Solder preforms for product and process improvement By Krayden Alpha technical specialist.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

1

the product:

ALPHA®

WS-819 Solder Pasteproduct guide

A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability.

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http://www.krayden.com/


2

WS-819 solder paste

Welcome to theALPHA® WS-819 Product Guide

2. Performance Summary 43. Print Performance 5 - 9

5. Post Reflow Cleaning 20 - 224. Reflow Performance 10 - 19

6 . Shelf Life 23

8. Technical Bulletin 27 - 30

CONTENTS

9. MSDS 31 - 36

7. Summary 24 - 26

1. Introduction 3

A world class lead free, high reliability water soluble paste offering best in class printing, resistance to BGA voids and cleanability.

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3

WS-819 solder pasteIntroduction

Introducing ALPHA® WS-819, the state of the art in Water Soluble, Lead Free Solder Paste.Water soluble solder pastes are commonly used for high reliability medical, military and telecom infrastructure applications. Until now, high reliability has had a price-namely poor resistance to variations in temperature and humidityin the print process, and poor resistance to BGA voiding.

WS-819 was developed to offer the widest possible print process window, with consistent high print deposit volumes, IPC Class III resistance to voiding, and ease of cleanability in a ORH0 class solder paste.

As with all Alpha brand products, WS-819 comes with complete process and product support whenever and however you need us. It’s the kind of support you would expect from a company that’s remained dedicated to serving the needs of the Global circuit assembly market for over 50 years.

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WS-819 solder paste

Performance SummarySMT Process Step Performance Indicator WS-819 Performance Capability

Fine Feature Print Performance

Excellent print definition and consistant volumetric performance to 0.30mm (12 mil) circles and 0.4mm (16 mil) pitch rectangular QFP pads.

Stencil Life 8 hours at 35-65% Relative Humidity

Humidity/Temperature Window Capable of printing in temperatures from 20°C to ≥ 28°C at Relative Humidities of 50% +-15% (35% to 65%)

Stencil Cleaning Frequency3 to 10 prints per wipe, depending on smallest feature printed, and use of apeture reduction and stencil thickness

Print Speed Range25mm/second to 100mm/second (1 inch/second to 4 inches/second) down to 0.30mm (12 mil) circles and .4mm (16 mil) pitch QFP pads. Optimal results found at 100mm/second.

Solder Spread 88.6% (Average) per JIS-Z-3197:1999 8.3.1.1

Resistance to VoidsExceeds requirements of IPC 7095 Class lll using soak and ramp reflow profiles on OSP, Immersion Tin, Immersion Silver and ENIG finishes.

Resistance to Hot and Cold Slump

Exceeds the requirements of IPC J-STD-005. No slump at 0.2mm gap per JIS-Z-3284.

Reflow Process WindowStraight Ramp, or <60 second soak profile in air. Nitrogen recommended for longer (>60 second) soak profiles.

Residue Cleaning Meets IPC requirements over range of cleaning temperatures and water pressures, using DI water without additives.

Cleanability Meets/Exceeds IPC Bellcore and HP EL-EN861-00 Requirements

J-STD-004 Classification ORH0Halide Content Halide Free

Print Process Window

Reflow Yield

Post Reflow

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5

WS-819 solder paste8 Hour Stencil Life at High Humidity (66% RH @ 27°C)

Vol

ume

ConditionTime

80F/65-67% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr

600

500

400

300

200

100

0

Theoretical Volume (565 cubic mils)

50% Trans Efficiency

Condition80F/65-67% RH

PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA56-12 (12 mil Circles)

Vol

ume

ConditionTime


900

800

700

600

500

400

300

200

100

0




PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA36 (15 mil Circles)

Vol

ume

ConditionTime


1600

1400

1200

1000

800

600

400

200

0





Vol

ume

ConditionTime


3500

3000

2500

2000

1500

1000

500

0


60% Trans Efficie


PWS0608A #70329576 - 8hr Stencil Life Volume ChartQFP120-1 (16 mil pitch QFP deposits, 63x10x5 mils)

PWS-0608A was the pre-commercial laboratory name for WS-819

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6

WS-819 solder paste8 Hour Stencil Life at Low Humidity (23% RH @ 29°C)

Vol

ume

ConditionTime

81-94F/23-25% RHT-8hrT-7hrT-6hrT-5hrT-4hrT-3hrT-2hrT-1hrT-0hr

600

500

400

300

200

100

0



Condition81-94F/23-25% RH

PWS0608A #70329576 - 8hr Stencil Life Volume ChartBGA56-12 (12 mil Circles)

Vol

ume

ConditionTime


900

800

700

600

500

400

300

200

100

0





Vol

ume

ConditionTime


1800

1600

1400

1200

1000

800

600

400

200

0





Vol

ume

ConditionTime


2500

2000

1500

1000

500

0




PWS0608A #70329576 - 8hr Stencil Life Volume ChartQFP120-2 (16 mil pitch QFP deposits, 56.7x9x5 mils)


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WS-819 solder paste

Vol

ume

Print SpeedBoard

4 inches/sec.2 inches/sec.1 inch/sec.432143214321

600

500

400

300

200

100

0



Print Speed1 inch/sec.2 inches/sec.4 inches/sec.

PWS0608A #70329576 - Volume Repeatability ChartBGA56-12 (12 mil Circles)

Fine Feature Print Performance1 inch (25mm) – 4 inches (100 mm)/second1

1) 5 mil laser cut stencil



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8

WS-819 solder pastePrint Process WindowIPC Tack Test

IPC TM-650 2.4.44

∆ Tack < 1 unit over 16 hours at all RH

Time 25% RH 50% RH 75% RH

Initial 2.8 2.8 2.816 hr 3.3 3.0 2.324 hr 3.4 3.1 3.0

Tack Strength (g / sq mm)

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WS-819 solder paste

Wipe Frequency–Number of Print Strokes between Stencil Cleaning Step

Paste: Lot Number:

Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%) Prints 16 (100%) 16 (90%) 20 (100%) 20 (90%)1 0 0 0 0 1 0 0 0 02 0 0 0 0 2 0 0 0 03 0 0 0 0 3 0 0 0 04 1 0 2 0 4 0 0 0 05 1 0 0 0 5 0 0 0 06 0 0 0 0 6 >10 0 0 07 3 0 0 0 7 0 0 0 08 0 0 0 0 8 0 0 0 09 2 0 0 0 9 0 0 0 010 0 0 0 0 10 0 0 0 0

Inside Printer Inside Printer80*F 80 F40 % RH 40 % RH

Temperature: Relative Humidity:

Temperature: Relative Humidity:

QFP Device QFP Device

Solder Paste - Wipe Freqency.ALPHA PWSO608A

Number of Bridges Number of BridgesBoard Set 1 Board Set 2

70329576

Print Parameters: 1 in/s, 1.25 lbs/inch, 0.02 in/s



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10

WS-819 solder pasteReflow YieldReflow Yield

Reflow Process GuidelinesParameter Guideline Additional Information

Atmosphere Air (Straight Ramp or < 60 Second Soak)N2 for soak profiles >60 seconds up to 180 seconds

Mass production verification both in air and N2.

SnAgCu alloy melting ranges. Lower temperature=solidus; higher temperature = liquidus

SAC305: 217 – 220 •SAC405: 217 – 225

Use for reflow above liquidus setting

Profile General Guideline (Typical for SAC305)

Setting Zone Optimal Dwell Period Extended window

40oC to 220oC 105 to 180 seconds <210 seconds

130oC to 220oC 90- 100 seconds <135 seconds

170oC to 220oC 60 seconds <90 seconds

TAL (220oC) 45 - 90 seconds 30-90 seconds.

Peak temp. < 240oC for standard OSP finish

<250°C For Entek HT, Immersion Silver,

Immersion Tin or ENIG finishes

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WS-819 solder paste

Ramp Profile 1: 0.7C/s 235C Peak 60s TAL

Reflow Yield

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12

WS-819 solder paste

Ramp Profile 2:1.5C/s 240C Peak 60s TAL

Reflow Yield

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13

WS-819 solder pasteSoak Reflow Profile: 175C/60s Soak 240C Peak 60s TAL(Nitrogen Required for Longer Soak Profiles)

Reflow Yield

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WS-819 solder paste

Spread Test MethodJIS-Z-3197:1999 8.3.1.1

Polish the surface of phosphor deoxidized copper plate (50×50×0.5mm) with #500 polishing paper applying drops of alcohol. Wash the surface with alcohol and cool in room temperature. Subject to oxidizing treatment in a dryer set at 150 for 1 hour. Put approx. 0.3g of solder paste on the center of the copper plate and weigh with high accuracy.Place the test panel onto the surface of melted solder in a solder bath set at 250.Keep heating for 30sec. after the solder melts.Remove the flux residues from the test panels with solvent. Measure the height of solder with a micrometer and calculate thespreading rate from the following formula. S＝[(D-H)/D] ×100 .

S: Spreading Rate(%)H: Height of Spreading Solder (mm)D: Diameter of Solder assuming it as a sphere (mm)

D ＝ 1.24 V 1/3 V: Mass / Specific Gravity of Solder

3．ApparatusSolder Bath POT-200C

Reflow Yield

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15

WS-819 solder pasteReflow Yield

Result: 88.6% Spread

Density of Solder Alloy [g/cm] 7.4A.

Weight of Paste Weight of Solder Height of Solder Spreading Rate Average[g] [g] [mm] [%] [%]

#1 0.3206 0.2853 0.384 90.8%#2 0.3174 0.2825 0.441 89.4%#3 0.3751 0.3338 0.494 88.8%#4 0.3052 0.2716 0.639 84.5%#5 0.3332 0.2965 0.442 89.6%

88.6%

Sample

#1 #2 #3 #4 #5

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Reflow Yield: Application NoteDefinition of Voiding Performance

0.1d

0.25d

Solder OutlineVoid Outlines

dExample:Total Void Diameter0.10d +0.25d = 0.35d

Location of Void Class I Class II Class III

Void in Solder

(Solder Sphere)

60% of diameter

= 36% of Area

42% of diameter

= 20.25% of Area

30% of diameter

= 9% of Area

Void at interface of

Solder (Sphere)

and Substrate

50% of diameter

= 25% of Area

25% of diameter

= 12.25% of Area

20% of diameter

= 4% of Area

IPC Criteria for Voids in BGAs, IPC 7095 7.4.1.6The IPC criteria provide three classes of acceptance for both the solder sphere and the sphere-pad interface.

Where multiple voids exist, the dimensions will be added to calculate total voiding in the joint.

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WS-819 solder paste

Void Size DistributionBGA256

0.00%

10.00%

20.00%

30.00%

40.00%

50.00%

60.00%

70.00%

80.00%

90.00%

100.00%

ZERO 0-4% 4-8% 8-12% 12-16% 16-20% >20%

% of Joint area

% o

f Joi

nts

WS-819 89.5 M17 Cerf HS 160/60 soak 240Cp

WS-819 89.5 M17 Cerf St.Ramp 0.7C_S 235Cp.

Voiding PerformanceReflow Yield

WS-819 Meets Criteria for Class lll Voiding Using Soak or Ramp Profile

Per IPC 7095 7.4.1.6

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Solder Balling Resistance IPC TM-650 Method 2.4.43

Initial After 4 Hr. @ 25°C, 50% RH

Both “Preferred” per IPC Standard

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Slump ResistanceIPC TM-650 2.4.35

Pad Size 00.63 x 2.03mm 0.33 x 2.03mm 0.63 x 2.03mm 0.33 x 2.03mm

Largest Gap Bridged No Bridges 0.1 0.41 0.25

IPC max gap 0.48 0.2 0.56 0.25bridge allowed Pass Pass Pass Pass

Cold Slump 25C / 50% / 75% RH

Hot Slump Oven 150C / 10mins

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WS-819 solder paste

Cleanability StudyBoards were built using all five pastes and subsequently cleaned using twowater temperatures (120 and 150F) and two conveyor speed settings (2and 5 ft/min) in order to assess the relative cleanability of the pastes. Thepre-wash and wash water pressure were both set at 90 psi, while the rinsewater pressure was set at approximately 70 psi.

IPC J-STD-001 states that the contamination limit for assemblies testedusing the dynamic method of detecting ionic surface contamination(method used with the Ionograph) is 10 µg/in2 (1.56 µg/cm2) sodium chlorideequivalent ionic or ionizable flux residue.

WS-819 (known as PWS-0608A during the product development process)showed Ionograph contamination levels of results of 1.10 to 1.58 µg/in2

(0.172 to 0.256 µg/cm2 ), after two reflows and a 48 hour delay beforecleaning, exceeding the IPC requirement under the pressure andtemperature conditions described above

Post Reflow Cleaning

Paste 120F/2.5 ft/min. 120F/5 ft/min. 150F/2.5 ft/min. 150F/5 ft/min.

PWS0608A 1.5799 µg/in2

•Pass1.1996 µg/in2

Pass1.5106 µg/in2

Pass1.1015 µg/in2

Pass

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WS-819 solder paste

Post Cleaning CosmeticsPaste Aged 21 Days in Sealed Container Prior to Reflow

Post Reflow Cleaning

QFP208

High soak profile 160°C, 240°C peak OSP

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WS-819 solder pastePost Reflow Cleaning

Electrical Reliability

Reflow & Cleaning 1 day 4 day 7 day

Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Within 2 hours of reflow 2.4 x 109 1.0 x 1010 9.9 x 109

Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Delayed 48 hours after reflow 1.4 x 109 2.4 x 109 2.5 x 109

SIR (Ω)

IPC SIR 85C / 85% RH, -48 V Bias

Req: SIR > 1 x 108 Ω after 4 & 7 days (PASS)

Reflow & Cleaning Ionic Contamination (µg/sq in)

Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Within 2 hours of reflow 1.36

Ramp 0.7 °C/sec, 237 °C peak Clean 130 °C, 8 min DI H20 - Delayed 48 hours after reflow 2.43

Ionic Cleanliness

Req: Ionic contamination < 10 µg / sq in (PASS)

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23

WS-819 solder pasteShelf Life

3 Weeks Room Temperature Stability(25°C; 77°F) in Unopened Container

0

500

1000

1500

2000

2500

3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

Days After Manufacture

10 R

PM M

alco

lm V

isco

sity

(KC

PS)

WS-819 Viscosity

Upper Limit

Low er Limit

6 Month Shelf Life When Stored in Sealed Jar at 1° to 10 ° C (34° to 50° F)

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24

WS-819 solder pasteSummary

Delivers excellent print volume and consistency• Prints .4mm (16 mil) pitch QFP’s , .3mm (12 mil) circles with Type 3 Powder• Consistent Print Volume Repeatability at both Low (<35%) and High (65%) Relative Humidity• 8 Hour Stencil Life at Low and High Humidity• Excellent post print tack life• Wide print speed process window (25mm/sec to 100mm/sec)

High Post Reflow Yields• IPC Class III Voiding Performance (Using Soak Reflow Profile)• Resistance to cold and hot slump• Easily Cleaned with Water, after 2 lead free reflow cycles and 48 hour delay

Electrical Reliability• IPC SIR• Bellcore SIR• Bellcore Electromigration• HP EL-EN861-00 Electromigration

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Leading Products

No Clean, SnPb• ALPHA OM-6106

•ALPHA OM-5100

No Clean, Lead-free• ALPHA OM-338 T

•ALPHA OM-338 PT

• ALPHA OM-350

Water Soluble, SnPb• ALPHA WS-809

Water Soluble, Lead-free• ALPHA WS-819

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The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 5-9-07

14 Tuas Avenue 10, Singapore 639138, 65-68611977, www.alphametals.com

SM919

ALPHA® WS-819 Water Soluble Lead-Free Solder Paste DESCRIPTION ALPHA® WS-819 is the newest Alpha® brand lead free, halide free solder paste offering the ideal combination of printability under varying environmental conditions, 8 hour stencil life, resistance to BGA voids, high spread combined with cleanability with water based cleaning systems. FEATURES & BENEFITS • Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features

• 8 hour stencil life at 35% to 65% Relative humidity

• High spread/wetting lead free paste compatible with lead free alloys and surface finishes

• High Reflow Yield with IPC Class III Voiding Performance when used to solder BGA components

• Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP.

• Cleanable with water based cleaning systems

PHYSICAL PROPERTIES • Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu), SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) • Application : Stencil printing (89.5% Metal Loading, M-17 Viscosity)

Dispense application (85% Metal Loading, Type 4 Powder, M9 Viscosity) • Powder Size: Type 3 (25µ-45µ) • RoHS Status: Completely free of Hazardous Materials per RoHS Directive 2002/95/EC APPLICATIONS Alpha® WS-819 was formulated to meet the requirements of water soluble solder lead free applications. Alpha® WS-819 was developed to offer best in class resistance to heat and humidity variations in the printing process, while offering exceptional post reflow cleanability and low BGA voiding.

This paste is designed to enable users of Alpha® WS-609; WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials. SAFETY While the ALPHA® WS-819 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the MSDS for additional safety information. SHIPPING AND STORAGE ALPHA® WS-819 is shipped in thermally controlled boxes and should be stored refrigerated upon receipt at 340 - 450F (10 - 70C). ALPHA® WS-819 should be permitted to reach room temperature before opening the package prior to use.

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ALPHA® WS-819 TECHNICAL DATA Physical PropertiesItems ALPHA® WS-819 SAC 305/405

89.5-3-M17 (stencil printing) Test Method

Appearance (flux residues after reflowed) Light yellowish color (before water washed) CEAMG PUT 001.05 Metal content (%) 89.4% +- 0.2% CEAMG STM 0355 Viscosity (Poise, Malcom spiral viscometer @10rpm)

M17 for stencil printing M9 for dispensing

CEAMG STM 0541

Stencil life (50%+- 15%RH, 25°C) >8 hours CEAMG PUT 001.01 Printability Suitable for fine pitch printing applications (Down

to 16 mil (0.4mm) pitch QFP components, 12 mil (0.3mm) BGA circles @) up to 100 mm/sec squeegee speed, using 5 mil (125µ) thick laser cut stencil

CEAMG PUT 001.01

Response to pause 0-1 Knead Stroke Required CEAMG PUT 001.08 Tack Initial 2.0 g/mm²; 1.8 g/mm² after 4 hours at 25°C

and 50% R.H. IPC TM-650 2.4.44

Random Solder Balls Preferred (Both Initial and after 4 hours at 25°C and 50% R.H.

IPC TM-650 2.4.43

Slump Resistance Pass IPC TM-650 2.4.35 Chemical Properties

Items ALPHA® WS-819 Flux System Halide content (IPC J-Std-004) ORH0 Corrosivity (IPC J-Std-004) Not applicable for water soluble solder paste

ALPHA® WS-819 PROCESSING GUIDELINES

STORAGE-HANDLING PRINTING / DISPENSING REFLOW CLEANING • Refrigerate to guarantee stability @

34-45°F (1-7°C) • Warm-up of 500g jar to room

temperature (should be ~ 6 hours). Set up printer with room temperature paste. Check paste temperature with a thermometer.

• Do not remove worked paste from

stencil and mix with unused paste in jar. This will alter rheology of unused paste.

• Do not shake or mix paste using

automatic paste shaking equipment prior to opening jar. The plunger insert used may submerge into paste and produce difficulties with plunger removal.

STENCIL: Recommend ALPHA CUT Laser Cut Stencil @ 0.005 inch (5 mil, 127µ) thick for 0.012 inch (.30 mml) pitch QFPs SQUEEGEE: Metal (Recommended) Print Speed: 2.0 -4.0 in./sec (50-100 mm/sec.) 4.0 in/sec. optimal SQUEEGEE: Pressure: 1.5 to 2.0 lbs./ linear in. (0357 Kg/cm) Stencil Release Speed: .02 in/sec (0.5 mm/second) Compatible with DEK Pro-Flow Enclosed print head. Report available upon request.

ATMOSPHERE: • Clean-dry air If soak temp ≥ 160°C) and soak time > 45-60 seconds Nitrogen recommended for longer soak profiles (60 to 180 seconds). • PROFILE (PRINTING): • See profiles evaluated in

product development below • Slow ramp from 130oC to

180oC for 90~120 seconds • Ramp @ 0.5~2oC/sec to peak

temperature 230oC - 250oC TAL for 40~80 seconds.

• Ramp down to R.T. @ 1~3oC/sec.

• ALPHA WS-819 is designed to be water rinsed in washing operations. with minimal foaming in recirculating systems.

• The flux residues from

ALPHA WS-819 are completely water soluble. This allows for more flexible washing conditions which can be board design specific.

• If lower/no foaming is desired

in cleaning equipment, Alpha P-2000 defoamer may be used.

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Reflow Profiles Tested, using Clean, Dry Air CERF Straight Ramp 0.7C/s 235C Peak 60s TAL


CERF Straight Ramp 1.5C/s 240C Peak 60s TAL

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CERF 60s Soak @ 175°C/ 240C Peak 60s TAL

Note- profiles using a soak time > 60 seconds may require nitrogen for satisfactory results Use of air for long soak profiles have resulted in dull, grainy joints, and possible de-wetting of solder joints.


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MATERIAL SAFETYDATA SHEET

PRODUCT NAME: ALPHA WS-819 SOLDER PASTE SAC305 & SAC405

MANUFACTURER'S NAME: ALPHA METALS, INCADDRESS: 600 ROUTE 440

JERSEY CITY, NJ 07304TRANSPORT EMERGENCY #: CHEMTREC: 1-800-424-9300

BUSINESS PHONE: 1-201-434-6778

CHEMICAL NAME CAS # % W/W OSHA PEL - TWATIN 7440-31-5 80 - 90 2.0 mg/m3SILVER 7440-22-4 1 - 5 0.01 mg/m3COPPER 7440-50-8 0.2 - 1 0.1 mg/m3 (fume)Ethoxylated-N-Tallow 61790-85-0 1 - 3 NEAlkyltrimethylenediamineFORAL AX 65997-06-0 1 - 3 **Ethoxylated octylphenol 9002-93-1 1 - 5 NE

**SENSITIZER

EMERGENCY OVERVIEW: MODERATE EYE IRRITANT.WILL NOT BURNTOXIC BY INHALATION.MODERATE GASTROINTESTINAL TRACT IRRITANT.MODERATE RESPIRATORY TRACT IRRITANT.CAUSES SKIN IRRITATION

HMIS RATING SYSTEM:Health: 1 ; Flammability: 0 ; Reactivity: 0 ; Protection: C

NFPA RATING SYSTEM:Health: 2 ; Flammability: 0 ; Reactivity: 0

ROUTES OF ENTRY: INHALATION; INGESTION; SKIN CONTACT; EYE CONTACT;ABSORPTION;

TARGET ORGANS: BLOOD; DIGESTIVE TRACT; KIDNEYS; NERVOUS SYSTEM; EYES;SKIN.

MEDICAL CONDITIONS AGGRAVATED: DIGESTIVE TRACT DISEASE; KIDNEY DISEASEEYE DISEASE. SKIN DISEASE INCLUDING ECZEMAAND SENSITIZATION.

IMMEDIATE (ACUTE) SYMPTOMS OVER-EXPOSURE BY ROUTE OF EXPOSURE:INHALATION: CAN CAUSE MODERATE RESPIRATORY IRRITATION, DIZZINESS,

WEAKNESS, FATIGUE, NAUSEA AND HEADACHE. MAY CAUSE AN

1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION

2. INGREDIENT AND EXPOSURE LIMIT INFORMATION

3. HAZARDS IDENTIFICATION

MSDS ID: AA 00151090

Page 1 of 6Revised 5/21/07Replaces 4/23/07Printed 5/21/07

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ALLERGIC REACTION. MAY CAUSE RESPIRATORY TRACTSENSITIZATION, CHARACTERIZED BY ASTHMA-LIKE SYMPTOMS.

EYES: CAN CAUSE MODERATE IRRITATION, TEARING AND REDDENING, BUTNOT LIKELY TO PERMANENTLY INJURE EYE TISSUE.

SKIN CONTACT: CAN CAUSE SLIGHT IRRITATION.INGESTION: IRRITATING TO MOUTH, THROAT, AND STOMACH. CAN CAUSE

ABDOMINAL DISCOMFORT, NAUSEA, VOMITING AND DIARRHEA.

LONG TERM (CHRONIC) HEALTH EFFECTS:CARCINOGENICITY: NONE OF THE SUBSTANCES HAVE BEEN SHOWN TO CAUSE CANCER IN

LONG TERM ANIMAL STUDIES. NOT A CARCINOGEN ACCORDING TO NTP,IARC, OR OSHA.

REPRODUCTION: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTSPRESENT AT GREATER THAN 0.1% MAY CAUSE BIRTH DEFECTS.

MUTAGENICITY: NO DATA AVAILABLE TO INDICATE PRODUCT OR ANY COMPONENTSPRESENT AT GREATER THAN 0.1% IS MUTAGENIC OR GENOTOXIC.

SKIN EXPOSURE: WASH WITH SOAP AND WATER. REMOVE CONTAMINATED CLOTHING ANDLAUNDER. GET MEDICAL ATTENTION IF IRRITATION DEVELOPS ORPERSISTS.

EYE EXPOSURE: FLUSH EYES WITH PLENTY OF WATER FOR AT LEAST 20 MINUTESRETRACTING EYELIDS OFTEN. TILT THE HEAD TO PREVENT CHEMICALFROM TRANSFERRING TO THE UNCONTAMINATED EYE. GET IMMEDIATEMEDICAL ATTENTION.

INHALATION: REMOVE TO FRESH AIR. IF BREATHING IS DIFFICULT, HAVE ATRAINED INDIVIDUAL ADMINISTER OXYGEN. IF NOT BREATHING, GIVEARTIFICIAL RESPIRATION AND HAVE A TRAINED INDIVIDUALADMINISTER OXYGEN. GET MEDICAL ATTENTION IMMEDIATELY

INGESTION: SEEK MEDICAL ATTENTION IMMEDIATELY.NOTES TO DOCTOR: NO ADDITIONAL FIRST AID INFORMATION AVAILABLE

FLAMMABILITY SUMMARY: NOT COMBUSTIBLEFLASH POINT: N/AAUTOIGNITION TEMPERATURE: N/EEXPLOSIVE LIMITS % IN AIR: N/EEXTINGUISHING MEDIA: USE ALCOHOL RESISTANT FOAM, CARBON DIOXIDE, OR

DRY CHEMICAL WHEN FIGHTING FIRES. WATER ORFOAM MAY CAUSE FROTHING IF LIQUID IS BURNINGBUT IT STILL MAY BE USEFUL EXTINGUISHING AGENTIF CAREFULLLY APPLIED TO THE SURFACE OF THEFIRE. DO NOT DIRECT A STREAM OF WATER INTO

3. HAZARDS IDENTIFICATION (Cont.)

4. FIRST AID MEASURES

5. FIRE FIGHTING MEASURES



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MOLTEN MATERIAL.FIRE AND EXPLOSION METHODS: MATERIAL MAY BE IGNITED ONLY IF PREHEATED TO

TEMPETURES ABOVE THE HIGH FLASH POINT, FOREXAMPLE IN A FIRE. DUST AT SUFFICIENTCONCENTRATIONS CAN FORM EXPLOSIVE MIXTURESWITH AIR.

FIRE FIGHTING METHODS: WILL NOT BURN, NO SPECIAL INSTRUCTIONSAVAILABLE. USE METHODS APPROPRIATE FORSURROUNDING MATERIALS.

HAZARDOUS COMBUSTION PRODUCTS: CARBON MONOXIDE; CARBON DIOXIDE; METAL FUMES;TOXIC FUMES.

PRECAUTIONS AND EQUIPMENT: EXPOSURE TO THE SPILLED MATERIAL MAY BE IRRITATINGOR HARMFUL. FOLLOW PERSONAL PROTECTIVE EQUIPMENTRECOMMENDATIONS FOUND IN SECTION VIII OF THISMSDS.

METHODS FOR CLEAN-UP: WEAR COMPLETE AND PROPER PERSONAL PROTECTIVEEQUIPMENT FOLLOWING THE RECOMMENDATION OF SECTIONVIII GATHER AND STORE IN A SEALED CONTAINERPENDING A WASTE DISPOSAL EVALUATION. DO NOT USEBROOM OR AIR CLEANING ETC.

HANDLING MEASURES: HARMFUL OR IRRITATING MATERIAL. AVOID CONTACTING AND AVOIDBREATHING THE MATERIAL. USE ONLY IN A WELL VENTILATEDAREA.AS WITH ALL CHEMICALS, GOOD INDUSTRIAL HYGIENE PRACTICESSHOULD BE FOLLOWED WHEN HANDLING THIS MATERIAL. AVOIDCONTACT WITH MATERIAL, AVOID BREATHING DUSTS OR FUMES, USEONLY IN A WELL VENTILATED AREA. WASH THOROUGHLY AFTERHANDLING; WASH HANDS BEFORE EATING; DO NOT GET IN EYES,ON SKIN AND CLOTHING; MINIMIZE DUST GENERATION ANDACCUMULATION; AVOID CREATING DUSTS AS AN EXPLOSIVEHIGH CONCENTRATIONS.

STORAGE MEASURES: NO SPECIAL REQUIREMENTSKEEP AWAY FROM FOOD AND DRINKING WATER. STORE IN A COOLDRY PLACE.

5. FIRE FIGHTING MEASURES (Cont.)

6. ACCIDENTAL RELEASE MEASURES

7. HANDLING AND STORAGE



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ENGINEERING MEASURES: USE LOCAL EXHAUST VENTILATION OR OTHER ENGINEERINGCONTROLS TO MINIMIZE EXPOSURES AND MAINTAIN OPERATORCOMFORT.ENGINEERING CONTROLS MUST BE DESIGNED TO MEET THEOSHA CHEMICAL SPECIFIC STANDARD IN 29 CFR 1910.VENTILATION IS REQUIRED TO MAINTAIN OPERATOR EXPOSUREBELOW PUBLISHED EXPOSURE LIMITS. USE PROCESSENCLOSURES, LOCAL EXHAUST VENTILATION, OR OTHERENGINEERING CONTROLS TO CONTROL AIRBORNE LEVELS BELOWRECOMMENDED EXPOSURE LIMITS; EXPLOSION PROOF EXHAUSTVENTILATION SHOULD BE USED. FACILITIES STORING ORUSING THIS MATERIAL SHOULD BE EQUIPPED WITH ANEYEWASH AND SAFETY SHOWER.

RESPIRATORY PROTECTION: RESPIRATORY PROTECTION MAY BE REQUIRED TO AVOIDOVEREXPOSURE WHEN HANDLING THIS PRODUCT. GENERAL ORLOCAL EXHAUST VENTILATION IS THE PREFERRED MEANS OFPROTECTION. USE A RESPIRATOR IF GENERAL ROOMVENTILATION IS NOT AVAILABLE OR SUFFICIENT TOELIMINATE SYMPTOMS.FOLLOW A RESPIRATORY PROTECTION PROGRAM THAT MEETS 29CFR 1910.134 AND ANSI Z88.2 REQUIREMENTS WHENEVERWORK PLACE CONDITIONS WARRANT THE USE OF ARESPIRATOR. WEAR A NIOSH APPROVED RESPIRATOR IF ANYEXPOSURE IS POSSIBLE.

EYE PROTECTION: WEAR CHEMICALLY RESISTANT SAFETY GLASSES WITH SIDESHIELDS WHEN HANDLING THIS PRODUCT. DO NOT WEARCONTACT LENSES.WEAR GOGGLES AND A FACE SHIELD

SKIN PROTECTION: WEAR PROTECTIVE GLOVES. INSPECT GLOVES FOR CHEMICALBREAK-THROUGH AND REPLACE AT REGULAR INTERVALS. CLEANPROTECTIVE EQUIPMENT REGULARLY. WASH HANDS AND OTHEREXPOSED AREAS WITH MILD SOAP AND WATER BEFORE EATING,DRINKING, AND WHEN LEAVING WORK

CONTROL PARAMETERS: ----------ACGIH EXPOSURE LIMITS----------------CHEMICAL NAME TLV-TWA STEL CEILINGForax AX Sensitizer;keep

exposure as lowas possible.

TIN 2 mg/m3 TWASILVER 0.01 mg/m3 TWACOPPER 0.1 mg/m3 TWA (fume)

8. EXPOSURE CONTROLS AND PERSONAL PROTECTION



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COLOR: GREYODOR: NONEpH: N/A

DECOMPOSITION PRODUCTS: METAL FUMES; TOXIC FUMES.INCOMPATIBLE MATERIALS: STRONG ACIDS; STRONG OXIDIZING AGENTS;CONDITIONS TO AVOID: NONE KNOWNCONTAMINATION: CONTACT WITH AIR. CONTACT WITH

WATER

COMPONENT TOXICOLOGY DATA (NIOSH)CHEMICAL NAME LD50/LC50

Ethoxylated octylphenol Acute oral toxicity (LD50):1800 mg/kg(Rat)

Ethoxylated-N-Tallow LD50: 945 mg/kg oral ratAlkyltrimethylenediamine

Floral AX Sensitizer

OVERVIEW: SLIGHT ECOLOGICAL HAZARD. IN HIGH CONCENTRATIONS, THISPRODUCT MAY BE DANGEROUS TO PLANTS AND/OR WILDLIFE.

WASTE DESCRIPTION: SPENT OR DISCARDED MATERIAL IS PROBABLY A HAZARDOUS WASTE.DISPOSAL METHODS: DISPOSE OF IN ACCORDANCE WITH FEDERAL, STATE, LOCAL, OR

PROVINCIAL LAWS AND REGULATIONS.

9. PHYSICAL AND CHEMICAL PROPERTIES

10. STABILITY AND REACTIVITY

11. TOXICOLOGICAL INFORMATION

12. ECOLOGICAL INFORMATION

13. DISPOSAL CONSIDERATIONS



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SHIPPING BASIC DESCRIPTION: DOT & IATA: NOT RESTRICTED

TSCA STATUS: ALL COMPONENTS OF THIS PRODUCT ARE LISTED ON THE TSCA INVENTORYOF EXISTING CHEMICAL SUBSTANCES.

REGULATED CHEMICALS:

CHEMICAL NAME REGULATIONSILVER 7440-22-4 SARA 313

WHMIS rating: D2B

The information contained herein is based on data considered accurate.However, no warranty is expressed of implied regarding the accuracy of thesedata or the results to be obtained from the use thereof. Additionally, AlphaMetals, Inc. assumes no responsibility for injury to the vendee or thirdpersons proximately caused by the material even if reasonable safetyprocedures are followed. Furthermore, vendee assumes the risk in his use ofthe material.

14. TRANSPORT INFORMATION

15. REGULATORY INFORMATION

16. OTHER INFORMATION



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Solder preforms for product and process improvement By Krayden Alpha technical specialist.

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Transcript of Solder preforms for product and process improvement By Krayden Alpha technical specialist.