Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA...

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Status of MAPS activities at DESY Devis Contarato – DESY/Hamburg University On behalf of the DESY MAPS Group : V. Adler, D. Contarato, E. Fretwurst, T. Haas, J. Hauschildt, U. Kötz, G. Kramberger, B. Löhr, P. Luzniak, C. Muhl, A. Polini, W. Zeuner 2 nd ECFA Study Workshop – Physics and Detectors for a Linear Collider University of Durham, 1-4 September 2004

Transcript of Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA...

Page 1: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Status of MAPS activities at DESY

Devis Contarato – DESY/Hamburg University

On behalf of the DESY MAPS Group:V. Adler, D. Contarato, E. Fretwurst, T. Haas, J. Hauschildt, U. Kötz,

G. Kramberger, B. Löhr, P. Luzniak, C. Muhl, A. Polini, W. Zeuner

2nd ECFA Study Workshop – Physics and Detectors for a Linear Collider University of Durham, 1-4 September 2004

Page 2: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

DESY activities on MAPS

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

• Chip tests: test-beam with 6 GeV electrons at DESY

• Power consumption and cooling: simulations, tests

• Mechanical layout and support

• Power switching

• Physics simulations: optimization of VXD design

Page 3: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

MIMOSA V (B)

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

• real-size prototype: 3.5 cm2, 1M pixels• 2003 batch; improved fabrication process• standard 0.6 µm CMOS of AMS with 14 µm epilayer• pixel pitch 17x17 µm2

• 4 independent matrices of 512x512 pixels• serial analogue readout @ 10 MHz• back-thinned down to 120 µm

chip size 1.74x1.94 cm2

Wafer view

Chip mounted on PCB board

Page 4: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

T=283 K

5.9 keV line

• Looking for conversion of the photon in the n-well diode (single pixel signal required, no signal on the neighbors).• 5.9 keV peak used to calibrate noise• conversion factor ~20 electrons/ADC• average pixel noise ~3 ADC counts• ENC ~40 electrons

Calibration with 55Fe

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

Page 5: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

MAPS Beam-tests at DESY

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

• electrons from 1 to 6 GeV• event rate ~5 Hz for 1 cm2

• 3 x-y planes silicon telescope (~10 µm)• VME readout (Motorola PowerPC CPU)• support for 2 Mimosa V chips available, cooling to –15°C possible • Stand-alone readout software for detector and telescope

MAPS DAQ board

First tests: middle August 2004• 2 matrices at 10°C and 0°C, ~13000 events

3 x-y planes

Spill Counter

Page 6: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Typical event

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

• High hit-occupancy for every event(detector integrates during VME dead-time)

• DAQ and data transfer/storage need to be improved to reduce hits/event

• Clustering software being developed from the one used for source runs

• Pattern recognition to find good hit

Example track fromthe telescope

x1

y1x2

y2 y3

x3

Page 7: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

Noise and Pedestals

Page 8: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

Signal and S/N

Page 9: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Simulation of temperature distribution

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

(from Carsten Muhl, DESY)

• simulation of cooling conditions in our experimental set-up• Mimosa 5 chip in a brass box cooled down to -16°C, nitrogen flow• Chip thickness 120 µm, PCB board modelled with a 0.035 mm copper layer• Convective heat transfer coefficient α~10 W/m2·K• Temperature distribution simulated with I-DEAS®-TMG®

• Chip temperature varies from +26°C in the readout area to +6°C in the pixel area

cut through the chip

Page 10: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Calculation for central VXD MAPS ladder

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

10 mm

200 pixels

200 pixels

cooling to –16°C

• 3 mm long portion of 10 mm wide ladder, 30 µm thick• Thermal coupling: 2500 W/m2K to a –16°C fluid, via two 0.5 mm wide strips on both sides of the bottom (a better coupling is feasible)• No convective coupling to environment gas• Under these conditions cooling is much better than for a single chip

(from Carsten Muhl, DESY)

max T ~4.8°C

Page 11: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Calculation for outer VXD MAPS ladder

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

22 mm

450 pixels

450 pixels

cooling to –16°C

(from Carsten Muhl, DESY)

max T ~16.5°C

• 3 mm long portion of 22 mm wide ladder, 30 µm thick• Thermal coupling: 2500 W/m2K to a –16°C fluid, via two 0.5 mm wide strips on both sides of the bottom (a better coupling is feasible)• No convective coupling to environment gas• Higher maximum temperature than for central ladder• Additional convection (not shown) would need additional cooling power

Page 12: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Cooling tests

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

(from Jan Hauschildt, DESY)

• evaporative cooling (like ATLAS) using octafluoropropaneC3F8: cooling plant available

• vessel with 30 µm glass ladders (SiC foam support) and aluminum strips to simulate power dissipation, 300 µm capillaries for cooling liquid

• tests under way!

Cooling plantTest vessel

Page 13: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Use of display glass for cooling tests

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

• Simulation of display glass test-ladder (25,4 mm x 102,4 mm x 0.03 mm), with two aluminum strips on both sides to represent readout area• Conductivity of display glass worse than silicon (factor 6)• Thermal coupling: 2500 W/m2K to a –16°C fluid• A temperature of ~2°C should be achieved in the pixel area

Silicon Borosilicate(load reduced by a factor 6)

(from Carsten Muhl, DESY)

Page 14: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Power switching

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

• principle has been proved (G. Claus, IReS-LEPSI, Strasbourg)

• facilities present on new version of control board

• tests under preparation

power switch

digital power line

analog power line

Mimosa 5 output

settling time within 4 ms

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Outlook

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

• Test-beam schedule:Fall 2004

- extensive studies as a function of T (single matrix)- multiple matrices readout (2/4)- test of irradiated chip (900 MeV electrons, Trieste)

2005- test of two Mimosa chips together (Maps telescope)- tests with || magnetic field (2 T) possible

• Cooling tests: hardware available (vessel with dummy ladders and cooling plant), tests under way

• Power switching tests: in preparation for next year

Page 16: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Temperature simulation (2)

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

(from Carsten Muhl, DESY)

Page 17: Status of MAPS activities at DESY · D. Contarato, Status of MAPS Activities at DESY 2 nd ECFA Study Workshop Durham, 1-4 September 2004 (from Carsten Muhl, DESY) • simulation of

Power consumption on central ladder (2)

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

(from Carsten Muhl, DESY)

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Power consumption on outer ladder (2)

D. Contarato, Status of MAPS Activities at DESY 2nd ECFA Study WorkshopDurham, 1-4 September 2004

Convection to a 20°C fluid with α=10 W/m2K introduced

max T of the ladder raises by ~2°C

(from Carsten Muhl, DESY)