SPECIFICATIONS Solid State Drive - TECHMAN...

Techman Electronics (Changshu) Co., Ltd.

1 of 32 Document Number: 9SE5501-201-M01 Rev 5

SPECIFICATIONS

Solid State Drive

MODEL :

XC100 Series (Single Port)

XC120 Series (Dual Port)

Release

Date: January 19, 2017

Rev : 2.03

Prepared by Reviewed by Approved by

Samuel Chen Ted Hsieh Ilong Hsiao

Techman SSD reserves the right to change specification of product and discontinue products without notice



TECHMAN XC100 SERIES (SINGLE PORT) XC120 SERIES (DUAL PORT)

PRODUCT SPECIFICATION

Form factors

2.5” U2: 15.0mm Z-height U.2 (SFF-8639)

Half-height, Half-Length (Single slot X4)

Interface

2.5” U2: PCIE Gen 3x4

2.5” U2 : PCIE Gen 3x(2x2) dual porti

Half-height, Half-Length: PCIE Gen 3x4

Components

Toshiba 15nm Enterprise Multi Level Cell

Toshiba 15nm Client Multi Level Cell

Support Capacity

800GB, 1600GB, 3200GB

Performance

128K Sequential Read 3200 MB/s

128K Sequential Write 1850 MB/s

4K Random Read 750K IOPS

4K Random Write: 380K IOPS

Power consumption

Power rail

U.2 12V and 3.3V

HHHL 12V and 3.3V

Power consumption

Max power 23W

Typical Power 8 W

Power mode 25W/20W/15W

Endurance

800GB (eMLC) 6DWPD / 8.76PBW



800GB (cMLC) 2DWPD / 2.92BW

1600GB (cMLC) 2DWPD / 5.84PBW

3200GB (cMLC) 2DWPD / 11.68PBW

Features

S.M.A.R.T / Health Information (LOG IDENTIFIER

02H)

TRIM

Wear-leveling

Bad Block Management

Background Garbage Collection

Advanced Encryption Standard (AES) 256bit

(optional).

End-to-End Data Protection

Power Loss Data Protection

T10-DIF Data Protection

Variable sector size: 512b, 520b ,4096b ,4104b

Multi-namespace supportii

Dual port supportiii

Temperature

OPERATING 0 to 55° C

Non-OPERATING -55 to 95° C

Airflow requirement 800GB 400LFM

1600GB 650LFM

3200GB 650LFM

Thermal throttling

Temperature monitoring (In-band)

Temperature monitoring (Out of band : SMBus )

Shock

OPERATING 1000G/0.5ms

Non-OPERATING 1000G/0.5ms

Vibration

OPERATING 3.01 Grms (Random,

2.5~500 Hz

Non-OPERATING 4.9 Grms (Random,

5~800 Hz

Reliability

Uncorrected bit error rate ≤10−17

MTBF > 1,200,000 POH

Operating System support

Windows 10, 8.1, 7 (X86/X64)

Windows server 2016, 2012R2, 2012, 2008R2

RHEL 6.5, 6.6, 6.7, 6.8, 7.0, 7.1, 7.2

SuseLiunx 11 SP3, 11 SP4, 12, 12 SP1

CentOS 6.5, 6.6, 6.7, 6.8, 7.0, 7.1, 7.2

Ubuntu Server 14.04, 15.04, 15.10, 16.04

Debian 7.8, 8.1, 8.2, 8.3

Vmware 5.5, 6.0, 2006

Xenserver 6.5 SP1, 7.0

Compliance

NVMe Express 1.1b

NVMe Express 1.2iv

PCI Express Base specification 3.1

Enterprise SSD Factor Version 1.0a

PCI Express Card Electromechanical Specification

Revision 3.0

System Management Bus (SMBus) Specification,

Version 2.0

Certification

UL CE C-tick, BSMI KCC,WHQL,VCCI

i Techman NVMe XC120 series support ii Techman NVMe XC120 series support iii Techman NVMe XC120 series support iv Techman NVMe XC120 series support



TABLE OF CONTENTS

TECHMAN XC100 SERIES (SINGLE PORT) XC120 SERIES (DUAL PORT) PRODUCT SPECIFICATION ........... 2

1 INTRODUCTION ............................................................................................................................................................. 5

2 PHYSICAL SPECIFICATIONS...................................................................................................................................... 6

DIMENSION ................................................................................................................................................................. 6 2.1

WEIGHT ...................................................................................................................................................................... 6 2.2

MECHANICAL ............................................................................................................................................................. 6 2.3

2.3.1 FORM FACTOR – U.2 ................................................................................................................................................... 6 2.3.2 FORM FACTOR – HHHL .............................................................................................................................................. 7

3 PERFORMANCE ............................................................................................................................................................. 8

LBA SETTING ............................................................................................................................................................. 8 3.1

SEQUENTIAL READ \ WRITE PERFORMANCE ............................................................................................................... 8 3.2

RANDOM READ \ WRITE IOPS .................................................................................................................................... 9 3.3

LATENCY .................................................................................................................................................................. 10 3.4

QUALITY OF SERVICE ............................................................................................................................................... 11 3.5

READY TIME ............................................................................................................................................................. 12 3.6

4 ELECTRICAL CHARACTERISTICS ......................................................................................................................... 13

POWER SUPPLY ......................................................................................................................................................... 13 4.1

VOLTAGE (RAISE \ FALL TIME) ................................................................................................................................ 13 4.2

INRUSH CURRENT ..................................................................................................................................................... 13 4.1

CURRENT AND POWER CONSUMPTION ...................................................................................................................... 13 4.2

POWER OFF TIME....................................................................................................................................................... 13 4.3

5 INTERFACE ................................................................................................................................................................... 14

CONNECTOR ............................................................................................................................................................. 14 5.1

5.1.1 FORM FACTOR – U.2 (SFF-8639) .............................................................................................................................. 14 DEVICE PLUG CONNECTOR PIN DEFINITION ............................................................................................................... 15 5.2

5.2.1 FORM FACTOR – U.2 (SFF-8639) .............................................................................................................................. 15 5.2.2 FORM FACTOR – HHHL ............................................................................................................................................ 16

NVME COMMAND .................................................................................................................................................... 17 5.3

SCSI COMMAND SET ................................................................................................................................................ 17 5.4

SET FEATURE IDENTIFIERS ...................................................................................................................................... 17 5.5

LOG PAGE SUPPORT.................................................................................................................................................. 17 5.6

SMART / HEALTH INFORMATION (LOG IDENTIFIER 02H) ........................................................................................ 17 5.7

VENDOR SPECIFIC (LOG IDENTIFIER C0-FFH) ........................................................................................................... 19 5.8

PCIE ID .................................................................................................................................................................... 19 5.9

SMBUS FUNCTION.................................................................................................................................................... 19 5.10

LED FUNCTION ........................................................................................................................................................ 19 5.11

5.11.1 FORM FACTOR – U.2 (SFF-8639) ......................................................................................................................... 19 5.11.2 FORM FACTOR – HHHL ....................................................................................................................................... 19

6 NVME DRIVER SUPPORT .......................................................................................................................................... 20

NVME DRIVER SUPPORT OPERATING SYSTEM .......................................................................................................... 20 6.1

7 RELIABILITY ................................................................................................................................................................ 22

MTBF ...................................................................................................................................................................... 22 7.1

UBER ....................................................................................................................................................................... 22 7.2

DATA RETENTION ..................................................................................................................................................... 22 7.3

ENDURANCE ............................................................................................................................................................. 22 7.4

8 ENVIRONMENTAL CONDITIONS ............................................................................................................................ 23

AMBIENT TEMPERATURE .......................................................................................................................................... 23 8.1

AIRFLOW REQUIREMENTS ........................................................................................................................................ 23 8.2

TEMP. GRADIENT ...................................................................................................................................................... 23 8.3

HUMIDITY ................................................................................................................................................................. 23 8.4



VIBRATION ............................................................................................................................................................... 23 8.5

SHOCK ...................................................................................................................................................................... 23 8.6

DROP ........................................................................................................................................................................ 23 8.7

ESD .......................................................................................................................................................................... 23 8.8

9 RESTRICTED MATERIALS CONTENT ................................................................................................................... 24

10 LABEL ............................................................................................................................................................................. 25

DRIVE LABELS .......................................................................................................................................................... 25 10.1

11 AGENCY CERTIFICATES ........................................................................................................................................... 28

SAFETY REGULATION ............................................................................................................................................... 28 11.1

EMC ......................................................................................................................................................................... 28 11.2

12 REVISION HISTORY .................................................................................................................................................... 29

APPENDIX A MAX PERFORMANCE TEST EQUIPMENT............................................................................................. 30

BIOS CONFIGURATION ........................................................................................................................................................... 30 WINDOWS CONFIGURATION .................................................................................................................................................... 30 LINUX CONFIGURATION .......................................................................................................................................................... 30

APPENDIX B SSD MODE NAME DEFINE ......................................................................................................................... 31

APPENDIX C SSD PRODUCT NUMBER LIST .................................................................................................................. 32



1 INTRODUCTION

A leader in manufacturing storage device, Techman Electronics (Changshu) Co., Ltd. (or Techman)

is positioned to provide Solid State Drive, a better solution to enterprise. Techman’s SSD mainly

consists of multicore processor and eMLC NAND flash memory which, along with our innovative

firmware architecture, deliver significant performance, high reliability, and power efficiency in a

small form factor. In addition, Techman’s SSD is compliant with Advanced Encryption Standard

(AES). Above enable Techman’s SSD to work much faster and hence to improve user experience

and satisfaction. In this manual is defined the functional, mechanical, and interface specifications of

Techman SSD XC100 series & XC120 series.

The general features of XC100 series (Single port) & XC120 (Dual Port) series are as follows:

S.M.A.R.T / Health Information (LOG IDENTIFIER 02H)

TRIM

Wear-leveling

Bad Block Management

Background Garbage Collection

Advanced Encryption Standard (AES) 256bit (optional).

End-to-End Data Protection

Power Loss Data Protection

T10-DIF Data Protection1

Variable sector size: 512b, 520b ,4096b ,4104b

Multi-namespace supportv

Dual port supportvi

v Techman NVMe XC120 series support vi Techman NVMe XC120 series support



2 PHYSICAL SPECIFICATIONS

Dimension 2.1

Form factor Length (mm) Width(mm) Height(mm)

2.5 inch 100.45 Max 69.85 +/- 0.25 15.0 +0/-0.5

HHHL 167.68 Max 68.95 Max 17.20 Max

Weight 2.2Form factor Weight (g)

2.5 inch 210 Max

HHHL 175 Max

Mechanical 2.3

2.3.1 Form factor – U.2



2.3.2 Form factor – HHHL



3 PERFORMANCE

LBA setting 3.1

Unformatted capacity

Capacity LBA User available Bytes

800GB 1,562,824,368 800,166,076,416

1600GB 3,125,627,568 1,600,321,314,816

3200GB 6,251,233,968 3,200,631,791,616

Note: (*1) 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes;

Sequential Read \ Write Performance 3.2

Model Capacity Sequential Read Sequential Write

(U.2) (Toshiba 15nm Multi Level Cell (eMLC)

XC100E55-800

XC120E55-800 800GB 2600 770

XC100E55-1600

XC120E55-1600 1600GB 3200 1400

XC100E55-3200

XC100E55-3200 3200GB 3200 1400

(HHHL) (Toshiba 15nm Multi Level Cell (eMLC)

XC100E5C-800 800GB 2600 770

XC100E5C-1600 1600GB 3200 1400

XC100E5C-3200 3200GB 3200 1400

(U.2) (Toshiba 15nm Multi Level Cell (cMLC)

XC100C55-800

XC120C55-800 800GB 2500 950

XC100C55-1600

XC120C55-1600 1600GB 2800 1850

XC100C55-3200

XC120C55-3200 3200GB 2800 1850

(HHHL) (Toshiba 15nm Multi Level Cell (cMLC)

XC100C5C-800 800GB 2500 950

XC100C5C-1600 1600GB 2800 1850

XC100C5C-3200 3200GB 2800 1850

Note: (*1) Test OS: Centos 7.2 (CPU C-state disable)

Note: (*2) Block size =128Kib

Note: (*3) Sequential Read & write performance test by FIO (OIO= 4 job with 64 Queue Depth)

Note: (*4) XC120 series support Single Port (Gen 3 x4) and Dual Port (Gen 3 2x2), If enabling dual port operations, the

performance will be depending on the IO.

Note: (*5) Consistency up to 90%

Note: (*6) Test Rage = Full capacity



Random Read \ Write IOPS 3.3

FOB

Model Capacity 4K Random

Read

4K Random

Write

4K Random

Read\Write

70/30

8K Random

Read

8K Random

Write

8K Random

Read\Write

70/30


XC100E55-800

XC120E55-800 800GB 580,000 200,000 210,000 310,000 100,000 110,000

XC100E55-1600

XC120E55-1600 1600GB 750,000 380,000 350,000 380,000 180,000 180,000

XC100E55-3200

XC100E55-3200 3200GB 750,000 380,000 350,000 380,000 180,000 180,000


XC100E5C-800 800GB 580,000 200,000 210,000 310,000 100,000 110,000

XC100E5C-1600 1600GB 750,000 380,000 350,000 380,000 180,000 180,000

XC100E5C-3200 3200GB 750,000 380,000 350,000 380,000 180,000 180,000


XC100C55-800

XC120C55-800 800GB 580,000 250,000 300,000 283,000 128,000 150,000

XC100C55-1600

XC120C55-1600 1600GB 700,000 390,000 430,000 350,000 210,000 230,000

XC100C55-3200

XC120C55-3200 3200GB 700,000 390,000 430,000 350,000 210,000 230,000


XC100C5C-800 800GB 580,000 250,000 300,000 283,000 128,000 150,000

XC100C5C-1600 1600GB 700,000 390,000 430,000 350,000 210,000 230,000

XC100C5C-3200 3200GB 700,000 390,000 430,000 350,000 210,000 230,000

Steady state

Model Capacity 4K Random

Read

4K Random

Write

4K Random

Read\Write

70/30

8K Random

Read

8K Random

Write

8K Random

Read\Write

70/30


XC100E55-800

XC120E55-800 800GB 580,000 55,000 140,000 310,000 27,000 71,000

XC100E55-1600

XC120E55-1600 1600GB 750,000 115,000 250,000 380,000 55,000 130,000

XC100E55-3200

XC100E55-3200 3200GB 750,000 115,000 250,000 380,000 55,000 130,000


XC100E5C-800 800GB 580,000 55,000 140,000 310,000 27,000 71,000

XC100E5C-1600 1600GB 750,000 115,000 250,000 380,000 55,000 130,000

XC100E5C-3200 3200GB 750,000 115,000 250,000 380,000 55,000 130,000


XC100C55-800

XC120C55-800 800GB 580,000 90,000 210,000 283,000 45,000 110,000

XC100C55-1600

XC120C55-1600 1600GB 700,000 150,000 310,000 350,000 72,000 170,000

XC100C55-3200

XC120C55-3200 3200GB 700,000 150,000 310,000 350,000 72,000 170,000


XC100C5C-800 800GB 580,000 90,000 210,000 283,000 45,000 110,000

XC100C5C-1600 1600GB 700,000 150,000 310,000 350,000 72,000 170,000

XC100C5C-3200 3200GB 700,000 150,000 310,000 350,000 72,000 170,000

Note: (*1) Test OS: Centos 7.2 (CPU C-state disable)

Note: (*2) Random read 4K IOPS & Random write 4K IOPS test by FIO (OIO= 4 job with 64 Queue Depth)

Note: (*3) XC120 series support Single Port (Gen 3 x4) and Dual Port (Gen 3 2x2), If enabling dual port operations, the

performance will be depending on the IO.

Note: (*4) Consistency up to 90%



Note: (*5) Test Rage = Full capacity

Latency 3.4

Model Capacity Sequential Read Sequential Write 4K Random Read 4K Random Write


XC100E55-800

XC120E55-800 800GB 100 us 110 us 100 us 20 us

XC100E55-1600

XC120E55-1600 1600GB 100 us 110 us 100 us 20 us

XC100E55-3200

XC100E55-3200 3200GB 100 us 110 us 100 us 20 us


XC100E5C-800 800GB 100 us 110 us 100 us 20 us

XC100E5C-1600 1600GB 100 us 110 us 100 us 20 us

XC100E5C-3200 3200GB 100 us 110 us 100 us 20 us


XC100C55-800

XC120C55-800 800GB 100 us 110 us 100 us 20 us

XC100C55-1600

XC120C55-1600 1600GB 100 us 110 us 100 us 20 us

XC100C55-3200

XC120C55-3200 3200GB 100 us 110 us 100 us 20 us


XC100C5C-800 800GB 100 us 110 us 100 us 20 us

XC100C5C-1600 1600GB 100 us 110 us 100 us 20 us

XC100C5C-3200 3200GB 100 us 110 us 100 us 20 us

Note: (*1) Queue Depth 1 with Max power mode

Note: (*2) Measurement by Fio



Quality of Service 3.5Quality of Service= 99%

Model Capacity Read (OIO=1) Write (OIO=1) Read (OIO=128) Write (OIO=128)


XC100E55-800

XC120E55-800 800GB 102 us 21us 750us 2400us

XC100E55-1600

XC120E55-1600 1600GB 102 us 21us 650us 1100us

XC100E55-3200

XC100E55-3200 3200GB 102 us 21us 650us 1100us


XC100E5C-800 800GB 102 us 21us 750us 2400us XC100E5C-1600 1600GB 102 us 21us 650us 1100us XC100E5C-3200 3200GB 102 us 21us 650us 1100us


XC100C55-800

XC120C55-800 800GB 105 us 21us 800us 1750us

XC100C55-1600

XC120C55-1600 1600GB 105 us 21us 670us 750us

XC100C55-3200

XC120C55-3200 3200GB 105 us 21us 670us 750us


XC100C5C-800 800GB 105 us 21us 800us 1750us XC100C5C-1600 1600GB 105 us 21us 670us 750us XC100C5C-3200 3200GB 105 us 21us 670us 750us

Quality of Service= 99.99%

Model Capacity Read (OIO=1) Write (OIO=1) Read (OIO=128) Write (OIO=128)


XC100E55-800

XC120E55-800 800GB 105 us 30us 1400us 2800us

XC100E55-1600

XC120E55-1600 1600GB 105 us 30us 1200us 1800us

XC100E55-3200

XC100E55-3200 3200GB 105 us 30us 1200us 1800us


XC100E5C-800 800GB 105 us 30us 1400us 2800us

XC100E5C-1600 1600GB 105 us 30us 1200us 1800us

XC100E5C-3200 3200GB 105 us 30us 1200us 1800us


XC100C55-800

XC120C55-800

800GB 110us 30us 1500us 2000us

XC100C55-1600

XC120C55-1600

1600GB 110us 30us 1200us 1400us

XC100C55-3200

XC120C55-3200

3200GB 110us 30us 1200us 1400us


XC100C5C-800 800GB 110us 30us 1500us 2000us

XC100C5C-1600 1600GB 110us 30us 1200us 1400us

XC100C5C-3200 3200GB 110us 30us 1200us 1400us

Note: (*1) Random 4K (Queue Depth 1,128) with Max power mode

Note: (*2) Measurement by Fio



Ready time 3.6

Model Capacity Power on to PCIe

ready

Power on to

Device ready Unsafe power on


XC100E55-800

XC120E55-800 800GB < 2sec < 12 sec 40 Sec (Max)

XC100E55-1600


XC100E55-3200



XC100E5C-800 800GB < 2sec < 12 sec 40 Sec (Max)




XC100C55-800

XC120C55-800 800GB < 2sec < 12 sec 40 Sec (Max)

XC100C55-1600


XC100C55-3200



XC100C5C-800 800GB < 2sec < 12 sec 40 Sec (Max)





4 ELECTRICAL CHARACTERISTICS

Power Supply 4.1

Capacity unit SPEC

Voltage V DC 12V +10% \ -20%

Noise V 1000 mVp-p Max, 10 ~ 100KHz

100 mVp-p Max, 100 ~ 20KHz

Voltage (Raise \ Fall Time) 4.2

Capacity unit Raise time ( Max/Min) Fall Time (Max/Min)

800GB 50 ms / 1ms 5s / 1ms

1600GB 50 ms / 1ms 5s / 1ms

3200GB 50 ms / 1ms 5s / 1ms

Inrush Current 4.1

Capacity unit Inrush Current Note

800GB A < 2.0

1600GB A < 2.0

3200GB A < 2.0

Current and Power Consumption 4.2

Capacity unit Idle (Avg) Read(Avg) Write(Avg)

25W power mode

800 GB Watt 8 20 21

1600 GB Watt 8 20 23 3200 GB Watt 8 20 23

Power off time 4.3

Capacity unit SPEC

Power off time s > 3sec



5 INTERFACE

Connector 5.1

5.1.1 Form factor – U.2 (SFF-8639)



Device plug connector pin definition 5.2

5.2.1 Form factor – U.2 (SFF-8639)

Pin Name Description Pin Name Description

S1 GND Ground E7 REFCLK1+ Reference clock port 0

S2

Not used (SATA/SAS) E8 REFCLK1 - Reference clock port 0

S3

Not used (SATA/SAS) E9 GND Ground

S4 GND Ground E10 PETp0 Transmitter differential pair, Lane 0

S5

Not used (SATA/SAS) E11 PETn0 Transmitter differential pair, Lane 0

S6

Not used (SATA/SAS) E12 GND Ground

S7 GND Ground E13 PERn0 Receiver differential pair, Lane 0

E1 REFCLK1+ Reference clock port 1(not used) E14 PERp0 Receiver differential pair, Lane 0

E2 REFCLK1 - Reference clock port 1(not used) E15 GND Ground

E3 3.3Vaux 3.3V auxiliary power E16 RSVD Reserved

E4 PERST1# Reference clock port 1(not used) S8 GND Ground

E5 PERST0# Fundamental reset port 0 S9

Not used (SATA/SAS)

E6 RSVD Reserved S10

Not used (SATA/SAS)

P1

Not used (SATA/SAS) S11 GND Ground

P2

Not used (SATA/SAS) S12

Not used (SATA/SAS)

P3

Not used (SATA/SAS) S13

Not used (SATA/SAS)

P4 IfDet_N Interface detect (drive type) S14 GND Ground

P5 GND Ground S15 RSVD Reserved

P6 GND Ground S16 GND Ground

P7

Not used (SATA/SAS) S17 PETp1 Transmitter differential pair, Lane 1

P8

Not used (SATA/SAS) S18 PETn1 Transmitter differential pair, Lane 1

P9

Not used (SATA/SAS) S19 GND Ground

P10 PRSNT_N Presence detect

(also used for drive type) S20 PERn1 Receiver differential pair, Lane 1

P11 Activity Activity signal from the drive S21 PERp1 Receiver differential pair, Lane 1

P12 Hot-Plug Ground S22 GND Ground

P13 +12V_pre 12V power S23 PETp2 Transmitter differential pair, Lane 2

P14 +12V 12V power S24 PETn2 Transmitter differential pair, Lane 2

P15 +12V 12V power S25 GND Ground

S26 PERn2 Receiver differential pair, Lane 2

S27 PERp2 Receiver differential pair, Lane 2

S28 GND Ground

E17 PETp3 Transmitter differential pair, Lane 3

E18 PETn3 Transmitter differential pair, Lane 3

E19 GND Ground

E20 PERn3 Receiver differential pair, Lane 3

E21 PERp3 Receiver differential pair, Lane 3

E22 GND Ground

E23 SMCLK SMBus clock

E24 SMDAT SMBus data

E25 DualPortEn_N Dual port enable

DualPortEn_N pin should be asserted by the system (driven low by storage backplane), then X120 Series will be configured as 2x2 lanes



5.2.2 Form factor – HHHL

Pin Name Description Pin Name Description

Side A Side B

1 +12V 12V power 1 PRSNT1# Hot-Plug presence detect

2 +12V 12V power 2 +12V 12V power

3 +12V 12V power 3 +12V 12V power

4 GND Ground 4 GND Ground

5 SMCLK SMBus(System Management Bus) clock 5 JTAG2 TCK (Test Clock), clock input for JTAG

interface

6 SMDAT SMBus (System Management Bus) data 6 JTAG3 TDI (Test Data Input)

7 GND Ground / UART_HOST 7 JTAG4 TDO (Test Data Output)

8 +3.3V 3.3V power 8 JTAG5 TMS (Test Mode Select)

9 JTAG1 TRST# (Test Reset) resets the JTAG

interface 9 +3.3V 3.3V power

10 3.3Vaux 3.3V auxiliary power 10 +3.3V 3.3V power

11 WAKE# Signal for Link reactivation 11 PERST# Fundamental reset

Mechanical Key

12 RSVD Reserved 12 GND Ground

13 GND Ground 13 REFCLK+ Reference clock (differential pair)

14 PETp0 Transmitter differential pair, Lane 0 14 REFCLK - Reference clock (differential pair)

15 PETn0 Transmitter differential pair, Lane 0 15 GND Ground

16 GND Ground 16 PERp0 Receiver differential pair, Lane 0

17 PRSNT2# Hot-Plug presence detect 17 PERn0 Receiver differential pair, Lane 0

18 GND Ground 18 GND Ground

End of the x1 Connector

19 PETp1 Transmitter differential pair, Lane 1 19 RSVD Reserved



22 GND Ground 22 PERn1 Receiver differential pair, Lane 1

23 PETp2 Transmitter differential pair, Lane 2 23 GND Ground



26 GND Ground 26 PERn2 Receiver differential pair, Lane 2

27 PETp3 Transmitter differential pair, Lane 3 27 GND Ground



30 RSVD Reserved 30 PERn3 Receiver differential pair, Lane 3

31 PRSNT2# Hot-Plug presence detect 31 GND Ground

32 GND Ground 32 RSVD Reserved

End of the x4 Connector



NVMe Command 5.3

ID (Hex) ATTRIBUTES ID (Hex) ATTRIBUTES

NVMe Admin Command

00h Delete I/O Submission Queue 0Ah GET Features

01h Delete I/O Completion Queue 0Ch Asynchronous Event Notification

02h Get Log Page 0Dh Namespace Management

04h Create I/O Submission Queue 10h Firmware Activate

05h Create I/O Completion Queue 11h Firmware Image Download

06h Identify 15h Namespace Attachment

08h Abort 80h Format NVM

09h SET Feature

NVMe I/O Command

00h Flush 0Dh Reservation Register ( XC120 series only)

01h Write 0Eh Reservation Report ( XC120 series only)

02h Read 11h Reservation Acquire ( XC120 series only)

09h Dataset Management (De-allocate only) 15h Reservation Release ( XC120 series only)

SCSI command Set 5.4

ID (Hex) Command ID (Hex) Command

08h Read 6 A0h Report LUNs

28h Read 10 03h Request Sense

A8h Read 12 1Bh Start Stop Unit

88h Read 16 35h Synchronize Cache 10

12h Inquiry 91h Synchronize Cache 16

1Ah Mode Sense 6 00h Test Unit Ready

5Ah Mode Select 10 3Bh Write Buffer

15h Mode Select 6 0Ah Write 6

55h Mode Select 10 2Ah Write 10

4Dh Log Sense AAh Write 12

25H Read Capacity 10 8Ah Write 16

9Eh/10 Read Capacity 16 42h Unmap

SET Feature Identifiers 5.5

Feature

Identifier (Hex) ATTRIBUTES

Feature

Identifier

(Hex)

ATTRIBUTES

01h Arbitration 08h Interrupt Coalescing

02h Power Management 09h Interrupt Vector Configuration

03h LBA Range Type 0Ah Write Atomicity (Option)

04h Temperature Threshold 0bh Asynchronous Event Configuration

05h Error Recovery (Option) 80h Software Progress Marker

07h Number of Queues

Log Page Support 5.6

ID (Hex) ATTRIBUTES

01h Error Information 03h Firmware Slot Information

02h SMART/ Health Information 05h Command Effects Log

SMART / Health Information (Log Identifier 02h) 5.7

Byte Description

0

Critical Warning: This field indicates critical warnings for the state of the controller. Each bit corresponds to a critical

warning type; multiple bits may be set. If a bit is cleared to ‘0’, then that critical warning does not apply. Critical

warnings may result in an asynchronous event notification to the host. Bits in this field represent the current associated

state and are not persistent.



2:1

Composite Temperature: Contains a value corresponding to a temperature in degrees Kelvin that represents the

current composite temperature of the controller and namespace(s) associated with that controller. The manner in which

this value is computed is implementation specific and may not represent the actual temperature of any physical point in

the NVM subsystem. The value of this field may be used to trigger an asynchronous event (refer to section 5.14.1.4).

Warning and critical overheating composite temperature threshold values are reported by the WCTEMP and CCTEMP

fields in the Identify Controller data structure in Figure 90.

3 Available Spare: Contains a normalized percentage (0 to 100%) of the remaining spare capacity available.

4 Available Spare Threshold: When the Available Spare falls below the threshold indicated in this field, an

asynchronous event completion may occur. The value is indicated as a normalized percentage (0 to 100%).

5

Percentage Used: Contains a vendor specific estimate of the percentage of NVM subsystem life used based on the

actual usage and the manufacturer’s prediction of NVM life. A value of 100 indicates that the estimated endurance of

the NVM in the NVM subsystem has been consumed, but may not indicate an NVM subsystem failure. The value is

allowed to exceed 100. Percentages greater than 254 shall be represented as 255. This value shall be updated once per

power-on hour (when the controller is not in a sleep state).

Refer to the JEDEC JESD218A standard for SSD device life and endurance measurement techniques.

31:6 Reserved

47:32

Data Units Read: Contains the number of 512 byte data units the host has read from the controller; this value does not

include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes read)

and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount of data

read to 512 byte units.

For the NVM command set, logical blocks read as part of Compare and Read operations shall be included in this value.

63:48

Data Units Written: Contains the number of 512 byte data units the host has written to the controller; this value does

not include metadata. This value is reported in thousands (i.e., a value of 1 corresponds to 1000 units of 512 bytes

written) and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount

of data written to 512 byte units.

For the NVM command set, logical blocks written as part of Write operations shall be included in this value. Write

Uncorrectable commands shall not impact this value.

79:64 Host Read Commands: Contains the number of read commands completed by the controller.

For the NVM command set, this is the number of Compare and Read commands.

95:80 Host Write Commands: Contains the number of write commands completed by the controller.

For the NVM command set, this is the number of Write commands.

111:96

Controller Busy Time: Contains the amount of time the controller is busy with I/O commands. The controller is busy

when there is a command outstanding to an I/O Queue (specifically, a command was issued via an I/O Submission

Queue Tail doorbell write and the corresponding completion queue entry has not been posted yet to the associated I/O

Completion Queue). This value is reported in minutes.

127:112 Power Cycles: Contains the number of power cycles.

143:128 Power On Hours: Contains the number of power-on hours. This does not include time that the controller was powered

and in a low power state condition.

159:144 Unsafe Shutdowns: Contains the number of unsafe shutdowns. This count is incremented when a shutdown

notification (CC.SHN) is not received prior to loss of power.

175:160

Media and Data Integrity Errors: Contains the number of occurrences where the controller detected an unrecovered

data integrity error. Errors such as uncorrectable ECC, CRC checksum failure, or LBA tag mismatch are included in

this field.

191:176 Number of Error Information Log Entries: Contains the number of Error Information log entries over the life of the

controller.

Support by NVMe 1.2 Firmware

195:192

Warning Composite Temperature Time: Contains the amount of time in minutes that the controller is operational

and the Composite Temperature is greater than or equal to the Warning Composite Temperature Threshold

(WCTEMP) field and less than the Critical Composite Temperature Threshold (CCTEMP) field in the Identify

Controller data structure in Figure 90.

If the value of the WCTEMP or CCTEMP field is 0h, then this field is always cleared to 0h regardless of the

Composite Temperature value.

199:196

Critical Composite Temperature Time: Contains the amount of time in minutes that the controller is operational and

the Composite Temperature is greater the Critical Composite Temperature Threshold (CCTEMP) field in the Identify

Controller data structure in Figure 90.

If the value of the CCTEMP field is 0h, then this field is always cleared to 0h regardless of the Composite Temperature

value.

201:200

Temperature Sensor 1: Contains the current temperature reported by temperature sensor 1.

Bits Description

15:00 Temperature Sensor Temperature (TST): Contains the current temperature in degrees

Kelvin reported by the temperature sensor.

The physical point in the NVM subsystem whose temperature is reported by the temperature

sensor and the temperature accuracy is implementation specific. An implementation that does

not implement the temperature sensor reports a temperature of zero degrees Kelvin. The

temperature reported by a temperature sensor may be used to trigger an asynchronous event

203:202 Temperature Sensor 2: Contains the current temperature reported by temperature sensor 2. Refer to bye201:200





209:208 Temperature Sensor 5: Contains the current temperature reported by temperature sensor 5.Refer to bye201:200




511:216 Reserved

Vendor specific (Log Identifier C0-FFh) 5.8

Byte Description

101:0 Reserved

PCIe ID 5.9

ID name Description XC100 U.2 XC120 U.2 XC100 HHHL

Vendor ID (VID) Vendor ID assigned by PCI-SIG 0x1D40 0x1D40 0x1D40

Device ID (DID) Device ID assigned by vendor 0x5501 0x5501 0x5C01

Subsystem Vendor ID Indicates Sub-system vendor ID 0x1D40 0x1D40 0x1D40

Subsystem ID Sub-system identifier 0x5501 0x5501 0x5C01

SMBus Function 5.10SMBUS address Function

0x53 Read Subsystem Management Data Structure -- defined by NVMe BMC revision 1.0a

0x1B (Register address 0x05) Get temperature in raw data

LED Function 5.11

5.11.1 Form factor – U.2 (SFF-8639) LED Description Blink Behavior

P11 (Activity) Activity signal from the drive Blinks at the rate of 250msec high, 250msec low with IO activity

5.11.2 Form factor – HHHL LED Description Blink Behavior

LED 1(Green) Shows IO activity Blinks at the rate of 250msec high, 250msec low with IO activity

LED 2(Green) Drive health indicator Solid green when drive is healthy

LED 3 (Orange) Drive pre-fail indicator Solid yellow if any of the critical warnings in log page 0x02 is

triggered

LED 4 (Red) Drive fail indicator Solid red if drive is in read only state



6 NVME DRIVER SUPPORT

NVMe Driver support operating system 6.1

OS Version Inbox driver Techman NVMe

Device driver UEFI Boot install

Microsoft

Windows

Windows 10 Support Support Support

Windows 8.1 Support Support Support

Windows 8 No Support Support

Techman NVMe driver

support(*1)

Windows 7 No Support Support

Techman NVMe driver

support(*1)

Windows Server 2016 Support Support Support Windows Server 2012 R2 Support Support Support

Windows Server 2012 No Support Support

Techman NVMe driver

support(*1)

Windows Server 2008 R2 No Support Support

Techman NVMe driver

support(*1)

Red Hat

Enterprise

Linux

RHEL 6.5

RHEL 6.6 No Support Support Not support Bootable(*2)

RHEL 6.7

RHEL 6.8

RHEL 7.0

RHEL 7.1

RHEL 7.2

Support Support Support

SUSE Linux

Enterprise

11 SP3

11 SP4 No Support Support Not support Bootable(*2)

12

12 SP1 Support Support Support

CentOS

6.5

6.6 No Support Support Not support Bootable(*2)

6.7

6.8

7.0

7.1

7.2


Ubuntu Server


14.04

15.04

15.10

16.04


Debian


8.1

8.2

8.3

8.4

8.5

8.6


VMware

6.5

6.0


5.5 Vmware NVMe

driver support(*3) Vmware NVMe driver

support(*3) Vmware NVMe driver

support(*3)

Citrix

XenServer

6.5 SP1 Citrix NVMe driver

support(*4)

N/A Not support Bootable(*2)

7.0 Support N/A Support

Note: (*1) NVMe device driver requirement

(*2) OS does not support NVMe Booting

(*3) Vmware device driver requirement



(*4) Citrix device driver requirement



7 RELIABILITY

MTBF 7.1

> 1,200,000 POH

UBER 7.2

> 10−17 (unrecoverable bit error rate)

Data Retention 7.340 C at 3 months

Endurance 7.4Capacity Flash Type DWPD PBW

XC100E55-800

XC100E5C-800

XC120E55-800

15nm eMLC 6 DWPD 8.76 PBW

XC100E55-1600

XC100E5C-1600

XC120E55-1600


XC100E55-3200

XC100E5C-3200

XC120E55-3200


XC100C55-800

XC100C5C-800

XC120C55-800

15nm cMLC 2 DWPD 2.92 PBW

XC100C55-1600

XC100C5C-1600

XC120C55-1600


XC100C55-3200

XC100C5C-3200

XC120C55-3200




8 ENVIRONMENTAL CONDITIONS

Ambient Temperature 8.1

PARAMETER OPERATING Non-OPERATING UNIT

2.5 inch(*1) 0 ~ 40 (Ambient)

0 ~ 70 (Case) -55 to 95 °C

AIC 0 ~ 55 -55 to 95 °C

Note: (*1) Airflow requirement

(*2) Measuring case temperature

Airflow Requirements 8.2

Capacity Ambient = 25C Ambient = 35C unit

800 GB 350 400 LFM

1600 GB 450 650 LFM

3200 GB 450 650 LFM

Temp. Gradient 8.3


Temperature 30 (Max) 30 (Max) °C/hr

Humidityvii 8.4


Relative Humidity

(non-condensing) 5 to 95 5 to 95 %

Vibration 8.5


U.2 3.01 Grms (Random,

2.5~500 Hz)

4.9 Grms (Random,

5~800 Hz)

HHHL

Shock 8.6


U.2 1000G/0.5ms 1000G/0.5ms

HHHL 50G (Trapezoidal) 50G (Trapezoidal)

Drop 8.7

PARAMETER Weight Height UNIT

Drop (1 corner, 3 edges,

6 surfaces) TBD TBD Packaged

ESD 8.8

PARAMETER Level UNIT

Contact discharge 4 KV

Air discharge 8 KV

vii Should under the condition without condensation.



9 RESTRICTED MATERIALS CONTENT

No usage of prohibited chemical substances. The chemical substances which defined in TECHMAN

"Environmental Requirements for materials parts and products" document. (9999999-201-M03.PDF)

never be used not only in components but also production process of both this products and

components.



10 LABEL

Drive Labels 10.1

The “Safety and Series number label” are located on the top cover.

The “Safety label” contains the following information.

XC100 series (U.2)

(1) Solid state drive

(2) Series

(3) Certification marks (UL / cUL, TÜ V, IC, CE, C-Tick, Korean EMC, Taiwan EMC)

(4) Model number and capacity

(5) Product number

(6) Barcode of product number

(7) Series number (YY: year / WW: week / 1: default / PPPPPP: number)

(8) Barcode of series number

(9) F/W version

P/N: 9SE5501XBXXXTXX

F/W: X.XX

S/N: YYWW1PPPPPP

XXX GB Model: XC100E55



XC120 series (U.2) Dual-port


(2) Series



(5) Product number

(6) Barcode of product number


(8) Barcode of series number

(9) F/W version

P/N: 9SE5501XBXXXTXX

F/W: X.XX

S/N: YYWW1PPPPPP

XXX GB Model: XC120E55



XC100 series (HHHL)


(2) Series



(5) Product number


(7) F/W version

(8) 2D barcode of product number and series number



11 AGENCY CERTIFICATES

Safety Regulation 11.1

UL UL60950-1 Second Edition

C-UL CSA C22.2 No. 60950-1-07, 2nd Edition

TUV EN 60950-1:2006 + A11:2009 +A1:2010+A12:2011+A2:2013

CB IEC 60950-1:2005(Second Edition) + Am 1:2009 + Am 2:2013

EMC 11.2

FCC FCC CFR 47 Part 15 Subpart B/Oct. 2013 and CISPR 22/1997 ANSI C63.4-2009

ICES-003 Issue 5 Aug. 2012

*CE Marking EN55022:2010 +AC:2011, Class B

EN61000-3-2:2006 +A1:2009 +A2:2009 and EN61000-3-3:2013

EN55024:2010

IEC61000-4-2:2008, IEC61000-4-3:2010,

IEC61000-4-4:2012, IEC61000-4-5:2005,

IEC61000-4-6:2013, IEC61000-4-8:2009

IEC61000-4-11:2004)

*C-Tick AS/NZS CISPR 22:2009 +A1:2010, RULES AND REGULATIONS OF CLASS B

(CISPR 22 Ed. 6.0:2008)

Taiwan EMC CNS 1343 (C6357

VCCI VCCI V-2/Apr. 2012 and V-3/Apr. 2013 and V-4/Apr. 2012



12 REVISION HISTORY

Rev. No. Reason for Release Release Date TECHMAN

1.00 First Release September 7, 2015 Samuel Chen

1.01

1.Typo

2. Revise 9. Label

Add NVMe logo

October 15, 2015 Samuel Chen

1.02

1. Revise 3.3 Random Read\Write IOPS –steady state

Modify random 4K from 110K to 105K (for Linux)

2. Revise 3.2 Sequential Read \ Write Performance

Modify Sequential Write from 1400MB to 1350MB

(for Linux)

October 21, 2015 Samuel Chen

1.03

Performance improvement (Firmware version 1.03)

1. Revise 3.3 Random Read\Write IOPS –steady state

Modify random 4K write from 105K to 115K

Modify random 4K read from 510K to 750K

2. Revise 3.2 Sequential Read \ Write Performance

Modify Sequential write from 1350MB to 1400MB

Modify Sequential read from 2500MB to 3200MB

January 14, 2016 Samuel Chen

1.10 Change document format February 16, 2016 Samuel Chen

1.11 Add APPENDIX A PERFORMANCE TEST

EQUIPMENT March 3, 2016 Samuel Chen

1.12

Add 8.2 Airflow Requirements

Add XC120 series dual port support (Firmware and

H/W requirement)

April 26 2016 Samuel Chen

2.00 Support NVMe command 1.2 July 11, 2016 Samuel Chen

2.01 Add XC120 Product number

Add Xenserver 7.0 support August 1, 2016 Samuel Chen

2.02

Add APPENDIX B model name define

Modify APPENDIX B SSD PRODUCT NUMBER

LIST to APPENDIX C SSD PRODUCT NUMBER

LIST

September 1, 2016 Samuel Chen

2.03

Add NVMe support operating system (6.1 NVMe

Driver support operating system)

Typo Page8

January 19, 2017 Samuel Chen



APPENDIX A MAX PERFORMANCE TEST EQUIPMENT

BIOS Configuration

Speed Step: Disabled

Turbo Boost: Disabled

CPU Power and Performance Policy: Performance

CPU C-state : Disabled

Virtualization : Disabled

Windows Configuration

FIO

Direct: Yes

thread:

o 4KB Random I/O: 64 outstanding I/O

o 128KB Seq. I/O: 64 outstanding I/O

Ramp Time: 5 seconds

Run Time:30 seconds

Norandommap: 1

I/O Engine: windowsaio

Numjobs: 4

Iometer

Queue depth:

o 4KB Random I/O: 10 worker with 256 outstanding I/O

o 128KB Seq. I/O: 1 worker with 32 outstanding I/O


Run Time:30 seconds

Linux Configuration

FIO

Direct: Yes

Queue depth

o 4KB Random I/O: 64 outstanding I/O

o 128KB Seq. I/O: 64 outstanding I/O


Run Time:30 seconds

Norandommap: 1

I/O Engine: libaio

Numjobs: 4

Vdbench

Iorate : max

Threads :128

Elapsed : 5 seconds

Run Time: 30 seconds

Override : 4

Multi JVM execution (jvms) : 16



APPENDIX B SSD MODE NAME DEFINE


Model Name XC100 series (Single Port)

XC120 series (Dual Port)

Flash Type E: eMLC

C: cMLC

Interface 5: PCIE Gen3 Lane4

Form factory 5 : U.2 ( SFF-8639)

C: AIC (HHHL)

Capacity -XXXX GB

Techman XC100 E 5 5 -1600



APPENDIX C SSD PRODUCT NUMBER LIST

XC100 series HHHL Product Number Flash type Capacity Model Name

9SE5C014B01TTQ3 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB XC100E5C-800



9SE5C014B01TTQ2 TOSHIBA 15nm Client Multi Level Cell (cMLC) 800GB XC100C5C-800



XC100 series U.2 Single-Port (SFF-8639) Product Number Flash type Capacity Model Name

9SE55014B01TTQ3 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB XC100E55-800



9SE55014B01TTQ2 TOSHIBA 15nm Client Multi Level Cell (cMLC) 800GB XC100C55-800



XC120 series U.2 Dual-Port (SFF-8639) Product Number Flash type Capacity Model Name

9SE55014B01TTX5 TOSHIBA 15nm enterprise Multi Level Cell (eMLC) 800GB XC120E55-800



9SE55014B01TTX4 TOSHIBA 15nm Client Multi Level Cell (cMLC) 800GB XC120C55-800



SPECIFICATIONS Solid State Drive - TECHMAN...

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