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Boston – U.S.A.

(General Semiconductor)

Long Island – U.S.A.

Dallas – TEXAS U.S.A.

Hillsboro-Oregon U.S.A.

Agrate B.za (MB)

Lainate (MI)

Mestre (VE)

Avezzano (AQ)

Catania

Novara

Arnad (AO)

Bologna University Modena University

Torino

Bollate (MI)

Siae M. - Milan

CORECOMMilan

Lainate (MI)

MDM Labs Agrate B.za

San Donato (MI)

CNR - MilanMilan University

Agrate B.za (MB)

Agrate B.za (MB) Roma

Vimercate (MB)

Trento

Lecce

L’Aquila

Milan Cernusco Lombardone (LC)

Limay -France

Rousset -France

Chiasso -Sw iss

C.D.T.A. Algeri - Africa

Vilnius -Lithuania

Montpellier France

Riazzino-Sw iss

Triembach France

Grenoble FranceVöcklabruck AUSTRIA

Athens Greece

STPEAlgeri - Africa

Voiron- France

Moscow-Russia

Germany

Czech Republic

Palaiseau - France

Singapore

VNU (Vietnam NATIONAL University) Ho Chi Minh city -Vietnam

Saigon HIGH TECH PARK -Vietnam

Taiwan

Shanghai- China

Ho Chi Minh city -Vietnam

Philippines

Philippines

Taiwan

Hanoi -Vietnam

P.O.U. 1

P.O.U. 2

P.O.U. 3

P.O.U. 4

P.O.U. 5

P.O.U. 6

P.O.U. 7

P.O.U. 8

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•

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It’s possible to

process one side

only of the wafer

without any need

of masking.

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••

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Horizontal PLASMA cleaner Vertical PLASMA cleaner, with the possibility of an

integration on wet benches lines

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