SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD...

18
SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho

Transcript of SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD...

Page 1: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

Breakdown Voltage(1)

2013.01.02SD Lab. SOGANG Univ.

Doohyung Cho

Page 2: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

Contents

3.1 Avalanche Breakdown 3.1.1 Power Law Approximations for the Impact Ionization Coeffi-cients 3.1.2 Multiplication Coefficient3.2 Abrupt One-Dimensional Diode3.3 Ideal Specific On-Resistance3.4 Abrupt Punch-Though Diode3.5 Linearly Graded Junction Diode3.6 Edge Terminations 3.6.1 Planar Junction Termination 3.6.2 Planar Junction with Floating Field Ring 3.6.3 Planar Junction with Multiple Floating Field Rings

Page 3: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.1 Avalanche Breakdown

• Mobile carriers are accelerated in the presence of a high electric field until they gain sufficient energy to create hole–electron pairs upon collision with the lattice atoms.

• An impact ionization coefficient was defined as the number of elec-tron–hole pairs created by a mobile carrier traversing 1 cm through the depletion region along the direction of the electric field.

Page 4: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.1.1 Power Law Approximations for the Impact Ion-ization Coefficients

• Fulop’s approxima-tion

• Baliga’s approxima-tion

• dashed line together with the impact ionization coefficient for electrons in silicon as governed by the Chynoweth’s law (shown by the solid line)

Page 5: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.1.2 Multiplication Coefficient

• The avalanche breakdown condition is defined by the impact ionization rate becoming infinite

• Total number of electron–holes pairs created as a result of the genera-tion of a single electron–hole pair at a distance x from the junction

Page 6: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.2 Abrupt One-Dimensional Diode

Page 7: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.2 Abrupt One-Dimensional Diode

Page 8: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.3 Ideal Specific On-Resistance

Page 9: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.4 Abrupt Punch-Through Diode

• Resistance of the drift region is greatly reduced during on-state cur-rent flow by the injection of a large concentration of minority carriers.

Page 10: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.5 Linearly Graded Junction Diode

Page 11: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6 Edge Terminations

• If the junction depth is 1 μm and the depletion region has a thickness of 30 μm, the maximum electric field at the cylindrical junction will be 15 times larger than that for the parallel-plane case

• Power devices with high breakdown voltages require large junction depths to reduce the degradation of the breakdown voltage due to junction curva-ture

Page 12: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6 Edge Terminations

Page 13: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6 Edge Terminations

• Electric field is enhanced even fur-ther than for the cylindrical junction, because the field lines approach a point in three dimensions for the spherical junction

• If the junction depth is 1 μm and the depletion region has a thickness of 30 μm, the maximum electric field at the spherical junction will be 20 times larger than that at the cylin-drical junction

Page 14: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6.2 Planar Junction with Floating Field Ring

• Floating field ring must be located at an optimal position to maximize the breakdown voltage

Page 15: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6.2 Planar Junction with Floating Field Ring

• The optimum spacing is in the range of 0.15–0.35 times the deple-tion layer width for the parallel-plane junction at breakdown

Page 16: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6.2 Planar Junction with Floating Field Ring

• The presence of a negative charge in the oxide compensates the positive charge at the ionized donors, producing an extension of the depletion layer along the sur-face. The presence of a positive charge has the opposite effect on the depletion layer at the surface.

• When Fixed Oxide Charge=1011cm-2

(Breakdown voltage is degraded 50V)

Page 17: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6.2 Planar Junction with Floating Field Ring

• It is necessary to make the width of the floating field ring at least equal to the depletion width (WPP) of the parallel-plane junction at breakdown

Page 18: SOGANG UNIVERSITY SOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB. Breakdown Voltage(1) 2013.01.02 SD Lab. SOGANG Univ. Doohyung Cho.

SOGANG UNIVERSITYSOGANG UNIVERSITY. SEMICONDUCTOR DEVICE LAB.

3.6.3 Planar Junction with Multiple Floating Field Rings

• The optimization of the spacing between the rings requires a precise knowledge of the charge in the field oxide

• There is a diminishing benefit in terms of increasing the break-down voltage from the addition of floating rings, while more space is occupied by the edge termination resulting in a larger die size and cost.