Stress and Characterization Strategies to Assess Oxide ... slides.pdf• GaN Field-Effect...
Transcript of Stress and Characterization Strategies to Assess Oxide ... slides.pdf• GaN Field-Effect...
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Stress and Characterization Strategies to Assess Oxide Breakdown
in High-Voltage GaN Field-Effect TransistorsShireen Warnock and Jesús A. del Alamo
Microsystems Technology Laboratories (MTL)Massachusetts Institute of Technology (MIT)
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Outline
• Motivation & Challenges• Time-Dependent Dielectric Breakdown (TDDB)
Experiments:‒ Current-Voltage‒ Capacitance-Voltage
• Conclusions
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Motivation• GaN Field-Effect Transistors (FETs) promising for high-voltage
power applications• Many challenges before transistors ready for deployment:
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Motivation
Inverse piezoelectric effectJ. A. del Alamo, MR 2009
• GaN Field-Effect Transistors (FETs) promising for high-voltage power applications
• Many challenges before transistors ready for deployment:
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Motivation• GaN Field-Effect Transistors (FETs) promising for high-voltage
power applications• Many challenges before transistors ready for deployment:
Inverse piezoelectric effectJ. A. del Alamo, MR 2009
Current collapseD. Jin, IEDM 2013
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Motivation
Inverse piezoelectric effectJ. A. del Alamo, MR 2009
Current collapseD. Jin, IEDM 2013
VT instabilityD. Johnson, TED 2013
• GaN Field-Effect Transistors (FETs) promising for high-voltage power applications
• Many challenges before transistors ready for deployment:
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Motivation
Inverse piezoelectric effectJ. A. del Alamo, MR 2009
Current collapseD. Jin, IEDM 2013
Oxide reliabilityVT instabilityD. Johnson, TED 2013
• GaN Field-Effect Transistors (FETs) promising for high-voltage power applications
• Many challenges before transistors ready for deployment:
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Time-Dependent Dielectric Breakdown• High gate bias → defect generation → catastrophic oxide
breakdown• Often dictates lifetime of chip
D. R. Wolters, Philips J. Res. 1985T. Kauerauf, EDL 2005
Typical TDDB experiments:Si high-k MOSFETs
Gate material melted after breakdown
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Challenges to study TDDB in GaN FETs• AlGaN/GaN metal-insulator-
semiconductor high electron mobility transistors (MIS-HEMTs)
• Gate stack has multiple layers & interfaces
→ Uncertain electric field distribution
→ Many trapping sites
• Complex dynamics involved→ Unstable and fast changing VT
P. Lagger, TED 2014
stress time ↑
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TDDB Experiments:Current-Voltage
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GaN MIS-HEMTs for TDDB study
GaN MIS-HEMTs from industry collaboration: depletion-mode
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Classic TDDB ExperimentConstant gate voltage stress experiment:
• Experiment gives time to breakdown and shows generation of stress-induced leakage current (SILC)
• Little other insight gained from measurement
trapping
SILC
Hard breakdown
tBD
IG
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Visualizing TDDB StatisticsTDDB uniqueness: Weibull distribution of time to breakdown
• As VGstress ↑, tBD ↓• Parallel distributions for different VGstress
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TDDB with Periodic Characterization Pause TDDB stress and sweep transfer characteristics at VDS=0.1 V
• Large VT shift → trapping in oxide or AlGaN• Immediate S degradation → interface state generation early in
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Validity of Characterization ApproachCompare statistics for standard and interrupted schemes
Same statistics for both schemes → characterization is benign15
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Step-Stress TDDB• Step-stress to examine early stages of degradation• Step VGstress in 0.5 V increments until breakdown
• Low VGstress: IG ↓ ⇒ trapping• High VGstress: IG ↑ ⇒ SILC
VDS=0 V
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Step-Stress TDDBTransfer characteristics during Step-Stress TDDB
• S and VT degradation is progressive• At VGstress ~12.5 V, ΔVT < 0 (red lines)
‒ Sudden increase in S, appearance of SILC→ interface state generation
VDS=0.1 V
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TDDB Experiments:Capacitance-Voltage
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C-V Characterization
• At VGS>1 V, conduction band of GaN cap starts being populated
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C-V Characterization
TDDB characterization takes place here
• TDDB characterized in regime where GaN cap is populated with electrons
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Constant VGstress TDDB
• As stress time ↑→ CGG ↑→ Frequency dispersion ↑
• Consistent with trap creation and trapping ‒ In oxide and/or at MOS interface
CGG vs. stress time in 5 devices at 5 different frequencies:
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Step-Stress TDDB
• Moderate VGstress → CGG ↓ ⇒ trapping in AlGaN
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Step-Stress TDDB
• Moderate VGstress → CGG ↓ ⇒ trapping in AlGaN• High VGstress → CGG ↑ ⇒ trap generation in oxide
CGG changes shape
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Conclusions• Developed methodology to study TDDB in GaN MIS-
HEMTs• TDDB behavior consistent with Si MOSFETs:
‒ Weibull distribution‒ SILC before breakdown
• For moderate gate voltage stress:‒ ΔVT > 0‒ IG ↓
• Beyond critical value of VGstress:‒ ΔVT < 0‒ Sudden ΔS ↑‒ Capacitance frequency dispersion ↑
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Conclusions• Developed methodology to study TDDB in GaN MIS-
HEMTs• TDDB behavior consistent with Si MOSFETs:
‒ Weibull distribution‒ SILC before breakdown
• For moderate gate voltage stress:‒ ΔVT > 0‒ IG ↓
• Beyond critical value of VGstress:‒ ΔVT < 0‒ Sudden ΔS ↑‒ Capacitance frequency dispersion ↑
Consistent with electron trapping
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Conclusions• Developed methodology to study TDDB in GaN MIS-
HEMTs• TDDB behavior consistent with Si MOSFETs:
‒ Weibull distribution‒ SILC before breakdown
• For moderate gate voltage stress:‒ ΔVT > 0‒ IG ↓
• Beyond critical value of VGstress:‒ ΔVT < 0‒ Sudden ΔS ↑‒ Capacitance frequency dispersion ↑
Consistent with electron trapping
Onset of trap generation in oxide/at MOS interface
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Acknowledgements
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Questions?
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