Solution Based Hybrid Thermoelectric Material · Solution‐Based Hybrid Thermoelectric Material UC...
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Solution Based Hybrid Thermoelectric Material Solution‐Based Hybrid Thermoelectric Material UC Berkeley Lawrence Berkeley National Laboratory Lawrence Berkeley National Laboratory C2M Team Scientist C2M Team Asher Burns‐Burg, MBA 2012 Alic Chen, PhD Mech. Eng. 2011 Russell Griffith, MBA 2012 Scientist Shannon Yee, PhD Mech. Eng. 2013 Primary Investigators Prof Rachel Segalman PhD Russell Griffith, MBA 2012 Tapan Patel, MS Mech. Eng. 2011 Prof . Rachel Segalman, PhD Jeff Urban, PhD
Transcript of Solution Based Hybrid Thermoelectric Material · Solution‐Based Hybrid Thermoelectric Material UC...
Solution Based Hybrid Thermoelectric MaterialSolution‐Based Hybrid Thermoelectric Material
UC Berkeley Lawrence Berkeley National LaboratoryLawrence Berkeley National Laboratory
C2M Team ScientistC2M Team
Asher Burns‐Burg, MBA 2012 Alic Chen, PhD Mech. Eng. 2011
Russell Griffith,MBA 2012
Scientist
Shannon Yee, PhD Mech. Eng. 2013
Primary Investigators
Prof Rachel Segalman PhDRussell Griffith, MBA 2012 Tapan Patel, MS Mech. Eng. 2011
Prof. Rachel Segalman, PhDJeff Urban, PhD
• Technology Overview1
• Technology Overview
2• Market Selection
• Market Analysis and Attractiveness3
Market Analysis and Attractiveness
4• Recommendations and Path to Market
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Thermoelectric Technology
1. Heat Pump: Electrical power input drives heat flow.
2. Electric Generator: Heat flow drives electron flow.
Heat InputElectric Power InputHeat Ejectedj
+ ‐
~0.01 ‐ 2 mm
Electric Power Generated
Cooling3
Opportunity for Thermoelectrics
• 60% of primary energy is wasted as unutilized heat
• Solid state
• Heating / Cooling – and – Electrical Generation
But… historically not scalable:
eat g / Coo g a d ect ca Ge e at o
• Materials – Reliant on expensive Bismuth Telluride
• Manufacturing – Complex and expensive process
Result: Extremely High $/W Niche Applications
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Luxurycar seat
Deep space probe
Our Technology
Solution‐Based Hybrid Thermoelectric
• Tellurium nanowires coated in a conductive polymer (PEDOT:PSS)
• Material Produced in Water Printable!
PrintingPrinting
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Our TechnologyStrengths
‐ Low production cost( i ti )
Weaknesses‐ Material degradation @
250OC(printing)‐ Material properties allow optimized performance
> 250OC
Opportunities‐ Flexible
Threats‐ Cost of PEDOT:PSSFlexible
‐ Transparent‐ Potentially No rare earth
l t
Cost of PEDOT:PSS‐ Material not field tested degradation unknown
elements‐ Cost effective at lowtemperatures (25OC–200OC)
‐ Scalability
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Thermoelectric Product CostsEstimated Cost Structure of a Thermoelectric Product
Traditional Bismuth Telluride Thermoelectric Device
Materials ˜17%
Manufacturing˜17%
Balance of System approx. 33%
Fixed Costs approx. 33%
Traditional Bismuth Telluride Thermoelectric Device
C S i ˜30% f l f d
Our Technology
Cost Savings ˜30% of Bi2Te3 device cost
Balance of System(application dependent)
Fixed Costs (organization dependent)
Although materials and processing cost advantage is understood, BOS and Fixed
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costs are more difficult to quantify. However, cost advantage still remains!
Thermoelectrics Landscapege US
ure Ra
n
0˚C
mpe
ratu 200
Tem
20˚C
Bulk Elements Thick Film Thin Film
8Ferrotec, Inc. Glatz et al (2009) Micropelt, Inc.
• Technology Overview1
• Technology Overview
2•Market Selection
3•Market Analysis and Attractiveness
3y
4• Recommendations and Path to Market
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Market Applications
POWER GENERATION• Remote generation
ELECTRONICS• Batteries• Remote generation
• Grid generation• Automotive• Solar PV• Concentrated solar PV
• Batteries• LEDs• Servers• Motors• Smart glass• Concentrated solar PV
INDUSTRIAL PROCESSES
• Smart glass• Displays• Car seats• Chips
INDUSTRIAL PROCESSES• Exothermic chemical reactions• Electronics fabrication• CPG manufacturing• Chemical processing
BIOLOGICAL• Implantable devices• Wearable electronics• Chemical processing
• Glass manufacturing• Metal manufacturing
• Wearable electronics
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Market Opportunity
Remote generationConcentrated
S l PVMarket Size
LEDs
Car seats
Chips
Solar PV
Wearable LEDsSmart Glass
Ser ers
Chips
Automotive
l ibl
Wearableelectronics
Sector
Industrial processes
ServersFlexibleDisplays
Solar PV
POWER GENERATION
ELECTRONICS
INDUSTRIAL PROCESSES
processes
Batteries
Grid
Implantabledevices
O S
BIOLOGICAL
Business RiskHigh Low
generation
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Target Markets
Market Value Add Function Market Characteristics
A th ti li bilit M i l dLEDs Aesthetics, reliability Mass commercial and residential adoption by 2013‐2015
No wiring or power Market is small but growing
LEDs
Smart Glass No wiring or power requirements
Market is small but growing 5x per year
Increased efficiency Growing market. 392 MW Con. Solar PV
Smart Glass
y gplant under construction
Reliable and light High willingness to pay –$/kW h b t
Wearable Elect.
$/kW‐h can be up to $500,000 (hearing aid)
Low cost/no fuel –Remote power is typically
Huge market ‐ Rural (dev. countries) and remote
Remote Gen.
Remote power is typically > $1/kW‐h.
countries) and remote (exploration, military)
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External Market Forces
Technologye e
Energy Price
Technology
uenc
uence
Materials Pricee Infl
Infl u
Policy
gative
sitive
Neg
Pos
Weak StrongWeakStrong13
• Technology Overview1
Technology Overview
2•Market Selection
3•Market Analysis and Attractiveness
3
4• Recommendations and Path to Market
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Sensitivity Analysis: Power Generation
1
Baseline Pub lished Datas _
s _
0.8
W−h
r)
A: Performanc e , $$ =B: Performanc e , $$
Electron
ics
Electron
ics
Smart GlassSmart Glass
0.6
erg
y ($
/k
Wearable
Wearable
Wearable ElectronicsWearable Electronics
Remote Power Generation
Remote Power Generation
0.4
ost o
f Ene
ass
ass
Remote Power Generation
Remote Power Generation
Concentrated Concentrated
GenerationGenerationPerformance & CostImprovement
0
0.2Co
Smart G
laSm
art G
la SolarSolar
Concentrated SolarConcentrated Solar
0 20 40 60 800
Available Energy or T (K)
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Sensitivity Analysis: Cooling
5
Baseline Pub lished DataA P f $$
4
W)
A: Performanc e , $$ =B: Performanc e , $$
3
Cos
t ($
/
LED CoolingLED
Cooling2
Coo
ling CoolingCooling
0
1
LED CoolingLED Cooling
0 2 4 6 8 100
Power Input (W/ m2)
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Market Attractiveness
Market SegmentWillingness to
PayIntegration Complexity
Market /Growth
Attractiveness RankingPay Complexity Growth Ranking
Remote Generation 1
LED Cooling 2
Concentrated Solar 3
Wearable Electronics 3
i
Smart Glass 5
Attractive Very AttractiveNot Attractive
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• Technology Overview1
• Technology Overview
2•Market Selection
3•Market Analysis and Attractiveness
3y
4• Recommendations and Path to Market
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Research Recommendations
Substitute • Select material replacement with
Tellurium target price < $138/kg
Optimize Material
Performance
• Improve material performance (ZT>1)
Performance
Design &Design & Prototype Devices
• Optimize device design ( ZT>1 )
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Paths to CommercializationValue Chain
M t i l ManufacturingMaterials(Ink)
Manufacturing
(Printing)Integration Installation
Short Term
Risk to develop Long TermManufacturing
Risk of IP Security
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Risks are present regardless of Start‐up or Licensing Strategy
The Vision
Multiple standardized products
LED CoolingWearable Remote
Smart GlassConcentrated LED Cooling
ElectronicsGenerationSmart Glass
Solar PV
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Thank You!• Administration, Scientists & Fellow C2M‐ers• Scientists & Researchers• Industry Segment Experts
– Matt Scullin & Adam Lorimer (Alphabet Energy)Matt Scullin & Adam Lorimer (Alphabet Energy)– Tom Hunt (Alion)– Bob McConnell (Amonix)– Marcelo Algrain (CAT)– Steve Hahn & Harry Fowler (Dow Chemical)Steve Hahn & Harry Fowler (Dow Chemical)– Christine Ho & Brooks Kincaid (Imprint Energy)– Dale Pike (LTI Smart Glass)– Nicholas Fowler (Perpetua Power)– David Bend (PG&E)David Bend (PG&E)– Anthony Atti (Phononic Devices)– Kunal Girotra (ThinSilicon)– Brian Berkeley (Samsung Mobile Devices)– John Yriberri (Xicato)John Yriberri (Xicato)
• Venture Community– Ron Hofmann (CIEE)– Maurice Gunderson (CMEA)– KT Moortgat & Marianne Wu (MDV)– KT Moortgat & Marianne Wu (MDV)– Brian Walsh (Nth Power)– Keith Gillard (Pangaea Ventures)– Jill Watz (Vulcan Capital) 22
APPENDIXAPPENDIX
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Path to Commercialization Take 2
Value Creation Power or Cooling
License Technology Develop Understand
Integration & Installthrough Tech Transfer
Printing Process Integration & Determine BOS
Install
Ink TE Film TE SystemSegalman Group’s
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Ink TE Film TE SystemSegalman Group sPatented Technology
The Vision
New TEStart‐UpOr Or
WearableRemote ldLED Cooling
Wearable Electronics
RemoteGeneration
Smart GlassConcentrated Solar PV
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Market Evaluation Criteria
Business Risk Business Risk
$/kW‐hr)
Technical Risk
10˚C 200˚CΔT (˚C l i )ΔT (˚Celsius)
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Thermoelectric Material Cost
Na2TeO3PEDOT:PSS Asc. Acid Δ H2O
Printing
21%$4 / kg prod
2%
1%76%$15 / kg prod
Cost of Materials
$4 / kg prod.
~ $100/m2
$15 / kg prod.
$ /Dry Film
Relative Device Cost Savings
Traditional Technology Our Technology
Estimated 30% cost reduction
Material
Material processing at BiTe melting point (>600 OC)
Material processing in water based solution (< 100 OC)
TE MaterialModule Assembl
y
Hand placement high labor cost
Printed placement of TE material low labor cost
TE Material
Module Assembly
Balance of
SystemAPPLICATION SPECIFIC
Fi d
Balance of System
Fixed Costs
Fixed Costs APPLICATION SPECIFIC
Existing Our Technology
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Although materials and processing costs are understood, BOS and Fixed costs are more difficult to quantify. However, cost advantage still remains!
Device Optimization
Cold Side
N P
Heat Sink
Fil
Hot Side
N P
++––
H t S
FilmThickness
1000Power Density
m2 )
T = 20 K
Heat Source
40Cost of Energy
T = 20 K
600
800
nsity
(W
atts
/
T = 50 KT = 100 K
20
30($
/W)
T = 50 KT = 100 K
Cost Optimization
200
400
x Po
wer
Den
10
20
Cos
t (
Power Optimization
0 0.1 0.2 0.3 0.4 0.50
Film Thic kness (mm)
Ma
0 0.02 0.04 0.06 0.08 0.10
Film Thickness (mm)
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Device Concept
N P
Heat Sink
N P N P
Therm. Cond. Silicone (7 mil)λ = 1.2 W/m‐K
lcontact
N P
++––ΔT
N P N P
+ – Aluminum Foil (0.002”)λ = 235 W/m‐K
l
Heat Source
Power Density 2 Thot Tcold 2
α – Material Seebeck coefficientρ – Material Resistivityλ Material Thermal ConductivityPower Density
22 contact
l
1 2 contact
lcontact
l
λ – Material Thermal Conductivityl – Element Lengthlcontact – Contact Lengthρcontact – Elec. Contact Resistance λ Therm Contact ResistanceSource: D.M. Rowe et al. λcontact – Therm. Contact ResistanceSource: D.M. Rowe et al.
Assumptions:• Electrical Contact Resistance ~ 10‐6 Ω‐cm2
• Optimized element length for power generation (dP/dl = 0, l ~ 110µm)p g p g ( / , µ )• Achievable ΔT range – System design & integration is not considered• 30% Material packing density
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Device Power Density
Custom Thermoelectric1261G‐7L31‐10CX156mm x 56mm
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$108.5
TellurexG2‐56‐037556mm x 56mm$110
MicropeltThe image cannot be displayed. Your computer may not have enough memory to open the image, or the image may have been corrupted. Restart your computer, and then open the file again. If the red x still appears, you may have to delete the image and then insert it again.
MPG‐D7514.3mm x 3.364mm
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Scenario Analysis
InorganicInorganic
PriceScenario
Inorganic Material
Material Price ($/kg)
Price ($M/m3)
ZT
Baseline Na2TeO3 $1398 $3 441 0 1Baseline Na2TeO3 $1398 $3.441 0.1A Na2TeO3 $1398 $3.441 1.0
BNa2TeO3 $139 8 $1 082 1 0Bsubstitute
$139.8 $1.082 1.0
B1 (Best Case)Na2TeO3
substitute$139.8 $1.082 1.5
B2 (Worst Case)Na2TeO3
substitute$139.8 $1.082 0.1
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Scenarios
Cost Improvement
ScenarioInorganic Material
ZT
Baseline Na2TeO3 0 1Baseline Na2TeO3 0.1
A Na2TeO3 1.0
Na2TeO3
B B1B2
BNa2TeO3
substitute1.0
B1(Best Case)
Na2TeO3
substitute1.5
A( )B2 (Worst Case)
Na2TeO3
substitute0.1 Performance
Improvement (ZT)
Baseline
A
(ZT)
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Sensitivity Analysis
5
Cost of Mat.+Man.BOS+Fi d C t 5X
4
)
BOS+Fixed Cost 5XBOS+Fixed Cost 10X
3
$/kW
−hr)
2
Cos
t (
Target MarketTarget Market
5X10X
1Scenario
5X
0 20 40 60 800
Delta T (K)
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Sensitivity Analysis: Power Generation
1
Baseline: ZT~0.1A ZT 1
0.8
)
A: ZT~1B: ZT~1, Te SubB1: ZT~1.5, Te SubB2: ZT~0.1, Te Subcscs
Smart GlassSmart Glass
0.6
$/kW
−hr) 0 , e Sub
e Electron
ie Electron
i
Wearable ElectronicsWearable Electronics
Remote Power Generation
Remote Power Generation
0.4
Cos
t (
Wearabl
Wearabl
ass
ass
Remote Power Generation
Remote Power Generation
Concentrated Concentrated
GenerationGeneration
0.2
Smart G
laSm
art G
la SolarSolar
Concentrated SolarConcentrated Solar0 20 40 60 80
0
Delta T (K)
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Concentrated SolarConcentrated Solar
Sensitivity Analysis: Cooling
5
Baseline: ZT~0.1A ZT 1
4
W)
A: ZT~1B: ZT~1, Te SubB1: ZT~1.5, Te SubB2: ZT~0.1, Te Sub
3
Cos
t ($
/ ,
LED CoolingLED
Cooling2
Coo
ling CoolingCooling
0
1
LED CoolingLED Cooling
0 2 4 6 8 100
Power Input (W/ m2)
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