Sony IMX400 Tri-Stacked Image Sensor - Home - …©2017 System Plus Consulting | Sony IMX400...
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21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr Sony IMX400 Tri - Stacked Image Sensor First stacked CIS with Logic, Memory and sensing die IMAGING report by Stéphane ELISABETH July 2017
Transcript of Sony IMX400 Tri-Stacked Image Sensor - Home - …©2017 System Plus Consulting | Sony IMX400...
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Sony IMX400 Tri-Stacked Image SensorFirst stacked CIS with Logic, Memory and sensing die IMAGING report by Stéphane ELISABETHJuly 2017
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Sony
o CIS Market Forecast
o New generation of CIS?
o Sony XZs Teardown
Physical Analysis 14
o Synthesis of the Physical Analysis
o Physical Analysis Methodology
o Module 17
Module Views & Dimensions
Module Opening:
Lenses, AF driver & Hall sensor, Plastic Filter
Module Opening: Wire Bonding, BSI, TSVs Process
Module Cross-Section :
Plastic Filter, Wire Bonding, PCB, FOV, Adhesives, FOV
o CIS Die 46
Pads, Pixels, Active Area Overview
Die View & Dimensions
Delayering:
Pixel Array, DRAM, Logic
Cross-Section:
Die Bonding, TSVs, Die Process
Process Characteristics
Physical Comparison 87
o History of Sony’s CIS
Module, Die area, PDAF, Pixel Area, TSVs
Manufacturing Process Flow 93
o Global Overview
o DRAM Front-End Process
o DRAM Wafer Fabrication Unit
o Logic Front-End Process
o Logic Wafer Fabrication Unit
o Pixel Array Front-End Process
o CIS Wafer Fabrication Unit
o DRAM/Logic Circuit Bonding Process Flow
o Pixel Circuit Process Flow
o Pixel Array/DRAM/Logic Circuit Bonding Process Flow
o Optical Process Flow
Cost Analysis 105
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o Circuits Wafer 110
Logic Circuit Front-End Cost
DRAM Circuit Front-End Cost
Pixel Array Circuit Front-End Cost
o Bonded Wafer 113
BSI & TSVs Front-End Cost
BSI & TSVs Front-End Cost per process steps
Color Filter & Microlenses Front-End Cost
Total Front-End Cost
CIS Back-End 0 : Probe Test & Dicing
CIS Wafer & Die Cost
Estimated Price Analysis 121
Company services 125
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodology
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology data, manufacturingcost and selling price of the Sony IMX400.
• This innovative CIS will be the next generation from Sony. The CIS included a 22 Mpixels array, a 1GbDRAM die and a Digital Signal Processing on the same die footprint. This is the first tri-layers stacked CISthat we can found on the market. In this configuration, Sony can provide a fast readout image sensor withno distortion when shooting fast-moving object thanks to the high capacity DRAM between the Pixel Arraycircuit and the DSP circuit.
• Using the Sony’s Exmor-RS and the Xperi’s Zibond technology, Sony managed to integrate the three dies ina single thin, small and cost-effective die sensor. Surprisingly, the die sensor a unique sort of TSV withmultiple level to interconnected the dies.
• This report includes a complete analysis of the Camera module from the Sony Xperia™ XZs, featuringcamera module disassembly and die analyses, processes and cross-section. It also includes a comparisonwith Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level,it compares the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, itcontains a complete cost analysis and a selling price estimation of the CIS die.
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 4
Overview / Introduction
Company Profile & Supply Chain o Sonyo Market Forecasto Next generation of CIS?o Sony XZs Teardown
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Sony XZs Opened view
Sony XZs Teardown
Sony XZs Top Flex PCB – Bottom View
Front CameraAmbient Light Sensor
Rear camera Module
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Synthesis of the Physical Analysis
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Physical Analysis Methodology
• Module is analyzed and measured.
• The module is opened to get overall dies data: dimensions, main characteristics, device markings.
o Pictures of selected area are made in order to understand the connections of the CIS.
o Cross section of Module to measure thicknesses and understand the assembly
• The CIS is separated to get overall die data: dimensions, main blocks, pad number and pin out, die marking.
o Removal of metal layers (step by step) to identify the dies and measure the minimum dimensions.
o Pictures of selected areas to identify the nature of the transistors.
o SEM photographs to measure the transistors dimensions.
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Module with Flex View & Dimensions
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Module Opening – Plastic Filter
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Module Cross-Section – Lenses
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
CIS Die – View & Dimensions
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
CIS Die – DRAM
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
CIS Die Cross-Section
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
CIS Die Cross-Section – Pixel Array
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
CIS Die Cross-Section – Pixel Array/DRAM Bonding
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
CIS Die Cross-Section – TSVs DRAM
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Moduleo Module Cross-Sectiono CIS Dieo CIS Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
CIS Die Cross-Section – TSVs Recap.
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Moduleo Die Areao PDAFo Pixel Areao TSVs
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
History of Sony’s CIS – Module
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Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison o Moduleo Die Areao PDAFo Pixel Areao TSVs
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
History of Sony’s CIS – TSVs
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Wafers Front-End Processo Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Global Overview
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Wafers Front-End Processo Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
DRAM/Logic Circuit Bonding Process Flow
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo Wafers Front-End Processo Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Pixel Array/DRAM/Logic Circuit Bonding Process Flow
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Circuits Wafer Costo Bonded Wafer & Die Cost
Selling Price Analysis
About System Plus
Logic Circuit Front-End Cost
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Circuits Wafer Costo Bonded Wafer & Die Cost
Selling Price Analysis
About System Plus
CIS Wafer & Die Cost
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Synthesiso Supply Chaino Yieldso Circuits Wafer Costo Bonded Wafer & Die Cost
Selling Price Analysis
About System Plus
Component Cost
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
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©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 26
COMPANYSERVICES
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2017 System Plus Consulting | Sony IMX400 – Tri-layer Stacked CIS 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Feedbackso Contacto Legal
Contact
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