Smartphone Design Win Monitor Q2 2021

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22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

REVERSE COSTING® – QUATERLY TECHNOLOGY MONITOR

SPM21002 – Monitor by Romain FRAUX

Q2 2021 – Sample

Q2 2021 Quarterly Technology Monitor

SMARTPHONE DESIGN WIN MONITOR

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

http://www.systemplus.fr/

©2021 by System Plus Consulting | SPM21002 - Smartphone Design Win Monitor Sample 2021 Q2 2

Table of Contents

Overview / Introduction 4

Executive Summary 12

Design Wins 32

o Design Wins per Vendors

o Design Wins per Vendors: Smartphones Details

o Design Wins per Vendors: OEM Evolution (Apple, Samsung, Huawei)

o Design Wins per Nationality

o Design Wins per Nationality: Smartphones Details

o Design Wins per Nationality: OEM Evolution (Apple, Samsung, Huawei)

Packaging 54

o Package Footprint per Vendors

o Package Footprint per Vendors: Smartphones Details

o Package Footprint per Vendors: OEM Evolution (Apple, Samsung, Huawei)

o Package Footprint per Category

o Package Footprint per Family

o Package Footprint: OEM Evolution (Apple, Samsung, Huawei)

eBoM Cost 69

o eBoM Cost per Category

o eBoM Cost per Category: Smartphones Details

o eBoM Cost per Category: OEM Evolution (Apple, Samsung, Huawei)

Die, Wafer & Technology 81

o Die Area per Vendors

o Die Area per Vendors: Smartphones Details

o Die Area per Vendors: OEM Evolution (Apple, Samsung, Huawei)

o Die Area per Nationality

o Die Area per Nationality: Smartphones Details

o Die Area per Nationality: OEM Evolution (Apple, Samsung, Huawei)

o Die Area per Category

o Die Area per Category: Smartphones Details

o Die Area per Category: OEM Evolution (Apple, Samsung, Huawei)

o Wafer Size Repartition

o Wafer Material Repartition

o Technology Node Repartition

Focus on Application Processors 113

o Focus on Application Processors

Focus on Memories 118

o Focus on NAND

o Focus on DRAM

Focus on Sensors 124

o Focus on Sensors: CMOS Image Sensors

o Focus on Sensors: Others

Focus on RF 133

o Focus on RF

Focus on Passives 138

o Focus on Capacitors



Feedbacks 143

Related Products 145

SystemPlus Consulting services 147



Overview / Introductiono Introductiono Monitor Methodologyo Smartphones Referenceso Glossary

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About System Plus Consulting

INTRODUCTION

The Smartphone Design Win Monitor allows to stay updated on the latest components, packaging and silicon chip choices of thesmartphone makers.

This monitor offer a clear view of the semiconductor compagnies leading the market and a direct comparison between OEM.

It provides :

✓ Design wins for the top smartphones OEM (per vendors., nationality…)

✓ Packaging evolution in term of type, footprint, pitch…

✓ Die area evolution per function, technology node, wafer size…

✓ Focus per category (Processor, Camera, Memory, Sensor…)

The following deliverables is included in the monitor:

▪ An online dynamic dashboard with historical data from past years and last quarter including at least 8 new smartphones analyzedduring this quarter.

▪ A PDF slide deck with graphs and comments to explain the main technology evolutions on the smartphone market.

▪ Direct access to the analyst for more details and analysis of the data.




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Mfr.Q2 2020 Units

(Million)

Q2 2020

%

Q3 2020 Units

(Million)

Q3 2020

%

Q4 2020 Units

(Million)

Q4 2020

%

Q1 2021 Units

(Million)

Q1 2021

%

Nb Phones to analyse

per year

Samsung 66 20% 68 20% 72 20% 75 22% 6.7

Apple 50 15% 51 15% 54 15% 61 18% 5.1

Xiaomi 36 11% 37 11% 40 11% 49 14% 3.8

Huawei 56 17% 57 17% 61 17% 18 5% 4.6

Vivo 26 8% 27 8% 28 8% 25 7% 2.5

OPPO 26 8% 27 8% 28 8% 37 11% 2.8

Honor 0 0% 0 0% 0 0% 18 5% 0.4

Realme 8 3% 8 3% 9 3% 8 2% 0.8

LG 6 2% 6 2% 6 2% 3 1% 0.5

ZTE 6 2% 6 2% 6 2% 3 1% 0.5

Lenovo 6 2% 6 2% 6 2% 5 1% 0.5

Google 1 0% 1 0% 1 0% 2 0% 0.1

OnePlus 3 1% 3 1% 3 1% 3 1% 0.3

TCL 2 1% 2 1% 3 1% 2 0% 0.2

Meizu 1 0% 1 0% 1 0% 1 0% 0.1

Sony 1 0% 1 0% 1 0% 1 0% 0.1

ASUS 0 0% 0 0% 0 0% 0 0% 0.0

HTC 0 0% 0 0% 0 0% 0 0% 0.0

Coolpad 0 0% 0 0% 0 0% 0 0% 0.0

Others 30 9% 30 9% 32 9% 32 9% 3.0

Total 324 332 353 342 32.0

MONITOR METHODOLOGY

❑ Methodology:

▪ We construct the smartphone monitor with data coming from representative phones:

➢ 8 per quarter, 32 per year

▪ It follows the shipment market share, which means that selected phones are a good representationof the market (i.e. if a vendor has 20% market share, we will take around 20% of phones from thatvendor).

❑ One-year smartphones shipment market share (from Yole Développement):




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MONITOR METHODOLOGY

Phone-Level Filters IC-Level Filters Package-Level Filters Die-Level Filters

Teardown Date IC Manufacturer Package Length Die Manufacturer

Phone Manufacturer IC Manufacturer Nationality Package Width Die Manufacturer Nationality

Phone Manufacturer Nationality IC Reference Package Height Die Category

Phone Model IC Category Package Area Die SubCategory

IC SubCategory Package Ball/Pin number Die Quantity

IC Quantity Package Pitch Die Length

IC ASP Package Type/Family Die Width

Die Area

Die Process Node

Die Wafer Size

Die Wafer Material

❑ Database Filters:

▪ The online dynamic dashboard access provided with the slides deck allows to realize filtersusing at least 29 levels of filters:




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MONITOR METHODOLOGY

❑ IC/Die Categories:

▪ Seven categories and several subcategories are used to differentiate the functional areas ofthe phones:

Application Processor

Audio & Power Management

Baseband Connectivity Memory RF Sensor

APU/APE ADC/DAC Modem (2G/3G/4G/5G)

Bluetooth DRAM RF Transceiver Fingerprint Sensor

ASIC Audio Amp GPS FLASH NAND RF Front-End Environmental Sensor

FPGA Audio Codec NFC/MST Serial FLASH/EEPROM

Image Sensor

ISP Audio Processor WiFi Inertial Sensor

MCU Charger/Interface/Protection IC

FM/TV Light/Proximity Sensor

Controller/Driver (Display, LED, Touch…)

Magnetic Sensor

Power Management Unit

(PMU)

Microphone

Switch/SMPS/Envelope Tracking IC

Radar




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Q2 2021 SMARTPHONES REFERENCES SELECTED

❑ Smartphones references selected for Q2 2021 monitor:▪ Q2 2021 (8 smartphones):

➢ ZTE Axon 20 5G

➢Samsung Galaxy S21+

➢ Xiaomi Mi 10 Ultra

➢ BLU G90

➢ Apple iPhone 12 mini US

➢ LG Wing 5G

➢ Samsung Galaxy Note20 Ultra

➢ Huawei Mate 40 Pro




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Year Quarter Mfr. Ref. Chipset Display RAM NAND Network

2021 Q2 ZTE Axon 20 5G Qualcomm Snapdragon 765G 6.9" 8GB 256GB 5G

2021 Q2 BLU G90 MediaTek Helio A25 6.5" 4GB 64GB 4G

2021 Q2 SAMSUNG Galaxy Note20 Ultra (US version) Qualcomm Snapdragon 865 6.9" 12GB 128GB 5G

2021 Q2 SAMSUNG Galaxy S21+ (International version) Qualcomm Snapdragon 888 6.7" 8GB 256GB 5G

2021 Q2 APPLE iPhone 12 mini (US version) Apple A14 Bionic 5.4" 4GB 64GB 5G

2021 Q2 Huawei Mate 40 Pro HiSilicon Kirin 9000 6.8" 8GB 256GB 5G

2021 Q2 XIAOMI Mi 10 Ultra Qualcomm Snapdragon 865 6.7" 8GB 128GB 5G

2021 Q2 LG Wing 5G Qualcomm Snapdragon 765G 6.8" 8GB 256GB 5G

2021 Q1 Samsung Galaxy Note 20 (US version) Qualcomm Snapdragon 865+ 6.7" 8GB 128GB 5G

2021 Q1 SAMSUNG Galaxy Z Fold 2 (US version) Qualcomm Snapdragon 865+ 7.6" 12GB 256GB 5G

2021 Q1 APPLE iPhone 12 5G (US version) Apple A14 6.1" 4GB 64GB 5G

2021 Q1 APPLE iPhone 12 Pro Max (US version) Apple A14 6.7" 6GB 128GB 5G

2021 Q1 Huawei nova 7 SE 5G Youth HiSilicon Kirin 820 6.5" 8GB 128GB 5G

2021 Q1 GOOGLE Pixel 4a Qualcomm Snapdragon 730G 5.8" 6GB 128GB 4G

2021 Q1 MICROSOFT Surface Duo Qualcomm Snapdragon 855 8.1" 6GB 128GB 4G

2021 Q1 Vivo X50 Pro Qualcomm Snapdragon 765G 6.5" 8GB 128GB 5G

2020 Q4 OnePlus 8 5G Qualcomm Snapdragon 865 6.5" 8GB 128GB 5G

2020 Q4 Sharp AQUOS R5G Qualcomm Snapdragon 865 6.5" 12GB 256GB 5G

2020 Q4 Motorola Edge+ Qualcomm Snapdragon 865 6.7" 12GB 256GB 5G

2020 Q4 Samsung Galaxy M31 Samsung Exynos 9611 6.4" 6GB 64GB 4G

2020 Q4 Apple iPhone SE (2020) Apple A13 4.7" 3GB 128GB 4G

2020 Q4 ZTE Nubia Red Magic 5G Qualcomm Snapdragon 865 6.6" 12GB 256GB 5G

2020 Q4 Huawei P40 Pro 5G HiSilicon Kirin 990 6.6" 8GB 256GB 5G

2020 Q4 Realme X50 5G Qualcomm Snapdragon 765 6.6" 8GB 128GB 5G

2020 Q3 OPPO Find X2 5G Qualcomm Snapdragon 865 6.7" 12GB 256GB 5G

2020 Q3 Samsung Galaxy S20 Ultra 5G (US version) Qualcomm Snapdragon 865 6.9" 12GB 128GB 5G

2020 Q3 Samsung Galaxy Z Flip Qualcomm Snapdragon 855+ 6.7" 8GB 256GB 4G

2020 Q3 Huawei Mate Xs HiSilicon Kirin 990 8.0"" 8GB 512GB 5G

2020 Q3 Xiaomi Mi 10 Pro 5G Qualcomm Snapdragon 865 6.7" 8GB 256GB 5G

2020 Q3 Vivo Nex 3s 5G Qualcomm Snapdragon 865 6.9" 12GB 256GB 5G

2020 Q3 Motorola Razr 2019 Qualcomm Snapdragon 710 6.2" 6GB 128GB 4G

2020 Q3 LG Electronics V60 ThinQ 5G Qualcomm Snapdragon 865 6.8" 8GB 128GB 5G

ONE-YEAR SMARTPHONES REFERENCES SELECTED

Mfr.Nb Phones

Selected over a year

Samsung 7

Huawei 4

Apple 4

Xiaomi 2

Vivo 2

ZTE 2

LG 2

Motorola 2

Oppo 1

OnePlus 1

Realme 1

BLU 1

Google 1

Microsoft 1

Sharp 1

Total 32

❑ Smartphones references selected for the monitor:



Overview / Introductiono Introductiono Reverse Costing

Methodologyo Glossary

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Q2 2021 DESIGN WINS PER VENDORS

©2021 by System Plus Consulting

❑ Q2 2021 shows Qualcomm leading with xxx design wins (xx%).

▪ Most of them are processors (Snapdragon), RF components (Transceivers, RFFEM) and PMIC

Q2 2021 Design Wins: xxx unitsQ1 2021 Design Wins: xxx units





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Q2 2021 DESIGN WINS PER NATIONALTY


Q2 2021 Design Wins: xxx unitsQ1 2021 Design Wins: xxx units

❑ Nationality represents the country of the headquarter of the component provider.

❑ USA represents xx% of the design wins in Q2 2021

▪ Qualcomm, Qorvo, Skyworks, Broadcom, On Semiconductor, Texas Instruments and Cirrus Logic account for the majority of these design wins.





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Q2 2021 PACKAGE FOOTPRINT PER VENDORS


Q2 2021 Total Footprint: xxx mm²Q1 2021 Total Footprint: xxx mm²

❑Without counting unidentified camera modules, Q2 2021 shows Qualcomm leading with xxx (xx%) of packages among the 8selected smartphones.

▪ Most of this area is for snapdragon processors and modems, followed by RF components (Transceivers, RFFEM).





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Q2 2021 PACKAGE FOOTPRINT DISTRIBUTION PER FAMILY


❑ BGA/LGA is the main packaging platform (34% in Q22021) for smartphones.

▪ BGA/LGA packages are used in all categories of components, witharound 40% of the footprint being used for memories.





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Q2 2021 eBOM COST PER CATEGORY


Q2 2021 Total eBOM Cost: $xxx (for 8 smartphones)Q1 2021 Total eBOM Cost: $xxx (for 8 smartphones)

❑ Memory represents xx% of BoM cost for the electronic components in Q2 2021 (Display, battery, PCB and mechanical componentsexcluded).

▪ NAND & DRAM drive this cost, with xxxx.





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Q2 2021 DIE AREA PER VENDORS


Q2 2021 Total Die Area: xxx mm²Q1 2021 Total Die Area: xxx mm²

❑ Samsung is leading the die area utilization in Q2 2021, with xxx mm² (xx%).

▪ Memory is the main driver.





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Q2 2021 DIE AREA PER NATIONALTY



❑ Korea accounts for xxx mm² of dies area in Q2 2021 (xx%)

▪ Samsung is accounting for xx% of this total area.





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Q2 2021 DIE AREA PER CATEGORY



❑ Memory accounts for xxx mm² (xx%) of dies area in Q2 2021.





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Q2 2021 WAFER SIZE REPARTITION


xxx mm²

❑ 300mm (12-inch) wafers represents xx% of dies area used inQ2 2021.

❑ By using this calculated area, and to ensure xxMsmartphones units shipment in Q2 2021 as estimated by YoleDéveloppement, it would require:

✓ xxx units of 150mm wafers







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Q2 2021 WAFER MATERIAL REPARTITION


❑ Silicon represents xx% of the materialused in Q1 2021.

❑ By using this calculated area, and toensure xxM smartphones unitsshipment in Q2 2021 as estimated byYole Développement, it would require:

✓ xxx units of silicon wafers (200mmequivalent)

✓ xxx units of SOI wafers (200mmequivalent)

✓ xxx units of LT/LN wafers (200mmequivalent)

✓ xxx units of III/V wafers (200mmequivalent)





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Q2 2021 TECHNOLOGY NODES BREAKDOWN


Total dies Area xxx mm²

❑ Leading edge technologies (14nm down to 5nm) represents xx% ofthe dies area in Q2 2021.

❑ DRAM and application processors are driving this consumption.

❑ By using this calculated area, and to ensure xxM smartphonesunits shipment in Q2 2021 as estimated by Yole Développement, itwould require:

✓ xxx units of wafers using 14-5nm technology nodes







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Q2 2021 PACKAGE FOOTPRINT PER CATEGORY: SMARPHONES DETAILS


❑ Samsung Galaxy Note 20 Ultra and Huawei Mate 40 Pro are the phones holding the most ICs area.





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Q2 2021 DIE AREA PER CATEGORY: SMARTPHONES DETAILS


❑ The Samsung Galaxy Note 20 Ultra and Huawei Mate 40 Pro 20 are the smartphones having the most dies area.

▪ They both have high memory content (12GB RAM for the Galaxy Note 20, 256GB FLASH for the Huawei Mate 40 Pro).





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Q2 2021 FOCUS ON APPLICATION PROCESSORS


Snapdragon 765G

Apple A14Kirin 9000

Snapdragon 865+Snapdragon

865+

❑ Among the 8 smartphones used for Q2 2021, five vendors are integrated: Apple, HiSilicon, Mediatek, Qualcomm and Samsung.

▪ The Exynos 2100 processor is the larger one in term of package footprint and die size.

Snapdragon 765G

Helio P22

Exynos 2100





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Q2 2021 FOCUS ON MEMORY: NAND


❑ The NAND Flash dies area is proportional to the amount of memory and the memory density.

▪ The 64GB provided by Kioxia for the iPhone 12 mini has much lower dies area compared to the 64GB dies provided by Micron for the BLU G90.

256GB

128GB

256GB

64GB

64GB

256GB

128GB

256GB





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Q2 2021 FOCUS ON MEMORY: DRAM


❑ The DRAM dies area is directly proportional to the amount of memory and the memory density.

8GBLPDDR4X

8GBLPDDR5

4GBLPDDR4X

12GBLPDDR5

8GBLPDDR5

4GBLPDDR4X

8GBLPDDR5

8GBLPDDR4X





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Q2 2021 FOCUS ON SENSORS – CMOS IMAGE SENSORS


❑ The CMOS Image Sensor dies area is mostly proportional to the sensor resolution and the pixel size.

▪ Huawei Mate 40 Pro and Xiaomi Mi 10 Ultra are using almost the same dies area.

Front: 32MpRear Macro: 2MpRear Depth: 2Mp

Rear Main: 64Mp

Rear Ultrawide: 8Mp

Rear Main: 16Mp

Front: 13MpRear Wide: 8Mp

Rear Main: 108MpRear Telephoto: 12Mp

Rear Wide: 12Mp

Front: 10Mp

Front: 10MpRear Wide: 64Mp

Rear Telephoto: 12Mp

Rear Ultrawide: 12Mp

Front: 12MpRear Main: 12MpRear Wide: 12Mp

Front 3D: 10Mp

Front: 13MpFront 3D: VGA

Rear Wide: 50MpRear Ultra Wide: 20MpRear Telephoto: 12Mp

Rear Ultra Wide: 20MpRear Periscope: 48Mp

Front: 20MpRear Telephoto: 12Mp

Rear Wide: 48Mp

Front: 32MpRear Main: 64Mp

Rear Ultra Wide 1: 12MpRear Ultra Wide 2: 13Mp





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Q2 2021 FOCUS ON SENSORS – OTHERS


❑ Fingerprint sensors are the sensors using to most dies area among the other sensors.

▪Apple iPhone 12 series do not integrate fingerprint sensors, which explains the low dies area consumption in sensors. Indeed, the dies area for Face ID,which replace the fingerprint authentication, is accounted in the image sensors.

▪ZTE Axon 20 and BLU G90 have fingerprint sensor, but with a very small die size.





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Q2 2021 FOCUS ON RF




R E L A T E DPRODUCTS


Overview / Introduction

Executive Summary

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About System Plus

RELATED PRODUCTS

REVERSE COSTING REPORTS

MONITORS

TEARDOWN TRACKS

o CMOS Image Sensor Quarterly Market Monitoro Advanced Packaging Quarterly Market Monitoro Processor Quarterly Market Monitoro NAND Quarterly Market Monitoro DRAM Quarterly Market Monitor


https://www.systemplus.fr/reverse-costing-reports/micron-lpddr5-12gb-mobile-memory/

https://www.systemplus.fr/reverse-costing-reports/camera-modules-comparison-2021-vol-1/

https://www.systemplus.fr/reverse-costing-reports/smartphone-camera-module-comparison-2020-vol-3-focus-on-huawei/

https://www.systemplus.fr/reverse-costing-reports/smartphone-3d-sensing-modules-comparison-2020/

https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/

https://www.i-micronews.com/products/advanced-packaging-quarterly-market-monitor/

https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/

https://www.i-micronews.com/products/nand-service-memory-research/

https://www.i-micronews.com/products/dram-service-memory-research/


C O M PA N YS E R V I C E S



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About System Pluso Company serviceso Contacto Legal

FIELDS OF EXPERTISE




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BUSINESS MODEL




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Headquarters› Nantes – System Plus Consulting› Lyon – Yole Développement

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[email protected] - +33 2 40 18 09 16

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Smartphone Design Win Monitor Q2 2021

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