Superior Decoupling for High Speed Digital Electronics ... · 1 12/1/2003 1 Superior Decoupling for...
Transcript of Superior Decoupling for High Speed Digital Electronics ... · 1 12/1/2003 1 Superior Decoupling for...
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Superior Decoupling for High Speed Digital Electronics with
3MTM Embedded Capacitor Material
Santa Clara Valley Chapter of the IEEE Components, Packaging & Manufacturing Technology Society
November 12th, 2003
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3M Facts for Year–end 20023M is one of 30 companies in the Dow Jones Industrial Average
and is a component of the Standard & Poor's 500 Index.Sales
Worldwide.................……………………………… $16.3 billionInternational (55% of total)……………………….. $ 8.9 billion
Earnings
Net Income – reported * …………………………. $ 1.97 billion
R&D Expenditures
For 2002..........................………………………….. $ 1.07 billion
Total for last five years ..............………………….. $ 5.33 billion
Employees
Worldwide ................................…………..………. 68,774
United States ……………………………………….. 35,024
Contributions
3M & 3M Foundation……………………………….. $43 million +
*Includes non-recurring net loss of $108 million principally related to 3M’s restructuring plan
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Microinterconnect Products Portfolio
Inkjet
DisplaysHard Disk Drives
Chip Scale Packaging
Medical
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375350300280250200Max Current/Device (A)Large Business Machine Products
300280240225225200Max Power/Device (W)Large Business Machine Products
‘16‘13‘10‘07‘06‘05‘04‘03‘02‘01NEMI Roadmap
288251218190180170160150140130Allowable Max Power (W)High Performance with Heatsink
0.40.50.60.70.90.91.01.01.01.1Power Supply Voltage (V)Vdd (High Performance)
‘16‘13‘10‘07‘06‘05‘04‘03‘02‘01SIA Roadmap
Driving Trends in Silicon
• Lower voltage• Higher power/current• Higher frequency
= ZVI
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Power Distribution Impedance
Ways to lower power distribution impedance:
Decoupling capacitor
IC
Power Plane
Ground Plane
FR4 Spacing = 2 – 4 mils
Dk of FR4 = 4
• Reduce power-ground plane spacing
• Increase Dk of material separating power-ground planes
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3MTM Embedded Capacitor Material Construction
Dielectric Layer is a Ceramic filled epoxy
Cu Foil, 1 oz. (1.4 mil)
Cu Foil, 1 oz. (1.4 mil)
Thickness:Dk:
3M16 um
16
FR450 um
4
4
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3MTM Embedded Capacitor Material Properties
94V-0Flammability Rating
35 umCopper Thickness
>100V, 500V*>50V
Breakdown Voltage - 16 um - 8 um*
~130V/umDielectric Strength
Meets X7RFreq., Voltage, Temperature
16Dielectric Constant
5 nF/in210 nF/in2
Capacitance /area - 16 um - 8 um*
ValueAttribute
* In development
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Development History of Embedded Capacitors at 3M
• 1996 - 1999 DARPA Program
• 1998 - 2000 NCMS Embedded Decoupling Capacitance (EDC)
• 1999 - 2003 NIST ATP Embedded Passives
• End 2003 Commercial Release
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Performance Data
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Impedance Comparison
3M (8 um)
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Data from NCMS Embedded Decoupling Capacitance Project Report - 12/00
-2 .5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 x 10 ns
-1 .5
-1
-0 .5
0
0.5
1
1.5
50 O hm m ode, V=3.3v
TV 1-3-1 BC 2000TV 1-3-1 H i-K TV 1-3-1 EM C AP TV 1-3-1 C -P ly
TV 1-2-1 FR4+d
(Time Domain - 50 MHz)
Vol
ts
Power Bus Noise
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Power Bus Noise on Test Vehicle
• Traditional decoupling capacitors are not effective at frequencies above 1 GHz
• C-Ply layer has excellent performance to 5 GHz
-40
-35
-30
-25
-20
-15
-10
-5
0
5
No Caps (FR4) DecouplingCaps
BC2000 EmCap HiK DuPont 3M C-Ply
Material
dBm
1MHz to 1GHz1 GHz to 3 GHz3 GHz to 5 GHz
Data from NCMS Embedded Decoupling Capacitance Project Report - 12/00
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Radiated Emissions Comparison
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Examples of EmbeddedCapacitance Replacing Discretes
>75%26.9196952,900529 x 0.1 uF
OEM D
>75%~10.6~3003,18029 x 0.1 uF28 x 0.01 uF
OEM C
>60%30.02106,31062 x 0.1 uF
11 x 0.01 uF
OEM B
NA42.030012,600126 x 0.1 uF
OEM A
100%3.110533033 x 0.01 uF
EDC TV1
% of Total Discrete
Capacitance Removed
Ratio of Removed to Embedded
Embedded Capacitance
(nF)
Discrete Capacitance
Removed (nF)
Design
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Electrical Performance Summary
• Lowers impedance of power distribution system
• Dampens board resonances
• Reduces noise on power plane
• Reduces radiated emissions
• Eliminates need for large numbers of discrete capacitors
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√Reduce EMI
√Improve PWB panel utilization
√√Reduce opportunities for damaged components
√Reduce weight
√Enable decoupling w/back-side heat sinks
√Reduce assembly time
√Reduce board size, thickness
√Simplify rework
√√Reduce via count
√Enable DS to SS assembly
√Reduce layer count
√√Eliminate capacitors
√√Reduce design time & redesigns
√Faster signaling/Reduce power bus noise
CostSpace PerformancePotential Benefits
Reasons for Embedded Capacitance
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PCB Compatibility
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PCB Processing
• Compatible with all rigid and flex PCB processing (including laser ablation)
• Material handling is most significant issue (compares to bare 2 ounce copper)
• A sequential lamination process is recommended– Pattern 1st side copper– Laminate patterned side to another layer of prepreg– Pattern 2nd side copper
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PCB Processing
4-Layer Board Cross Section
3MTM Embedded Capacitor layer
Through-hole connection to top electrode of embedded capacitor layer
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Environmental Testing
Test Property Result
High Temp (125°C) Capacitance No Change (1000 hrs)
Thermal Cycle Thermal Shock Capacitance No Change (1000 cycles)
High Humidity (85°C/85% RH)
Capacitance Dissipation Factor
10-15% Increase* 0.4% to 0.9%*
TMA (T260) Life >5 minutes THB
(85C/85%RH/15 V) Life >1000 hrs
ESD Capacitance/D.F. No change
Pressure Cooker Capacitance/D.F. No change after bake
Bend Test Capacitance No change
Multiple Reflow (3X) Capacitance No change
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TMA Profile
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UL Testing
Test Property Result
Laminate Flammability 94V-0
Laminate Solderability Limits 288C/30 sec
Laminate Relative Thermal Index 130C
Board (Merix) Flammability 94V-0
Board (Merix) Max Operating Temp 130C
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Intellectual Property & Licensing
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Intellectual Property & Licensing
• 3MTM Embedded Capacitor Material utilizes a patented formulation that incorporates barium titanate particles to increase the dielectric constant
• 3M will not require customers to purchase a license for this technology– Fabricator avoids unreasonable up-front fees– OEMs have wider choice of fabricators
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Commercialization Status
• Product release by end of 2003• Currently sampling to OEMs and
Fabricators for qualification testing• Types of applications under evaluation
include:• Server/Workstation• Engine control unit• Wireless basestation• Video card• Weapon guidance
• Router• Burn-in boards• DUT boards• PDA• Aircraft electronics
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Contact Information
Bill Balliette(512) 984 7324