C, DSC) 140 150 145(TMA) 170 190(DMA) 205(DMA)

CTE (%, 50~250℃) 4,1 2,4 2,4 2,4 2,2 2,0

T-260 (min) 25 >60 >60 >60 >60 >60

T-288 (min) 2 >20 >40 >40 >40 >40

NPG: „G“ for Green MaterialsMeasurement on construction 4 x 7628

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Black Oxide Brown Oxide

Chemie A B C D

Standard FR-4 0,86 N/mm 0,67 N/mm 0,80 N/mm 0,62 N/mm

Halogen Free 0,57 N/mm 0,55 N/mm 0,53 N/mm 0,48 N/mm

Halogen Free New 0,65 N/mm 0,61 N/mm 0,63 N/mm 0,55 N/mm

Material

Innerlayer Adhesion Comparison

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New Standard FR-4 PN+Filler Halogen

Free Parameters

Ø 0,25 mmU/min: 200Km/min: 2,9Hits: 3500

Drill Bit Wear Comparison

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Drilling Parameter

Type Ø Speed Infeed Retreat Thk Stack

Schmoll LZ 0,30 mm 160K U/min 3,4 m/min 11 m/min 1,6 2

Drill Bit Wear Comparison

3000 Hits2000 Hits1000 Hits

32,93%27,32%25,28%Halogen Free New

36,52%30,72%24,46%Halogen Free

Drilling Test

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Drill Hole Precision NPG NPGN-150

Cp/Cpk 1,334 / 0,785 1,859 / 1,204

1325 / 48098 660 / 48104

2,75 % 1,37 %Target < 50 µm

Drilling Test

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Standard FR-4 Halogen Free Factors

Laminate 1,0 1,2 ~ 1,5

2,0

1,0 ~ 1,2

1,10 ~ 1,15

HF Resin

Drilling 1,0 Reduced drill hits

Desmear 1,0 Increased cycle time

Total cost increase for 4~6-layer PCB 1,0

Cost Effect for Halogen Free PCB

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Summery• Halogen free laminates contain more expensive epoxy

resin and flame retardant, that‘s not for free• compared with other thermal resistant BFR-laminates

there is no difference in processing costs• voluntary conversion is anticipating environmental legis-

lation and enables a settled and well approved change• existing halogen free laminates perform well due to good

heat resistance and low thermal expansion• demand from EEE-industry will accelerate further

developments, exposing the advantages of HF laminates

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Contact:Technolam GmbHwww.technolam.deVolker Klafki+49 2241 [email protected]

Contact:Nan Ya Plastics Corporationwww.npc.com.twLouis Lin+886 2 271 22211 [email protected]

Thanks for your attention!Q & A

http://www.npc.com.tw/

http://www.npc.com.tw/

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