“Soldering and Brazing” comparing with Diffusion bonding, Hot pressing, and Solid phase...
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““Soldering and Brazing” Soldering and Brazing” comparing withcomparing with Diffusion bonding, Hot pressing, Diffusion bonding, Hot pressing,
and Solid phase bondingand Solid phase bonding
Dr. Kunio TAKAHASHIDr. Kunio TAKAHASHI - Associate professor,- Associate professor,
Dept. of International Development Engineering,Dept. of International Development Engineering,Tokyo Institute of TechnologyTokyo Institute of Technology,Tokyo 152-8552, Japan,Tokyo 152-8552, JapanPhone/Fax:+81-3-5734-3915Phone/Fax:+81-3-5734-3915E-Mail:[email protected]:[email protected]://www.ide.titech.ac.jp/~takahak/http://www.ide.titech.ac.jp/~takahak/
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Prior to this lecture...Prior to this lecture...Activities of Japanese welding Activities of Japanese welding
communitycommunity
Organizations and their rolesOrganizations and their roles
Japanese system of education and Japanese system of education and certificationcertification
Movement around Asian Welding FederationMovement around Asian Welding Federation
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About About lecturer’s ...lecturer’s ... Back groundBack ground
welding ( what is this ? )welding ( what is this ? ) Tokyo Institute of technologyTokyo Institute of technology
http://www.titech.ac.jp/http://www.titech.ac.jp/
Department of International Development Eng.Department of International Development Eng.NetworkNetwork beyondbeyond the the borderborder of of engineering fieldengineering field(community)(community) nationnationhttp://www.ide.titech.ac.jp/http://www.ide.titech.ac.jp/
Welcome to JapanWelcome to JapanAlready, you have joined to Already, you have joined to our Networkour Network..
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Welding Technology, Welding Technology, as ”Inter-Field” Engineeringas ”Inter-Field” Engineering based onbased on Plasma physicsPlasma physics Electronics/Electrical Eng.Electronics/Electrical Eng. Power SourcePower Source Control Control (“self-controlled” is the best) (“self-controlled” is the best) = = Heat sourcesHeat sources Thermal Eng.Thermal Eng. Fluid dynamicsFluid dynamics Material scienceMaterial science Fracture mechanicsFracture mechanics
Physics of phenomenaPhysics of phenomena StandardStandard IndustryIndustry
roles of roles of SocietySociety
PlasmaPlasma ee---beam-beam LaserLaser Joule’s heatJoule’s heat etc…etc…
SteelsSteels(Materials)(Materials)- Making- Making- Design- Design
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About this lecture “Brazing and Soldering About this lecture “Brazing and Soldering …”…”
Basic knowledgeBasic knowledge based on physics based on physics– PhenomenaPhenomena– Comparison with other welding processesComparison with other welding processes– What is and what is not clarified, theoretically ?What is and what is not clarified, theoretically ?– Recent progresses for physical understanding.Recent progresses for physical understanding.so,so,
You will understand...You will understand...– Why and How the process is used ?Why and How the process is used ? Experimental Experimental
trainingtraining– How the process can be modified ?How the process can be modified ?
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Definition of brazing and solderingDefinition of brazing and soldering ExamplesExamples Comparison with other welding Comparison with other welding
processesprocesses Heat sourcesHeat sources Brazing filler metals and soldersBrazing filler metals and solders Fluxes and atmosphereFluxes and atmosphere Set up and joint shapeSet up and joint shape Phenomena in brazing and solderingPhenomena in brazing and soldering
– Wetting ( surface and interfacial tension )Wetting ( surface and interfacial tension )– Conduction of heatConduction of heat– DissolutionDissolution– FlowFlow– DiffusionDiffusion– DeformationDeformation– Oxidation - reduction reactionOxidation - reduction reaction– Solidification -> microscopic structureSolidification -> microscopic structure
ExerciseExercise
Contents Contents ofofthis lecturethis lecture
Please remember in your experimental training (Sept.19 ?)
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Definition of the brazing and soldering.Definition of the brazing and soldering.
Joint is Joint is heatheateded distributing distributing filler metalfiller metal between base materials, between base materials, by by capillarycapillary action action below below solidus temperaturesolidus temperature of of base materialsbase materials.. Sometimes the joint is pressed.Sometimes the joint is pressed.
example of brazing example of brazing main engine LE7A main engine LE7A H2A rocket H2A rocket
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Filler metalsFiller metals
BrazingBrazingmelting point of filler metal melting point of filler metal >> 723723 K K ( ( 450 450 C, C, 840 840 F F ))
SolderingSolderingmelting point of filler metal melting point of filler metal << 723723 K K ( ( 450 450 C, C, 840 840 F F ))
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Capillary actionCapillary action
Wetting phenomenonWetting phenomenon
Surface tensionSurface tensionor or
Surface energySurface energy
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A g-C u phase diagram .
Solidus temperatureSolidus temperature
phase diagramphase diagram
– Equilibrium Equilibrium phasephase
– Lever ruleLever rule
Solidus Liquidus
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exampleexample
Soldering is key technologySoldering is key technologyin micro-electronics assemblyin micro-electronics assembly
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exampleexample
Soldering is key technologySoldering is key technologyin micro-electronics assemblyin micro-electronics assembly
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exampleexample “flip chip” technology“flip chip” technology
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A ssessed P b-Sn phase diagram.
Solders for electronicsSolders for electronicsEutectic phasEutectic phas
ee conventional solderconventional solder
– Sn-PbSn-Pb
(Sn-(Sn-3838Pb Pb 180180CC))
lead free solderslead free solders– Sn-AgSn-Ag
(Sn-3.8Ag 220(Sn-3.8Ag 220CC))– Sn-InSn-In– Sn-BiSn-Bi– Sn-ZnSn-Zn– etc...etc...
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Wire bonding by Kaijo
by H.Miyazaki, S.Saito, et.al...
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Pb ( lead ) problem for healthPb ( lead ) problem for health
Mental development index – age ->Mental development index – age ->
Audition handicap - Pb in bloodAudition handicap - Pb in blood Blood pressure - Pb in bloodBlood pressure - Pb in blood
(positive correlation)(positive correlation)
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A ssessed P b-Sn phase diagram.
Solders for electronicsSolders for electronicseutectic phaeutectic pha
sese conventional solderconventional solder
– Sn-PbSn-Pb
(Sn-38Pb 180(Sn-38Pb 180CC))
lead free solderslead free solders– Sn-AgSn-Ag
(Sn-3.8Ag 220(Sn-3.8Ag 220CC))– Sn-InSn-In– Sn-BiSn-Bi– Sn-ZnSn-Zn– etc...etc...
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A ssessed A g-Sn phase diagram.Solders for electronicsSolders for electronics
conventional solderconventional solder– Sn-PbSn-Pb
(Sn-38Pb 180(Sn-38Pb 180CC))
lead free solderslead free solders– Sn-AgSn-Ag
(Sn-(Sn-3.83.8Ag Ag 220220CC))– Sn-InSn-In– Sn-BiSn-Bi– Sn-ZnSn-Zn– etc...etc...
Sn-Ag-Bi-Sb-CuSn-Ag-Bi-Sb-Cu Sn-Ag-InSn-Ag-In Sn-Ag-Bi-CuSn-Ag-Bi-Cu ......
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A ssessed In-Sn phase diagram.
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A ssessed Sn-B i phase diagram .
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A ssessed Z n-Sn phase diagram.
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Problems Pb free solderProblems Pb free solder
Melting pointMelting pointproblemsproblems in processesin processes almost solve almost solve
dd ViscosityViscosity
Corrosion Corrosion still under R still under R/D/D– Heating ironHeating iron in iron solderingin iron soldering– Solder bathSolder bath in reflow solderingin reflow soldering
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exampleexample Al brazingAl brazing
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exampleexample Ni brazingNi brazing
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exampleexample Ag brazing of Stainless and Ag brazing of Stainless and Ceramics Ceramics
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The highest technology is The highest technology is never used for space never used for space development.development.
The highest technology is The highest technology is the the combinationcombination of of conventional technologies.conventional technologies.
OptimizationOptimization & & breakthroughbreakthrough are based on are based on scientific understandingscientific understanding
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Comparison with other welding or joining processesComparison with other welding or joining processes
melting base materials melting base materials ex. arc welding, resistance welding, etc…ex. arc welding, resistance welding, etc…
adding molten metals between base materialsadding molten metals between base materialsex. ex. brazingbrazing,, soldering soldering, etc..., etc...
not melting base materialsnot melting base materialsex. solid phase bonding, hot pressing, etc...ex. solid phase bonding, hot pressing, etc...
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Diffusion bonding, Hot pressing, Diffusion bonding, Hot pressing, and Solid phase bondingand Solid phase bonding
Samples are Samples are – heatedheated,,
and and – pressedpressed..– Sometimes Sometimes metal metal
sheetsheet is inserted. is inserted.
“filler metal” ? in brazing
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Another type of equipmentsAnother type of equipments Hot Isostatic Pressing (HIP)Hot Isostatic Pressing (HIP)
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ExampleExample Ni alloyNi alloy
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Requirements for joiningRequirements for joining– to bring atoms near stable inter-atomic distanceto bring atoms near stable inter-atomic distance
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WettingWetting Heat transfer Heat transfer DissolutionDissolution FlowFlow DiffusionDiffusion DeformationDeformation OxidationOxidation ReductionReduction SolidificationSolidification
Phenomena Phenomena
Soldering and BrazingSoldering and Brazing
and alsoand also
Diffusion bondingDiffusion bonding Hot pressingHot pressing Solid phase bondingSolid phase bonding
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Heat sources for brazing and solderingHeat sources for brazing and soldering
Oxyfuelgas flameOxyfuelgas flame ::Torch brazingTorch brazing/soldering , braze weldi/soldering , braze weldingng
Arc plasmaArc plasma :Arc brazing, braze welding:Arc brazing, braze welding Joule’s heatJoule’s heat :Resistance brazing:Resistance brazing Induction heatInduction heat :Induction brazing:Induction brazing Hot iron Hot iron ::Iron solderingIron soldering Ultrasonic waveUltrasonic wave :Ultrasonic soldering:Ultrasonic soldering Infrared rayInfrared ray :Infrared soldering:Infrared soldering Laser beamLaser beam :Laser beam soldering:Laser beam soldering
etc...etc...
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Other terminology Other terminology for brazing and solderingfor brazing and soldering
AtmosphereAtmosphere Atmospheric brazing/solderingAtmospheric brazing/soldering
Vacuum brazingVacuum brazing
Furnace brazingFurnace brazing
Dip brazing/solderingDip brazing/soldering ex. of dip ex. of dip solderingsoldering– Metal bath brazing/soldering Metal bath brazing/soldering (in molten solder bath)(in molten solder bath)– Salt bath brazing/solderingSalt bath brazing/soldering (in flux)(in flux)
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Other terminologyOther terminology
ProcedureProcedure Abrasion tinning & re-flowAbrasion tinning & re-flow Re-flow solderingRe-flow soldering Diffusion brazing/solderingDiffusion brazing/soldering
– Transient Liquid Phase bondingTransient Liquid Phase bonding
ambiguousambiguous
Diffusion bonding ( Hot pressing ) ?Diffusion bonding ( Hot pressing ) ?– Liquid phase diffusion bondingLiquid phase diffusion bonding : : iso-thermal solidificationiso-thermal solidification– Eutectic bondingEutectic bonding : no filler metal and: no filler metal and
intent to melt base materiaintent to melt base materialsls
ex. Re-flow used in electronicsex. Re-flow used in electronics
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A ssessed P b-Sn phase diagram.Brazing/Soldering temperatureBrazing/Soldering temperature
= Liquidus temp. + = Liquidus temp. + 5050~~100100 K K ( because of viscosity )( because of viscosity )
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Brazing filler metals and soldersBrazing filler metals and solders Brazing filler metals in Japanese Industrial Standards (Brazing filler metals in Japanese Industrial Standards (JISJIS))
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Fluxes and atmosphereFluxes and atmosphere
FluxesFluxes Shielding Shielding Reduction of surfaces Reduction of surfaces
RequirementsRequirements wettablewettable easily removableeasily removable never harmfulnever harmful
Shielding gasShielding gas
WettabilityWettability
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Set up and joint shapeSet up and joint shape
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Phenomena in brazing and solderingPhenomena in brazing and soldering Wetting ( Surface and interfacial tension )Wetting ( Surface and interfacial tension ) Conduction of heatConduction of heat DissolutionDissolution FlowFlow DiffusionDiffusion DeformationDeformation Oxidation - reduction reactionOxidation - reduction reaction Solidification -> microscopic structureSolidification -> microscopic structure
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Wetting driven by Wetting driven by surface and interfacial tensionsurface and interfacial tension
What determines equilibrium What determines equilibrium ( contact angle, meniscus, etc… ) ?( contact angle, meniscus, etc… ) ?– surface and interfacial tensionsurface and interfacial tension
Young’s equationYoung’s equation coslis
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Surface and interfacial tensionSurface and interfacial tension(Surface tension is interfacial tension between material and vacuum.)(Surface tension is interfacial tension between material and vacuum.)
Surface ( interfacial ) tensionSurface ( interfacial ) tension– ex. soap filmex. soap film– ex. soap bubbleex. soap bubble
Force on meniscusForce on meniscusLaplace equationLaplace equation
Effect of gravity on meniscus Effect of gravity on meniscus on shape of filleton shape of fillet– Curvature changes with height.Curvature changes with height.
21l
11RR
P
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Surface (interfacial) tensionSurface (interfacial) tension and Surface (interfacial) energyand Surface (interfacial) energy
Internal energy and entropyInternal energy and entropy
1st law and 2nd law of thermodynamics1st law and 2nd law of thermodynamics
For bulk,For bulk,thereforetherefore
Variables for unit area of surfaceVariables for unit area of surface
For arbitrary area of surface,For arbitrary area of surface,
Therefore,Therefore,
dApdVTdSdU btottot
sbtot UUU sbtot SSS
bbb pdVTdSdU dATdSdU ss
AUU ss ASS
ss
0ssss TdSdUAdATSU
ss TSU ss TdSdU
pTS
s
T
p
dTTU
TTU
TpTSTpUTp
0s
s
ss
1
),(),(),(
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Relation betweenRelation betweenSurface (interfacial) Surface (interfacial) tensiontension and Surface (interfacial) and Surface (interfacial) energenergyy
Surface contribution of internal energy is important.Surface contribution of internal energy is important. at 0 K, at 0 K,
T
p
dTTU
TTU
TpTSTpUTp
0s
s
ss
1
),(),(),(
Surface ( interfacial ) entropy
dTTU
T
TS
T
p
0s
s
1
Surface ( interfacial ) tension
Surface ( interfacial ) energy
sU
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Theoretical approach forTheoretical approach for Electronic theory Electronic theory surface tension at surface tension at 0 K0 K (quantum (quantum mechanics)mechanics)
SCF-Jellium
Stabilized jellium
Al
ZnMg
Pb
CaLi
Sr
BaNa
K
Rb Cs
Shifted step potential
Effective electron density parameter rm (Bohr)
Surf
ace
ener
gy a
t zer
o te
mpe
tratu
re
s
(mJ/
m2 )
Be
GaCd
InHg
2 3 4 5 6
500
1000
1500
200025003000
100
Shifted step potentialShifted step potentialK.Takahashi, and T.Onzawa,K.Takahashi, and T.Onzawa,Physical Review B, 48, 5689 (1993)Physical Review B, 48, 5689 (1993)
Stabilized jelliumStabilized jelliumJ.P.Predew, H.Q.Tran and E.D.Smith, J.P.Predew, H.Q.Tran and E.D.Smith, Phys. Rev. B, 42, 11627 (1990).Phys. Rev. B, 42, 11627 (1990).
SCF-jelliumSCF-jelliumN.D.Lang and W.Kohn, Phys. Rev. B, 1, 4555 (1970).
comparison by K.F.Wojciechovski, Surface Science, 437, 285-288 (1999)comparison by K.F.Wojciechovski, Surface Science, 437, 285-288 (1999)
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T
p
dTTU
TTUTp
0s
s1),(
trans.phase s,phonon s,electron s,s UUUU
Temperature dependence Temperature dependence ofof surface tension surface tension
Other contributionsOther contributions( phonon, phase transformation )( phonon, phase transformation )
=0, at 0 (zero) K.
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Temperature T (K)
Al
Li
Na
K
Cs
Surfa
ce te
nsio
n s
(J/
m2 )
Rb
Bi
Hg
Pb
Sn
Zn
0 500 1000 15000.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
SCF-Jellium
Stabilized jellium
Al
ZnMg
Pb
CaLi
Sr
BaNa
K
Rb Cs
Shifted step potential
Effective electron density parameter rm (Bohr)Su
rfac
e en
ergy
at z
ero
tem
petra
ture
s (m
J/m
2 )
Be
GaCd
InHg
2 3 4 5 6
500
1000
1500
200025003000
100
Experimental Experimental measurements of measurements of surface tensionsurface tension
Experimental value Experimental value which theorists which theorists have been used, have been used, is…is… “ “extrapolatedextrapolated””
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Data base of Data base of Surface- and interfacial- tensionSurface- and interfacial- tension
Experimental approaches• Cleavage method• Zero creep method• Thermal grooving method• Contact angle method ( sessile drop )• Adhesion force method• ...
Theoretical approaches• Quantum mechanics • Thermodynamics• Molecular dynamics• …
!! No experimental method gives perfect information by itself.!! No experimental method gives perfect information by itself.!! No theory gives perfect information by itself.!! No theory gives perfect information by itself.
Strategy by lecturer for...Strategy by lecturer for...
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Conduction of heat (1)Conduction of heat (1)
Fourier's LawFourier's LawHeat flux (J/mHeat flux (J/m22s)s)Thermal conductivity (J/sKm, W/Km)Thermal conductivity (J/sKm, W/Km)Temperature (K)Temperature (K)
Diffusion equationDiffusion equationLatent heat (J/kgK)Latent heat (J/kgK)Density (kg/mDensity (kg/m33))Diffusion coefficient (mDiffusion coefficient (m22/s)/s)
Diffusion equation for Cartesian coordinate system Diffusion equation for Cartesian coordinate system
2
2
2
2
2
2
zT
yT
xTD
tT
T grad q
TDTcct
T grad div grad div div1
q
c
D
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Conduction of heat (2)Conduction of heat (2)
Solutions for special boundary conditionsSolutions for special boundary conditions– Steady state (t=Steady state (t=), one dimensional), one dimensional
– Steady state (t=Steady state (t=), axially symmetric ), axially symmetric
– Steady state (t=Steady state (t=), center symmetric ), center symmetric
02
2
xTD
tT
012
2
rT
rrTD
tT
022
2
rT
rrTD
tT
21)( CxCxT
21 ln)( CrCrT
211)( Cr
CrT
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Conduction of heat (2)Conduction of heat (2)
Basic solutions of diffusion equationBasic solutions of diffusion equation– one dimensionalone dimensional area heatingarea heating
for heat input for heat input QQ Q Q ((J/mJ/m))
– two dimensionaltwo dimensional linear heatinglinear heating
Q Q ((J/mJ/m22))
– three dimensionalthree dimensional point heatingpoint heating
Q Q ((J/mJ/m33))
Dtx
DtcQT
4exp
41 2
Dtyx
DtcQT
4exp
41 22
Dtzyx
DtcQT
4exp
41 222
2/3
-20 -10 0 10 20X-AXIS
0
0.2
0.4
Y-A
XIS
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A g-C u phase diagram .
DissolutionDissolution
increasingincreasing temperaturetemperature
– heatingheating– heat conductionheat conduction
concentrationconcentration– filler metalfiller metal– diffusiondiffusion
Solubility limitSolubility limit
Phase diagramPhase diagram
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FlowFlow
WettabilityWettability driving forcedriving force
ViscosityViscosity dragging forcedragging force
Approximation “Liquid is always uniform.”Approximation “Liquid is always uniform.”
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DiffusionDiffusion
Fick’s 1st law, Fick’s 2nd law, and Diffusion equationFick’s 1st law, Fick’s 2nd law, and Diffusion equation
Application of basic solutionsApplication of basic solutions
wherewhere
Dtx
DtcC
4exp
4
20
DtxcC
4erf1
20
0
2exp2erf d
-10 0 10X-AXIS
0
0.5
1
Y-A
XIS
2
2
2
2
2
2
zC
yC
xCD
tC
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DiffusionDiffusion
When material P is joined with iWhen material P is joined with insert (filler) metal, change in cnsert (filler) metal, change in concentration profiles across booncentration profiles across bond interface.nd interface.
and if and if below eutectic temperature…below eutectic temperature… joint of P and Q at Tjoint of P and Q at T0 0 ,…,… joint of P and Q at <Tjoint of P and Q at <Teutectic eutectic ,…,… Q is inserted,...Q is inserted,... etc...etc...
DtxcC
4erf1s
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DeformationDeformation : Deformation around joint: Deformation around joint
Elastic deformationElastic deformation usually negligibleusually negligible Plastic deformationPlastic deformation Creep deformationCreep deformation Diffusional deformationDiffusional deformation
( diffusional creep )( diffusional creep )– surface diffusionsurface diffusion– boundary diffusionboundary diffusion– volume diffusionvolume diffusion
Solid phase bondingSolid phase bonding
Surface
Void
Before contact
After plastic deformation
During creep deformation
L
h00
(a)
Void
Volume diffusion
Boundary diffusion
Surface diffusion (b)
X
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0 5 10 15 20Bonding pressure Pb (MPa)
100
101
102
103
104
105
106
Tim
e re
quir
ed f
or p
erfe
ct c
onta
ct
t fin
(s)
L=10 m, h00=1 m
L=1 m, h00=0.1 m
T=1000 K
VoidL
X
Time required for perfect contact by deformationTime required for perfect contact by deformation
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800 1000 1200
0
50
100
Bonding temperature T (K)
Perc
ent b
onde
d ar
ea S
(%)
Plastic deformation
Creep deformation
Boundary diffusion
Volume diffusion
L=10m, h00=1m, Pb=10MPa
VoidL
X
Dominant mechanismDominant mechanism
Elastic deformationElastic deformation Plastic deformationPlastic deformation Creep deformationCreep deformation Diffusional deformationDiffusional deformation
– surface diffusionsurface diffusion– boundary diffusionboundary diffusion– volume diffusionvolume diffusion
Why it is called “diffusion” bonding ?
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800 1000 1200
0
50
100
Bonding temperature T (K)
Perc
ent b
onde
d ar
ea S
(%)
Plastic deformation
Creep deformation
Boundary diffusion
Volume diffusion
L=1m, h00=0.1m, Pb=10MPa
800 1000 1200
0
50
100
Bonding temperature T (K)
Perc
ent b
onde
d ar
ea S
(%)
Plastic deformation
Creep deformation
Boundary diffusion
Volume diffusion
L=10m, h00=1m, Pb=10MPa
If you want to use If you want to use diffusion for precise diffusion for precise
joining…joining…
popular popular roughnessroughness
If carefullyIf carefullyprepared...prepared...
VoidL
X
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Oxidation - reduction reaction between Oxidation - reduction reaction between fluxes fluxes andand metal metal
ex. Cu joint by Pb-Sn solder with HCl fluxex. Cu joint by Pb-Sn solder with HCl flux– Reduction of base metal surfaceReduction of base metal surface
– Shield of molten metalShield of molten metal
– Assist wettabilityAssist wettability
OHCuCl2HClCuO 22
22 HSnCl2HClSn
SnCuClSnClCu 22
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Oxidation - reduction reaction between Oxidation - reduction reaction between atmosphereatmosphere and and metal metal
ex. atmospheric brazing with hydrogen gasex. atmospheric brazing with hydrogen gas
depending ondepending on Material (M)Material (M) Partial pressure of HPartial pressure of H22OO Liquid NLiquid N2 2 trap, Silica gel, trap, Silica gel,
etc...etc... Partial pressure of HPartial pressure of H22 Gas controlGas control
022 OHMHOM Gnmnnm
2
2
22H
OH00H
0OH lnln
pp
RTnKRTGGG
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SolidificationSolidification
Phase diagramPhase diagram
precipitation processprecipitation process
Microscopic structureMicroscopic structure
Mechanical propertyMechanical property– materialsmaterials– cooling ratescooling rates ex. Fe-C systemex. Fe-C system
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A ssessed P b-Sn phase diagram.ex. Pb-Sn solderex. Pb-Sn solder eutectic phaseeutectic phase
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Ball Grid Array (BGA)Ball Grid Array (BGA)in “flip chip” technologyin “flip chip” technology
Eutectic phase can be seen.Eutectic phase can be seen.
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WeaknessWeakness of of low melting point materiallow melting point materialex. Pb-Sn solderex. Pb-Sn solder
CrackingCracking
Thermal effectThermal effect
150 150 C 100 hoursC 100 hours
A ssessed P b-Sn phase diagram.
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Brittleness Brittleness of of inter-metallic compoundinter-metallic compoundex. Fe - Alex. Fe - Al Although Al is low melting point Although Al is low melting point
material,...material,...
A ssessed F e-A l phase diagram.
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ex. filler metal for Al: Low melting point ex. filler metal for Al: Low melting point precise heat precise heat controlcontrol
A ssessed A l-C u phase diagram.
A ssessed A l-Si phase diagram. A ssessed A l-M g phase diagram.
A ssessed A l-Z n phase diagram.
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Weld metal Weld metal solidification cracksolidification crack
ex. Alex. Al
at the at the end of the solidificationend of the solidification,,
the liquid vanish the liquid vanish very quicklyvery quickly
lack of liquidlack of liquid crackcrack
A ssessed A l-Si phase diagram .
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ex. Ti - Ti bonding with Cu filmex. Ti - Ti bonding with Cu filmA ssessed T i-C u phase diagram .
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Exercise 1Exercise 1Schematically, illustrate a concentration profile at 700 Schematically, illustrate a concentration profile at 700 C C
across the interface of diffusion couple (Ag/Cu), across the interface of diffusion couple (Ag/Cu), considering phase diagram.considering phase diagram.
A g-C u phase diagram .
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Exercise 2Exercise 2Cu samples are bonded using insert film of Ag by keeping Cu samples are bonded using insert film of Ag by keeping
joint at 900 joint at 900 C. After liquid metal vanished, the joint was C. After liquid metal vanished, the joint was cooled to room temperature. Schematically, illustrate a cooled to room temperature. Schematically, illustrate a change of concentration profile across the interface.change of concentration profile across the interface.
A g-C u phase diagram .
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Exercise 3Exercise 3Choose a percentage of Sn in Pb-Sn solder.Choose a percentage of Sn in Pb-Sn solder.And answer a soldering temperature. And answer a soldering temperature. A ssessed P b-Sn phase diagram.
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Exercise 4Exercise 4List up deformation mechanisms for solid phase bonding.List up deformation mechanisms for solid phase bonding.
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fin.fin.
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ボツボツ
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Conduction of heatConduction of heat
Application of basic solutionsApplication of basic solutions– Step distribution in t=0.Step distribution in t=0.
– Area heatingArea heating
– Linear heatingLinear heating
– Point heatingPoint heating
Thermal conductivity, Specific heat, Mass densityThermal conductivity, Specific heat, Mass densityTemperature dependence Temperature dependence Thermal diffusion Thermal diffusion
coefficientcoefficient
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Surface and interfacial tensionSurface and interfacial tension(Surface tension is interfacial tension between material and (Surface tension is interfacial tension between material and
vacuum.)vacuum.)
Meniscus between flat planeMeniscus between flat plane
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