Space Cowboys
description
Transcript of Space Cowboys
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Space Cowboys
University of WyomingKyle Fox, Sean King, Erich Lichtfuss,
Jeff Parkins, Anne-Marie Suriano
Progress Design Review
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Overview• Mission Overview• Subsystem Requirements• Special Requirements• Block Diagrams• Schematics• Activity Diagram• Parts List
• Test Plans• Canister Guidance• Canister Shared Logistics Plan• Management• Issues and Concerns
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Mission Overview• Objective
– Accurately measure flight parameters including ambient and skin temperatures, pressure, acceleration, spin rate, and magnetic field.
– Gain basic understanding of design requirements and associated hurdles for designing in real-world space applications.
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Mission Overview• Goal
– Provide an accurate base of flight parameters to model rocket flight conditions and patterns for assessment of associated affects on other systems.
– Attain real-world design experience.
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Mission Overview• Underlying Science/Theory
– Recognition of magnetic field changes associated with altitude
– Quantification of varying flight parameters– Attempt to determine rocket orientation using
post-flight accelerometer data
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Mission Overview• Previous Related Experimentation
– Previous flights have included multi-sensor packages
– Results provide a basis for improvement on future data collection
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Mission Overview• Mission Requirements
– Multipoint Temperature Monitoring– Pressure Monitoring – 3-Axis Accelerometer Monitoring– Humidity Monitoring– 3-Axis Gauss Meter
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Mission Overview• Success Criteria
– No mechanical failure of structure– No electrical failures in system– Clear and accurate data stored
• Allows for analysis• Easily organized and identifiable
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Mission Overview• Benefits
– Other experiments on the rocket• Accurate flight data
– Future rocket flights and teams• Accurate flight data• Clear identification of extreme parameters for more
efficient design• Multi-sensor platform that allows for expansion to add
future sensors and experiments as desired
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Subsystem Requirements• Subsystems
– Power– Sensors– Command & Data Handling– PCB– Support Structure
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Subsystem Requirements• Power
– Payload will consume 1.2 amps under peak conditions• See next slide for peak power usage breakdown
– Batteries will provide peak current for 1.5 hours– Two 3.6V Batteries will operate in series to provide 7.2V– Voltage regulation will be performed on the main board
and will negate effects of temperature and voltage variations of the batteries during discharge
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Subsystem Requirements• Peak Power Usage Breakdown
Part Power UsageMain Processor ~200mA @ 2.5V and ~300mA @ 5.0vSub Processor ~170mA (x2) @ 5.0vAccelerometer ~0.12mA (x2) @ 3.3vTemp & Humidity Sensor ~1mA (x2) @ 3.3vPressure Sensor ~0.5mA @ 3.3vPressure Sensor Oscillator ~220mAMagnetic Sensor ~0.5mA @ 3.3vData Storage Memory ~100mATotals: ~1.2 amps
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Subsystem Requirements• Sensors
– Main board accelerometer will be located on the center axis of payload canister
– Each sensor requires specific sampling intervals and returns specific sample sizes
• Command & Data Handling– Code must be extremely robust with excellent error
handling capabilities
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Subsystem Requirements• PCB
– Multilayer construction focusing on noise mitigation and ease of future expansion
• Support Structure– Maximize strength, minimize mass
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Special RequirementsSupport Columns
University of Minnesota may only be willing to allow Option 1
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Block DiagramsMain Sensor BoardMain Sensor Board
Power Source (Li Ion Batteries)
Main Microprocessor(FreeScale:
MC9S12XDP512MAL)
µSD Data Storage Memory Card
3-Axis Accelerometer(VTI: SCA3000-E05)
Humidity and Temp Sensor
(Sensirion: SHT15)
Pressure Sensor(Hope RF: HP03)
CAN Data and Power Supply Interface to Peripheral Boards
RBF PinMechanical G-Switch & Latch Circuit
Color KeyDataPower
Data + Power5.0 v and 3.3 v
Voltage Regulators
I2C
I2C
SPI
Unused I/O for Future Development
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Block DiagramsPeripheral Board #1:
Skin Temperature and Off-Axis Acceleration Measurement
Color KeyData
Power
Data + Power
Peripheral Board #1
Sub Microprocessor(Microchip Technology: DSPIC30F401230ISO)
CAN Data and Power Supply Interface to Main Board
Humidity and Temp Sensor (for Side of Can)
(Sensirion: SHT15)
3-Axis Accelerometer(VTI: SCA3000-E05)
I2C SPI
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Block DiagramsPeripheral Board #2:Magnetic Field Measurement
Color KeyData
Power
Data + Power
Peripheral Board #2
Sub Microprocessor(Microchip Technology: DSPIC30F401230ISO)
CAN Data and Power Supply Interface to Main Board
3-Axis Gauss Sensor(PNI: MicroMag3)
SPI
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Batter & Power Schematic
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Main Board Schematic
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Peripheral Board 1 Schematic
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Peripheral Board 2 Schematic
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Activity Chart
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• The Payload will operate with a Real Time Interrupt Driven Operating System
• The Operating System will have extensive error handling capabilities including multiple sensor failures
• The Operating System will be constructed to allow easy modification and expansion as required by future missions
Operating System
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• The Main Board will communicate with all satellite boards via a CAN bus Interface
• CAN has the ability to address over 110 devices
• CAN provides 1MB/s throughput• CAN is commonly available and very
inexpensive
CAN bus interface
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Satellite Boards BandwidthSensor Sample Size(bits) Sampiling Interval(Hz) Bandwidth(B/s)
VTI SCA3000-E05 16 200 400
SHT15 (Humidity sample) 14 0.13 0.22
SHT15(Temp sample) 12 0.20 0.3
MicroMag 3 16 2000 4000
Total Peak CAN Throughput (KB/s) 4.30
CAN Bandwidth Utilization (1MB/s peak) 0.42%
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• MicroSD will be implemented for project storage
• MicroSD is inexpensive and is available in high data densities on a small footprint
• MicroSD provides 3MB/s throughput• MicroSD offers an 8-bit data path over SPI
MicroSD Main Board Storage
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SensorNumber of Sensors
Sample Size(bits)
Sampiling Interval(Hz)
Total Bandwidth(B/s)
Total Mission Memory (MB)
VTI SCA3000-E05 2 16 200 800 2.747SHT15 (Humidity sample) 2 14 0.13 0.4375 0.002SHT15(Temp sample) 2 12 0.20 0.6 0.002MicroMag 3 1 16 2000 4000 13.733HP03 1 16 35 70 0.240Total Memory Requirement (MB) 16.72Total Memory Bandwidth (KB/s) 4.76Total Memory Bandwidth Utilization (1MB/s peak) 0.46%
Main Board Bandwidth
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• Temperature– Sensirion SHT15– Temperature is measured on both the Main Board
and a single Satellite Board for approximating skin temperature
– Resolution: 0.01C– Accuracy: +/- 0.3C– Response Time: 5s
Sensor Package
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• Relative Humidity– Sensirion SHT15– Humidity is measured on the Main Board– Resolution: 0.05 %RH– Accuracy: +/- 3.0 %RH– Response Time: 8s
Sensor Package
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• Accelerometers– VTI SCA3000-E05– Three axis acceleration is measured along the
center axis and inner edge of payload canister– Resolution: 0.002g– Accuracy: +/- 2.0 %– Response Time: 200Hz
Sensor Package
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• Magnetic Sensor– PNI MicroMag 3– Magnetic field is measured on peripheral board #2– Resolution: 0.015µT– Response Time: 500µs
Sensor Package
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• Pressure Sensor– Hope RF HP03– Pressure is measured on the Main Board– Resolution: 0.1 hpa– Accuracy: ± 0.5 hpa– Response Time: 35ms
Sensor Package
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• Structure– Developed mathematical models
• Basis for initial design• Reviewed by ME professor
– Research of Materials• Extensive properties list determined• Basic materials analysis performed
Analysis
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Support Column3D Schematic Drawings
(Left) Non-deformed 3D
Mesh
(Right) Scaled Deformation 3D
Mesh (20 G vertical load, 10G
Lateral Load)
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• Electrical – Code verification will be completed in the
CodeWarrior Development Environment– Hardware verification will be completed by a
series of tests TBD• Structure
– Vibration testing will be completed at a local businesses 2-axis vibration table
– Spin Stabilization Testing will also be conducted at local business using a spin table
Testing
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Testing
• Full Package Testing– Environmental Testing using previous RockSat
flights data as a reference – Possible Weather Balloon Launch. Local Civil Air
Patrol Squadron has offered to run our package as a payload for a future weather balloon launch.
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Testing
• Potential Points of Failure– Electrical
• Contact to data storage card• Electrical connection breakage during high Gs• Unforeseen code interruption due to interference
– Mechanical• Bolt thread shearing • Vertical supports buckling• Tray malfunction
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Major Structural Components• Makrolon (Tray Material)
– Bayer• Properties are known (www.MatWeb.com)• Price & Availability known
• Aluminum (Support Columns & Circuit Mounts)
– Provided by University of Wyoming Engineering Machine Shop
• Properties known• Prices & Availability known
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Major Electrical Components• Parts List
– See file “Parts List.docx”• Lead Times
– 1.5 Weeks• S+H
– $50 in addition to listed part costs
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RockSat Payload Canister User Guide Compliance
• Mass/Volume– Estimate 3lbs
• Payload Activation– G-switch activation
• Open circuit until g-switch activation
• Rocket Interface– RBF/Shorting wires
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Shared Can Logistics Plan• University of Wyoming (UW) & University of
Minnesota (UMN)• UW Missions
– Multi-sensor: Rocket flight parameter measurements– Good Vibrations: Explore rocket flight effects on
electrical and crystal oscillators• UMN Mission
– To characterize the flight of the rocket and attempt to record data using techniques untested in suborbital flight.
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Shared Can Logistics Plan• Interfacing Collaboration Plan
– E-mail and phone conferencing– Exchange of 3D modeling suggestions– Full assessment and agreement on location,
structure and interface• Structural Interfacing
– Still to be determined– Positioning has been discussed
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Management• Project Schedule
– See attachment• Preliminary mass/monetary budgets
– Mass Budget: 3lb (Multi-Sensor)– Budget: approx. $750
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Conclusions• Issues/Concerns
– Structural Interface with other Payloads within Canister
– Electrical Interference from Payloads and External Radiation