BLT Circuit Services Ltd., Brome Industrial Estate, Brome, Eye, Suffolk IP23 7HN England

Telephone +44 (0)1379 870870 Fax +44 (0)1379 870970Email sales@blt.keme.co.uk

Soldering Products for Circuit Assembly

STENCIL CLEANERS

Product Description Main application Flash Point

Water Soluble

SCS/1 Solvent based, universal cleaner for paste, flux and adhesive residues. Suitable for hand and under stencil machine cleaning.

Fast drying for hand application 20ºC Yes

SCS/2M Solvent based for paste, flux and adhesive residues. Medium drying for machine use 32ºC Yes

SCS/13M Solvent based for paste, flux and adhesive residues.Medium drying, lowest odour for machine use

40ºC No

Flux Saponifier 1990

Aqueous base for dilution with water for paste, flux and adhesive residues.

Machine or hand use None Yes

© C

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BLT

Circ

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.co.

uk

www.bltcircuitservices.co.uk

STENCIL WIPES – Lint Free with excellent solvency beating many competitors’ alternative brands. BLT offer the simplest method of wiping clean your stencils with fast evaporating solvents so as not to contaminate paste causing problems on print.

BLT has developed a range of solvent impregnated wipes for manual cleaning of stencils and circuit boards.Wipes are available impregnated with ISOPROPYL ALCOHOL or preferably for solder paste utilising the water free SCS/1 or SCS/2M. Supplied in 200mm x 200mm x 100 sheet or larger 200 Sheet tubs.

POLYIMIDE TAPES AND DOTS – Silicone for heat and wave soldering and acrylic adhesive systems for conformal coating applications.

Temperature resistant for temporary masking during soldering

Tapes - 3, 4, 6, 8, 9, 10, 12, 19, 20 and 25mm x 33M rolls

Dots - 3, 6, 8, 9, 12, 15mm dots x 1,000 on split lining

Other sizes available to order. Many die-cut shapes available to order.

BLT also offer the following:l Conformal coatings l Lead check swabs l SMT adhesives l Stencil wipesl Peelable solder masks l Rework flux paste l SMT Oven cleaner l X-ray facility available forl Solder tip tinner l Flux rework pens range l Desoldering braids customer support

ISO

9001:2015

APPROVED

ZESTRON STENCIL AND ASSEMBLED BOARD CLEANERS

Product Description Main application Flash Point Water Soluble

ZESTRON Vigon SC200RTU Aqueous, universal stencil cleaner for paste, flux and adhesive residues

Compatible with all commercial cleaning machines

None Yes

Zestron UC160 Underside Stencil cleaner for Automatic Wiping systemsCompatible with all commercial cleaning machines

None Yes

ZESTRON Vigon N600 Aqueous ph neutral final board cleaner, no attack on metal components

Compatible with all commercial cleaning machines

None Yes

ZESTRON Vigon N640 Latest development, aqueous ph neutral board cleaner, ideal for cleaning Japanese Solder Paste

Compatible with all commercial cleaning machines

None Yes

ZESTRON Vigon A250 Alkaline, inhibited aqueous board cleanerCompatible with all commercial cleaning machines

None Yes

ZESTRON Atron SP300 Concentrate or RTU for solder pallets and condensation traps

Compatible with all commercial cleaning machines

None Yes

ZESTRON Vigon EFM Solvent flux remover in Aerosol or liquid form Manual application Liquid -12°C No

Plus the full range of ZESTRON high efficiency cleaning products.

SolderWave soldering fluxesSolder pasteCored solder wireSolid solder wireWipes

CLEANING MACHINES – Low cost, air operated, simple operation.

BLT manufactures low cost, efficient machines for stencil and board cleaning.Misprint Cleaner – Air operated, bench top machine for cleaning misprinted boards or flux removal. Proven performance with the SCS range of chemical solutions.VSCM1 and VSCM2 – Air operated, efficient, low cost machine for stencils.ASCM1 and ASCM2 – Fully Automatic stencil cleaning machines for stencil and misprint/tool cleaning.

BLT is a leading manufacturer and

distributor for a comprehensive range

of consumable products for cost

efficient, high reliability circuit assembly.

Established since 1989 and experts in

soldering technologies we have grown rapidly in our home

market and across the world supported by our Technical Team.

We specialise in selling a solution to your needs.

WAVE SOLDERING FLUXES

Flux Description and main application Solids Content

Acid Value

Flash Point

No Clean

35-90 No Residue

ORLO – Alcohol based for spray or foam application and Dip Tinning. Cleanest flux with low solids. Rosin/Resin free. No residue.

2.0% 16 12ºC Yes

35-90TX No Residue

ORLO Alcohol based flux for spray or foam application and Dip Tinning and rework.Increased activity. Rosin/Resin Free . No residue.

2.5% 22 12ºC Yes

35-92LA No Residue

ORL0 – Alcohol/DI Water based for Spray and Foam application. Highest Activity.Rosin/Resin Free. Excellent in Selective and Wave applications, Reduced VOC content. No Residue.

3.8% 30 25ºC Yes

35-92 No Residue

ORL0 - Alcohol based for Spray and Foam application, medium activity. Rosin/Resin Free. No Residue. Good all rounder.

3.0% 22 12ºC Yes

35-92-35ORL0 - Alcohol based for Spray and Foam application, sustained high activity. Rosin/Resin Free. No Residue.

4.0% 35 12ºC Yes

35-41ROL0 - Alcohol based for Spray and Foam application. Low Rosin good for problematic Solder Resists. Perfect for volume consumer applications.

4.0% 25 12ºC Yes

35-41-22ROL0 - Alcohol based for Spray and Foam application, very low Rosin content with Pallet Protection. Ideal for Lead Free.

3.1% 22 12ºC Yes

10-75-30-R ORL0 - VOC Free for Spray application. No Residue, fast wetting. Excellent solderability and wicking. Used for volume manufacturing.

4.5% 30 None Yes

10-75-40-R ORL0 - VOC Free for Spray application, high activity. No Residue. Strongest VOC Free. 4.5% 40 None Yes

10-95-WS Water Soluble, alcohol based for Foam application. Neutral Ph. 14.0% - 12ºCWater

Washable

SOLDER PASTES - Supplied from stock and expertly backed up by our own personnel.

Paste Description and benefits Alloy and Flux content Particle size

Lead Free

LED3 No Refrigeration

No refrigeration, No Clean, suited ideally for void free LED Manufacture. Long Stencil and tack life

SAC305 Flux 11.6%

Type T420-38 Micron

LFS UFP T4 No Refrigeration

No clean, low slumping, No solder balls, Controlled Viscosity, Fine pitch. Excellent wetting, 72 hour tack. Good up to 35ºC

SAC305 AlloyFlux 12.0%

Type T420-38 Micron

LFS UFP ZQ-HFNo refrigeration

No clean, non-refrigerated up to 50ºC, No Mid Chip Beading and Excellent Voiding Properties with reduced possibility of Head in Pillow. 72-120 Hour Tack possible. Twelve month shelf life

SAC305Flux 11.8%

Type T420-38 Micron

Type T525-10 Micron

AIM NC259 No clean, excellent wetting,No Head-in-Pillow

SN100CFlux 12.0%

Type T420-38 Micron

AIM M8 No clean, improved tack time, Easily cleanable in many Solutions including Co Solvent. Nine Month Refrigerated Storage

SAC305Flux 11.5%

Type T420-38 Micron

AIM NC273 LT Low Melt

No clean, low temperature 138ºC soldering, recommended for Double sided mass intolerant boards. Gives a much larger reflow window at temperatures of 175ºC.

Sn42Bi57Ag1Flux 11.50%

Type T420-38 Micron

LMP NC210 No Clean, 210ºC reflow, Silver dosed for ductility Sn64Bi35Ag1Flux 11.0%

Type T420-38 Micron

AIM WS488 Water soluble, excellent wetting SAC305 Flux 11.5%

Type T4 20-38 micron

Tin/Lead

NCS 900 No clean, excellent wetting, 72 hour tack time. Fine pitch, No refrigerated storage up to 35ºC

62/36/2Flux 9.5%

Type T420-38 Micron

AIM NC 258-M8 No Clean, excellent wetting, Cleanable Residues 62/36/2Flux 10%

Type T420-38 Micron

AIM WS 483 Water soluble, high activity. 2 week cleaning window 63/37 Flux 10%

Type T420-38 Micron

SOLDER WIRE

Product Description and benefits Alloy Flux type and content Packaging

Lead Free

Nitrosol SN100SB HF

No clean, excellent wetting,Non-hygroscopic residue, high activity for Halide Free flux, bright shiny solder joints.

SN100SBHalide Free

2.2% flux cored. ROL0

0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

Nitrosol SAC305

No clean, excellent wetting,Non hygroscopic residue, bright joints. SAC305 RMA 2.2%

0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

S45VTC Rosin free, No clean, bright joints. 99C Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

S45VTSC Rosin free, No clean. SAC305 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

KS100FT Rosin free, No clean, excellent wetting,Tip saving alloy. 99C Synthetic 3.0%

0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

AIM GLOWCORE SN100C No clean, bright joints. Tin/Copper/

Nickel RMA 3.0%0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

AIM GLOWCORE SAC305 No clean, excellent wetting. SAC305 RMA 3.0%

0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

Solid, Lead Free and Tin/Lead

SN100SB Modified Tin/Copper/Nickel. - - 2mm x 4kg 3mm x 3kg

SAC305 SAC305 – 3% Silver solid wire. - - 2mm x 4kg 3mm x 3kg

LMP NC210 Low melting point - 64%Tin/35% Bismuth/1% Silver.

2mm x 3kg3mm x 3kg

63/37 Leaded Wire. - - 2mm x 4kg 3mm x 3kg

Tin/Lead

Nitrosol TL1 No clean, excellent wetting. 63/37 RMA 1.5%

0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

AIM WS482 Water Soluble solder Wire. 63/37 WS 3% 0.4mm x 250g

S45V Rosin free, no clean. 60/40 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

*Other diameters also available.

LEAD FREE SOLDERSAll solder is manufactured using 99.98% Pure Virgin Tin from regulated sources. BLT do not use reclaimed tin, due to the inherent risk of abnormal amounts of organic inclusions that can be detrimental to the high reliability electronics market. These cannot be detected in the typical metallic solder analysis. Tin is only sourced from Registered Conflict Free countries.

SN100SB - RoHS compliant, Dross inhibited, Nitrogen cast, high purity, modified Tin/Copper alloy exhibiting excellent flow and wetting characteristics, low drossing, bright solder joints, economical, suitable for Wave Soldering, Hot Air Levelling and selective soldering.Available in I kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.

SACP0307 - RoHS compliant, Nitrogen cast Tin 99/Silver 0.3/Copper 0.7, high purity, reliable, low drossing for use in Wave Soldering, Hot Air Levelling and selective soldering. Available in 1 kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.

LMPNC210 - RoHS compliant, Tin 64%/Bismuth 35%/Silver 1% low melting point alloy for selective soldering. Available in 1 kilo bars, small chunks and 2 & 3mm wire. SAC305 and SAC387 also available.

Tin/P Dross Inhibitor – Extremely effective anti-oxidant system used when Solder turns a Yellow/Gold tinge to improve flow and greatly reduce dross rates.

BLT offers customers free solder analysis and monitoring and as a licensed dross collection company, can provide customers with a full collection and recycling package for Solder Dross and Solder Pastes.

ISO

9001:2015

APPROVED

TIN/LEAD SOLDERNitro Flo 63/37 Tin/Lead - Nitrogen cast, high purity, dross inhibited solder for all electronic soldering applications.Available in 1 kilo bars, 3.5 kilo feeders and small chunks. Other alloys available on request.

Type 4 Solder Spheres 20-38 microns giving excellent printing definition 0.2mm print.

COMPLIANTRoHS

BLT is a leading manufacturer and

distributor for a comprehensive range

of consumable products for cost

efficient, high reliability circuit assembly.

Established since 1989 and experts in

soldering technologies we have grown rapidly in our home

market and across the world supported by our Technical Team.

We specialise in selling a solution to your needs.

WAVE SOLDERING FLUXES

Flux Description and main application Solids Content

Acid Value

Flash Point

No Clean

35-90 No Residue

ORLO – Alcohol based for spray or foam application and Dip Tinning. Cleanest flux with low solids. Rosin/Resin free. No residue.

2.0% 16 12ºC Yes

35-90TX No Residue

ORLO Alcohol based flux for spray or foam application and Dip Tinning and rework.Increased activity. Rosin/Resin Free . No residue.

2.5% 22 12ºC Yes

35-92LA No Residue

ORL0 – Alcohol/DI Water based for Spray and Foam application. Highest Activity.Rosin/Resin Free. Excellent in Selective and Wave applications, Reduced VOC content. No Residue.

3.8% 30 25ºC Yes

35-92 No Residue

ORL0 - Alcohol based for Spray and Foam application, medium activity. Rosin/Resin Free. No Residue. Good all rounder.

3.0% 22 12ºC Yes

35-92-35ORL0 - Alcohol based for Spray and Foam application, sustained high activity. Rosin/Resin Free. No Residue.

4.0% 35 12ºC Yes

35-41ROL0 - Alcohol based for Spray and Foam application. Low Rosin good for problematic Solder Resists. Perfect for volume consumer applications.

4.0% 25 12ºC Yes

35-41-22ROL0 - Alcohol based for Spray and Foam application, very low Rosin content with Pallet Protection. Ideal for Lead Free.

3.1% 22 12ºC Yes

10-75-30-R ORL0 - VOC Free for Spray application. No Residue, fast wetting. Excellent solderability and wicking. Used for volume manufacturing.

4.5% 30 None Yes

10-75-40-R ORL0 - VOC Free for Spray application, high activity. No Residue. Strongest VOC Free. 4.5% 40 None Yes

10-95-WS Water Soluble, alcohol based for Foam application. Neutral Ph. 14.0% - 12ºCWater

Washable

SOLDER PASTES - Supplied from stock and expertly backed up by our own personnel.

Paste Description and benefits Alloy and Flux content Particle size

Lead Free

LED3 No Refrigeration

No refrigeration, No Clean, suited ideally for void free LED Manufacture. Long Stencil and tack life

SAC305 Flux 11.6%

Type T420-38 Micron

LFS UFP T4 No Refrigeration

No clean, low slumping, No solder balls, Controlled Viscosity, Fine pitch. Excellent wetting, 72 hour tack. Good up to 35ºC

SAC305 AlloyFlux 12.0%

Type T420-38 Micron

LFS UFP ZQ-HFNo refrigeration

No clean, non-refrigerated up to 50ºC, No Mid Chip Beading and Excellent Voiding Properties with reduced possibility of Head in Pillow. 72-120 Hour Tack possible. Twelve month shelf life

SAC305Flux 11.8%

Type T420-38 Micron

Type T525-10 Micron

AIM NC259 No clean, excellent wetting,No Head-in-Pillow

SN100CFlux 12.0%

Type T420-38 Micron

AIM M8 No clean, improved tack time, Easily cleanable in many Solutions including Co Solvent. Nine Month Refrigerated Storage

SAC305Flux 11.5%

Type T420-38 Micron

AIM NC273 LT Low Melt

No clean, low temperature 138ºC soldering, recommended for Double sided mass intolerant boards. Gives a much larger reflow window at temperatures of 175ºC.

Sn42Bi57Ag1Flux 11.50%

Type T420-38 Micron

LMP NC210 No Clean, 210ºC reflow, Silver dosed for ductility Sn64Bi35Ag1Flux 11.0%

Type T420-38 Micron

AIM WS488 Water soluble, excellent wetting SAC305 Flux 11.5%

Type T4 20-38 micron

Tin/Lead

NCS 900 No clean, excellent wetting, 72 hour tack time. Fine pitch, No refrigerated storage up to 35ºC

62/36/2Flux 9.5%

Type T420-38 Micron

AIM NC 258-M8 No Clean, excellent wetting, Cleanable Residues 62/36/2Flux 10%

Type T420-38 Micron

AIM WS 483 Water soluble, high activity. 2 week cleaning window 63/37 Flux 10%

Type T420-38 Micron

SOLDER WIRE

Product Description and benefits Alloy Flux type and content Packaging

Lead Free

Nitrosol SN100SB HF

No clean, excellent wetting,Non-hygroscopic residue, high activity for Halide Free flux, bright shiny solder joints.

SN100SBHalide Free

2.2% flux cored. ROL0

0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

Nitrosol SAC305

No clean, excellent wetting,Non hygroscopic residue, bright joints. SAC305 RMA 2.2%

0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

S45VTC Rosin free, No clean, bright joints. 99C Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

S45VTSC Rosin free, No clean. SAC305 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

KS100FT Rosin free, No clean, excellent wetting,Tip saving alloy. 99C Synthetic 3.0%

0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

AIM GLOWCORE SN100C No clean, bright joints. Tin/Copper/

Nickel RMA 3.0%0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

AIM GLOWCORE SAC305 No clean, excellent wetting. SAC305 RMA 3.0%

0.25mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

Solid, Lead Free and Tin/Lead

SN100SB Modified Tin/Copper/Nickel. - - 2mm x 4kg 3mm x 3kg

SAC305 SAC305 – 3% Silver solid wire. - - 2mm x 4kg 3mm x 3kg

LMP NC210 Low melting point - 64%Tin/35% Bismuth/1% Silver.

2mm x 3kg3mm x 3kg

63/37 Leaded Wire. - - 2mm x 4kg 3mm x 3kg

Tin/Lead

Nitrosol TL1 No clean, excellent wetting. 63/37 RMA 1.5%

0.25mm x 100g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

AIM WS482 Water Soluble solder Wire. 63/37 WS 3% 0.4mm x 250g

S45V Rosin free, no clean. 60/40 Synthetic 1.5%0.35mm x 250g, 0.5, 0.7, 0.8, 1.0, 1.2mm x 500g

*Other diameters also available.

LEAD FREE SOLDERSAll solder is manufactured using 99.98% Pure Virgin Tin from regulated sources. BLT do not use reclaimed tin, due to the inherent risk of abnormal amounts of organic inclusions that can be detrimental to the high reliability electronics market. These cannot be detected in the typical metallic solder analysis. Tin is only sourced from Registered Conflict Free countries.

SN100SB - RoHS compliant, Dross inhibited, Nitrogen cast, high purity, modified Tin/Copper alloy exhibiting excellent flow and wetting characteristics, low drossing, bright solder joints, economical, suitable for Wave Soldering, Hot Air Levelling and selective soldering.Available in I kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.

SACP0307 - RoHS compliant, Nitrogen cast Tin 99/Silver 0.3/Copper 0.7, high purity, reliable, low drossing for use in Wave Soldering, Hot Air Levelling and selective soldering. Available in 1 kilo bars, 3.2 kilo feeders, small chunks for Tinning pots and 2 & 3mm wire.

LMPNC210 - RoHS compliant, Tin 64%/Bismuth 35%/Silver 1% low melting point alloy for selective soldering. Available in 1 kilo bars, small chunks and 2 & 3mm wire. SAC305 and SAC387 also available.

Tin/P Dross Inhibitor – Extremely effective anti-oxidant system used when Solder turns a Yellow/Gold tinge to improve flow and greatly reduce dross rates.

BLT offers customers free solder analysis and monitoring and as a licensed dross collection company, can provide customers with a full collection and recycling package for Solder Dross and Solder Pastes.

ISO

9001:2015

APPROVED

TIN/LEAD SOLDERNitro Flo 63/37 Tin/Lead - Nitrogen cast, high purity, dross inhibited solder for all electronic soldering applications.Available in 1 kilo bars, 3.5 kilo feeders and small chunks. Other alloys available on request.

Type 4 Solder Spheres 20-38 microns giving excellent printing definition 0.2mm print.

COMPLIANTRoHS

BLT Circuit Services Ltd., Brome Industrial Estate, Brome, Eye, Suffolk IP23 7HN England

Telephone +44 (0)1379 870870 Fax +44 (0)1379 870970Email sales@blt.keme.co.uk

Soldering Products for Circuit Assembly

STENCIL CLEANERS

Product Description Main application Flash Point

Water Soluble

SCS/1 Solvent based, universal cleaner for paste, flux and adhesive residues. Suitable for hand and under stencil machine cleaning.

Fast drying for hand application 20ºC Yes

SCS/2M Solvent based for paste, flux and adhesive residues. Medium drying for machine use 32ºC Yes

SCS/13M Solvent based for paste, flux and adhesive residues.Medium drying, lowest odour for machine use

40ºC No

Flux Saponifier 1990

Aqueous base for dilution with water for paste, flux and adhesive residues.

Machine or hand use None Yes

© C

opyr

ight

BLT

Circ

uit

Serv

ices

Ltd

201

9 -

desi

gn: w

ww

.pan

publ

icity

.co.

uk

www.bltcircuitservices.co.uk

STENCIL WIPES – Lint Free with excellent solvency beating many competitors’ alternative brands. BLT offer the simplest method of wiping clean your stencils with fast evaporating solvents so as not to contaminate paste causing problems on print.

BLT has developed a range of solvent impregnated wipes for manual cleaning of stencils and circuit boards.Wipes are available impregnated with ISOPROPYL ALCOHOL or preferably for solder paste utilising the water free SCS/1 or SCS/2M. Supplied in 200mm x 200mm x 100 sheet or larger 200 Sheet tubs.

POLYIMIDE TAPES AND DOTS – Silicone for heat and wave soldering and acrylic adhesive systems for conformal coating applications.

Temperature resistant for temporary masking during soldering

Tapes - 3, 4, 6, 8, 9, 10, 12, 19, 20 and 25mm x 33M rolls

Dots - 3, 6, 8, 9, 12, 15mm dots x 1,000 on split lining

Other sizes available to order. Many die-cut shapes available to order.

BLT also offer the following:l Conformal coatings l Lead check swabs l SMT adhesives l Stencil wipesl Peelable solder masks l Rework flux paste l SMT Oven cleaner l X-ray facility available forl Solder tip tinner l Flux rework pens range l Desoldering braids customer support

ISO

9001:2015

APPROVED

ZESTRON STENCIL AND ASSEMBLED BOARD CLEANERS

Product Description Main application Flash Point Water Soluble

ZESTRON Vigon SC200RTU Aqueous, universal stencil cleaner for paste, flux and adhesive residues

Compatible with all commercial cleaning machines

None Yes

Zestron UC160 Underside Stencil cleaner for Automatic Wiping systemsCompatible with all commercial cleaning machines

None Yes

ZESTRON Vigon N600 Aqueous ph neutral final board cleaner, no attack on metal components

Compatible with all commercial cleaning machines

None Yes

ZESTRON Vigon N640 Latest development, aqueous ph neutral board cleaner, ideal for cleaning Japanese Solder Paste

Compatible with all commercial cleaning machines

None Yes

ZESTRON Vigon A250 Alkaline, inhibited aqueous board cleanerCompatible with all commercial cleaning machines

None Yes

ZESTRON Atron SP300 Concentrate or RTU for solder pallets and condensation traps

Compatible with all commercial cleaning machines

None Yes

ZESTRON Vigon EFM Solvent flux remover in Aerosol or liquid form Manual application Liquid -12°C No

Plus the full range of ZESTRON high efficiency cleaning products.

SolderWave soldering fluxesSolder pasteCored solder wireSolid solder wireWipes

CLEANING MACHINES – Low cost, air operated, simple operation.

BLT manufactures low cost, efficient machines for stencil and board cleaning.Misprint Cleaner – Air operated, bench top machine for cleaning misprinted boards or flux removal. Proven performance with the SCS range of chemical solutions.VSCM1 and VSCM2 – Air operated, efficient, low cost machine for stencils.ASCM1 and ASCM2 – Fully Automatic stencil cleaning machines for stencil and misprint/tool cleaning.