SPECIFICATION SIPLACE HF/3 SPECIFICATION - Tekmart€¦ · Single Conveyor 18 Technical Data for...

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SPECIFICATIONSIPLACE HF/3SPECIFICATIONFlexible High-Speed SMD Placement Sys

3

Flexible High-Speed SMD Placement SystemSIPLACE HF/3Contents

Flexible High-Speed SMD Placement System 3Contents 3

Machine Description 5Overview 5Technical Data 7

Line Concept 8Description 8

Placement Heads 9Head Modularity 912-Segment Collect&Place Head for High-Speed Placement 106-Segment Collect&Place Head for High-Speed IC Placement 11Collect&Place Heads 12Technical Data for the C&P Heads 12TwinHead for High-Precision IC Placement 13Technical Data for the TwinHead 14Nozzle Changers (Collect&Place Heads) 15Nozzle Changer (TwinHead) 16Technical Data for the Nozzle Changers 17

PCB Conveyor 18Single Conveyor 18Technical Data for the Single Conveyor 19Flexible Dual Conveyor 20Technical Data for the Dual Conveyor 21PCB Barcode for Product-Controlled Production (Option) 22

Component Feeding 23Component Changeover Table 23Technical Data for the CO Changeover Table 24Tape Feeders 25Bulk Case Feeder 26Dummy Feeder 27Manual Trays 28Matrix Tray Changer 29Technical Data for the MTC 30

Technical Data 32Connections 32Dimensions and Set-Up Conditions 34Placement System’s Center of Gravity 35Maneuvring Radii 36MTC Dimensions and Set-Up Conditions 36Transport and Delivery Configuration 37

Sample Configuration 38

5

Machine DescriptionOverview

Innovation

• Three gantries → higher placement rate and greater flexibility when configuring the placement heads

• Linear drives on every gantry → faster accelera-tion and braking of X and Y gantries → higher placement rate

• Gantry extensions con-structed from carbon fiber composite, 5 times lighter than steel and twice as rigid → increased speed and accuracy

• TwinHead places two com-ponents at the same time using the Pick & Place prin-ciple→ increased speed when placing large components → greater flexibility due to broader range of compo-nents

• TwinHead component vision camera with 50 mm x 40 mm field of view → maximum speed together with more reliable detec-tion of even complex com-ponents such as CCGA or flip chip

Description

The SIPLACE HF/3 placement system is particularly suitable for applications that demand a high level of flexibility, utmost precision, and a high placement rate. Two place-ment methods are used:

• the Collect&Place method for high-speed placement of standard

components (see diagram on page 6)

• the Pick&Place method for fast placement of spe-cial fine-pitch and super-fine pitch components

The HF/3 placement system has three gantries driven by linear motors. The gantries can be quickly and accurately positioned in the X and Y directions. There is a place-ment head on each gantry.

The following placement head configurations are possible:

Placement area 1

• Two 12-segment Collect & Place heads or

• two 6-segment Collect & Place heads or

• one 6-segment and one 12-segment Collect&Place head

Placement area 2

• 12-segment Collect & Place head or


• TwinHead

The head modularity prin-ciple allows the placement heads to be reconfigured to suit changing requirements.

The moving head picks up the components from their stationary feeder, and places them on the PCB, which is also stationary. This proven SIPLACE principle has many advantages:

• Short down times for refill-ing or splicing

• Even the smallest compo-nents (e.g. 0201) are picked up reliably

• The components cannot slip on the PCB

• Minimal traversing paths

High flexibility, cost-effec-tiveness and set-up reliability guarantee that the SIPLACE HF/3 placement system will be highly productive. The minimal down times increase utilization, thus further in-creasing productivity.

6

Machine DescriptionOverview

Upgrade

The following options are available to extend the machine's functionality:

• Additional component changeover tables increase machine utiliza-tion since set-up times can be reduced by carrying out preliminary set-up off the machine.

• Large and sensitive fine-pitch components can be supplied in trays by a matrix tray changer.

• The dual conveyor also increases machine utiliza-tion by eliminating non-productive PCB transport times.

• Automatic nozzle chang-ers speed up and optimize the nozzle configuration process.

• PCB barcode scanners allow the production set-up to be changed over when triggered by a new product.

• Component barcode scan-ners optimize the set-up and refill checks.

• The productivity lift imple-ments the concept of par-allel placement, and thus improves the ratio be-tween productive and non-productive times.

• There are a lot of addi-tional options, such as the dipflux module, the copla-narity module or the com-ponent disposal module to name just a few.

Placement principleCollect&Place

7

Machine DescriptionTechnical Data

Types of placement head SIPLACE TwinHead (TH)6-segment Collect&Place head (C&P6)12-segment Collect&Place head (C&P12)

Number of gantries 3

Placement rate(Benchmark test for the single conveyor)

Placement area 1 Placement area 2 Placement rateC&P12 / C&P12 C&P12 40,400 comp./hC&P12 / C&P12 C&P6 35,700 comp./hC&P12 / C&P12 TH 30,100 comp./hC&P12 / C&P6 C&P6 29,600 comp./hC&P12 / C&P6 TH 24,000 comp./hC&P6 / C&P6 C&P6 27,600 comp./hC&P6 / C&P6 TH 22,000 comp./h

Range of components 0.6 x 0.3 mm² (0201) to 85 x 85 mm² / 125 x 10 mm²max. 200 x 125 mm² (with restrictions)

Component height C&P12: 6 mmC&P6: 8.5 mmTH: 25 mm (When using the multi-color camera, the height

reduces to 18.3 mm.)

Placement accuracy C&P12: ± 60 µm standard, ± 55 µm DCA, ± 0.7° / (4 σ)C&P6: ± 60 µm standard, ± 55 µm DCA, ± 0.3° / (4 σ)TH: ± 35 µm standard, ± 30 µm FC, ± 0.07° / (4 σ)

PCB format(LxW)

PLEASE NOTE:With PCB widths > 450 mm make sure that the peripheral modules are also able to pro-cess these widths.

Single conveyor50 x 50 mm² to 450 x 508 mm²50 x 80 mm² to 610 x 508 mm² ("Long board" option)Dual conveyor50 x 50 mm² to 450 x 250 mm²50 x 80 mm² to 610 x 250 mm² ("Long board" option)Dual conveyor in Single conveyor mode50 x 50 mm² to 450 x 450 mm²50 x 80 mm² to 610 x 450 mm² ("Long board" option)

PCB thickness 0.3 - 4.5 mm (thicker PCBs on request)

Feeding capacity 180 tracks, width 8 mm (60 3 x 8 mm S feeder)120 tracks, width 8 mm (60 2 x 8 mm S feeder)60 tracks, width 12 or 16 mm (60 12/16 mm S feeder)40 tracks, width 24 or 32 mm (40 24/32 mm S feeder)28 tracks, width 44 mm (28 44 mm S feeder)24 tracks, width 56 mm (24 56 mm S feeder)20 tracks, width 72 mm (20 72 mm S feeder)16 tracks, width 88 mm (16 88 mm S feeder)

Component feeding 4 component changeover tables with tape roll holders and integral waste containers 15 slots, 30 mm wide per changeover table or matrix tray changer, rather than a CO changeover table (location 2)

Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM feeders, surftape feeders (8, 12, 16 mm), manual trays

Electrical ratings and com-pressed air specification

see page 32

Dimensions and set-up condi-tions

see page 34

8

Line ConceptDescription

Innovation

• Modularity, flexibility → the line can easily be adapted to suit production requirements

• Compactness, high power density → less space required for increased placement rate

Description

The SIPLACE HF/3 is fully compatible with other SIPLACE systems. This com-patibility enables a produc-tion line to be configured from identical and different modules. If production re-quirements change, the indi-vidual placement systems can be quickly and easily recombined.

The SIPLACE family has exact-ly the right placement sys-tem, whatever the output requirements:

SIPLACE HF and HF/3 placement systems place the entire SMD spectrum of com-ponents from 0201 to 125 x 10 mm² with a high place-ment rate.

The SIPLACE HS-60 is a super high-speed placement sys-tem for processing compo-nents ranging from 0201 through to 18.7 x 18.7 mm².

The SIPLACE S-27 HM is a high-speed system for placing components from 0201 to 32 x 32 mm².

The flexible SIPLACE F5 HM system places large ICs, flip chips, bare dies and exotic components (OSC). It has a component range of 0201 to 55 x 55 mm².

SIPLACE set-up optimization is a tool for increasing the line's productivity.

The software calculates indi-vidual set-ups for individual products, individual set-ups for different products and family set-ups for different products.

The program data can be ex-changed between the indi-vidual lines - even for different machine configurations.

System SIPLACE SMD placement lines

Placement modules

SIPLACE HF/3, SIPLACE HF, SIPLACE HS-60, SIPLACE S-27 HM, F5 HM

Peripheral modules

Input/output stations, screen printers, soldering ovens, inspection stations, etc, available from SIEMENS A&D EA

Component range 0201 to 85 x 85 mm² / 125 x 10 mm² max. 200 x 125 mm² (with restric-tions)

PCB conveyor Single and dual conveyor with auto-matic width adjustment unit

Placement rate Depends how modules are connected in series

Space required 4 m² per S module6.7 m² per HF and HF/3 module7.5 m² per HS module

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Placement HeadsHead Modularity

Innovation

• TwinHead picks up two components at the same time using the Pick&Place principle→ increased speed when placing large components→ greater flexibility due to broader range of compo-nents

• Head modularity→ A simple placement head change adapts the machine to the current production requirements

• Reconfiguration kit→ Local placement head change

Description

One key advantage of the SIPLACE machines is its head modularity. The placement heads on the HF/3 machines are configurable:

Placement area 1

• Two 12-segment Collect & Place heads or

• two 6-segment Collect & Place heads or

• one 6-segment and one 12-segment Collect & Place head

Placement area 2



• TwinHead

When you order a SIPLACE HF/3 placement system, you can select the ideal head con-figuration for your needs. The placement system will then be configured and sup-plied as per your order.

Also available is a reconfigu-ration kit if you wish to change the placement head locally. This package contains

the appropriate nozzle changers, assembly parts, ca-bles, etc, in addition to the placement head.

Head modularity provides an easy way to match the place-ment system to your produc-tion needs without having to invest in additional machines.

10

ponent vision dule

DP axisRotate component to place-

ment angle

Pull offor insertsleeve

Placement Heads12-Segment Collect&Place Head for High-Speed Placement

Innovation

• Compact construction→ Low centrifugal forces on the components

• Same cycle time for all components→ Placement rate does not depend on the component size

• High-speed placement of components ranging from 0201 to 18.7 x 18.7 mm²

Description

The 12-segment Collect & Place head works on the Collect&Place principle. This means that, within each cycle, twelve components are picked up by the place-ment head, are optically cen-tered on the way to the board and are rotated into the required placement angle. Lastly, the component is placed gently and accurately on the board. The twelve nozzles on SIPLACE Collect &Place heads turn about a horizontal axis, in contrast to conventional chip shooters.

The compact construction has the following advan-tages:

• The centrifugal forces act-ing on the components are much lower than with con-ventional chip shooters.

• The cycle time of the Collect & Place head is the same for all components, which means that the placement rate is not de-pendent on the compo-nent size.

Checking and self-learning functions

The reliability of the Collect & Place head is increased by various checking and self-learning functions.

• For example, vacuum checks at the nozzles indi-cate whether the compo-nent was picked up or set down correctly.

• A fiducial mark on the feeder is used to deter-mine the precise compo-nent pick-up position on the feeder.

• A camera on the place-ment head (component vision module) determines the precise angle of each component on the nozzle. Any deviations from the required pick-up position are corrected before place-ment takes place.

• The package form is also checked and the compo-nent is not placed if the geometric data thus deter-mined differs from the programmed data.

The vertical axis for picking up and placing the compo-nent works in sensor stop mode, in which differences in height during pick-up and any unevenness of the PCB

surface are compensated during placement. A compo-nent sensor may be installed on the C&P head in order to increase placement reliabili-ty. This sensor checks the edge ratio in addition to the presence of the component at the nozzle.

DCA option

The 12-segment Collect& Place head can optically cen-ter and place components from 0.6 x 0.3 mm² to 13 x 13 mm² using the optional DCA vision module. The DCA vision module optimizes the speed and accuracy when placing flip-chips and bare dies (values in table on page 12).

Commo

Z axisPick up or

place component

DR axisRotate star

Rejectcomponent

11

nentnt angle

Placement Heads6-Segment Collect&Place Head for High-Speed IC Placement

Innovation

• High-speed placement of ICs → Components up to 32 x 32 mm²

Description

The 6-segment Collect& Place head also works on the Collect&Place principle. With the standard component vision module, the HF/3 machine places components with an edge length of up to 32 mm both fast and accu-rately. It is therefore ideal for use with products containing a large proportion of ICs.

DCA option

The 6-segment Collect& Place head can optically cen-ter and place components from 0.6 x 0.3 mm² to 13 x 13 mm² using the optional DCA vision module. The DCA vision module optimizes the speed and accuracy when placing high-speed flip-chips and bare die components. The values are shown in the table on page 12.


The checking and self-learn-ing functions described on page 10 for the 12-segment Collect&Place head also apply to the 6-segment Collect & Place head.

Component vision module

DP axisRotate compo to placeme

Z axisPick up or

place component

DR axisRotate star

Reject component,pull off or

insert sleeve

12

-segmentct&Place head vision module

)

Com to flip-chip, ie

Comspec

mmmmmmm

m mm

m0.3 mm²3 mm²

Progset-d - 5.0 N

Noz 9 xx

X/Y m/4 σAng /4 σ

Placement HeadsCollect&Place HeadsTechnical Data for the C&P Heads

Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific standards, the component packaging tolerances and the component tolerances.

12-segmentCollect&Place head

(standard vision module)

12-segmentCollect&Place head(DCA vision module

)

6-segmentCollect&Place head

(standard vision module

)

6Colle(DCA

ponent range 0201 to PLCC44, BGA, µBGA, flip-chip, TSOP, QFP, SO to SO32, DRAM

0201 to flip-chip, bare die

0603 to 32 x 32 mm² 0201 bare d

ponent ificationsax. heightin. lead pitchin. ball pitchin. ball diameterin. dimensionsax. dimensionsax. weight

6 mm0.5 mm0.35 mm0.2 mm0.6 x 0.3 mm²18.7 x 18.7 mm²2 g

6 mm0.4 mm0.2 mm0.11 mm0.6 x 0.3 mm²13 x 13 mm²2 g

8.5 mm0.5 mm0.56 mm0.32 mm1.6 x 0.8 mm²32 x 32 mm²5 g

8.5 m0.4 m0.2 m0.11 m0.6 x 13 x 15 g

rammableown force 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N

zle types 9 xx 9 xx 8 xx, 9 xx 8 xx,

accuracy ± 60 µm/4 σ ± 55 µm/4 σ ± 60 µm/4 σ ± 55 µ

ular accuracy ± 0.7°/4 σ ± 0.7°/4 σ ± 0.3°/4 σ ± 0.3°

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rks

Placement HeadsTwinHead for High-Precision IC Placement

Innovation

• The TwinHead places two components at the same time using the Pick&Place method→ Increased speed when placing large components→ Greater flexibility due to broader range of compo-nents

Description

This sophisticated placement head consists of two place-ment heads of the same type coupled together (twin head). Both heads work using the Pick&Place prin-ciple. The TwinHead is suit-able for processing partic-ularly difficult or large com-ponents. Two components are picked up by the place-ment head, optically cen-tered on the way to the placement position and rotated into the necessary placement angle. The com-

ponents are then placed gently and accurately on the board.

In addition to the vacuum nozzles specially developed for the TwinHead, the place-ment head can also use the nozzles for the Pick&Place head. Collect &Place head nozzles can also be used.


The TwinHead's reliability can be further increased with various checking and self-learning functions.

• For example, vacuum checks at the nozzles indi-cate whether the compo-nent was picked up or set down correctly.

• High-resolution, intelli-gent vision modules, such

as the fine-pitch and flip-chip vision modules, iden-tify and correct minute de-viations from the desired component position, thus guaranteeing a correct placement position. The vision modules are per-manently fixed to the machine frame.

• The component package form is also checked, and the component is not placed if the geometric data thus determined dif-fers from the programmed data.

• A force sensor measures and monitors the specified component placement forces.

Z axis

DP axis

How the TwinHead wo

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Placement HeadsTwinHead for High-Precision IC PlacementTechnical Data for the TwinHead

*) Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific standards, the component packaging tolerances and the component tolerances.

**) When using the multi-color camera, the height reduces to 18.3 mm.

Optical centering with Fine-pitch vision module Flip-chip vision module

Component range*) 0603 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips

0201 to SO, PLCC, QFP, sockets, plugs, BGA, special components, bare dies, flip-chips, shields

Component specifications

max. heightmin. lead pitchmin. bump pitchmin. ball ∅min. dimensionsmax. dimensions

max. weight

25 mm**)

0.4 mm0.56 mm0.32 mm1.6 x 0.8 mm²50 x 40 mm²(single measurement)For use with two nozzles50 x 50 mm² or69 x 10 mm²For use with one nozzle:85 x 85 mm² or125 x 10 mm²max. 200 x 125 mm² (with restrictions)100 g***)

25 mm**)

0.25 mm0.14 mm0.08 mm0.6 x 0.3 mm²8 x 8 mm²(single measurement)

100 g***)

Programmable placement force

1.0 N - 15 N 1.0 N - 15 N

Nozzle types 5 xx (standard)4 xx + adapter8 xx + adapter9 xx + adapter

5 xx (standard)4 xx + adapter8 xx + adapter9 xx + adapter

Nozzle spacing on the two Pick&Place heads

70.8 mm 70.8 mm

X/Y accuracy ± 35 µm/4 σ ± 30 µm/4 σAngular accuracy 0.07° / 4 σ 0.07° / 4 σ

***) If standard nozzles are used.

15

Placement HeadsNozzle Changers (Collect&Place Heads)

Innovation

• Nozzle changers increase the flexibility of placement heads when processing different components→ nozzle configuration can be quickly modified for new placement jobs→ accurate nozzle seat minimizes radial eccentric-ity→ defective nozzles are quickly replaced

Description

Up to 7 nozzle changers can be installed for the 6-seg-ment or 12-segment Collect & Place heads (C&P6 or C&P12):

Location 1: 2 nozzle changers (NC6 or NC12)

Location 2: 1 nozzle changer (NC6 or NC12)



Magazine for 12 type 9xx nozzles

Magazine for 6 type 9xx nozzles

Magazine for 6type 8xx nozzles

Nozzle changer for the 12-segment Collect&Place head (NC12)

Nozzle changer for the 6-segment Collect&Place head (NC6)

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Placement HeadsNozzle Changer (TwinHead)

The nozzle changer (NCTH) for the TwinHead (TH) can be installed at location 2 and 3. The supporting plate can hold up to 12 magazines for standard or special nozzles.

Position of the nozzle changers

Magazine for 2 standard nozzles

Magazine for 1 special nozzle,gripper

TH

NC12 / NC12 orNC6 / NC6

NCTH

C&P12/C&P6

PCB

PCBC&P12/C&P6

NC12 / NC12or NC6 / NC6

NCTH

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Placement HeadsNozzle ChangersTechnical Data for the Nozzle Changers

Nozzle changer for the 12-segment Collect&Place head

Dimensions (length x width x height) 449 x 62.7 x 77.7 mm³

Number of magazines min. 1 / max. 5, each with 12 nozzle holders

Number of nozzle holders min. 12 / max. 60

Nozzle types 9 xx

Nozzle change time < 200 ms per nozzle

Compressed air connection 0.48 MPa (4.8 bar)

Nozzle changer for the 6-segment Collect&Place head

Dimensions (length x width x height) 448 x 122.5 x 97.7 mm³

Number of magazines min. 1 / max. 6, each with 6 nozzle holders


Nozzle types 8 xx, 9 xx

Nozzle change time < 200 ms per nozzle

Compressed air connection 0.48 MPa (4.8 bar)

Nozzle changer for the SIPLACE TwinHead

Dimensions (length x width x height) 448 x 68.5 x 49 mm³

Number of magazines min. 4 / max. 12


Nozzle types 4 xx with adapter5 xx (standard)9 xx with adapterSpecial nozzle, gripper

Nozzle change time < 2 s per nozzle

18

nt area 2

Placement area 1

Placeme

Output conveyor

Intermediate conveyor

Input conveyor

PCB ConveyorSingle Conveyor

Innovation

• The PCB is clamped from below for placement → distance between the PCB and placement head is always constant→ placement rate does not depend on the PCB thickness→ fiducial contours are always sharply displayed → improved PCB fiducial centering

• The width adjustment unit has a dedicated control circuit→ independent of other machine components → faster and easier to adjust

Description

For placement, the PCB is clamped from below. The dis-tance between the top of the PCB and the placement head thus remains unchanged for each PCB, and is no longer dependent on the thickness of the PCB. The placement rate is thus also independent of the PCB thickness.

Since the distance between the PCB surface and the PCB camera remains the same, the PCB camera is always focussed on the PCB surface with the same level of sharp-ness.

The PCB fiducial contours are optimally mapped on the CCD chip of the PCB camera.

The inline PCB conveyor sys-tem quickly adapts to a wide range of PCB widths. The set-ting is made using the place-ment program or via the station software menu. The width of the PCB conveyor is monitored by an integral control circuit.

The transport height can be modified, thus allowing the machines to be integrated into lines with a transport height of 830, 900, 930 or 950 mm.

The PCB conveyors can com-municate with the individual machines via the SMEMA interface.

The fixed transport side can be located on the left or right for both the dual conveyor and the single conveyor. With this conveyor, the fixed side can be easily switched from right to left or vice versa.

Movement and clamping of the PCBs are monitored and controlled by sensors. When the board has reached the placement area and passed the light barrier, it is braked. A laser light barrier deter-mines the position of the board. As soon as the circuit board has reached its target position, the conveyor belt is stopped and the board is clamped from the underside. The placement process then starts immediately.

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PCB ConveyorSingle ConveyorTechnical Data for the Single Conveyor

*) With PCB widths > 450 mm make sure that the peripheral modules are also able to process these widths.

Stationary conveyor side Right or left

PCB formatStandard (length x width)"Wide board" configuration"Long board" option"Long board" option in "Wide board"configuration

50 x 50 mm² to 450 x 450 mm²50 x 50 mm² to 450 x 508 mm²*)

50 x 80 mm² to 610 x 450 mm²50 x 80 mm² to 610 x 508 mm²*)

PCB thicknessStandard 0.3 to 4.5 mm (± 0,2 mm)

(thicker PCBs on request)

Max. PCB warpage Up: 6 mm - PCB thicknessDown: 0.3 mm + PCB thickness

PCB weight max. 3 kg

Clearance on PCB undersideStandardOption

25 mm ± 0.2 mmmax. 40 mm ± 0.2 mm

Component-free PCB handling edge 3 mm

PCB changeover time < 2.5 s

PCB positioning accuracy ± 0.5 mm

PCB transport height 830mm ± 15mm (standard)900mm ± 15mm (SMEMA)930mm ± 15mm (SMEMA)950mm ± 15mm (SMEMA)

Type of interface SMEMA / SIEMENS

Ink spot detection possible

Automatic width adjustment possible

20

onveyor mode

Asynchronous conveyor mode

Synchronous c

PCB ConveyorFlexible Dual Conveyor

Innovation

• As for single conveyor

Plus:

• The dual conveyor can be configured online to cre-ate a single conveyor → no mechanical conversion work required

• Reduced down times → increased production throughput

Description

The PCB dual conveyor can greatly increase throughput with shorter down times - depending on the placement program. It allows two PCBs to be carried simultaneously (synchronously) or alternate-ly (asynchronously) through the placement machine.

In asynchronous mode, only one PCB in a transport track is processed. At the same time, another PCB in the second transport track is moved into the placement position. This saves the full conveying time of one PCB, thus considerably increasing performance, par-ticularly for PCBs with a short cycle time. The placement process starts as soon as one PCB is transported into the processing area.

In synchronous mode, two PCBs are moved into the placement position at the same time. They are pro-cessed as a common panel.

In this way, the top and bottom of a PCB can be pro-cessed on a single line. The proportion of non-productive time is reduced as two circuit boards are always conveyed simultaneously.

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PCB ConveyorFlexible Dual ConveyorTechnical Data for the Dual Conveyor

Fixed conveyor side Right or left

PCB formatStandard (length x width)"Wide board" configurationLong board optionLong board option in "Wide board"configuration

Dual conveyor in "Single conveyor" modeStandard (length x width)"Wide board" configurationLong board optionLong board option in "Wide board"configuration

50 x 50 mm² to 450 x 216 mm² 50 x 50 mm² to 450 x 250 mm² 50 x 80 mm² to 610 x 216 mm²

50 x 80 mm² to 610 x 250 mm²

50 x 50 mm² to 450 x 380 mm²50 x 50 mm² to 450 x 450 mm²50 x 80 mm² to 610 x 380 mm²

50 x 80 mm² to 610 x 450 mm²

PCB thicknessStandard 0.3 mm to 4.5 mm (± 0,2 mm)

(thicker PCBs on request)

Max. PCB warpage Up: 6 mm - PCB thicknessDown: 0.3 mm + PCB thickness

PCB weight max. 3 kg

Clearance on PCB undersideStandardOption

25 mm ± 0.2 mmmax. 40 mm ± 0.2 mm

PCB transport height 830mm ± 15mm (standard)900mm ± 15mm (SMEMA)930mm ± 15mm (SMEMA)950mm ± 15mm (SMEMA)

Type of interface SMEMA / SIEMENS

Component-free PCB handling edge 3 mm

PCB changeover time < 2.5 s

PCB positioning accuracy ± 0.5 mm

Conveyor mode synchronous or asynchronous

Components on each conveyor same or different

PCB width on each conveyor same or different

Ink spot detection synchronous: not possible, asynchronous: possible

Automatic width adjustment synchronous: not possible, asynchronous: possible

22

PCB ConveyorPCB Barcode for Product-Controlled Production (Option)

Label dimensions Stroke width (W): 0.19 < W ≤ 0.3 mm (corresponds to high and medium density), stroke length: ≥ 4 mm, length of the barcode template win-dow: ≤ 90 mm

Recommended label colors

Coding: black, dark green, dark blue, background: white, beige, yellow, orange (contrast ratio > 70% to DIN 66236

Code types Code 39, Code 128 / EAN 128, Codabar, 2/5 IATA 2/5 industrial, 2/5 inter-leaved, UPC, EAN, Pharma Code, EAN Addendum (others available on request), max. 25 digits, a barcode filter may be defined

Laser scanner safety

Laser diode 670 nm (red) / 1.2 mWLaser protection class 2, degree of protection IP65

PCB barcode reader Q [mm]2D on top 3901D on top 390

2D on bottom 4301D on bottom 430

PCB barcode reader L [mm]1D on top 320 - 350

1D on bottom 380 - 410

PCB barcode reader PCB rear projection [mm]2D on bottom (dual conveyor) 17

PCB barcode reader LQ [mm] RQ [mm]2D on top 3 31D on top 3 3

2D on bottom 5 51D on bottom 5 5

PCB dimensions/conveyor LO [mm] RO [mm]460 mm SC 3 20508 mm SC 3 44

216 mm DC1 3 24250 mm DC1, 450 mm SM1 3 58

216 mm DC2 3 3250 mm DC2, 450 mm SM2 3 3

PCB dimensions/conveyor LU [mm] RU [mm]460 mm SC 20 3508 mm SC 44 3

216 mm DC1 3 3250 mm DC1, 450 mm SM1 3 3

216 mm DC2 24 3250 mm DC2, 450 mm SM2 58 3

Downstreammachine

Upstreammachine

PCB

PCB barcode scanner 1D on top

PCB barcode scanner 1D bottom

SC - Single conveyor, DC1/2 - Dual conveyor, track 1/2, SM1/2 - Dual conveyor in Single conveyor mode, track 1/2

23

Loc

Component FeedingComponent Changeover Table

Innovation

• Automatic coupling and uncoupling

• Combined interface for both, electrical and pneu-matic connections → cables no longer have to be connected and discon-nected manually

• Precise alignment → particularly important for small components

• Easy to convert for other PCB transport heights

• Tape reel diameter from 7“ up to 19“ → high flexibility

Description

Up to four component changeover tables may be docked in the machine. Optionally, a matrix tray changer may be installed at location 2. The component

changeover tables are stand-alone modules that can be set up at an external set-up area with feeders. In this way, changes only interrupt the production process for a short time. The chassis runs smoothly and is easy to maneuver. There are pockets for holding set-up list print-outs on both sides of the component changeover table. The operator has un-hindered access to the docu-ments, even during production.

The component feeder table has a capacity of up to 15 locations for 30 mm wide feeders. The total capacity with four component changeover tables is thus 180 x 8 mm tracks.

Bulk case feeders, vibratory stick feeders, surftape feeders, dip flux modules, CO

disposal modules, and manu-al trays may be set up in addi-tion to the tape feeders. Dummy feeders are used at unassigned locations to pro-tect the operators.

The communication unit sends the necessary voltages and control signals to the feeders.

The component feeders are at rest during the placement process, which means that components can be refilled (in sticks, for example) and tapes may be spliced without stopping the machine.

An optional component bar-code reader can be used to scan and check the barcodes on the tape reels, thus guar-anteeing that the compo-nents are allocated to the correct tracks.

Location 2

Location 3

ation 4

Location 1

24

Component FeedingComponent Changeover TableTechnical Data for the CO Changeover Table

Length x width 728 x 592 mm², 752 x 592 mm² (with waste container)

Height 830 mm for 830 mm PCB transport height900 mm for 900 mm PCB transport height930 mm for 930 mm PCB transport height950 mm for 950 mm PCB transport height

PCB transport height 830 mm ± 15 mm (standard)900 mm ± 15 mm (SMEMA)930 mm ± 15 mm (SMEMA)950 mm ± 15 mm (SMEMA)

Weightwithout feederwith feeders at every locationwith compressed air supply for bulk case feeder and adapter for the 3rd tape reel

approx. 85 kgapprox. 125 kg

approx. 150 kg

Reel diameterstandardmaximum

up to 432 mm (17“)483 mm (19“)

Feeder locations max. 15

Changeover time less than 1 min.

Component feeder table

Centering

Communication unit

Waste containerfor pieces of used tape

Tape container

25

Component FeedingTape Feeders

Technical data

a) Fiducial for feeder position detection;

b) for 0201 and 0402 only;

c) variable in 4 mm increments.

Description

Only 9 different feeder sizes are needed to feed tapes from 8 mm to 88 mm. Reels are kept in the tape container on the component change-

over table. A cutting device automatically cuts the used tape. SIPLACE feeders have short cycle times and high-precision pick-up positions. Even multiple products and small batch sizes are easy to handle since the feeders can be quickly changed over.

Packaging Model Loca-tions

Transport distance

Max. CO height

Paper and blister tapes

2 x 8 mm S a)

3 x 8 mm S3 x 8 mm S b)

1 x 12/16 mm S

1111

2/4 mm2/4 mm2/4 mm4/16 mm c)

2.5 mm2.5 mm0.7 mm14 mm

Blister tapes

1 x 24/32 mm S1 x 24/32 mm S DP1 x 44 mm S1 x 44 mm S DP1 x 56 mm S1 x 56 mm S DP1 x 72 mm S1 x 88 mm S

1.51.52.02.02.52.533.5

4/40 mm c)

4/40 mm c)

4/52 mm c)

4/56 mm c)

4/68 mm c)

4/68 mm c)

4/80 mm c)

4/88 mm c)

14 mm24 mm14 mm24 mm14 mm24 mm14 mm14 mm

Tape reels 178 - 483 mm diameter (7" - 19")

Feeder cycle

S feeder up to 20 mm transport distance < 150 ms

Both the tape cycle incre-ment and the use of tape ma-terials are variable. SIPLACE feeders are suitable for both paper and plastic tapes. This represents a significant bene-fit in terms of both cost and logistics. A signal from the communication unit enables the feeders to automatically control the entire feeder sequence, including auto-matic strip take-up.

The S feeders have shorter cycle times and can process tapes with a pocket pitch of 2 mm (8 mm S).

The 8 mm S and 12/16 mm S also have a component cover. The feeders can also be used in other SIPLACE placement machines.

2 x 8 mm S

3 x 8 mm S

3 x 8 mm S 0201

12/16 mm S

24/32 mm S

44 mm S

56 mm S

72 mm S

88 mm S

26

Component FeedingBulk Case Feeder

Technical data

a) Fiducial for feeder position detection

Bulk case feeder a)

Packaging form Bulk case

Feeder rails Chip 0402 CO height: 0.35 mmChip 0402 CO height: 0.50 mmChip 0603 CO height: 0.45 mmChip 0603 CO height: 0.80 mmChip 0805 CO height: 0.45 mmChip 0805 CO height: 0.60 mmChip 0805 CO height: 0.85 mmChip 0805 CO height: 1.25 mmMicro-Melf: 1.05 ± 0.05 mmMini-Melf: 1.4 ± 0.1 mm

Location 1 location for 2 different compo-nent types

Vibratory stick feeder, type 3

with control circuit

Number of tracks and width

3 x 9.5 mm2 x 15 mm1 x > 15 mm1 x 30 mm

Location 1 location

Description

The SIPLACE bulk case feeder processes bulk cases on two tracks. It feeds rectangular and round, passive compo-nents. The PCB magazines (bulk cases) are simply re-placed for refilling - without stopping the machine.

The module essentially con-sists of the basic element plus two feeder rails and PCB mag-azines to suit the component type and height. The compo-nents are separated and fed along the rails by compressed air.

The principle of the fixed component pocket has prov-en most suitable, even when using bulk cases: the vibra-tions that occur with other placement machine concepts can greatly impair the com-ponent quality due to fric-tion, for example.

The stationary component feeder also has significant advantages with stick maga-zines: the universal vibratory stick feeder can be refilled during placement.

Bulk case feeder

Vibratory -stick feeder, type 3

27

Component FeedingDummy Feeder

Danger

To ensure that your SIPLACE placement machine runs safe-ly, a feeder must be assigned to every location on the com-ponent changeover table. If you do not have enough feeders, then you should use dummy feeders as space holders.

The following dummy feeders may be used:

SIPLACE dummy feeder for 1 locationSIPLACE dummy feeder for 6 - 10 locationsSIPLACE dummy feeder for 11 - 20 locations

Dummy feeder for 1 location

Dummy feeder for 6 - 10 locations

Dummy feeder for 11 - 20 locations

28

Component FeedingManual Trays

Manual tray

Component feeder table

Waffle tray

Description

The manual tray is a device for holding JEDEC trays used to supply components. The waffle trays are changed manually. The manual tray is placed on the component feeder table just like a feeder. There are two different ver-sions of the waffle tray: one fills 5 locations, while the other takes up 9 locations on the component feeder table.

On the SIPLACE HF/3 the manual tray is used at loca-tion 2. This option is recom-mended if there are only a few types of component to be placed from a tray.

Technical data

Manual tray - possible positions

Sizes 136 x 360 mm²; requires 5 locations260 x 360 mm²; requires 9 locations

Max. tray height

12.5 mm, including component

Parts Waffle tray carrierTray holder

JEDEC waffle tray

Directly in the waffle tray carrier136 mm wide

29

Component FeedingMatrix Tray Changer

Innovation

• Two mutually indepen-dent bins → optional, pro-grammable access to all waffle trays

• Capacity of up to 100 JEDEC trays → production is not interrupted when the tray is changed

• Integral chassis → easy to couple

• PCB transport height can be changed with just a few easy actions

Description

For numerous tray fed com-ponents we recommend an automatic tray change using a matrix tray changer (MTC). The MTC set-up is precisely matched to the placement sequence in order to opti-mize the timings and dis-tances traveled. Two bins with trays move indepen-dently of one another in the vertical direction until the de-sired magazine is within range of the feed axis. The horizontal feed axis trans-

ports the tray from the bin to within the range of the place-ment head. The first maga-zine is made available as soon as a PCB moves onto the PCB conveyor, and valid pan-el and set-up data is avail-able.

All other magazine changes are carried out time-neutrally during the placement pro-cess. The magazines can be refilled without stopping the machine. Defective compo-nents are returned to the original tray.

Tray supply 2

Tray supply 1

Feedaxis 1

Feedaxis 2

30

Component FeedingMatrix Tray ChangerTechnical Data for the MTC

* Waffle-pack tray carrier

Tray supply 1 (XL) Tray supply 2

Dimensionslength x widthheight

1305 x 600 mm²1490 mm for 830 mm PCB transport height1560 mm for 900 mm PCB transport height1590 mm for 930 mm PCB transport height1640 mm for 950 mm PCB transport height

Weight (basic equipment) approx. 500 kg (with PCB magazines andwaffle tray carriers)

Weight (fully equipped) approx. 534 kg (with components)

Weight (moving mass) approx. 80 kg approx. 43.5 kg

PCB magazine size (L x W x H) 391.2 x 305.6 x 93.3 mm³ 352.7 x 154.8 x 133.8 mm³

PCB magazine weight(fully equipped)(without waffle tray carrier)

approx. 11 kgapprox. 1.7 kg

approx. 7.5 kgapprox. 1.35 kg

Weight of thewaffle tray carrier

850 g 150 g

Dimensions of the waffle tray carrier (L x W x H)

386.5 x 295.8 x 11.1 mm³ 371 x 146 x 10.1 mm³

Distance from PCB magazine to magazine

96 mm 135 mm

Distance from level to level 12 mm 11.8 mm

Vertical travel 444 mm (1st to 30th waffle tray carrier)

511.2 mm (1st to 40th waffle tray carrier)

Horizontal travel between out-going and pick-up position

approx. 647 mm approx. 638 mm

Storage capacity 30 XL waffle-pack tray carriers with 60 JEDEC or 30 special magazines of

maximum size

40 waffle-pack tray carrierswith 40 JEDEC waffle trays

Changeover time (over 5 levels) approx. 2 sec approx. 1.5 sec

Max. height of component and waffle tray, including tolerances

all levels filledone level freetwo levels free

8.5 mm19.5 mm31.5 mm

8.5 mm19.5 mm

-

31

Component FeedingMatrix Tray ChangerTechnical Data

Electrical ratings

Noise emissions

Permitted environmental factors

Supply voltage 3 x 400 VAC, 50 Hz (Europe)3 x 208 VAC, 60 Hz (USA)

Total power 1.5 kW

Rated current 2.7 A at 3 x 400 VAC4.2 A at 3 x 208 VAC

Fuses 3 x 16 A

Rated power consumption of the largest consumer 2 A

Maximum noise emissions 74 dB (A)

Room temperature between 15 °C and 35 °C

Atmospheric humidity30 - 75 %(No higher than 45% on average to prevent any possibility of condensation on the machine)

32

Technical DataConnections

Electrical ratings

Compressed air specification

*) Collect & Place head

**) TwinHead

Supply voltage 3 x 208 VAC ± 5 %; 50/60 Hz (U.S.A.)3 x 230 VAC ± 5 %; 50/60 Hz3 x 380 VAC ± 5 %; 50/60 Hz3 x 400 VAC ± 5 %; 50/60 Hz (Europe)3 x 415 VAC ± 5 %; 50/60 Hz

Fuses 3 x 32 A (3 x 208 VAC / 3 x 230 VAC)3 x 16 A (3 x 380 VAC / 3 x 400 VAC / 3 x 415 VAC)

Nominal apparent power 3.5 kVA

Rated current consumption 8.9 A / 3 x 400 VAC

Power failure max. 20 msec

pmin 0.5 MPa = 5.0 bar

pmax 1.0 MPa = 10 bar

Connection 3/4" thread with 1/2" hose connection

Compressed air consumption 550 st. l/min (2 x C&P* / TH**)700 st. l/min (3 x C&P*)

Particle size 0.1 µm

Particle density 0.1 mg/m³

Maximum oil content (class 1) Particle density 0.01 mg/m³

Pressure dewpoint (class 4) Dewpoint + 3°

33

Technical DataConnections

Compressed air connectionSMEMA / SIEMENS interface

PC an

d LAN

conn

ection

Power connector5 x 6 mm² cable with CEKON plug 5 x 32 A (3 x 208 VAC / 3 x 230 VAC)

5 x 4 mm² cable with CEKON plug 5 x 16 A (3 x 380 VAC / 3 x 400 VAC / 3 x 415 VAC)

34

Technical DataDimensions and Set-Up Conditions

* The load per unit area calculation included an additional working space of 0.5 m on each side of the machine. Additional data on request.

Lengthwith both extension kitswith one extension kitwith no extension kits

2380 mm2103 mm1826 mm

Width of the basic machinewith component changeover table docked(locations 1 + 4)with component changeover table docked(locations 2 + 3)including monitors

2515 mm

2810 mm

2382 mm2831 mm

Weight of the machine with component changeover tables fully equipped with feeder modules

3826 kg4153 kg

Footprint 6.70 m²

Load per unit area *) 5.83 kN/m²

Height of the machinewith warning lamp with folded-up protective covers

max. 1974 mm1990 mm (PCB conveyor height: 830 mm)2060 mm (PCB conveyor height: 900 mm)2090 mm (PCB conveyor height: 930 mm)2112 mm (PCB conveyor height: 950 mm)

Machine ground clearance 120 mm (PCB conveyor height: 830 mm)190 mm (PCB conveyor height: 900 mm)220 mm (PCB conveyor height: 930 mm)240 mm (PCB conveyor height: 950 mm)

Maximum noise emissions 74 dB (A)

Room temperature between 15 °C and 35 °C

Atmospheric humidity30 to 75 % (no higher than 45% on average to prevent any possibility of condensation on the machine)

35

Technical DataDimensions and Set-Up ConditionsPlacement System’s Center of Gravity

36

Technical DataManeuvring RadiiMTC Dimensions and Set-Up Conditions

37

Engagement point for the fork-lift

Engagement point for the fork-lift

Technical DataTransport and Delivery Configuration

Transport dimensions and weight

Means of transport

A fork-lift truck with the following specification will be needed to carry the machine in its crate:

LengthWidthHeight

2404 mm2790 mm1600 mm

Weight 4000 kg (dispatch within Europe)4500 kg (dispatch overseas)

Fork lengthLifting powerClear fork width

min. 1800 mmmin. 6000 kgmin. 350 mm

Description

The placement machine is supplied in a wooden crate, mounted on a stable wooden pallet.

Configuration when delivered

• The extension kit on the PCB input side and the computer unit are discon-nected from the basic machine.

• All electrical cables to the basic machine are discon-nected.

• Each track on the single or dual conveyor is set to a width of 136 mm.

• The input conveyors of the single and dual conveyor are dismantled. The electri-cal cables to the conveyor motors and light barriers are disconnected.

• Both keyboards are folded down vertically.

• The main fault indicator is dismantled.

38

Fine pit

Flip ch

t changeover 15 locations

Sample Configuration

Services

As a service, SIEMENS A&D EA can fully integrate the SIPLACE HF/3 placement machine into your produc-tion line. With our extensive expertise and by using the right tools and equipment, we can ensure that the instal-

lation process runs smoothly and efficiently. However, this will require you to clarify the infrastructure aspects in ad-vance and make any neces-sary changes at your production facility.

Safety instructions

Read the operating instruc-tions before starting to set up and commission the place-ment machine. The appli-cable accident prevention regulations concerning the transportation of heavy goods must be followed.

PCB transport direction

Nozzle changer C&P12

ch vision module

Nozzle changer C&P12

ip vision module

Componentable with

Component reject bin TH

Nozzle changer TH

5-part conveyor beltwith automatic width adjustment

from 50 mm to 508 mm (2“ to 20“)

Siemens AGElectronics Assembly Systems Rupert-Mayer-Strasse 44D-81359 MunichTel.: +49 - 89 - 208 00 - 278 19Fax: +49 - 89 - 208 00 - 366 92e-mail: [email protected]

Siemens Pte. Ltd.Electronics Assembly Systems The Siemens Centre60 MacPherson RoadSingapore 348615Tel.: +65 - 64 90 - 60 00Fax: +65 - 64 90 - 84 59e-mail: [email protected]

Siemens Electronics Assembly Systems Inc.3140 Northwoods Parkway, Suite 300Norcross, GA 30071, USATel.: +1 - 888 - SIPLACEFax: +1 - 770 - 797 - 30 94e-mail: [email protected]

SiemensElectronics Assembly Systems Ltd.20F Majesty Building, No.138Pu Dong Avenue, Shanghai P. R. China 200120Tel.: +86 - 21 - 58 87 - 30 30Fax: +86 - 21 - 58 87 - 61 00e-mail: [email protected]

The information in this brochure is merely a general de-scription and lists performance features that will not necessarily be present as described in the specific appli-cation, or that may be modified if the product is further developed. The desired performance features are only binding if expressly agreed when the contract is conclud-ed. All technical data according to our Scope of Service and Delivery.

We reserve the right to make changes.

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SPECIFICATION SIPLACE HF/3 SPECIFICATION - Tekmart€¦ · Single Conveyor 18 Technical Data for...

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