SMD REFLECTOR - Everlight Americas
Transcript of SMD REFLECTOR - Everlight Americas
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SMD REFLECTOREAPL3232RGBA0
Features
․ Package in 12mm tape on 7〞diameter reel․ Compatible with automatic placement equipment․ Various Compatible with infrared and vapor phase reflow solder process․ 6 Pins for separate control of each chip and better thermal management․ Good color fidelity and brightness uniformity across the viewing angle․ Pb-free․ RoHS compliant
Description
․ The SMD LED package provides a perfect solution when users need a clear view of signage display with any size board with 3 in 1 full color SMD LEDs which offer smaller pixel pitch between two LEDs to create a high resolution and better contrast with its black surface design.
Applications
․ Indoor signage display applications․ Indicator and backlighting for all consumer electronics.․ Gaming equipment.․ General use.
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DATASHEETSMD REFLECTOREAPL3232RGBA0
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Device Selection Guide
Chip Materials Emitted Color Resin Color
AlGaInP Brilliant Red
Water DiffuseInGaN Brilliant Green
InGaN Brilliant Blue
Absolute Maximum Ratings (Ta=25℃)
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IFR:50G:30B:30
mA
Peak Forward Current
(Duty 1/10 @1KHz)IFP
R:100G:100B:100
mA
Power Dissipation PdR:130G:110B:110
mW
Junction Temperature Tj 100 ℃
Operating Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -40 ~ +90 ℃
ESD
(Classification acc. AEC Q101)ESDHBM
R:2000G:1000B:1000
V
Soldering Temperature TsolReflow Soldering : 260 fo℃ r 30 sec.
Hand Soldering : 350 for 3 sec.℃
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Electro-Optical Characteristics (Ta=25℃)
Parameter Symbol Min. Typ. Max. Unit Condition
Luminous Intensity Iv
R 435 ----- 900mcd IF=20mAG 1045 ----- 2210
B 280 ----- 485
Viewing Angle 2θ1/2 ----- 120 ----- deg IF=20mA
Peak Wavelength Λp
R
-----
632
----- nm IF=20mAG 518
B 468
Dominant Wavelength Λd
R 620.0
-----
629.0
nm IF=20mAG 522.0 534.0
B 462.0 474.0
Spectrum Radiation Bandwidth Δλ
R
-----
20
----- nm IF=20mAG 25B 25
Forward Voltage VF
R 1.75
-----
2.55
V IF=20mAG 2.75 3.35
B 2.75 3.35
Reverse Current IR ----- ----- 10 μA VR=5V
Note: 1. Tolerance of Luminous Intensity: ±10%2. Tolerance of Dominant Wavelength: ±1nm3. Tolerance of Forward Voltage: ±0.1V
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Bin Range of Luminous Intensity(Red)
Bin Code Min. Max. Unit Condition
RA 435 520
mcd IF =20mARB 520 625RC 625 750RD 750 900
Bin Range of Dominant Wavelength
Bin Code Min. Max. Unit Condition
R1 620.0 623.0nm IF =20mAR2 623.0 626.0
R3 626.0 629.0
Bin Range of Luminous Intensity(Green)
Bin Code Min. Max. Unit Condition
GA 1045 1275
mcd IF =20mAGB 1275 1530GC 1530 1840GD 1840 2210
Bin Range of Dominant Wavelength
Bin Code Min. Max. Unit Condition
G1 522.0 525.0
nm IF =20mAG2 525.0 528.0G3 528.0 531.0G4 531.0 534.0
Note: 1.Tolerance of Luminous Intensity: ±10%2.Tolerance of Dominant Wavelength: ±1nm
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Bin Range of Luminous Intensity(Blue)
Bin Code Min. Max. Unit Condition
BA 280 335mcd IF =20mABB 335 400
BC 400 485
Bin Range of Dominant Wavelength
Bin Code Min. Max. Unit Condition
B1 462.0 465.0
nm IF =20mAB2 465.0 468.0B3 468.0 471.0B4 471.0 474.0
Note: 1. Tolerance of Luminous Intensity: ±10%2. Tolerance of Dominant Wavelength: ±1nm
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Typical Electro-Optical Characteristics Curves
Forward Voltage V (V)
For
war
d C
urre
nt
I (
mA
)F
Forward Voltage
F
Ta=25°C
Forward Current vs.
0
10
20
25
30
40
50
2.82.01.6 2.4 4.23.43.0 3.8
RED GREENBLUE
25
0
50
75
100Ta=25°C
Rel
ativ
e lu
min
ous
inte
nsi
ty (
%)
Wavelength λ (nm)
Spectrum Distribution
400 550450 500 600 650 700
REDGREENBLUE
Forward Current Derating Curve
Forward Current I (mA) FP
0
1
0
2
3
4
5
4020 60 10080
Rel
ativ
e lu
min
ous
inte
nsit
y
RED
GREEN
BLUE
Ta=25°CRadiation Diagram
70°0.7
0.5 0.40.10.3 0.290°80°
0.6
1.0
0.9
0.8
0° 10°
40°
60°
50°
30°20°
30°20°Ta=25°C
10°0°Radiation Diagram
40°
60°
50°
90°80°
0.6
70°
0.20.10.5 0.3 0.4
1.0
0.8
0.9
0.7
30°20°Ta=25°C
10°0°Radiation Diagram
40°
60°
50°
90°80°
0.6
70°
0.20.10.5 0.3 0.4
1.0
0.8
0.9
0.7
30°20°Ta=25°C
10°0°Radiation Diagram
40°
60°
50°
90°80°
0.6
70°
0.20.10.5 0.3 0.4
1.0
0.8
0.9
0.7
REDGREEN
BLUE
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Typical Electro-Optical Characteristics Curves
Ambient Temperature vs.
Ambient Temperature Ta (°C)
0
Tot
al P
ow
er
Dis
sipa
tion
50
0
100
150
(mW
)
200
250
4020 60 10085
Total Power Dissipation
Ambient Temperature Ta (°C)
0
Tot
al P
ower
Dis
sipa
tion
50
0
100
150
(m
W)
200
250
4020 60 10085
RED
GREEN
BLUE
Ambient Temperature vs. Power Dissipation
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Package Dimension
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
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Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer’s Product NumberP/N: Product Number‧QTY: Packing Quantity‧CAT: Luminous Intensit‧ y RankHUE: Dom. Wavelength Rank‧REF: Forward Voltage Rank‧LOT No: Lot Number‧
Reel Dimensions
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Carrier Tape Dimensions:
Minimum packing amount is 1000 pcs per reel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
Moisture Resistant Packing Process
Aluminum moistue-proof bag LabelDesiccantLabel
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
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Precautions for Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big current
change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 168Hrs under 30℃ or less and 60% RH or
less.If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
Pre-heating
150~200°C60~120sec.
3°C/sec.Max.
Above 217°C 60~150sec.
260°C Max.10sec. Max.
6°C/sec.Max.
Above255°C 30sec.Max.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.
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5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
6.Directions for use
The LEDs should be operated with forward bias. The driving circuit must be designed so that
the LEDs are not subjected to forward or reverse voltage while it is off. If reverse voltage is
continuously applied to the LEDs, It may cause migration resulting in LED damage.
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight Americas before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond thespecification described in this document.