SR - Summary Report Integrated Harness Technologyemits.sso.esa.int/emits-doc/ESTEC/8002RD4.pdf ·...

SR - Summary Report Integrated Harness Technology activity

Ref. TVIMST/NT/4636/13 Issue 00 30/10/2013

TVIMST_NT_4636_13_SR_Summary_Report_Integrated_Harness_Technology_activity.doc (Formulaire : FOR/BTS/014 Ed05) Page : 2 / 15

TABLE OF CONTENTS

1. INTRODUCTION 4

1. 1. SCOPE 4

1. 2. APPLICABLE AND/OR REFERENCE DOCUMENTS 4

1. 2. 1. Applicable documents 4

1. 2. 2. Reference documents 4

1. 3. RECORD OF REVISIONS 4

1. 4. DISTRIBUTION 5

1. 5. GENERAL INFORMATION 5

1. 5. 1. Unit system 5

1. 5. 2. Symbols 5

1. 5. 3. Subscripts and superscript 6

1. 6. GLOSSARY & ABBREVIATIONS 6

2. FUNCTIONAL DESCRIPTION 7

2. 1. SYSTEM OVERVIEW 7

2. 2. INTEGRATED HARNESS STUDY SYNTHESIS 8

2. 2. 1. Mechanical 8

2. 2. 2. Electrical 8

2. 2. 3. Functional 8

2. 2. 4. Work Package and delivery 9

2. 3. EVOLUTION FOR A FUTURE INTEGRATED HARNESS 11

2. 4. ROM COST FOR INTEGRATED HARNESS DEVELOPMENT 11

2. 4. 1. ROM Cost for Structure mechanical parts 12

2. 4. 2. ROM Cost for IH FLEX Panel 12

2. 4. 3. ROM Cost for Flex Panel to Panel 12

2. 4. 4. ROM Cost for Flex panel to Equipment 13

2. 4. 5. TOTAL ROM Cost 13

2. 5. DEVELOPMENT PLAN 13

3. GLOBAL FINDINGS 15




TABLE OF FIGURES

Figure 1: Integrated harness system overview ....................................................................................................... 7 Figure 2: Integrated harness Development plan ................................................................................................... 14




1. INTRODUCTION

1. 1. SCOPE

This document presents the conclusions of the project. It includes a study synthesis, some recommendations for future Integrated Harness, a ROM Cost and a development plan for a future study.

1. 2. APPLICABLE AND/OR REFERENCE DOCUMENTS

1. 2. 1. Applicable documents

"Applicable documents" refer to any normative or contractual document which is going to be used for the project concerned by the present document.

No. Reference Issue Date Title

AD1 TEC-MMA/2010/40 01 27/05/2010 ESA SoW Integrated harness technology

AD2 2188.SP.RB.11.16594. ASTR 03 09/2011 Integrated Harness requirement Specification (TN2)

AD3 2188.NT.CT.11.17264.ASTR 00 09/2011 Integrated Harness Technology - Preliminary Design Of Basic Integrated Harness And Critical Items Definition - TN3

1. 2. 2. Reference documents

“Reference documents” are documents which support a good understanding of the present document.

No. Reference Issue Date Title

DR1 D 2188 NT CT 11 17264.ASTR 02 09/2011 Preliminary Design of BIH (TN3)

DR2 2188.PL.CT.11.17265.ASTR 02 09/2011 Proof-of-Concept Plan for BIH (TP1)

DR3 B10P370 NT 3310 12 00 28/03/2013 Basic Integrated Harness Technology Proof of Concept Preparation - TN5

DR4 TVIMST/NT/4631/13 00 19/06/2013 Enhanced Integrated Harness Technology Feasibility Demonstration Preparation (TN6)

DR5 B10P370/NT/3961/13 00 13/06/2013 Basic Integrated Harness Technology Proof-of-Concept Demonstration (TN7)

DR6 TVIMST/NT/4633/13 00 01/08/2013 Enhanced Integrated Harness Feasibility Demonstration (TN8)

DR7 TVIMST/NT/4634/13 00 01/10/2013 Basic & Enhanced Integrated Harness Technology Evaluation (TN9)

DR8 TVIMST/NT/4635/13/DP1/ 00 12/10/2013 Integrated Harness Development plan for multifunctional structural panel demonstrator prototype (DP1)

1. 3. RECORD OF REVISIONS

Issue Date Remarks

00 13/08/2013 Creation




1. 4. DISTRIBUTION

- Internally: To the whole personal using intranet and signed original copy to the project leader, - Externally: According to the distribution list, if diffusion is controlled.

1. 5. GENERAL INFORMATION

1. 5. 1. Unit system

All the units used in this document are SI. Therefore the unit system used in this model is metric or international. The different quantities are then expressed in:

Degree Celsius °C

Hertz Hz

Joule J

Kilogramme kg

Meter m

Newton N

Newton meter N.m

Pascal Pa

Radian rad

Second s

Watt W For greater ease of use, other units may be presented but are never used in the model:

Decanewton daN

Degree (angle) °

g 9,81 m.s-2

Gram gr

Mega Pascal MPa

Millimetre mm

Gigapascal GPa

1. 5. 2. Symbols

The following symbols may be used:

Cp Mass thermal capacity

E Young’s Modulus

f Frequency

g Gravity acceleration

G Shear modulus

t Time

T Temperature

Coefficient of thermal expansion (CTE)

Coefficient of moisture expansion (CME)

Deformation

Thermal conductivity

Poisson’s ratio

Solid density

Stress

Shear stress




1. 5. 3. Subscripts and superscript

The following notations are applied:

xl Longitudinal value relative to an orthotropic material

xt Transversal value relative to an orthotropic material

xc Compressive value

xt Tensile value

xy Yield value

xu Ultimate value

1. 6. GLOSSARY & ABBREVIATIONS

ASTR: Astrium BIH: Basic Integrated Harness EIH: Enhance Integrated Harness ESA: European space Agency ESD: Electro Static Discharge IH: Integrated Harness I/F: Interface MMI: Man Machine Interface PC: Personal Computer PCB: Printed Circuit Board PID: Proportional Integral Derivative SOW: Statement Of Work SpW: SpaceWire




2. FUNCTIONAL DESCRIPTION

2. 1. SYSTEM OVERVIEW

The end system for this activity is a modular integrated harness for modular microsystem-based nano-spacecraft

applications. For the purpose of this activity, the integrated harness system includes the following parts:

Signal and power conduit (grid, routing, etc.),

Harness material matrix,

Structural part (maximal panel dimensions 0.23m x 0.34m),

Harness interface (connection to the harness).

Figure 1: Integrated harness system overview The developed Integrated Harness is composed of:

- One sandwich honeycomb panels, - Three Panel Integrated harness - Three flexible PCB equipped with three Nano-D connectors for equipment connection, (Flex Panel to Equipment), - Two Micro-D connectors to allow connection with the other panel (Flex Panel to Panel).

Moreover, two kinds of flex are developed to connect devices on the harness, one flex to interconnect the three harness parts altogether (Flex quantity = 2), and another flex to connect devices on the harness (Flex quantity = 3).




2. 2. INTEGRATED HARNESS STUDY SYNTHESIS

This paragraph provides a summary of the project. All the documents previously written, as DR4, DR5, DR6 & DR7 are used as the basis of this synthesis.

2. 2. 1. Mechanical

For mechanical aspects, two equipment are checked: - The sandwich honeycomb panel, - The Rivekle.

The dimensions of the sandwich honeycomb panel and its components as well as the Rivekle dimensions are well designed. Shear tests for Rivekle were successful. When maximum load was reached, no breakdown appeared. For a future Integrated Harness, the same components can be used, it will fit with the needs for a multifunctionnal structural panel. Note : In the frame of the study only one honeycomb panel have been manufactured. In case of Nano sattelite development three identical panel should integrate harnesses, that means three panels should be manufactured.

2. 2. 2. Electrical

The Integrated Harness was declined in two versions for this study: - Basic Integrated Harness (BIH), - Enhanced Integrated Harness (EIH).

The BIH was used to validate the electrical characteristics. Several measurements were performed:

- Continuity test, - Isolation test, - Ground DC impedance test, - Line parameters – characteristic impedance of SpW lines, - Capacitance of I²C data bus, - Coupling measurement.

The tests results show that the values measured for each characteristic are closed to the theory. Electrical design (geometry of the lines, width of the tracks…) were well designed. Some thermal tests were also carried out to validate the physical assembly of the BIH face to cycling temperature. After seven cycling, there was no change for the harness, electrical characteristics were the same. Mechanical was also performed. Tensile and compression tests have been done. For tensile tests, there was no rupture of the flex until the maximum load was reached. The compression tests were more difficult to perform, because of the flex technology itself. There were no conclusive results for this case. The EIH is an evolution of the BIH. It was decided to modify the existing BIH by adding a resistor to transform it in EIH. This resistor allows connecting the concerned NanoD connector to the SpaceWire bus. Using the EIH is was demonstrated that point to point communication between two devices is electrically possible. The next paragraph presents the functionally findings for the Integrated Harness.

2. 2. 3. Functional

At the same time as electrical tests, some functional tests on SpW and I²C protocols were done. The test results are available in DR5. Tests run for one hour each, and no errors were faced. The throughput of I²C increased to 400 kHz with success.




The SpW was tested with a throughput between 10MHz & 100MHz, with success. It can be concluded that the Integrated Harness is well designed to transmit data between two devices with correct throughput, defined according to the norms.

2. 2. 4. Work Package and delivery

The project lifecycle was divided in five Work Packages. At the end of each package, several documents and hardware were delivered. Documents were written by both ASTRIUM and NEXEYA SYSTEMS, depending of the phases of the project. The table below presents the set of document deliveries and their status.




WP1 WP2 WP3 WP4 WP5

Title of the document Reference Author Date Issu

e Status Status Status Status Status

NEXEYA SYSTEMS TN1: Survey of Integrated Harness Technology (WP1)

NEXEYA 10/05/2011 OUT IN IN

IN

TN2: Basic and Enhanced Integrated Harness Requirement Specification (WP1)

ASTRIUM 07/10/2011 OUT IN IN

IN

TN3: Preliminary Design of Basic Integrated Harness and Critical Items Definition (WP2)

ASTRIUM 07/10/2011

OUT IN

IN

TP1: Proof-of-Concept Plan for Basic Integrated Harness Technology. (WP2)

07/10/2011 OUT IN

PSR: Preliminary Summary Report of Integrated Harness Technology and baseline performance datasheet. (WP2)

NEXEYA 05/08/2012

OUT IN

TN4: Enhanced Integrated Harness Conceptual Design and Critical Items Definition (WP3)

ASTRIUM 21/08/2012

OUT IN IN

TP2: Enhanced Integrated Harness Feasibility Demonstration Plan (WP3)

ASTRIUM 21/08/2012 OUT IN IN

TN5: Basic Integrated Harness Technology Proof-Of-Concept Preparation (WP3)

NEXEYA 02/04/2013

OUT IN IN

TP3: Basic Integrated Harness Technology Test Plan (WP3)

NEXEYA 01/06/2012 OUT IN

HW1: Basic Integrated Harness Technology samples and demonstrators. (WP3)

IN

TN6: Enhanced Integrated Harness Technology Feasibility Demonstration Preparation (WP4)

TVIMST/NT/4631/13 NEXEYA

OUT IN

HW2: Enhanced Integrated Harness Technology Feasibility Demonstration samples (WP4)

NEXEYA

IN

TN7: Basic Integrated Harness Technology Proof-Of-Concept Demonstration (WP4)

NEXEYA

OUT IN

TN8: Enhanced Integrated Harness Technology Feasibility Demonstration (WP5) TVIMST/NT/4633/13 NEXEYA

OUT

TN9: Basic and Enhanced Integrated Harness Technology Evaluation. (WP5) TVIMST/NT/4634/13 NEXEYA

OUT

DP1: Integrated Harness Development Plan for Multifunctional Structural Panel Demonstrator Prototype.

TVIMST/NT/4635/13 NEXEYA

OUT

TDP: Technical date package of the Integrated Harness Technology activity

NEXEYA

OUT

SR: Summary report of the Integrated Harness Technology activity TVIMST/NT/4636/13 NEXEYA

OUT

Abstract of the Integrated Harness Technology activity. TVIMST/NT/4637/13 NEXEYA

OUT




2. 3. EVOLUTION FOR A FUTURE INTEGRATED HARNESS

For a future study, some areas of improvement can be developed:

- Switching devices dynamically, with a configuration by I²C protocol. However, some problems can be met as line impedance (on SpW) on the Integrated Harness, or capacitance on the lines due to the multiplexor component.

- Change the protocol of SpW communication, using for example M-LVDS. This protocol is perfectly designed for multi equipment communication, using differential signals.

- If keeping the same design, use the RS422 protocol for the SpW, - Change the location of the Integrated Harness on the Honeycomb panel. It can be located on the side of

the panel, in order to win space for devices. - Instead of two NanoD rows connectors, only one row of connectors can be soldered and adds space for

multiplexor component.

There are several areas of modification, and the next Integrated Harness could be a mix of theses, in order to find the best ratio between functionality, ROM Cost and manufacturing time. This kind of harness is compliant with functional needs of the Nano-satellite. In effect, this harness provides functionality and electric characteristics required, with a high facility of mechanical integration. Its light weight is an advantage too. This technology can be used without any problems on bigger telecommunication satellite, which interconnects more equipment. The ease of manufacturing are in lines with the constraint of time and cost for satellite constellation.

2. 4. ROM COST FOR INTEGRATED HARNESS DEVELOPMENT

For the current design of Integrated Harness, this paragraph presents the development ROM Cost. For this case, the hypothesis is that all the harness components are already manufactured (referenced as product), considering them as COTS. The initial need to manufacture an assembly equal to the existing one (with three equipped panel) is:

- Three Sandwich Honeycomb Panels, with their respective Enhanced Integrated Harness, - Two Flex Panel To Panel, - Three Flex Panel To Equipment, for each Enhanced Integrated Harness panel.

For all these assemblies, the ROM Cost presented here after takes in account:

- The materials, - The hours for development, manufacturing, assembly and validation, - The hours for project management.

The following paragraph presents the ROM Cost (Excluding VAT) detailed for each parts of the Integrated Harness. Duration of the studies depends of the modifications and evolutions asked. For this ROM Cost, the duration of the study is thirty days. This is the minimum time needed to integrate the multiplexor component on the design of the Integrated Harness.




2. 4. 1. ROM Cost for Structure mechanical parts

Total

(Euro)

Total Structure mechanical parts 14 442

- Honeycomb Panel 230x340 equipped (1)

- Dummy Nano connectors A2 for thermal tests (11)

- Flat washer A2 for 0.80UNF screws (22)

- Screws CHC A2 0.80UNF x 3/16 (22)

- Stiffener Omega smalls (7)

- End Stiffener Omega (2)

- Flat washer Ti for M3 x 8mm screws (24)

- Screws BHC Titane G5 M3 (24)

2. 4. 2. ROM Cost for IH FLEX Panel

Total

(Euro)

Total IH FLEX Panel 2 595

- Flex IH (1)

- MWDM 25P - PCB panel(Power output side) (1)

- MWDM25S - PCB panel (Power input side) (1)

- Flat washer A2 for #2 for 2.56UNC screws (4)

- Screws CHC A2 2.56UNC x 3/16 (4)

- chip resistor CMS0402 0R

- Flex IH wiring

2. 4. 3. ROM Cost for Flex Panel to Panel

Total

(Euro)

Total Flex Panel to Panel 2 169

- Flex PCB Micro (1)

- MWDM25S - FLEX panels (PCB power input side) (1)

- MWDM 25P - FLEX panels (PCB on next panel side) (1)

- Flex Panel to Panel wiring




2. 4. 4. ROM Cost for Flex panel to Equipment

Total

(Euro)

Total Flex panel to Equipment 6 234

- Flex PCB Nano (3)

- NANOD 25P - FLEX PCB / equipment (Equipment side) (3)

- NANOD 25S - FLEX PCB / equipment (PCB side) (3) - NANOD 25P - PCB panel connection from FLEX equipment

(3)

- Flat washer A2 for 0.80UNF screws (6)

- Screws CHC A2 0.80UNF x 3/16 (6)

- Flex Panel to Equipment wiring

2. 4. 5. TOTAL ROM Cost

The total ROM COST to manufacture an Integrated Harness is:

Price / Unit QTY Nano Sat 3 panels IH

Total Management & Follow-up 13 377 - 13 377

Total Assembly & validation 2 545 3 7 636

Total for project management & validation 15 922 21 013

Total Structure mechanical parts 14 442 3 43 325

Total IH FLEX Panel 2 595 3 7 784

Total Flex Panel to Panel 2 169 2 4 338

Total Flex panel to equipment 6 234 3 18 701

Total for Manufacturing 25 439

74 148

41 361

95 160

Table below is an example of studies cost to be added to the previous ROM Cost (see above):

Price / Unit QTY Nano Sat 3 panels IH

Total Studies 21 145 - 21 145

These costs are presented for the manufacturing of one Integrated Harness. For a serial production, total costs can be reduced.

2. 5. DEVELOPMENT PLAN

According to the previous ROM Cost and to NEXEYA SYSTEMS feedback on this project, development plans have been prepared. It includes optional studies to change the design of the Integrated Harness. With the hypothesis of all the EIH components are already bought or manufactured, the necessary time to assembly a complete Integrated Harness is almost one month. For a serial production, this time can be reduced.




Figure 2: Integrated harness Development plan




3. GLOBAL FINDINGS

This study demonstrates that the current definition of the Integrated Harness can be used without any constraints. Mechanical tests show that the definition of Rivekle and the sandwich honeycomb panel are correct. Electrical tests demonstrate the good design of the complete PCB (Panel integrated harness, Flex Panel to Panel and Flex Panel to Equipment). The measured characteristics were equal or very close to the hypothesis. Functional tests confirmed that the maximum rates of each signal (I²C, Spacewire) can work during a long time without any errors. However, an evolution could be imagined in order to dynamically switch devices, with a configuration by I²C. Without changing the design, a new protocol can be used, as RS 422, or, if needed, a new design could be studied, and in this case, the M-LVDS protocol would be the best solution. With all this data, a ROM cost and a development plan have been prepared to provide the reader with price quotations and a manufacturing schedule for the production of a complete Integrated Harness. The price and schedule take into account of the possibility to introduce some modifications on the current harness.

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