Space Coast Chapter Meeting held at Mack Technologies, FL

V O L U M E 5

I S S U E 2

I N S I D E T H I S I S S U E :

Chapter Mtg & Interview 1, 5

Technical Article 2-4

Meet an Officer 6

GLOBAL

PARTICIPATING

MEMBERS Henkel Electronic Materials LLC

The Space Coast Chapter of the

SMTA held a local meeting on

9-12-13. The topic was Ad-

vanced SMT Rework methods.

The meeting was graciously

held at Mack Technologies in

Melbourne Florida. Lunch, and

refreshments were served.

The meeting was attended by

29 guests and the three subject

matter experts; Mike Newman,

Todd DeZwarte, and Larry Hin-

kle. The audience was made up

of over 20 technology compa-

nies from the local chapter, in-

cluding Harris Corp., Rockwell

Collins, DRS, Mack Technolo-

gies, Test Medics and MC As-

sembly.

The meeting opened with Brad

Latraverse, A board member of

the SC SMTA, introducing the

panel of Subject matter experts.

An overhead presentation was

used to convey a collaboration

of specific topics and tech-

niques previously prepared by

the panel.

Each of the subject mater ex-

perts shared their experiences

and best practices, as Brad led the

panel through the topics. A few

minutes into the meeting the audi-

ence began to direct some of the

discussion by sharing their applica-

tions, challenges and experiences.

The conversations continued on for

the next 45 minutes as the panel

fielded more and more questions

from the audience. As the allotted

time began to run short, the meet-

ing was concluded with announce-

ments of upcoming SMTA local

and international events.

Space Coast SMTA conducts interview at Eastern Florida State College

As part of the ongoing effort to create a SMTA

local student chapter, Mark Leyden from R.S.

Hughes conducted an interview with Mark Ed-

wards, Adjunct Electronics Instructor

and Susie VanMeter, Director of Corp Services

& Workforce Training.

Susie and Mark, thank you for having me

this morning. So tell me how BCC, now East-

ern Florida State College, got started and

when did it recognize that there was a need

to train folks in the electronics industry?

Mark: I know from the very beginning they had

an electronics course for technicians and for

engineers. In the days of the Apollo program,

there was a need for people to be skilled and

have training in the do’s and don'ts's of working

around flight hardware; especially electronics.

The circuitry for aerospace had to be very pre-

cise and exact and reliable, highly reliable.

Maxwell King, the guy who started the college,

realized that there was a definite need here for

that.

Ok, so Aerospace really was the initial driver

for this college? Mark: I would say so. Susie:

The Space Tech Program was begun here and

we would train technicians to work on the rock-

ets and they would learn everything there was

to do. It turns out there are a lot of companies in

Brevard County that could use many of the

skills that these technicians learned, not just for

space. And that’s what carried a lot of them

from layoff to jobs. Transferable skills.

So where are we now?

Susie: EFSC has the highest graduation rate

among community colleges in Central Florida.

In 2010, the college reported over 25,000 stu-

dents enrolled for courses. It’s ranked 19th in

the 1,200 community colleges in the nation.

That is phenomenal.

What is EFSC doing to get that high a grad-

uation rate? Mark: Paying attention to the stu-

dents. There’s a lot of mentoring that goes on at

EFSC also. Susie: This college has always done

an outstanding job in advertising and being also

highly recognized in our training and skills

from everything from training through degrees.

CORPORATE MEMBERS

Continued on Page 5

AV Repair Concept 2 Market, Inc. Conelec of Florida, LLC Control Micro Systems, Inc. DiagnoSYS Systems, Inc. Florida MicroElectronics Harris Corporation Inovaxe Corporation Mack Technologies MC Assembly Mercury Marine EPM Rockwell Collins Semipack Services, Inc. SolTec Electronics Stanley Supply & Svces. STARboard TECHnology Symetrics Industries, LLC The Jefferson Project Tropical Stencil, Inc.

J A N U A R Y , 2 0 1 4

ELECTRONIC ASSEMBLY

CLEANING MATERIALS

Electronic assembly cleaning material

options cover three classes that in-

clude solvent, co-solvent, bi-solvent,

semi-aqueous, and aqueous composi-

tions. During the pre-ozone depletion

era, CFC-113 and rosin-based flux

compositions were the standard. In

today’s environment, the cleaning

agent of choice is selected based on

the soil to be cleaned, throughput,

readily-available cleaning equipment,

compatibility with materials of con-

struction, cost, and environmental

regulations. All cleaning material

types comprise strengths and weak-

nesses. In most cases, the application

drives the cleaning material type.

Best in Class Cleaning Agents

Electronic assembly cleaning materi-

als are designed to remove a broad

array of flux technologies including

organic acid, rosin, resin, and poly-

meric structures from mixed technolo-

gy circuit boards.

The building blocks (Figure 8) used to

formulate best in class cleaning agents

are solvency to dissolve resin struc-

tures; reactive agents to buffer and

saponify soils; wetting agents to lower

surface tension and improve penetra-

tion under low standoff components;

and minor ingredients to improve ma-

terials compatibility and control foam

propagation under high pressure.

Oxygenated organic materials dissolve

rosin and resin (solute) structures nat-

urally present in many flux types. The

interaction of resin/rosin with solvent(s)

increases the dissolution rate (Figure 9).

Solvents are selected on the basis of

“like dissolves like” commonly re-

ferred to as the solvated state, where-

by organic resin flux residues are dis-

solved by oxygenated solvent mole-

cules. Solvent dissolution is a kinetic

process and is quantified by its rate.

The rate of dissolution depends on the

solvent and solute, temperature,

impingement pressure, and interfacial

surface tension.

For electronic assembly defluxing, the

solvent materials interact with the

polar solvent, water. Dissolving the

flux residue involves different types of

intermolecular interaction: hydrogen

bonding, polarity and dispersive at-

tractions. The hydrogen bonding, ion-

dipole, and dipole-dipole interactions

occur from the water and water’s in-

teraction with oxygenated solvents

(Figure 10). The oxygenated solvents

interact with water to improve dissolu-

tion of organic acid ions necessary to

leave an ionically clean assembly.

For aqueous cleaning fluid designs,

mild alkalinity provides two im-

portant functions: 1. Improving the

cleaning rate and 2. Maintaining a

consistent pH by forming a strong

buffer. Rosin, commonly used in flux

compositions, is a solid form of resin

obtained from pine trees and some

other plants. To improve the cleaning

rate, alkaline materials are used to

react (saponify) with the rosin/resin

to increase the rate of

dissolution (Figure 11). Additionally,

the alkaline source is used to react

with a weak acid to form a buffer that

keeps the pH at a nearly constant val-

ue. An optimal pH range of 9-11 pre-

vents redeposition of flux soils and

ionic constituents onto the circuit

assembly after the cleaning process.

Wetting agents lower the surface ten-

sion of the cleaning fluid, by reducing

the droplet size, improving spreading,

and lowering the interfacial surface

tension. Surface active agents form

micelles that contain a lipophilic end

to dissolve oily soils and hydrophilic

ends to hydrogen bond with water.

Wetting agents reduce surface tension

of water by adsorbing at the liquid-

gas interface (Figure 12). These mate-

rials reduce the interfacial tension

between oil and water by adsorbing at

the liquid-liquid interface. When mi-

celles form in the cleaning solution,

their tails encapsulate an oil droplet,

and their ionic polar heads form an

outer shell that maintains favorable

contact with water. Wetting agents

improve penetration under the Z-axis

to remove flux residues under compo-

nents.

Strategies for Addressing White Residue

and Localized Contamination (Part 2)

P A G E 2

Continued on Page 3

By Mike Bixenman, Phil Zhang, Chris Shi

Figure 9: Like Dissolves Like

Figure 10: Solubility of the Flux Residue

Figure 11: Flux Dissolution Driven by Reactivity

for improved mechanical and chemi-

cal energy. The objective mechanical

cleaning systems is to reduce time by

using by maximizing the physical

energy delivered at the surface to be

cleaned.

Fluid management is critical in main-

taining an electronic assembly clean-

ing process. Individual module con-

tainment and specifically with the

wash chemistry is essential. Fluid de-

livery is critical for penetrating and

rapidly breaking the flux dam under

low standoff components. Air man-

agement is critical to reducing chemi-

cal odors in the workspace while min-

imizing the amount of wash fumes

exhausted from the machine. Fluid

storage is critical for long wash bath

life. Fluid control is critical in main-

taining the proper wash bath concen-

tration within the cleaning process

tolerance.

Cleaning equipment design issues in

any of these areas can and will upset

the cleaning process over time. Issues

such as high wash consumption, steam

out of the machine, foaming in the

wash and or rinse, exhaust losses, and

poor cleaning all result from an imbal-

ance caused by one or more of these

factors. Process issues may not show

up when the machine is initially

charged with cleaning chemistry and

started up, but slowly creep in over

time. Lack of process optimization

results in higher defect rates, which

typically render white residue for-

mation and unacceptable levels of

ionic residues on the surface and un-

der component gaps.

To improve cleaning under low stand-

off components, research data indi-

cates that fluid flow, pressure at the

board surface, directional forces, and

time in the wash improve the process

cleaning rate. The wash section of the

cleaning machine is highly important.

Research data findings indicate that

flux not adequately removed in the

wash will not be removed in the rinse

sections. Cleaning data studies show

that high levels of fluid across the

board surface decrease needed clean-

ing time. Directional forces that pro-

vide a 360° impingement pattern dur-

ing the wash exposure decreases time

in the wash. Maintaining pressure

with flow also decreases the amount

of time required in the wash section.

Wash impingement effects can be

generated using various nozzle and

pump technologies. To improve

cleaning efficacy, boards are initially

sprayed in the pre-wash section using

fan jets. The pre-wash zone brings the

circuit card up to process tempera-

ture, which starts the flux softening

process. In the wash section, nozzle

jets provide uniform wash coverage.

Board geometry, density, and compo-

nent types are impinged upon using a

combination of nozzle technologies

that provide various levels of fluid

flow, pressure at the board surface,

and directional forces. Printed circuit

boards with increased density and

component shadowing require a long-

er wash time to allow wash fluid to

penetrate blind gaps.

To remove all flux residues under

gaps less than 2 mils, time in the

wash and wash temperature are criti-

cal parameters. The wetting effects of

flux during the reflow soldering pro-

cess cause the flux to penetrate under

small component gaps and create a

flux dam (Figure 14). To break the

flux dam, the cleaning fluid and im-

pingement energy must first dissolve

the residue to create an opening for

the wash fluid to flow under the com-

ponent. Hard flux residues take long-

er time to dissolve than do soft flux

residues, which increases wash com-

plexity. The static cleaning rate

(dissolution in the absence of im-

pingement energy) of the wash chem-

istry is driven by the cleaning materi-

al compatibility with flux soil, rate of

dissolving the flux soil, concentra-

tion, part fixturing, and wash temper-

ature effects. The cleaning material

static cleaning rate may vary on dif-

ferent flux residues. To address these

complexities, best in class cleaning

material designs are formulated to

work on most flux residue types, but

the rate varies for both hard and soft

flux residues, with the key variable

representing the length of the wash

section, the nozzle design, and wash

time.

P A G E 3 Cleaning, from Page 2

Minor ingredients formulated into the

cleaning agent address two important

functions: Control wash bath foam

when processing in high pressure

equipment and decrease the rate of

metal alloy corrosion. Foam is a sub-

stance that is formed by trapping

many gas bubbles at the liquid inter-

face. Rapid turn over of the wash tank

and high pressure jets create a condi-

tion to trap and grow gaseous tight

foam. To break or retard foam, anti-

foaming agents are added to the engi-

neered composition to inhibit foam

formation (Figure 13).

The second class of minor ingredients

includes materials that decrease the

corrosion rate of tin, lead, aluminum,

and yellow metals. Alkaline saponi-

fied cleaning materials chemically

react with soft metals. Corrosion in-

hibitors form a passivation layer - a

thin film on the surface of the alloy(s)

that stops access of the corrosive sub-

stance to the metal. Properly designed

cleaning agent inhibition packages

reduce

oxidation and reduction reactions.

Solder joints, aluminum heat sinks,

anodized aluminum and copper are

protected from exposure to the clean-

ing media

Cleaning Equipment

Cleaning equipment designs are cate-

gorized into two classifications: batch

and inline. Increased complexity of

board and component geometry cou-

pled with more difficult solder paste

and flux formulations, drives the need

<90 >90

Figure 12: Wetting

Figure 13: Controlling Foaming

Continued on Page 4

P A G E 4 V O L U M E 5 I S S U E 2

Controlling the Wash Process

As cleaning complexities increase, the

cleaning process window narrows.

Wash bath consistency over time is

critically important. High energy

cleaning machines drive with pres-

sure, heat, and fluid flow. Fluid losses

in the wash must be monitored and

controlled to assure consistency over

time. Lack of wash tank control leads

to cleaning agent depletion and even-

tually to incomplete cleaning The

chemical wash tank has a critical soil

loading level at which cleaning will

drop off. As flux soils load into the

wash tank, the level of soil will in-

crease over time. Additionally, wash

tank fluid will be lost over time to

exhaust and drag-out. To maintain

control between the upper and lower

design limits, additional cleaning ma-

terial will need to be added when the

wash tank is replenished. Failure to

add cleaning material when replenish-

ing the wash tank with water will re-

duce bath life. Adding wash chemistry

at optimal levels will extend bath life

and assure cleaning consistency over

time (Figure 15).

Bath Life Simulation

To maintain wash bath consistency

over time, programmable logic pro-

cess control units are design to moni-

tor the wash bath (Figure 16). As wa-

ter is added, cleaning chemistry is also

added to a preset concentration level.

The process control unit monitors the

concentration of cleaning chemistry

and water within the upper and lower

pre-set requirements.

Properly controlled wash baths reduce

variation and consistency for cleaning

leading edge designs.

Process Integration

Cleaning process optimization re-

quires a balanced of chemical and

mechanical effects. The job of the

cleaning material is to remove flux

residue and ionic contaminants. As

previously discussed, aqueous clean-

ing material designs contain reactive

materials at various concentration

levels. On certain flux types, higher

reactivity increases the static cleaning

rate, but can cause other issues. When

cleaning flux residue under low stand-

off components, longer wash time is

needed. Highly reactive cleaning ma-

terials create several compatibility

concerns in the form of solder joint

attack, anodized aluminum attack, dry

film solder mask removal, part mark-

ing removal, component attack,

polymer/adhesive attack, and a range

of other issues. Highly reactive clean-

ing materials saponify rosin, which

can create a foam condition as the

wash bath loads.

Best in class cleaning materials exhib-

it other important properties. The va-

por pressure of each material used in

the compositional make-up influences

evaporative loss rates. The dissolution

rate on higher molecular weight resin

structures used in low residue and lead

-free flux compositions influences the

static cleaning rate. The rate of clean-

ing material solvency in water can

influence the cleaning rate and

defoaming properties. The cleaning

material wetting forces is critical to

penetrating low standoff gaps. Proper-

ly designed, the cleaning material rap-

idly dissolves rosin /resin structures,

wetting low standoff gaps, inhibits

solder joint attack, overcomes compat-

ibility concerns, works at low concen-

trations, and provides long bath.

The cleaning machine design is equal-

ly important. Fluid management is

critical in maintaining an economic

cleaning process. Individual module

containment and specifically with the

wash chemistry is essential. Fluid de-

livery is critical for penetrating and

rapidly breaking the flux dam under

low standoff components. Air man-

agement is critical to reducing chemi-

cal odors in the workspace while min-

imizing the amount of wash fumes

exhausted from the machine. Fluid

storage is critical for long wash bath

life. Fluid control is critical in main-

taining the proper wash bath concen-

tration within the cleaning process

tolerance.

CONCLUSION

Leading edge circuit board design

failures are attributed to feature size

reduction, which increases the risk of

defects randomly induced by process

flaws. Cleaning processes take on a

whole new cleaning definition of re-

moving residue that can be seen visu-

ally and residue entrapped under com-

ponents that is commonly out of sight.

Cleaning process optimization re-

quires a balance of chemical and me-

chanical effects. Best in class cleaning

materials remove a wide range of flux

materials, decrease droplet size, ex-

hibit wide material compatibility, sta-

ble under pressure, and support pro-

cess control. Best in class cleaning

machines offer fluid management,

fluid delivery, air management, fluid

storage, and fluid control. The sum of

the parts must be integrated and con-

trolled.

♦ Dr. Mike Bixenman is the CTO of

Kyzen Corporation.

♦ Phil Zhang is Kyzen’s territory man-

ager for NorthernChina.

♦ Chris Shi is Kyzen’s territory man-

ager for Southern China.

Figure 14 Impingement Needed to Break Flux Dam

Figure 15: Bath Life Simulation

Figure 16: Process Control System

Continued from Page 3

P A G E 5 V O L U M E 5 I S S U E 2

Continued from Page 1

Mark: The board of directors and original founders knew what

they were doing and knew what was needed. They must have

brought in some good people to get it all set up right.

What specific departments are there that are training folks

to go into the various fields of the electronics industry?

Mark: This department, which is Workforce Training and devel-

opment. Technical and Professional Workforce Training. Right,

so part of it is IPC training and we get into basic soldering, cir-

cuit board repair, crimped cables and harnesses, as well as in-

spection capability. For inspectors on how to inspect the soldera-

bility of a board or something like that. What’s the default? Does

it meet the IPC requirements? IPC is a nonprofit organization,

worldwide, and they support the ISO 9000. So companies who

want government contracts that are ISO, their technicians have

to be somewhat certified in soldering, circuit board repair, in-

spection, there’s some different ones right now, and they’re get-

ting more. They’re talking about adding fiber optics in the very

near future. Susie: The college

found out that this was important

to companies in Brevard County

and that’s where I come in with

Corporate Services. We go to com-

panies and write specific custom-

ized contract training. If something

is a semester course, and they only

want certain things out of it, we

can customize it to meet the com-

panies’ needs. We go into the com-

pany itself and many times we’ll

hold the training on site so that the

employees don’t lose time travel-

ing to and from their worksite to

get the training. It’s been very suc-

cessful.

I see you teach everything from fiber optics to ESD aware-

ness, to composites inspection, this is amazing! I know a lot

of companies who could benefit from this. I’m not sure if

they’re aware of this yet, but they should be. Susie: Some-

times it’s the best kept secret in Brevard County. Mark: These

are IPC members by location all over Florida; United Launch

Alliance, Lockheed Martin, MC Assembly and many others.

This is great, you guys are really getting integrated in the

community. Now someone who doesn’t have the job yet but

wants to get certified so they can have credentials that will

help them get hired? Mark: Right, oh yeah big time.

And that’s separate from a current full-time enrolled student

with the college already? Susie: Yes because these are non-

credit courses. This whole area is non-credit, so it’s skill build-

ing. Mark: You have a whole phenomenal choice of career fields

now. And all of them are precision and all of them are very ex-

act. You just have to find something you like. In some cases, you

can work your way through it, and become an apprentice, and

your employer may help you pay for your college and your de-

gree. But it’s up to you. You have to be motivated, they’re not

going to come up and hand it to you on a silver platter.

As you know, over the last 10-15 years, a lot of manufactur-

ing has been outsourced overseas to China. Thankfully,

we’re starting to see some of that come back. But it does look

like in some areas of manufacturing, we’re still not as com-

petitive as we need to be. To the point where, the last five

manufacturing engineers hired from a large defense technol-

ogy company in Brevard County were picked up in Puerto

Rico. They’re not even looking in our local area as often as

they used to. That’s kind of sad. Why do you think that is?

Mark: Basically it comes down to one word and I hate to say it

but society has demotivated a lot of our kids, they’re spoiled.

They are used to having everything given to them, and they

don’t want to work for it.

So you don’t think it’s that the per-

ception of a career in manufacturing

has been tarnished in the public eye in

favor of more white collar-type jobs?

Mark: No not in America. Because even

in the early 1900’s and 1920’s, it was

pretty industrialized but people back

then worked, they wanted to work. We

had immigrants from all parts of the

world coming into the United States.

People were motivated because they

came from Europe where there was pov-

erty, people were starving to death. The

WWII motivated everybody, and we had

prosperity basically all the way up to the

1980’s and 90’s. The economy was go-

ing like crazy. But kids today, it’s not

that they don’t have a clue, but its hard to get them to find out

what they really want to do. But you know what, I’m so glad to

see the industry that’s moving into the Melbourne Airport area

and even here in Cocoa as well.

How can the local Space Coast Chapter of the SMTA help

motivate kids to be excited about the industry? Susie: I think

spreading the word to companies that could use the training to

let them know that we’re here and available. I think going to all

of the high school fairs and career days and they would welcome

you at any one of those. Kids need to see examples of the elec-

tronics in real world products used in their lives.

So just being aware of those real world, locally-developed

technologies may be just the spark to get these kids heading

in the right direction and go on to leading the United States

back to the top. Thank you very much for your time.

Eastern Florida State College interview continued

Mark Edwards, Electronics Adjunct Professor outside the Vocational Training Building

Why join SMTA? To be affiliated with the leading industry or-

ganization for those involved in SMT and oth-er advanced packaging technologies To gain access to the top technologists and

experts in the industry To receive leading edge technical information To acquire information to help you stay com-

petitive

Membership Categories: Global - $ 1495

Corporate - $ 450

Individual - $ 75

Participating - $ 50

Associate (Student/Retiree) - $ 5

For more information go to www.smta.org

Highlight your company by advertising in the

SMTA Newsletter. Four issues are planned for each year

Contact Ken Lawrence for more information.

(321) 394-4143 - klawrence@macktech.com

One Issue:

Business Card: $25

1/4 Page: $50

Three issues:

Business Card: $50

1/4 Page: $125

Six issues:

Business Card: $100

1/4 Page: $200

ADVERTISING Space Available

SMTA Mission Statement We are an international network of

professionals who build skills, share practical experience and develop solutions in electronic assembly

Including micro-systems, emerging technologies, and related

business operations.

P A G E 6 V O L U M E 5 I S S U E 2

Upcoming SMTA EVENTS: February 19, 2014 11:00AM - Lunch Technical Meeting

A case study on automating the assembly pro-

cess of components traditionally hand soldered.

hosted by: Tom Borkes of the Jefferson Project

$20 Members $30 Non-members @

Mack Technologies, FL 7505 Technology Drive, Melbourne, FL

Meet a Chapter Officer Joan Carroll—Treasurer, Space Coast SMTA

It all began when

my family relo-

cated to the tech-

nology-rich town

of Huntsville,

Alabama from the

pre-technology

rich city of San

Jose, CA. After

graduation from

Auburn Universi-

ty with a B.S. degree in Marketing (War Ea-

gle) I went back to Huntsville to work for a

manufacturers’ representative company,

Advanced Components Marketing in a tem-

porary capacity while I searched for a “real”

job. Three months later I was hired as a full

time employee. Shortly after that I relocated

to Winter Park, FL and went to work for an-

other manufacturers’ representative company,

(thanks to networking), HHP Associates

where I stayed from 1991 through 2005. I

enjoyed my time at HHP enjoying consistent

growth year over year and winning several

sales contests which sent me to awesome trips

to Japan. In 2006 I left the industry to pursue

a career as a credit manager. I thought I

would actually be working in the world of

finance and managing credit with this UK

based company. In the electrical distribution

world, the title “credit manager” is code for

collection agent. If you have ever had any

experience with a credit manager I can almost

100% guarantee it was not pleasant. I never

thought I would miss the electronics industry

like I did. I truly missed meeting with engi-

neers, seeing new designs, specifying compo-

nents and working on manufacturing issues to

help make our parts fit into real products;

products that help people be it medical, indus-

trial and test equipment or military equipment

that directly assists our armed forces defend

our freedoms. In 2009, it was back to elec-

tronics with REStronics, another manufactur-

ers’ representative firm. This was different

than what I had known before: equipment,

manufacturing supplies and process related

issues. I knew I was right at home with this

national company: the great reputation of the

ownership and the support and resources for

their sales force. How had this whole world

existed while I was chasing down specifica-

tions for fans and switches? Five years later I

am still working in the manufacturing world

and loving it most of the time.

In my spare time I am a compulsive volun-

teer. Of course SMTA has been an awesome

experience working to provide meaningful

meetings and solutions for the problems that

keep our manufacturing partners up at night.

The friends I have met through SMTA have

been such a positive experience with my eve-

ryday work life and I feel very fortunate to

work with this exceptional group.

In the very early hours of the morning I lead a

marathon training group through a local run-

ning store program, Track Shack Marathon-

fest. I am up to 39 marathons completed in

18 states including most of the majors, New

York, Chicago, Marine Corp and Boston and

2 internationals, Quebec City and Berlin.

As a lady from the South, college football

has always been an important thread of my

life and I spend time as a volunteer on the

Associates Board and as a Bowl Scout with

Florida Citrus Sports. Also as a lady from the

South and my sorority days behind me, for

many years I have been a member of the Jun-

ior League of Greater Orlando, a wonderful

organization that really makes a difference

addressing needs in our local community. I

serve on other boards in the Orlando and

Winter Park communities. I am an active

member of the Cathedral Church of St. Luke

in downtown Orlando which is an awesome

place to worship; the clergy, congregation,

historical building and incredible music pro-

gram all make it great.

P A G E 7 V O L U M E 5 I S S U E 2

OFFICER LISTING

President: Eileen Hibbler (TEK Products) Phone: 321-355-8519 Email Address: ehibbler@tekproducts.com Vice President: Todd Barham (Kimball Electronics Group) Phone: 321-474-8393 Email Address: todd.barham@kimball.com Secretary: Jack Reinke (Kyzen Corporation) Phone: 404-290-6744 Email Address: jack_reinke@kyzen.com Treasurer: Joan Carroll (REStronics Florida) Phone: 407-670-8765 Email Address: jcarroll@restronics.com VP of Technical Programs: Brad Jon Latraverse (Harris Corporation) Phone: 321-729-3086 Email Address: blatrave@harris.com VP of Membership: Robert McGlynn (Tropical Stencil, Inc.) Phone: 561-745-7769 Email Address: tropicalstencil@hotmail.com VP of Publications: Ken Lawrence (Mack Technologies, FL) Phone: 321-394-4143 or 321-394-4118 Email Address: klawrence@macktech.com Student Chapter Chair: Angela Pichardo (Amptech Solutions) Phone: 321-821-8590 Email Address: angie12596@yahoo.com Publicity Chairperson (Appointed): Mark Leyden (R.S. Hughes) Phone: 561-762-4953 Email Address: mleyden@rshughes.com Board Liason & Technical Advisor (Appointed): Scott Nelson (Harris Corporation) Phone: 321-757-5078 Email Address: jnelso09@harris.com Technical Committee (Appointed): Michael Newman (Harris Corporation) Phone: 321-727-6163 Email Address: michael.newman@harris.com Technical Committee (Appointed): Brian Wright (MC Assembly) Phone: 321-608-4232 Email Address: bjwright@mcati.com Special Projects Committee Chair Jeanette deChantal (Lockheed Martin) Phone: 321-482-0973 Email Address: Jnet4@earthlink.net

“Calling all golfers”

2014 Winter Golf Classic February 7th, 2014

Duran Golf Club 8:30am Shotgun Start Scramble Format Trivia Contest ! $ 75 Per Player $300 Per Foursome

Call Eileen Hibbler (321) 355-8519 to reserve your spot.