STMicroelectronics L3G4IS Dual-Core 3-Axis MEMS Gyroscope Report published by Yole Developpement

© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G4IS – Dual-Core 3-Axis MEMS Gyroscope 1

21 rue La Nouë Bras de Fer - 44200 Nantes - France

Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr

April 2013 - Version 1

Written by: Romain FRAUX

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.

http://www.systemplus.fr/



Table of Contents

Glossary

1. Overview / Introduction 4– Executive Summary

– Reverse Costing Methodology

2. STMicroelectronics Company Profile 7– ST Profile

– ST MEMS Gyroscopes Portfolio

– L3G4IS Characteristics

– ST Business Model

3. Nokia Lumia 920 Teardown 19– Nokia Lumia 920 Specs

– Nokia Lumia 920 Teardown

4. L3G4IS Physical Analysis 23– Physical Analysis Methodology

– Package

Package Characteristics & Markings

Package Pin-Out

Package Opening – Main Parts

Package Opening – Wire Bonding Process

Package Opening – PCB Layout

Package Cross-Section

– ASIC

ASIC Dimensions & Markings

ASIC Pinout

ASIC Cross-Section

ASIC Characteristics

– MEMS

MEMS Dimensions & Markings

MEMS bonding pads

MEMS Cap Opening

MEMS Cap Getter

MEMS Sensing Area

MEMS Cross-section

MEMS Characteristics

– MEMS Gold-Gold Bonding Version

Shrinked MEMS die

Modified THELMA Process

5. Manufacturing Process Flow 79– Global Overview

– ASIC Process Flow

– Description of the ASIC Wafer Fabrication Unit

– MEMS Process Overview

– MEMS Sensor Process Flow

– MEMS Cap Process Flow

– MEMS Wafer Bonding Process Flow

– Description of the MEMS Wafer Fabrication Unit

– Packaging Process Flow

6. Cost Analysis 97– Synthesis of the Cost Analysis

– Main Steps of Economic Analysis

– Yields Explanation

– Yields Hypotheses

– ASIC Front-End Cost

– ASIC Back-End 0 : Probe Test, Backgrinding & Dicing

– ASIC Die Cost

– MEMS Front-End Cost

– MEMS Front-End Cost per Process Steps

– MEMS Front-End : Equipment Cost per Family

– MEMS Front-End : Material Cost per Family

– MEMS Back-End 0 : Probe Test & Dicing

– MEMS Die Cost (Front End + Back End 0)

– Back-End : Packaging Cost

– Back-End : Final test & Calibration Cost

– L3G4IS Component Cost (FE + BE 0 + BE 1)

7. Estimated Price Analysis 122– Definition of Prices

– Manufacturer Financial Ratios

– L3G4IS Estimated Manufacturer Price

– L3G4IS Estimated Selling Price

Contact 128



Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing

cost and selling price of the STMicroelectronics L3G4IS component.

• The L3G4IS is the first two-in-one three-axis MEMS gyroscope that can simultaneously handle user-

motion recognition and camera image stabilization, allowing cost and board space savings.

• The L3G4IS features a 16-pin 4x4x1mm LGA package and provides accurate output across full-scale

ranges up to ±2000dps (UI) and ±65dps (OIS). It is targeted for mobile applications: Gaming and virtual

reality input devices, Optical image stabilization, Motion control and gesture recognition, GPS navigation

systems.



What's Surprising in this Device?

• Two versions of the L3G4IS are studied in this report. One was extracted from the Nokia Lumia 920

smartphone and the other was sourced as a single component.

• The version of the L3G4IS inside the Nokia Lumia 920 integrates a MEMS die using a glass-frit wafer

bonding process for the capping of the sensor. The sensor is manufactured with the well known THELMA

process.

• The other version of the L3G4IS integrates a MEMS die featuring a Gold-Gold thermocompression wafer

bonding process which allows for a smaller sealing frame width and thus shrink the MEMS die size of

30%. Moreover, the MEMS sensor of this version is manufactured with a modified version of the

THELMA process. This "new" THELMA process uses a stack of three materials for the buried polysilicon

interconnect layer.



Nokia Lumia 920 Teardown



Synthesis of the Physical Analysis



Package Cross-Section



ASIC – Markings

• The die markings include the logo of STMicroelectronics and:

2012

V729B

• This lead us to suppose that the mask set origin is 2012.

ASIC Die Markings



MEMS – Bond Pads (Glass-Frit Version)



MEMS - Cross-Section (Glass-Frit Version)



MEMS – Bond Pads (Gold-Gold Version)



MEMS - Sensor Process Flow 1/2



ASIC Front-End Cost

Probe Test Cost

Backgrinding & Dicing Cost

• We perform the economic analysis of the ASIC with the IC Price+ software.

• We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software.

Packaging Cost

Final Test & Calibration Cost

Component Cost

MEMS Front-End Cost

Probe Test Cost

Dicing Cost

Main steps of economic analysis

L3G4IS

Back-End 0

Back-End 1

Front-End


http://www.systemplus.fr/index.php?lang=us&page=icprice.php

http://www.systemplus.fr/index.php?lang=us&page=mems-cost.php


ASIC Die Cost (Front-End + Back-End 0)



MEMS Front-End Cost



MEMS FE Cost per Process Steps (1/3)



MEMS Front-End : Equipment Cost per Family



L3G4IS Component Cost (FE+BE 0+BE 1)



L3G4IS Estimated Selling Price (Medium Yield)


STMicroelectronics L3G4IS Dual-Core 3-Axis MEMS Gyroscope Report published by Yole Developpement

Technology

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