Pursue Speed and Accuracy togo to New Stage.

New Product

1

VP6000-VVP5200-V Series

Solder Paste Inspection Machine

CC-1041A

Quality of the total line shall be improved !

VP6000-V/5200-VVP6000-V/5200-V

Printing Machine

(Remote Monitoring)

Solder Paste Inspection Machine

Mounter

After-Mounted Inspection Machine

ReflowAfter-ReflowInspection Machine

FBFBFB

Intelligent Eye Intelligent Eye

Elimination of Solder

Printing Faults at the

initial stage.

Adjustment of Printing Machine based

on Inspection Result Data.

Adjustment of Printing Machine based

on Inspection Result Data.

Advice Advice

SmartRIn (Remote Monitoring)

PCB quality shall be improved by combination function

with another machines.

Inspection, production situation for max 6 sets of VP can be monitored

by mobile terminal.

Inline detection of mounting faults at the initial stage, where 70% of faults are developed Printing quality improvement by utilizing SPC Function

9,400m㎡/sec

Top class inspection speed in the industry

VP5200-V（25μm）

The Highest Speed of VP Series：9,400mm2/sec.

VP-V series has achived higher speed to realize corresponding high speed product line.

Inline Detection

High speed inspection

VP6000-V/5200-V

AIR OIL

Environmental SupportInspection camera reads barcode on PCB. The read information shall be input to inspection results.

Support Experience : 1D, 2D (Data Matrix ECC200, QR Code Model 2)

Support for RoHS Directive

Barcode Reading Function, Option

By grouping Statistic Data to each category, Printing Trend can be compared. It is optimized to compare each printing condition, and that of cleaning before/after printer.

The Report of solder paste situation can be created automatically on the basis of inspection result data. The report with images also is available.

Solder paste's volume or displacement trend can be confirmed on the PCB layout. It helps to recognize easily musks leaving solder paste and displacement areas.

(With Color Image Saving Function for All Pads at Real Time)

Statistic Data can be displayed flexibly per time periods, parts and areas. For instance, it makes a graph of only the same BGA inspection results, which produced in the same month.

Printing Condition Improvement Report Function

Displaying Print Trend Flexible Statistic Display

Advanced SPC FunctionVarious statistical work functions achieve process improvement by complete simple operation.

Support for RoHS Directive.

The machine which cares for global environment and does not required pneumatic supply.

Long term maintenance free guide is adopted to control accuracy degradationand human power for maintenance.

6 Materials RoHS Bans

Lead

Mercury Cadmium

Polybrominated Biphenyl

SexivalentChrome

PBDERoHS directive is supported. Not required Pneumatic Supply. This machine is friendly to global environment.

[Detected Sample]

Maximum height pad

0603 pad

Inspection Resolution can be switched by parts unit to

pursue either accuracy or speed.

Inspection Resolution Switch Function

High Accuracy and Repeatability support Inspection of Fine Pads

Repeatability of height inspection: within 1μm at 3 (height standard jig)

Repeatability of volume inspection: within 2% at 3 (CKD's sample PCB)

Standard Inspection

(25μm)

Image Pictures

High Resolution INSP

(12.5μm)

CSP Solder Shape(microscope)

QFP Solder Shape(microscope)

CSP Solder Shape(Shape Display VP6000M-V)

QFP Solder Shape(Shape Display VP6000M-V)

High Accuracy

Solder paste inspection is also usable.

Trend of PCB warping is displayed in colored distribution.

Difference between maximum and minimum height of IC pad (BGA, CSP)

can be detected.

■ Confirming PCB quality.

■ Possible to examine the relation between warping trend of PCB bottom side and

reflow condition.

■ Possible to examine the relation between warping trend of PCB and inspection

result.

PCB Warping Distribution Display(Standard)Coplanarity Inspection (Standard)

Minimum height pad

Causing loose connection. Confirmed

excessivewarpingat this area.

Realized 3Dglue inspectionfor qualityimprovement

Glue Inspection(Option)Foreign Material Inspection(Option)Foreign material can be detected at the same time as solder paste

inspection. Exclusive NG check screen comes up with alarm.

Dust ofcleaning paper

Dust of string

Size of detectable foreign material (X・Y): 100μm on more height: Upper level of printed silk

PCBcutting dust

Scattering ofsolder paste

Each pad is judged as “OK”,but “NG” on CoplanarityInspection.

Z axis Auto-Focus FunctionPCB Warping is recognized per inspection area by correcting the distance between inspection camera and PCB. It can inspect follow suit PCB Warping by focusing.

Camera

Projector

Camera

Projector

■ It takes only 3 minutes to complete Inspection Program from loading Gerber Data.

■ Inspection Program without Gerber Data can be created with scanning printed PCB.

■ Optional mount data conversion function can make parts registration easily.

Loading DataParts

Registration Completed

Creating Inspection Program : Only 3minutes

Simple Operation

Simple Operation − Full Touch Panel Method

■ Pursuing Simple Operation, full touch panel is adopted, instead of operation buttons and switched. Complete one touch operation can be achieved from setting speci�cations to checking inspection results.

■ Each menu is tag selecting type with simple menu, which anyone can operate easily.

■ Setting log-in ID can make operating administrations.

Besides displaying 3D shape image, 2D actual image (color display) is also checked on the screen at the same time, and solder paste shapes can be recognized ef�ciently.

Speci�cation Setting Start Inspection Inspection Result Check Pad Shapes

One Touch

Operation

Outline of only solder paste is extracted with a ring shape (360°circle) light source projecting against inspection object (solder). This method inspect by 3D for only solder paste existing area, achieves more reliable inspection.

Inspection Principles of VP Series

A camera, which positioned at the vertical direction, captures inspection object (solder) images with stripe pattern light by twin projectors* from the cross angle. With the height of the objects, the stripe pattern is sifted against the base face and captured, so the shift amount is converted with the triangulation principle.* only VP6000-V

ProjectorsRing Light

■

Options*1 Use CKD sample board

1450

1450

724 904

Standard

High Resolution

Twin Projectors Single Projector

Within 2% Within 3%

25/12.5μm 20/10μm 15/7.5μm 25/12.5μm 20/10μm 15/7.5μm

8900 5700 3200 9400 6000 3300

5600 3500 1900 6000 3700 2000

Phase Shift Method

(M) 50x50mm~330x250mm

(L) 50x50mm~510x460mm

0.3~5.0mm

±5mm

(M) 724x870x1450mm

(L) 904x1080x1450mm

Single Phase AC200~230V 50~60Hz MAX 1KVA

Not Required

(M) 500kg

(L) 560kg

Standard Equipped, for Only PC.

RoHS

Digital Switching Method

∙ Transformer.

∙ Barcode Reading Function.

∙ Mount Data Conversion Software.

∙ Glue Inspection.

∙ Foreign Material Inspection.

∙ Advice Function.

∙ SmartRIn. (Remote Monitoring) ∙ Data Station, VPDS.

Up to 6 units can be connected.

∙ Loading Conveyor.

∙ Unloading Conveyor.

870 1080

VP6000L-V/VP5200L-VVP6000M-V/VP5200M-V

Standard Specification

■Outline View

Model VP5200-VVP6000-V

Inspection Method

PCB Size

PCB Thickness

Projection

Inspection Resolution

Speed (mm2/sec)

Accuracy (Volume 3 )*1

PCB Warping

Outline Dimension

Power Supply

Pneumatic Supply

Weight

UPS

Environmental Support

2015.9.AAC

営業統括部