Smart Building/Internet-of-Things - Vývoj.HW.cz | Vše o ... · PDF fileSmart...
Transcript of Smart Building/Internet-of-Things - Vývoj.HW.cz | Vše o ... · PDF fileSmart...
Smart Building/Internet-of-Things
Sensors
Wireless
Connectivity
Wired
ImageLightProximityTouchTemperature
•••••
ZigBeeS-FSKKNXM-BUSHART6loWPANProprietary
•••••••
Boost / FlybackConverters & Battery Management
System PowerManagement
Non-VolatileMemory & Security
Processor / MCU
Motor Control
BatteryEnergyHarvester
• Seamlessly connected intelligent devices that sense, analyze and control the environment
• Connected smart lighting, surveillance/security systems, HVAC systems, home appliances, energy management systems, vehicles, traffic control
• Key building blocks include sensors/actuators, ultra low power MCUs/DSPs, connectivity, power management, security and software, chip integration and micro-packaging
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PAC
KAG
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Broad Packaging Portfolio
AYRE SA3291 - Wireless DSP SiP for Hearing Aids
Custom 3D packaging connects different silicon die and discrete components together in the same package to dramatically save space and improve electrical performance by decreasing signal distances.
ON Semiconductor offers advanced packaging and integration capabilities, ranging from chip scale packaging through multichip modules. This extensive portfolio of packaging technology helps customers solve their unique design challenges related to thermal performance, power density, and low profile. Shown below is a small sample from the company’s broad and deep package portfolio.
• Stacking with or without wirebonds• Modular, scalable architectures with high
degree of manufacturing testability • Mature, robust technologies and structures• RoHS-compliant and ISO-certified
Die
Top Substrate
Interposer
Capacitors
Solder Pads
Flip Chip Connections
Main Substrate
Solder Connections
Advanced 3D Packaging
IPM
DPAK6.0 x 6.5 mm
SO8-FL5.0 x 6.0 x 1.0 mm
SOT-8831.0 x 0.6 x 0.4 mm
XDFN-40.8 x 0.8 x 0.4 mm
PIM
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2.4 GHz IEEE 802.15.4-2006 Wireless Transceiver
Low power, fully integrated system-on-chip for secure wireless connectivity
Features• Integrates ARM® Cortex-M3 32-bit µP, 640kB FLASH,
48 kB RAM, hardware accelerated MAC• AES 256 / 128 encryption engine• Peripherals: DMA, UART (x2), SPI (x2), I2C (x2), PWM,
RTC, WDT, 18 GPIO, 10-bit ADC, programmable timers (x3), temperature sensor, supply voltage sensor
• Programmable transmit power (up to ~8 dBm)• Receiver sensitivity less than –99 dBm• Antennae diversity• Supports external LNA & PA• <0.5 µA Timed Coma Mode Current• 6.9 mW Transmit Mode Power Consumption• 6.6 mW Receive Mode Power Consumption• VDD includes low voltage mode with operation down
to 1.0 V
Software Ecosystem• 2.4 GHz IEEE 802.15.4-2006 certified MAC/PHY• ZigBee PRO support included (ZHA, ZSE 1.x, ZLL, etc.)• ZigBee IP support included (SE 2.0)• 802.15.4-2006 compatible applications• Partner program for design services & support
UART 1
UART 2
SPI 1
I2C 1
GPIO
PWM
SUPPLYMONITOR
SAR ADC
TEMP SENSOR
PMUDVDDDVDDA
FVDDLRVDDn
AVDDn128 AES
RESETCTRL
DIO[17:0]
NCS36510
A[3:0]
V3V
V1VO
FVDDHO
FVDDHI
VDDIO
TIMERS
MUX
TEST MODES
FLASHCONTROL
CLOCKCTRL
32 kHz
32 MHzRTC
WATCHDOG
32MO
32MI
32KO
32KI
POWER SEQ
MACMODULATOR
DEMODULATOR
RF ANALOGCONTROL
RADIO
VPA
RFPWR
TX
RX
RESETN
RANDOMNUMBER
GENERATOR
SPI 2
I2C 2
CROSSBAR
PAD CONTROL
System Bus
ARMCORTEX−M3
I−code D−code
BUS MATRIX
INTERRUPTAND
WAKEUPCONTROL
ataDnoitcurtsnI
AHB to APBBRIDGE
320 kBFLASH A
320 kBFLASH B
16 kBSRAM A
16 kBSRAM B
16 kBSRAM C
DMASERIALWIRE
DEBUG
TEST
V1VI
DIO[13]
DIO[12]
DIO[11]
RESETN
SWDIO
SWDCLK
SWO
SWD_RESET
NCS36510 Block Diagram
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PLC Modems/Power Line Driver
12 V 3V3_D
3V3_DVEEVcom
GNDuC R9
C5
R7
R8
C8
C6
R6
R14
R2
REF_OUT
RX_IN
RX_OUT
TX_ENB
TX_OUT
R1
CDREF
C1C2
R4R5
C4 C3
R3
Vwarn Rlim
VCC
C7C9
D3
D2
D1
D4
ZC_INR11
C11
Tr1:2
R10MAINS
C10
12 V
D5
C12
3 V 3_A
VDDA
C13
NCS5651Application
&Metering
μC
T_REQ
R12
TXD
RXD
BR0
BR1
RESB
EXT_CLK_E
SEN
VDD1V8
3V3_D
C17
3V3_A
C16
VDD
C14
XTA
L_IN
XTA
L_O
UT
VS
SA
VS
S
C15
NCN49597
Device Function Features Package(s)
Smart Grid
Modem
NCN49599PLC S-FSK Modem;
A - D Band
• ARM Cortex M0• Baud rate: 4800 Bauds• S-FSK modulation
• Hardware embedded MAC + PHY• Embedded 1.2 A, 2-stage power amplifier
with current limitation and thermal protectionQFN-56
NCN49597PLC S-FSK Modem;
A - D Band• ARM Cortex M0• Baud rate: 4800 Bauds
• S-FSK modulation• Hardware embedded MAC + PHY
QFN-52
Smart Metering Modem
AMIS49587PLC S-FSK Modem;
A & B Band
• ARM7TDMi, 24 MHz core• Baud rate: 2400 Bauds
• S-FSK modulation• Hardware embedded MAC + PHY QFN-52
Power Amplifier NCS5651
Power Line Driver;Class AB
• Low distortion power line driver with optimized interface for PLC modems
• Capability to drive 2.0 A peak into reactive loads
• Current shutdown minimizes power consumption during power down state
• Rail-to-Rail Drop of Only ±1 V with Iout = 1.5 A
QFN-20 EP
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KNX TransceiversKNX is a standardized (EN 50090, ISO/IEC 14543), OSI-based network communications protocol for intelligent buildings. KNX is the successor to, and convergence of, three previous standards:
the European Home Systems Protocol (EHS), BatiBUS, and the European Installation Bus (EIB or Instabus).
Applications• Connects appliances and sensors, especially for climate
and light control to the 9600 Baud KNX twisted pair (TP) bus inside a building
• TP bus provides data communication and power supply
KNX Open Standards• EN 50090: European Standard• ISO/IEC 14543-3: International Standard • GB/Z 20965: Chinese Standard • ANSI/ASHRAE 135: US Standard
Switch
230 VMain
Distribution
230 V
230 V
TP (Twisted Pair)
PL (Power-Line)
RF (Radio Frequency) or IR (Infrared)
Lighting SunBlinds
Heating Monitoring
PhysicalCommunication
Media
WashingMachine
Oven
Device
DC=DC Converters 20 V Regulator
Embedded MAC + LLC1
KNX Host Interface
PackageFixed 3.3 V Adj 3.3 to 21 V Digital SPI/UART Analog UART
NCN5120 4 4 4 4 4 4 QFN-40
Note 1: LLC = Logical Link Control layer of the OSI-based communications network.
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General Application Diagram
Wired M-BUS Transceiver
Features• Satisfies physical requirements for M-BUS, described in EN 13757-2 and EN 1434-3• UART communication speeds up to 38400 baud• Integrated 3.3 V VDD LDO regulator (extended peak current of 15 mA)• Supports powering slave device from the bus or from external power supply• SOIC-16 and QFN-20 packages
RIS
RIS
PFb
SC
CSC
CVDD
RIDD
TVS1 MBUS
RBUS1
RBUS2
RIDD STCGND
CSTC
RXIRXTXTXI
VDD
μC
VIOVS
BUSL2
VB
BUSL1
NCN5150
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Modems
AMIS-49200 & AMIS-49250 Fieldbus Physical Layer Medium Access Units• Compatible to both FOUNDATION Fieldbus H1 (Type 111 and Type 112
per FF-816) and PROFIBUS PA standards
• Enables Fieldbus to completely power field devices using the integrated power supply block
• Data rate: 31.25 kbps voltage mode
• Low current consumption 500 μA typ
• LQFP-44 and NQFP-44 packages
ProcessSensor
Microprocessorwith RAM and ROM
LinkController
FieldbusMAU
FieldbusSegment
Industrial HART Protocol Modems• Single-chip, half-duplex 1200 bps FSK modem
• Bell 202 shift frequencies of 1200 Hz and 2200 Hz
• Transmit-signal wave shaping
• Receive band-pass filter
HART Modems
DeviceInput
Frequency DACTemp Range
(°C) Package
NCN5193460.8 kHz, 920 kHz,or
1.8 MHz
Integrated 16-bit
Sigma-Delta–40 to +85 QFN-32
NCN5192460.8 kHz, 920 kHz,or
1.8 MHz
Integrated 16-bit
Sigma-Delta–40 to +85 QFN-32
A5191HRT 460.8 kHz External –40 to +85QFN-32, LQFP-32, PLCC-28
NCN5193
XOUT
XIN3.6864 MHz
CBIAS VSS MODE
μC
VDDA
HART &4 – 20 mA OUT
HART IN
1.8 V − 3.5 V
TxA
CDREF
AREF
RxAN
RxAFRxAFIVDDAVDD
RxD
CD
TxD
RTS
RESET
VPOR
CS
DATA
SCLK
KICK
DACVDDA
JUMPDACREF
CLK2
CLK1
VDDA
TEST1
TEST2
RxAP
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CAN Transceivers for Long Networks, >500 m
Features• ISO 11898-2 compliant
• Up to 1 Mb/s communication speed
• Delivers low transmit data rate in networks exceeding 1 km
• Functional in 12 V and 24 V systems
Text
Rx0
Tx0
Rint
CANH2
CANL1
GND
VrefVCC
CANL2
CANH1
CANBUS 2
CANBUS 1
100 nF
VBAT5 V−reg
RLT60
RLT60
CD
EN1
EN2
AMIS–427707
9
2
3
10
4
18
1312
19
14
8
5 6 15 16 17
CAN TransceiversDevice Type Description Package
AMIS42770 Dual High-Speed CAN Repeater SOIC-20
AMIS42670 Single High-Speed CAN Transceiver for Long Networks SOIC-8
AMIS42671 Single High-Speed CAN Transceiver for Long Networks SOIC-8
AMIS42673 Single High-Speed CAN Transceiver for Long Networks SOIC-8
AMIS42675 Single High-Speed CAN Transceiver for Long Networks SOIC-8
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Motion Detector Passive Infrared Controller (PIR ) — NCS36000
• Passive infrared controller circuit for the lighting and occupancy sensing market• Amplifies and conditions signal from PIR sensor
Features• 3.0 – 5.75 V operation• Integrated low noise 2-stage amplifiers• Internal voltage reference to drive sensor• Internal oscillator with external RC• Single or dual pulse detection• Digital filter to minimize false alarms• Direct drive of LED and relay
Benefits• Lower BOM cost than comparable discrete solutions
• Extremely flexible solution• Customer can customize digital filtering
• Customer can customize analog processing• Designed for wide range of occupancy sensors
NCS36000
DigitalControlCircuit
2WindowComparator
OUT
VSS VDD
LED
AmplifierCircuit
SystemOscillator
LDO &Voltage
References
xLED_ENMODEOP1_P
OP1_NOP1_O
VREF
OP2_N
OSC
OP2_O
2
Old Solution NCS36000 Solution
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IEEE 802.3at + Auxiliary, 40 W• Auxiliary input voltage range from 9.0 V to 57 V• Integrated DC-DC converter controller implements highly efficient
power conversion at low output voltages in conjunction with auxiliary voltage input
• Delivers 25.5 W for PoE+ IEEE 802.3at and up to 40 W in proprietary applications
• Supports IEEE two event classification• Best-in-class cable ESD and thermal characteristics
Features – NCP1083NCP1083, consisting of fully compliant PoE functionality and DC-DC controller, may be used to drive LED lamps. Additionally, lamps may be controlled remotely through PoE.
• Emits white color of ~2700°K
• LED lamp overall maximum power output 33 W
• Peak efficiency ~89%
• LED lamp powered by PSE directly over NCP1083 load switch circuitry; DC-DC controller can provide 3.3 V, 5 V or 15 V power supply
• LED drivers operate in buck operation mode, switching frequency about 1.05 MHz, PWM dimming frequency 16 kHz
• DC-DC controller working frequency up to 500 kHz, fly-back topology used
• Under-voltage startup level set to 38 V, or programmble down to 8.5 V; current limit 970 mA
NCP1083
nCLASS_AT
GATE
RTNCOMP
VDDL
VAUX(+)
VOUT
DataPairs
SparePins
VAUX(–)
CLASS
INRUSH
ILIM1
UVLO
AUX
VPORTIN
VPORTP
TL431
MBRS1100
MBRS1100
1SM
A58A
Power-Over-Ethernet (PoE ) Controllers
Device Description TopologyControl Mode
VCC Min (V)
VCC Max (V)
Pd Typ (W)
Ron Typ (Ω) Package
NCP1080 PoE-PD Controller and DC-DC Converter Flyback Current 0 57 15 0.6 TSSOP-20
NCP1081 PoE-PD Controller and DC-DC Converter Flyback Current 0 57 40 0.6 TSSOP-20
NCP1082 PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current 0 57 15 0.6 TSSOP-20
NCP1083 PoE-PD Controller and DC-DC Converter, with Auxiliary Supply Support Flyback Current 0 57 40 0.6 TSSOP-20
NCP1090 PoE-PD Interface Controller — — 0 57 15 0.5 SOIC-8, TSSOP-8
NCP1091 PoE-PD Interface Controller with Programmable UVLO — — 0 57 15 0.5 SOIC-8, TSSOP-8
NCP1092 PoE-PD Interface Controller with Vaux Support — — 0 57 15 0.5 SOIC-8, TSSOP-8
NCP1093 PoE-PD Interface Controller — — 0 57 25 0.5 DFN-10
NCP1094 PoE-PD Interface Controller with Vaux Support — — 0 57 25 0.5 DFN-10
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NCN8024R Demo Board
VccRSTCLKC4
GNDVppI/OC8
DET DET
GNDGND1
234
567
8
SMART CARD
VDD
VDDP10 uF
100 nF
VDDR1
R2
Microcontroller
DAT
APO
RTC
ON
TRO
L
GND
GND220nF
100nF
100 uF
CRD_VCC
CRD_AUX1CRD_CLK
I/Ouc
CRD_RST
CRD_PRES
VDD
CLKDIV2CLKDIV1
GNDP
CRD_AUX2
CRD_GND
CRD_IO
CLKIN
AUX1ucAUX2uc
PORADJ
RSTIN
INT
CMDVCC5V/3V
VDDP
CRD_PRES
NCN8024R
GND
Smart Card Interfaces
Device PortsControl
InterfaceCard Type
VDD μC Interface(V)
PowerSupply Sequencer
Card Detect
Clock Divider Standards Package(s)
SmartCard
NCN6001 1 SPI A, B, C 2.7 – 5.5InductiveDC-DC
Yes Yes Yes ISO7816; EMV4.3TSSOP-20, TLLGA-20
NCN8024R 1 Parallel A, B 2.7 – 5.5 LDO Yes Yes Yes ISO7816; EMV4.3 SOIC-28W
NCN8025/A (SAM/SIM)
1/3 Parallel A, B, C 2.7 – 5.5 LDO Yes Yes YesISO7816; EMV4.3;
UICCQFN-16, QFN-24
NCN8026 (SAM/SIM)
1 Parallel A, B, C 1.6 – 5.5 LDO Yes Yes YesISO7816; EMV4.3;
UICC; SIMQFN-24
SAM NCN4555 1 Parallel B, C 1.8 – 5.5 LDO No No No UICC; SIM QFN-16
Features• ISO & EMV compliance• ESD protection on card pins up to
+8kV (Human Body Model)
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Mainstream CMOS Image Sensors
DeviceSensor/
SOC Resolution
(MP)Optical Format Frame Rate
Pixel Size(μm) Shutter Type1 CFA
Operating Temp (°C)
MT9V115 SOC VGA 1/13” 30 fps 1.8 ERS Color -30 to +70
MT9V124 SOC VGA 1/13” 30 fps 1.8 ERS Color -30 to +70
ASX350AT SOC VGA 1/5” 60 fps digital, 30 fps analog 3.8 ERS Color -40 to +105
ASX340AT SOC VGA 1/4” 60 fps digital, 30 fps analog 5.6 ERS Color -40 to +105
ASX340CS SOC VGA 1/4” 60 fps 5.6 ERS Color -30 to +70
MT9V128 SOC VGA 1/3” 60 fps 6.0 ERS Color -40 to +105
MT9V024 Sensor WVGA 1/3” 60 fps 6.0 GS Color, Mono, RCCC -40 to +105
MT9V034 Sensor WVGA 1/3” 60 fps 6.0 GS Color, Mono -30 to +70
ARX550AT Sensor 0.5 1/5” 66 fps 3.8 ERS Color, RCCC -40 to +105
AR0140AT Sensor 1.0 1/4” 60 fps 3.0 ERS Color -40 to +105
AR0140CS Sensor 1.2 1/4” 1.2 45 fps, 720p60 3.0 ERS Color -30 to +85
AR0141 Sensor 1.2 1/4” 1.2 45 fps, 720p60 3.0 ERS Color, Mono -30 to +85
AR0130 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 ERS Color, Mono -30 to +70
AR0132AT Sensor 1.2 1/3” 1.2 45 fps, 720p 60 fps 3.8 ERS Color, Mono, RCCC -40 to +105
AR0134 Sensor 1.2 1/3” 1.2 54 fps, 720p60 3.8 GS Color, Mono -30 to +70
MT9M021/31 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 GS Mono -30 to +70
MT9M024/34 Sensor 1.2 1/3” 1.2 45 fps, 720p60 3.8 ERS Color, Mono -30 to +70
MT9M114 SOC 1.3 1/6” 1.3 30 fps, VGA 75 fps 1.9 ERS Color -30 to +70
MT9M001 Sensor 1.3 1/2” 30 fps 5.2 ERS Mono 0 to +70
MT9D131 SOC 1.9 1/3.2” 1.9 15 fps, SVGA 30 fps 2.8 ERS Color -30 to +70
AR0261 Sensor 2.1 1/6” 1080p60 1.4 ERS Color -30 to +70
AR0262CP Sensor 2.1 1/6” 1080p 60 fps 1.4 ERS Clarity+ -30 to +70
AS0260 SOC 2.1 1/6” 30 fps 1.4 ERS Color -30 to +70
AR0331 Sensor 3.1 1/3” 1080p60 2.2 ERS, GRR Color -30 to +85
AR0330 Sensor 3.5 1/3” 1080p60 2.2 ERS, GRR Color -30 to +70
AR0543 Sensor 5.0 1/4” 5 15 fps, 1080P 30fps 1.4 ERS Color -30 to +70
MT9P004 Sensor 5.0 1/3.2” 5 15 fps, 1080p30 1.8 ERS, GRR Color -30 to +70
MT9P006 Sensor 5.0 1/2.5” 5 15 fps, 720p60 2.2 ERS, GRR Color -30 to +70
MT9P031 Sensor 5.0 1/2.5” 5 15 fps, 720p60 2.2 ERS, GRR Color, Mono -30 to +70
AR0842CP Sensor 8.0 1/4” 8 30fps, 1080P 30fps 1.1 ERS Clarity+ -30 to +70
AR0833 Sensor 8.0 1/3.2” 8 30 fps, 1080P 30fps 1.4 ERS, GRR Color -30 to +70
AR0835 Sensor 8.0 1/3.2” 8 42 fps, 1080P 60fps 1.4 ERS, GRR Color -30 to +70
MT9J003 Sensor 10 1/2.3” 10 15 fps, 1080p60 1.7 ERS, GRR Color, Mono -30 to +70
AR1011HS Sensor 10 1” 60 fps 3.4 ERS Color -30 to +70
AR1335 Sensor 13 1/3.2” 13 30 FPS, 1080p 60 fps 1.1 ERS Color -30 to +70
MT9F002 Sensor 14 1/2.3” 14 13 fps 1.4 ERS, GRR Color -30 to +70
AR1820HS Sensor 18 1/2.3” 18 24 fps, 1080p 120 fps 1.3 ERS, GRR Color -30 to +70
1. ERS = Electronic Rolling Shutter, GRR = Global Reset Release, GS = Global Shutter
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Co-Processors for Mainstream CMOS Image Sensors
Automotive/Industrial Co-Processors
AP0100 AP0101
Applications Home Security, Surveillance, Automotive
Home Security, Surveillance, Automotive
Sensors Supported
MT9M024/34,AR0130, AR0140CS,
AR0132AT, AR0140AT, ARX550AT
MT9M024/34,AR0140CS, AR0132AT, AR0140AT, ARX550AT
Maximum Resolution 1.2 MP 1.2 MP
Frame Rate 1.2 MP 45 fps 720p60 1.2 MP 45 fps
Color Pipe Features
Demosaic Demosaic
Gamma correction Gamma correction
Auto white balance Auto white balance
Defect correction Defect correction
Noise reduction Noise reduction
Auto exposure Auto exposure
Flicker detection Flicker detection
HDR with ALTM YES YES
Dewarp (Yes or No)
YES Up to 165 degrees NO
Spatial Transform Engine Software Add-on
YES,Multiple viewing options,
PTZ NO
Overlays YES NO
GPIOs Up to 5 Up to 5
Sensor Interfaces 2-lane HiSPi,12-bit parallel 12-bit parallel
Output Interfaces NTSC/PAL, 16-bit parallel 16-bit parallel
Input Clock 6-30 MHz 6-30 MHz
Output Clock 27 MHz (NTSC/PAL)84 MHz parallel 84 MHz parallel
Operating Temp –30 to +70°C (CS Version)–40 to +105°C (AT Version)
–30 to +70°C (CS Version)–40 to +105°C (AT Version)
Package VFBGA-100 VFBGA-81
Mobile Applications Co-Processors
AP1302
Full Featured Image Processor
Main Camera Up to 13 MP @ 30 fps
Secondary Camera Up to 1080 @ 60 fps
MobileHDR Support 4
Clarity+ Processing 4
Bayer Output 4
JPEG Output 4
YUV Output 4
Gamma Correction
4
Face Detection/ Smile Detection
4
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Major Components Description
ON Semiconductor AR0230 2 MP/1080p CMOS image sensor with superior low light performance
Gainspan Wi-Fi Module GS2011M module streams data over Wi-Fi
Bluetooth Module Noridc BLE nRF51822
TI DM368 ARM9 core, high performance digital media system on chip
PIR Motion Sensor Triggers camera functions on motion detection
Microphone Omnidirectional microphones
LEDs For power, video streaming
USB Port Provides power to board, firmware upgrades
Battery 4200 mAH Lithium-ion battery
Storage Micro SD card slot
Internet of Things ( IoT) Video Development Kitfor Home Automation – smart lock, home security, smart lighting, smart door bell, smart appliances
Features• 1080p, Video on Demand (VOD), Live Streaming,
Cloud Connectivity, WiFi, BLE, Ethernet, remote control of device, Android and ios app for control, open source APIs
• Based on AR0230 (2MP/1080p) – Superior Low Light, Flexible interfaces (Parallel, HiSpi), High Dynamic Range
• Pending 2Q15
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Interline Transfer CCD Image Sensors
With an integrated electronic shutter, Interline Transfer CCD image sensors provide real time imaging in applications where a mechanical shutter or strobe illumination is either not required or desired. With progressive scan readouts, they are particularly well suited for machine vision, microscopy, fluoroscopy, and other applications that demand the highest imaging performance. All 5.5 μm and most 7.4 μm devices share common pin-out and electrical connections, allowing a single camera design to support a full family of products.
Features• Progressive scan with electronic
shutter and anti-blooming support• High resolution• High sensitivity• Low image lag and smear
1. CFA Options – Bayer Color (C), Monochrome (M), and TRUESENSE Sparse CFA (S). 2. Pin and Electrically Compatible
5.5 μm Interline Transfer CCD Image Sensors
DeviceResolution
(MPix) Pixel CountPixel(μm)
Diagonal(mm) Lens CFA1 FPS Max
Evaluation Kit
KAI-0330 VGA 648 x 484 9 7.3 1/2” C/M 120 3
KAI-0340 VGA 640 x 480 7.4 5.9 1/3” C/M 210 3
KAI-0373 WVGA 768 x 484 11.6 x 13.6 11.1 2/3” C/M 30
KAI-011502 0.9 1280 x 720 5.5 8.1 1/2” C/M/S 138 3
KAI-1003 1 1024 x 1024 12.8 18.5 4/3” M 30 3
KAI-1010 1 1008 x 1018 9 12.9 1” M 30
KAI-1020 1 1000 x 1000 7.4 10.5 2/3” C/M 50 3
KAI-010502 1 1024 x 1024 5.5 8 1/2” C/M 120 3
KAI-2001 1.9 1600 x 1200 7.4 14.8 1” C/M 30 3
KAI-2020 1.9 1600 x 1200 7.4 14.8 1” C/M 30 3
KAI-020502 1.9 1600 x 1200 5.5 11.1 2/3” C/M 68 3
KAI-021702 2.1 1920 x 1080 7.4 16.3 1” C/M/S 60 3
KAI-021502 2.1 1920 x 1080 5.5 12.1 2/3” C/M/S 64 3
KAI-040702 4.2 2048 x 2048 7.4 21.4 4/3” C/M/S 28 3
KAI-040502 4.1 2336 x 1752 5.5 16.1 1” C/M/S 32 3
KAI-080512 8.1 3296 x 2472 5.5 22.7 4/3” C/M/S 16 3
KAI-11002 10.7 4008 x 2672 9 43.4 35 mm C/M 5 3
KAI-16000 15.8 4872 x 3248 7.4 43.3 35 mm C/M 3
KAI-160502 16 4896 x 3264 5.5 32.4 APS-H C/M/S 8 3
KAI-160702 15.7 4864 x 3232 7.4 43.2 35 mm C/M/S 8 3
KAI-290502 28.8 6576 x 4384 5.5 43.5 35 mm C/M/S 4 3
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Full Frame CCD Image Sensors
From the intricacies of microscopy to the far reaches of astrophotography, Full Frame CCD image sensors deliver high performance results. With high quantum efficiency across the entire visible spectrum, these sensors are ideal for demanding imaging applications that can accommodate a mechanical shutter or strobe illumination, such as electronic still photography, medical X-ray, and inspection.
Features• High resolution• Support for large sensor formats• Simple, two-phase clocking• Very low dark current for long exposures• Vertical and horizontal binning
1. CFA Options – Bayer Color (C), Monochrome (M).
Full Frame CCD Image Sensors
DeviceResolution
(MPix) Pixel CountPixel(μm)
Diagonal(mm) Lens CFA1 FPS Max
Evaluation Kit
KAF-0261 VGA 512 x 512 20 14.5 1” M 15 3
KAF-0402 WVGA 768 x 512 9 8.3 1/2" M 20 3
KAF-1001 1 1024 x 1024 24 34.8 APS-H M 3 3
KAF-1603 1.6 1536 x 1024 9 16.6 1” M 2.2 3
KAF-3200 3.3 2184 x 1510 6.8 18 4/3” M 2.5 3
KAF-4320 4.3 2084 x 2084 24 70.7 645 M 2 3
KAF-6303 6.3 3088 x 2056 9 33.4 APS-H M 0.6 3
KAF-8300 8.3 3326 x 2504 5.4 22.5 4/3” C/M 2.9 3
KAF-09000 9.3 3056 x 3056 12 51.9 645 1.3x M 0.4
KAF-16801 16.8 4096 x 4096 9 52.1 645 1.3x M 0.4 3
KAF-16803 16.8 4096 x 4096 9 52.1 645 1.3x M 0.2
KAF-40000 40 7304 x 5478 6 54.8 645 1.3x C 1.3
KAF-50100 50.1 8176 x 6132 6 61.3 645 1.1x C/M 1
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Page 18 Internet of Things Solutions
Linear CCD Image Sensors
Linear CCD image sensors combine high resolution with high dynamic range, making them ideal for use in applications such as flatbed scanners, high-speed document scanners and copiers, machine vision cameras, and satellite imaging.
Features• High dynamic range• Pinned photodiodes for low lag and low dark current• Channel independent electronic exposure control• Single output per color, including multi-readout register
architectures• High data rates Linear CCD Image Sensors
1. CFA Options – Bayer Color (C), Monochrome (M).
Device Pixel CountPixel(μm)
Diagonal(mm) CFA1 Evaluation Kit
KLI-2104 4196 x 1, 2098 x 3 7.0, 14.0 29.4 Luma+C
KLI-2113 2098 x 3 14 29.4 C/M 3
KLI-4104 8160 x 1, 4080 x 3 5.0, 10.0 40.8 Luma+C/M 3
KLI-8023 8002 x 3 9 72 C/M 3
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Page 19ON Semiconductor
High Sensitivity CMOS Image SensorsWith resolutions of 300 K, 500 K and 1.3 Megapixels (MPix) respectively, the PYTHON 300, 500 and 1300 are designed to address the needs of general purpose industrial image sensing applications such as machine vision, inspection and motion monitoring, as well as security and surveillance applications including intelligent transportation systems (ITS).
ON Semiconductor’s new global shutter image sensors combine flexibility in configuration and resolution with high speed and high sensitivity for the industrial imaging market. The pixel in these PYTHON sensors allows the capture of fast moving scenes without distortion by combining a read noise of less than 9 e-, with 7.7 V/lux sensitivity and frame rates as high as 850 fps.
The KAC-12040 and KAC-06040 CMOS image sensors provide both global shutter and low noise rolling shutter modes, combined with programmable bit depth (8 to 14 bit) with a flexible readout architecture that supports interspersed video streams. This feature enables the use of multiple regions of interest that can simultaneously monitor both wide areas and local regions. These devices are ideal for machine vision, surveillance, ITS, and analytical microscopy.
1. CFA Options – Bayer Color (C), Monochrome (M).
DeviceResolution
(MPix)Pixel Count
(H x V)Pixel(μm)
Diagonal(mm) Lens CFA1 FPS Max
Evaluation Kit
PYTHON 300 0.3 640 x 480 4.8 3.8 ¼” C/M 840 3
PYTHON 500 0.5 800 x 600 4.8 4.8 1/3.6” C/M 560 3
PYTHON 1300 1.3 1280 x 1024 4.8 7.9 ½” C/M 210 3
PYTHON 2000 2 1920 x 1200 4.8 10.9 2/3” C/M 245 3
PYTHON 5000 5 2592 x 2048 4.8 15.9 1” C/M 105 3
1. CFA Options – Bayer Color (C), Monochrome (M).
DeviceResolution
(MPix)Pixel Count
(H x V)Pixel(μm)
Diagonal(mm) Lens CFA1 FPS Max
Evaluation Kit
KAC-06040 6 2832 x 2128 4.7 16.7 1” C/M 160 3
KAC-12040 12 4000 x 3000 4.7 23.5 4/3” C/M 70 3
Features• CDS global shutter technology with single digit
noise performance• True HW scalable family concept• High configurability and fast adaptability• High frame rates• Multiple regions of interest• High dynamic range• High NIR sensitivity
Features• Global shutter, low noise rolling shutter • Programmable bit depth• Interspersed video streams• Multiple regions of interest• High frame rates• High NIR sensitivity
KAC-12040
KAC-06040
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Ambient Light & Proximity Sensors
Features• Design flexibility/customization (i.e., EEPROM if
desired for trimming)• 0.0125 lux detection with customizable filtering
(i.e., Photopic Light Response)• Dark current and temperature compensation• Lowest power consumption per resolution bit• I2C Interface (including High Speed Mode) and
no effect on bus during power down
SDA
1 k
Vin = 3.3 V
1 k
1 μFSCL
MCU LEDDrivers LEDs
SDA
SCL
VDDAmbient
LightSensor
VSS
hν
Device Special FeaturesIO Typ @ EV = 100 Lux
(μA) Output InterfaceVin Range
(V)TA Range
(°C) Package
LA0151CS 2-Stage Gain Switching 8 (high gain) Analog, linear current 2.2 - 5.5 -30 to +85 ODCSP-4
LA0152CS Standby Function 8 Analog, linear current 2.2 - 5.5 -30 to +85 ODCSP-4
LV0104CS Integrated Sleep Mode - I2C, 16-bit ADC 2.3 - 3.6 -30 to +85 ODCSP-4
LV0111CF Standby Function 21 Analog, logarithmic current 2.3 - 5.5 -30 to +85 ODCSP-4J
NOA1212 Dark Current Compensation 51 (high gain) Analog, linear current 2 - 5.5 -40 to +85 CUDFN-6
NOA1305 Dark Current Compensation - I2C, 16-bit ADC 2.4 - 3.6 -40 to +85 CUDFN-6
NOA3302 Proximity Sensor - I2C, 16-bit ADC 2.3 - 3.6 -40 to +80 CWDFN-8
LA0151CS
0.1 μF
VoltageSupply
SW Gain Cont.
OUT
VCC
GND
Current-VoltageConversion
When the Sunlight is Strong,Extending the Dynamic Range
by Lowering Gain
AmpCPU
I/O
ADC
LV0104CS
0.1 μF
VoltageSupply
CPUSCL
SD
ApproximatesHuman EyeResponse
Simple2-Wire I2CInterface
16-BitADC
I2CBus
ControlLogic
VCC
GND
Page 20 Internet of Things Solutions
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Page 21ON Semiconductor
Capacitive Touch Sensors
Design Friendly, Low-Cost Operation, High Reliability
Acrylic Thickness: 3.0 mm
Air Gap: 1.5 mm
• Adhesive free • Reduce manufacturing cost and improve reliability by eliminating existing adhesive process
• Long sensor trace • Provide flexible PCB design
• Wide range operational temperature • Available in high-temperature environment
• No extra components • Reduce BOM
• High noise immunity • Improve stability and reliability
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Page 22 Internet of Things Solutions
Capacitive Touch Sensors
OverviewThe LC717A00/10 is a high-performance and low-cost capacitance-digital-converter LSI for electrostatic capacitive touch sensor, especially focused on usability. It has 8/16 channels of capacitance-sensor input. This makes it ideal for various switch applications.
The calibration function and the judgment of ON/OFF are automatically performed internal to the LSI, reducing development time. A detection result (ON/OFF) for each input can be read out by the serial interface (I2C compatible bus or SPI). Moreover, LC717A00 outputs a detection result (ON/OFF) by changing the Pout output level.
Also, the measurement value of each input can be read out as 8-bit digital data. Gain and other parameters can also be adjusted via serial interface.
Features• Detection system: Differential capacitance detection (mutual
capacitance type)• Input capacitance resolution: Can detect capacitance changes in the
femto-Farad order• LC717A00 measurement interval (8 differential inputs)
• 18 ms typical at initial configuration• 3 ms typical at minimum interval configuration
• LC717A10 measurement interval (16 differential inputs)• 30 ms typical at initial configuration• 6 ms typical at minimum interval configuration
• External components for measurement: Not required• LC717A00 current consumption: 320 μA typical (VDD = 2.8 V);
740 µA typical (VDD = 5.5 V)• LC717A10 current consumption: 570 μA typical (VDD = 2.8 V);
1.3 mA typical (VDD = 5.5 V)• Supply voltage: 2.6 V to 5.5 V• Detection operations: Switch• Packages: VCT-28 for LC717A00/10AR; SSOP-30 for LC717A00/10AJ• Interface: I2C compatible bus or SPI selectable
Cin0
SCL/SCK
SDA/SI
VDD
VSS
INTOUT
Cin1
Cin2
Cin3
Cin4
Cin5
Cin6
Cin7
Pout0
Pout1
Pout6
Pout7
Pout5
Pout4
Pout3
Pout2
nCS
SA/SO
Cdrv
GAIN
nRST
ERROR
Cref
MUX
1stAMP
A/DCONVERTER
2ndAMP
POR
CONTROLLOGIC
OSCILLATOR
I2C/SPI
Cin0
VDD
VSS
INTOUT
Cin1
Cin2
Cin3
Cin4
Cin5
Cin6
Cin7
Cin8
Cin9
Cin10
Cin11
Cin12
Cin13
Cin14
Cin15
Cref
CrefAdd
Cdrv
nRST
nCS
SCL/SCK
SDA/SI
SA0/SO
SA1
MUX
MUX
1stAMP
A/DCONVERTER
2ndAMP
CONTROLLOGIC
I2C/SPI
POR OSCILLATOR
LC717A00 Block Diagram LC717A10 Block Diagram
SEN
SIN
G
1
VDD 3.0 V To 5.5 V
2
5
6
7
4
3OS/ALERT
GND
SDA
SCL
A2
A1
A0
CBYPASS
ADDRESS(SET AS DESIRED)
SERIAL INTERFACE
NOTE: SDA, SCL AND OS/ALERT PINSREQUIRE PULL-UP RESISTORS TO VDD
NCT75
Device Sensor Type
Data Transmission
StandardICC Max
(mA)VCC Max
(V)VCC Min
(V)T Min (°C)
T Max (°C)
Temperature Error (°C) Package
NCT175 Local SMBus 0.575 3 5.5 -55 125 ±1 Micro8™
NCT203 Local I2C 44 µA 1.6 2.75 -40 125 ±1.75 WDFN-8, WLCSP-8
NCT275 Local SMBus 0.575 3 5.5 -55 125 ±1 WLCSP-6
NCT75 Local SMBus 0.575 3 5.5 -55 125 ±1 DFN-8, Micro8, SOIC-8
NCT218 Remote I2C — 1.6 2.75 — — — WDFN-8, WLCSP-8
NCT210 Local & Remote SMBus 0.37 3 5.5 -65 125 ±3 QSOP-16
NCT214 Local & Remote SMBus 0.35 3 3.6 -40 125 ±1 WDFN-10
NCT72 Local & Remote I2C 0.35 2.8 3.6 -40 125 ±1 DFN-8, WDFN-8
Page 23ON Semiconductor
Typical Application Diagram
Temperature Sensors
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Page 24 Internet of Things Solutions
JFETs for Infrared ( IR ) Sensing
DeviceVGDO Min
(V)IDSS Min
(mA)IDSS Max
(mA)|yfs| Typ
(mS)Ciss Typ
(pF)Crss Typ
(pF) Package
TF412S 30 1.2 3 5 4 1.1 SOT-883
TF414 40 0.05 0.13 0.11 0.7 0.3 SOT-883
2SK3738 40 0.05 0.13 0.13 1.7 0.7 SOT-490
2SK3796 30 0.6 3 6.5 4 1.1 SOT-490
2SK545 40 0.055 0.095 0.13 1.7 0.7 CP (SOT-23)
2SK3666 30 0.6 3 6.5 4 1.1 CP (SOT-23)
Infrared Sensor for White Goods, Security, and Lighting
ThermalEnergy
JFET
R
1
2
D
S
G3
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Page 25ON Semiconductor
Full Bridge Rectifier for Wireless Charging
Features – NMLU1210• Full Bridge Rectification block - up of 3.2 A of operation• Low RDS(ON) minimizes conduction losses• Low profile UDFN-8 package (4 x 4 x 0.55 mm)
Device
MOSFET SCHOTTKY
Package(s) VLL(V)
ID(A)
RDS(ON) Max @ VGS = 10 V (Ω)
VR(V)
VF(A)
IF(A)
NMLU1210 20 3.2 0.017 20 0.45 3.2 UDFN-8
D2
A2
C2
S2G2
D1
L1_1 A1
C1
S1 G1
GND1
GND1
ACInput
DCOutput
L1_2
GND2
GND2
Vout Vout
NMLU1210AC-DC
DC-DCStep Downand Control
AC-DC
Transmitter Receiver
Drivers+
Controller+
V/I Sensing
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Page 26 Internet of Things Solutions
LC709203F High Accuracy Fuel Gauge LSIFuel Gauge for 1 Cell Li+ with Low Power and with No Sense Register
Features• Accuracy of remaining capacity ±2.8% (0 ~ +50°C)• Active mode current of 15 µA• Hibernate mode current of 2 µA• Standby mode current (RAM retention) of 0.1 µA• No need for sense register for current detection
Conventional Display
Detailed Display ofRemaining Capacity
CorrectOperating Time
WithLC709203F
Standby Time120 h
Call Time75 min
77%
Ideal vs. Display (by Temperature) Ideal vs. Display (by Load)
Discharge Characteristics
100
100 90 80 70 60 50 40 30 20 10 0 100 90 80 70 60 50 40 30 20 10 0
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
Real (%)
Dis
p (%
)
Dis
p (%
)
Load: 50 mABattery: DB-L50 Typ 1900 mAh
Room TempBattery: DB-L50 Typ 1900 mAh
Real (%)
0°CRoom Temp50°CIdeal
500 mA750 mA1000 mA1250 mA1500 mAIdeal
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Page 27ON Semiconductor
Power Supply/Management, Voltage Regulation
POWER SUPPLY/MANAGEMENTN L
High VoltageAC-DC
SwitchingRegulator
DC-DCConverters
LDO VoltageRegulators
Device Function Features Package
AC-DC
NCP1010~15NCP1070~77
Self-Supply High Voltage Monolithic Switching Regulator for Low Power Offline Power Supplies
• Dynamic self-supply, no need of an auxiliary winding• Current-mode fixed frequency (options of 65 kHz, 100 kHz, 130 kHz)
PDIP-7, SOT-223
NCP1027~28NCP1124/26/29NCP1136*
High Voltage Monolithic Switching Regulator for Medium Power Offline Power Supplies
• 700 V, 5.8 Ω FET current-mode fixed frequency (65 kHz, 100 kHz)• 650 V, 9/6/2 Ω rugged FET current-mode fixed frequency (65 kHz, 100 kHz)• 800 V, 3.8 Ω rugged FET current-mode fixed frequency (65 kHz, 100 kHz)
PDIP-7
NCP1050~5High Voltage Gated Oscillator Monolithic Switching Regulator
• Oscillator frequency (options of 44 kHz, 100 kHz, 136 kHz) dithering with controlled slew rate driver for reduced EMI
• Startup circuit eliminates the need for transformer auxiliary bias winding
PDIP-7, SOT-223
DC-DC
NCP3170 3 A Switching Regulator• Output voltage adjustable to 0.8 V• 500 kHz or 1 MHz switching frequency
SOIC-8
NCP3063/41.5 A Switching Regulator or utilize as controller for up to 5 A
• Capable of 40 V input• Up to 250 kHz switching frequency
SOIC-8
LM2594/5/6 0.5 A/1.0 A/3 A Switching Regulators• Capable of 40 V input• Fixed 150 kHz switching frequency
TO-220, DPAK,
SOIC-8, PDIP-8
NCP3020/11 PWM Controller• 4.7-28 V input voltage range• EN/PG/SYNC features• Fixed 300/400/600 kHz switching frequency
SOIC-8, TSSOP-14
NCP1034 PWM Controller• Capable of up to 100 V input• Adjustable switching frequency (50-500 kHz)
SOIC-16
* Pending 2Q15.
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Page 28 Internet of Things Solutions
Power Source Voltage Device
VDDS (V)
ID(A)
RDS(ON) (Ω) @ 10 VCiss (pF)
Qg (nC)
G-S Protection DiodeTyp Max Package
≤AC 120 V
FW276 450 0.7 8.6 11.2 55 3.5 Built in SOIC-8
SFT1423 500 2 3.8 4.9 175 8.7 Built in DPAK
2SK4196LS 500 5.5 1.2 1.56 360 14.6 — TO-220F
2SK4096LS 500 8 0.65 0.85 600 24 — TO-220F
BFL4036 500 14 0.4 0.52 1000 38.4 Built in TO-220F
BFL4037 500 16 0.33 0.43 1200 48.6 Built in TO-220F
2SK4085LS 500 16 0.33 0.43 1200 46.6 — TO-220F
2SK4124 500 20 0.33 0.43 1200 — — TO-3P
≤AC 240 V
SFT1440 600 1.5 6.2 8.1 130 6.3 Built in DPAK
SFT1458 600 1 10 13 73 4.7 Built in DPAK
2SK4197FS 600 3.5 2.5 3.25 260 11 — TO-220F
2SK4198FS 600 5 1.8 2.34 360 14.3 — TO-220F
2SK4099LS 600 8.5 0.72 0.94 750 29 — TO-220F
2SK4087LS 600 14 0.47 0.61 1200 46 — TO-220F
2SK4125 600 17 0.47 0.61 1200 — — TO-3P
2SK4088LS 650 11 0.65 0.85 1000 37.6 — TO-220F
BFL4004 800 6.5 1.9 2.5 710 36 — TO-220F
BFL4026 900 5 2.8 3.6 650 33 — TO-220F
BFL4001 900 6.5 2.1 2.7 850 44 — TO-220F
AC 380 V to 480 V
2SK3745LS 1500 2 10 13 380 37.5 Built in TO-220F
2SK4177 1500 2 10 13 380 — Built in TO-263 (D2PAK)
2SK3746 1500 2 10 13 380 — Built in TO-3P
2SK3747 1500 2 10 13 380 — Built in TO-3PF
2SK3748 1500 4 5 7 790 80 Built in TO-3PF
NDFPD1N150C 1500 0.1 100 150 80 4.2 — TO-220F
NDFP03N150C 1500 2.5 8 10.5 650 34 — TO-220F
NDTL03N150C 1500 2.5 8 10.5 650 34 — TO-3P
NDUL03N150C 1500 2.5 8 10.5 650 34 — TO-3PF
NDUL09N150C 1500 9 2.2 3 2400 130 — TO-3PF
AC 590 V to 690 V WPH4003 1700 3 8.2 10.5 850 48 — TO-3PF
Power MOSFETs for Circuit Breakers and Metering Power Supplies
Features• High reliability• Low power dissipation• Avalanche ruggedness• High-speed switching
Transformer/Primary Side
Clamper Circuit
FeedbackCircuit
Output 1
Output 2
RectifierBridge
Driver
AC InputVoltage
DC Output 1
DC Output 2
Low Saturation Voltage BJT forOver Current Sensing Circuit2SC6144SG: 50 V/10 A TO-220F-3FS2SC5707: 50 V/8 A TP, TP-FA
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Page 29ON Semiconductor
LDO Regulators
DeviceIout(mA)
Dropout Typ @ 3.3 V
(mV)Iq
(μA)
PSRR @ 120 Hz
(dB)Vin Max
(V) Vout(V) Package(s)
NCP785A 10 - 12 80 450 3.3, 5.0, 12, 15 SOT-89-3
NCP508 50 180 145 70 13 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SC-70-5, WDFN-6
NCP715 50 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6
NCP716 80 350 4.7 52 24 1.2, 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 SC-70-5, XDFN6
NCP120 150 30 80 72 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6
NCP571 150 450 40 - 12 0.8, 0.9, 1.0, 1.2 TSOP-5, DFN-6
NCP170 150 240 0.5 40 5.5 1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3 SOT-563, uDFN-4
NCP700B 200 118 70 82 5.5 1.8, 2.8, 3.0, 3.3 WDFN-6, TSOP-5
NCP702 200 140 10 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5
NCP752 200 130 12 68 6 1.8, 2.8, 3.0, 3.3 SOT-23-5, XDFN-6
NCP160 250 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4
NCP703 300 180 12 68 6 1.8, 2.8, 3.0, 3.3 XDFN-6, TSOP-5
NCP130 300 60 80 75 6 0.8, 1.05, 1.1, 1.15, 1.2, 1.5, 1.8, 2.1 XDFN-6
NCP161 450 120 20 100 6 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14 XDFN-4, WLCSP-4
NCP3335A 500 250 190 75 18 Adj., 1.5, 1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 5.0 Micro8, DFN-10
NCP3334 500 250 190 75 18 Adj. SOIC-8
NCP705 500 250 12 70 6 0.8, 1.8, 2.8, 3.0, 3.3 SOT-223-6, WDFN-6
NCP5500 500 230 300 75 18 Adj., 1.5, 5.0 DPAK-5, SOIC-8
NCP133 500 140 80 72 6 Adj, 0.9, 1.0, 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.8 XDFN-6
NCP59748 1.5 60 - 70 6 Adj. DFN-10, QFN-20
NCP59744 3 100 - 70 6 Adj. QFN-20
MO
TOR
CO
NTRO
L
Page 30 Internet of Things Solutions
Motor Drive for Small Motor Control
Features• Integrated active flyback protection• Thermal and UVLO fault detection• Over-current fault detection on LV8711T
Motor Controllers
Device TypeVM Max
(V)VCC Max
(V)IO Max
(A)IO Peak Max (A)
Step Resolution
Control Type Current Sense
Regulator Output Package
LV8400V Brush DC 16 6 1.2 3.8 — Parallel None No SSOP-16
LV8711T Stepper/Brush DC 18 6 0.8 1 1/2 Parallel External Resistor Yes TSSOP-24
LV8712T Stepper 18 6 0.8 1 1/8 Clock External Resistor Yes TSSOP-24
LV8713T Stepper 18 6 0.8 1 1/32 Clock External Resistor Yes TSSOP-24
Motor Driver for Zoom
Motor Driver for Focus
Motor Driver forLens Shift
(Up/Down, Left/Right)
LensUnit
Lens
Motor Driver for Iris
CPU
MO
TOR
CO
NTR
OL
MOSFETs and MOSFET Drivers for Motor Control
Page 31ON Semiconductor
MOSFET Features• Low RDS(on) improves efficiency by reducing
conduction loss• Low Gate Charge reduces dynamic power loss• Extensive voltage lineup
Power MOSFETs
Device ChannelVDS (V)
ID (A)
RDS(on) (mΩ)
Qg (nC) Package
ATP208 N 40 90 6 83 ATPAKATP401 N 60 100 3.7 300 ATPAK2SK4066 N 60 100 4.7 220 D2PAK, I2PAKNDBA170N06A N 60 170 3.3 280 D2PAKNDBA180N10B N 100 180 2.8 95 D2PAKCPH3461 N 250 0.35 6500 2.1 CPH-3PCP1405 N 250 0.6 6500 2.1 PCP-1 (SOT-89)SFT1452 N 250 3 2400 4.2 DPAK, IPAKNDDP010N25AZ N 250 10 420 16 DPAK, IPAKFW297 N+N 60 4.5 58 14 SOIC-8FW276 N+N 450 0.7 12100 3.7 SOIC-8FW4604 P+N 30 -4.5/6 65/39 7.5/9.1 SOIC-8ECH8690 P+N 60 -3.5/4.7 94/55 15/18 ECH-8FW389 P+N 100 -2/2 300/225 21/10 SOIC-8ATP107 P -40 -50 17 47 ATPAKATP108 P -40 -70 10.4 79.5 ATPAKATP304 P -60 -100 6.5 250 ATPAKBBS3002 P -60 -100 5.8 280 D2PAK, I2PAKSMP3003 P -75 -100 8 280 D2PAK, I2PAKBMS3004 P -75 -68 8.5 300 TO-220F-3FG
MOSFET Drivers
Device DescriptionNumber of
DriversVin Max
(V)Drive Source/Sink Typ
(mA) Package
TND523SS Single Input High Voltage High Side MOSFET Driver 1 625 200/400 SOIC-8TND524VS Single Input High Voltage High Side MOSFET Driver 1 625 200/400 VEC-8TND525SS Dual Input High Voltage High and Low Side MOSFET Driver 2 625 200/400 SOIC-8TND314S Dual Low Side Driver(Dual Inverter) 2 25 1000/1000 SOIC-8TND315S Dual Low Side Driver(Dual Buffer) 2 25 1000/1000 SOIC-8TND316S Dual Low Side Driver(Inverter and Buffer) 2 25 1000/1000 SOIC-8TND321VD Dual Low Side Driver(Dual Inverter) 2 25 800/1000 VEC-8TND322VD Dual Low Side Driver(Dual Buffer) 2 25 800/1000 VEC-8TND323VD Dual Low Side Driver(Inverter and Buffer) 2 25 800/1000 VEC-8
M
High SideDriver
MOSFETDriver
MOSFETDriver
High SideDriver
Low SideDriver
Low SideDriver
PROC
ESSING
Page 32 Internet of Things Solutions
ASIC
• Microcontroller• DSP
• Coil Driver• Class-D Amp• DAC• Display Driver
• Magnetic Flux• Temperature• Light• Sound• Pressure• Acceleration• Angular Rate
Example:Example:
AnalogSignals
Sensor:• Stepper Motors• Transducers• MOSFETs & BJTs• Relays• Speakers• Lamps• LCD/LED Displays
Mechanical orElectrical System:
• EEPROM• OTP• SRAM• ROM
High Voltage (40 to 80 V)Low Voltage (<3.3 V)
• CAN, LIN• I2C-bus• USB• KNX• M-BUS
• RF
Low orHigh
Voltage
Low orHigh
Voltage
Filtering
Amplification
Sensor Interface
SignalProcessing Actuator
WirelessRadio
WiredCommunications
Power/Battery
Management
SupportingLogic
Analog/Digital
Conversion
Memory
Value Proposition• Experienced resources and assets to bring customers’ design objectives successfully to market
• Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP
• Flexible cost models to reduce customers’ total cost
IP & Fab Processes• ≥55 nm, analog-focused CMOS/BCDMOS process technologies
utilizing internal fabs and external foundry partners
• Low, medium, high voltages — ≤1 V to 90 V
• Low current optimization — active & standby
• Low noise design — “count the electrons”
• High temperature — ≤200°C (profile, for selected technologies)
• Integrated low power wireless
• Non-Volatile Memory (EEPROM, OTP), RAM & ROM
• Embedded digital IP
• Robust ESD protection
• Extensive building block ‘starting points’ consisting of amplifiers, references, DACs, ADCs, linear & switching regulators, power management, etc.
Design Engineering• Approximately 200 expert mixed-signal
designers with extensive SoC and SiP experience
• Robust custom development process
• Dedicated project managers track & report development progress
• Flexible customer development engagement — from full turnkey to subcontractor production services
• Design expertise in:
» Sensor interface
» Wireless systems
» Medical imaging
» Energy management
» Building & home control
Mixed-Signal Custom Solutions
Category Mixed Signal Intellectual Property (IP)
Serial Interfaces USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART
Microprocessors ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals
Memory SRAM, DPRAM, ROM, EEPROM, OTP, FLASH
Clocking Oscillators, PLLs, DLLs
Communication Wireless (Proprietary & Standards), Wired (KNX, PLC and others)
Encryption ECC, AES, 3-DES, DES, RSA
Data Converters DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS)
Wireless IP PGA, LNA, PLLs, Correlators, DSP
Power Management Efficient Switching Regulators, LDOs, Charge Pumps, Thermal Protection
References Precision Bandgaps, Current References, Temperature Sensors
Analog and High Voltage Interfaces
High-Voltage Drivers, Display and LCD Drivers, Class D Amplifiers
Signal Conditioning PGA, Instrumentation Amps, Digital and Analog Filters
PRO
CES
SIN
G
Page 33ON Semiconductor
General and LCD MCUs
MCUs for USB
MCU Features• Pins: 10 – 100• ROM: 4 – 512 KBytes• RAM: 256 – 24,576 Bytes• ADC: 3 – 16 channels
• Operation Voltage: 1.8 – 5.5 (V)• Stand-by IDD: 0.02 µA• RTC (Clock) IDD: 0.45 µA
(with low power model)
Device TypeROM
(kByte)RAM
(Byte) I/Os PWMs UARTs ADC LVD POR Features Package
LC87FBG08A 8-bit General 8 256 21 2 1 12/8-bit x 9ch 4 4 High accuracy internal OSC (±2.0%); all operation is minimum 1.8 V SSOP-24, VCT-24
LC87FBK08A 8-bit General 8 256 21 2 — 12/8-bit x 8ch 4 4 High accuracy internal OSC (±3.0%); Support Mask Type SSOP-24
LC87FBL08A 8-bit General 8 256 26 2 — 12/8-bit x 11ch 4 4 High accuracy internal OSC (±3.0%) QFP-36
LC87FBH08A 8-bit General 8 256 26 2 1 12/8-bit x 11ch 4 4 High accuracy internal OSC (±3.0%) QFP-36
LC87F2R04A 8-bit General 4 128 21 — — 12/8-bit x 8ch 4 4 Small scale 8bit MCU; Remote Control Receiver Circuit SSOP-24
LC87BK08A* 8-bit General 8 256 21 2 — 12/8-bit x 8ch 4 4 Mask ROM edition of LC87FBK08A SSOP-24
LC87F2416A 8-bit General 16 512 26 2 1 12/8-bit x 10ch — — Premium market segment QFP-36
LC87F2J32A 8-bit General 32 1024 41 2 1 12/8-bit x 14ch 4 4 Premium market segment SQFP-48, QIP-48
LC87F2W48A 8-bit General 50 1536 40 2 1 12/8-bit x 14ch 4 — Premium market segment SQFP-48
LC87F2C64A 8-bit General 64 2048 73 4 2 12/8-bit x 16ch 4 4 RTC; low power consumption QFP-80
LC87FC096A 8-bit General 96 4096 55 6 2 12/8-bit x 11ch 4 4 12bit PWM x 6 QIP-64E
LC87F2608A 8-bit General 8 512 7 1 — 12/8-bit x 3ch 4 4 High speed 12-bit PWM; Analog Comparator MFP-10SK
LC87F0808A 8-bit General 8 256 30 6 1 10/8-bit x 10ch 4 4 MCPWM; High speed ADC (10-bit); Analog Comparator/Amplifier x 2 QFP-36
LC87F0N04A 8-bit General 4.5 128 12 4 — 10/8-bit x 6ch 4 4 MCPWM; High speed ADC (10-bit); Analog Comparator x 2 SSOP-16
LC87F0G08A 8-bit General 8 256 18 3 — 12/8-bit x 7ch — — MCPWM, OP-AMP, Analog comparator SSOP-24
LC87F0A08A 8-bit General 8 256 30 2 — 12/8-bit x 8ch 4 4 OP-AMP, Analog comparator, Constant current output port QFP-36
LC87F5VP6A 8-bit General 256 10240 89 4 2 8-bit x 15ch — — Large scale memory QIP-100E
LC88F58B0A 16-bit General 128 6144 54 2 2 12/8-bit x 11ch — 4 Motor control signal generator SQFP-64
LC88F52H0A 16-bit General 512 24576 90 4 4 12/8-bit x 16ch — 4 DAC; PWM; RTC; SIO x 5; UART x 4 TQFP-100
LC87F7932B 8-bit LCD 32 2048 49 2 1 12/8-bit x 7ch — 4 32 x 4 segment driver; RTC; low power consumption SQFP-64
LC87F7J32A 8-bit LCD 32 1024 51 2 1 12/8-bit x 12ch 4 4 24 x 4 segment driver; support 5 V/3 V for LCD-panel TQFP-64
LC87F76C8A 8-bit LCD 128 4096 71 2 1 12/8-bit x 12ch — — 32 x 4 segment driver QFP-80
LC87F7DC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; many segment drivers QIP-100E
LC87F7NC8A 8-bit LCD 128 4096 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E
LC87F7NJ2A 8-bit LCD 192 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E
LC87F7NP6A 8-bit LCD 256 8192 91 2 2 12/8-bit x 15ch — — 54 x 4 segment driver; large scale memory QIP-100E
Device TypeROM
(kByte)RAM
(Byte) I/Os PWMs UARTs ADC LVD POR Features Package
LC87F1A32A 8-bit USB 32 2048 39 2 1 12/8-bit x 12ch — — IR reciever SQFP-48
LC87F1M16A 8-bit USB 16 1024 38 2 1 12/8-bit x 20ch 4 4 UART & SCUART; high current driver SQFP-48
LC87F1K64A 8-bit USB 64 8192 39 2 1 12-bit x 12ch 4 4 USB I/F x 2; USB Host; Audio I/F SQFP-48
LC87F17C8A 8-bit USB 128 8192 39 2 1 12/8-bit x 12ch 4 4 USB 2.0 full speed host/device controller x2; audio IF SQFP-48
LC87F1HC8A 8-bit USB 128 16384 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
LC87F1JJ2A 8-bit USB 192 16384 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
LC87F1JJ4A 8-bit USB 192 20480 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
LC87F1JJ8A 8-bit USB 192 24576 39 2 1 8-bit x 12ch — — USB Host; Audio I/F SQFP-48
* Mask ROM Device; Contact ON Semiconductor for additional information.
MCU Features• USB 2.0 full-speed / low speed functions• USB device function / USB host function
• Integrated voltage regulator• USB D+ line pull-up function
μA
PROC
ESSING
Page 34 Internet of Things Solutions
Development Tools for Microcontrollers
SoftwareDevelopment
Debugging/Verification
Writing
•
•
Inst87 (Information on micro-controller models)SU (Options setup program)
Single programmer AF9709C / AF9711
Gang programmer AF9723/23B (main body) AF9833 (unit)
Onboard Programmer AF9101/03 (main body) SIB87-TYPEC-GMDT (ON Semiconductor)
Supports Both 8- and 16-Bits
For 8-Bit
For 16-Bit
C Compiler/Assembler
C Compiler/Assembler
Software DevelopmentEnvironment CD
•
•
Inst87 (Information on micro-controller models)SU (Options setup program)
Software DevelopmentEnvironment CD
On-chip DebuggerFlash Writing System
Display Panel EmulationTool
TCB87-TYPEC-MDT(On-chip debugger software included)
On-chip DebuggerEOCUIF2-MDT(On-chip debugger software included)
Panel Design
On Board WriterSKK-DBG-TYPECMDT
•
Flash ROM WriterSKK-TYPEC-MDT
•
On Board WriterFWSX16DITYPE2MDT
•
Flash ROM Writer fromSupport Group
•
PRO
TEC
TIO
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Page 35ON Semiconductor
USB 2.0 for ConsumerOne High Speed Pair, VCC, Low Capacitance ESD Protection
Key Requirement• Cap < 1.5 pF
Features• 0.5 - 0.8 pF• 4 low speed + 1 VBUS integrated – can protect
up to 2 USB ports• Industry leading low clamping voltage
Device LinesCapacitance
(pF) PackageSize(mm)
NUP4114UPX 4 0.8 SOT-563 1.6 x 1.6
NUP4114UCL 4 0.5 SC-88 2.0 x 2.1
NUP4114H 4 0.8 TSOP-6 3.0 x 2.75
ESD7L5.0 2 0.5 SOT-723 1.2 x 1.2
ESD9L5.0 1 0.5 SOD-923 1.0 x 0.6
VBUS
D-
D+
GND
NUP4114
I/O 1 I/O 2
=
I/O 3 I/O 4
One High Speed Pair, VCC, Common Mode Filter + ESD Protection
Key Requirement• Cap < 1.5 pF• Common Mode Filtering
Features• 0.5 - 0.8 pF• Integrated EMI suppression with ESD protection• Industry leading low clamping voltage
Device PairsCapacitance@ 2.5 V (pF)
CM Attenuation@ 800 MHz (–dB)
DM Bandwidth F3dB (GHz) Package
Size(mm)
EMI2121 1 0.9 –25 2.5 WQFN 2.2 x 2.0 x 0.75
USB 2.0 @ 480 Mb/s
D+
D-
VBUS
Top layerOther layer
ID
GND
Micro USBConnector
EMI2121
-35
-30
-25
-20
-15
-10
-5
0
1.E+06 1.E+07 1.E+08 1.E+09
dB
Frequency
CommonMode
DifferentialMode
Suppresses Common Mode NoiseDeeper than Competing Passive Solution
PROTEC
TION
Page 36 Internet of Things Solutions
Ethernet : 10/100BASE-T, 1000BASE-TX, and GigabitTwo & Four Pairs, Low Capacitance Surge and ESD Protection
Signal Integrity for Gigabit Ehternet
Line Side : LC03-6 (optional)Transformer Side: ESD1014
Protection against metallic (transverse) strikes
Typical ApplicationFeatures• Wide range of voltages and capacitance values for tertiary
protection• Vclamp (25 A surge) < 11 V• IEC 61000-4-2 rating > 30 kV• No latching danger• Surge rating maintained to 125°C
Benefits• Compatible with Gigabit Ethernet and beyond• Enhanced protection for downstream electronics• Accommodates operating transients above 3.3 V• Small form-factor allows integration into connectors
The 10/100BASE-T, 1000BASE-TX, and Gigabit Ethernet (GigE) interfaces operating at higher rates are susceptible to ESD strikes, cable-discharge events and lightning-induced transients. Our products help meet IEC 61000-4-5, GR-1089-CORE and other Standards.
C5VDDC1
C1
ESD1014 LC03
C1
C1
ESD1014
C5VDD
LC03
C5VDD
LC03
C5VDD
LC03
TPOPA
TPONA
TPOPB
TPONB
TPOPC
TPONC
TPOPD
TPOND
A+
A-
B+
B-
C+
C-
D+
D-
1000
BA
SE
-TE
TH
ER
NE
T T
RA
NS
CE
IVE
R
TR
AN
SF
OR
ME
R
RJ4
5
1 8
1 8
1 8
1 8
Through Board
With ESD1014
VDD
RJ4
5
A+
A–
B+
B–
C+
C–
D+
D–
MX4+
MX4–
TR4+
TR4–
TCT4MCT4
MDI_A+
MDI_A–
10/100BASE-T
LINEDRIVER
TRANSFORMER
VDD
GNDCHASSIS
SRDA3.3
1 8
Transformer Side – SRDA3.3Line-to-Line protection against metallic strikes
Typical Application
Transient Voltage Suppressors
Device Data LinesVDC Max
(V)
Surge IPP 8/20 μs
(A)
Typical Line-Line
Capacitance(pF)
ESD Contact Rating(±kV) Package
NUP4114H 2 pair ESD Only10/100/1000BASE-TX, GigE 5.0 12* 0.4 13 TSOP-6
SRDA3.3 1 pair10/100BASE-T 3.3 25 4 8 SOIC-8
ESD1014 2 pair1000BASE-TX, GigE 3.3 25 1.5 30 UDFN-10
LC03-6 1 pair Line Side10/100/BASE-T, GigE 5.0 100 8 30 SOIC-8
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Page 37ON Semiconductor
Serial EEPROMs
Features• Broad density range: 1 kb to 2 Mb
• Wide operating Vcc range: 1.8/1.7 V to 5.5 V
• High endurance: 1 million program/erase cycles
• Wide temperature range: industrial and extended
EasyPRO™ is a user-friendly, portable programming tool for ON Semiconductor serial EEPROMs
(I2C, SPI, Microwire)
EEPROMsData
Transmission Standard Device Density Organization*
VCC Min(V)
VCC Max(V)
fCLK Max(MHz) Package(s)
I2C
CAT24M01 1 Mb 128k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8
CAT24C512 512 kb 64k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8
CAT24C256 256 kb 32k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8
CAT24C128 128 kb 16k x 8 1.8 5.5 1 SOIC-8, TSSOP-8, UDFN-8
CAT24C64 64 kb 8k x 8 1.7 5.5 1 SOIC-8, TSSOP-8, UDFN-8, WLCSP-4
CAT24C32 32 kb 4k x 8 1.7 5.5 1 SOIC-8, TSSOP-8, UDFN-8, WLCSP-5
CAT24C16 16 kb 2k x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
CAT24C08 8 kb 1k x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
CAT24C04 4 kb 512 x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
CAT24C02 2 kb 256 x 8 1.7 5.5 0.4 SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SPI
CAT25M02 2 Mb 256k x 8 1.7 5.5 10 SOIC-8
CAT25M01 1 Mb 128k x 8 1.8 5.5 10 SOIC-8, TSSOP-8
CAT25512 512 kb 64k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25256 256 kb 32k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25128 128 kb 16k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25640 64 kb 8k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25320 32 kb 4k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25160 16 kb 2k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25080 8 kb 1k x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25040 4 kb 512 x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25020 2 kb 256 x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
CAT25010 1 kb 128 x 8 1.8 5.5 20 SOIC-8, TSSOP-8, UDFN-8
Microwire
CAT93C86 16 kb 2k x 8 / 1k x 16 1.8 5.5 3 SOIC-8
CAT93C86B 16 kb 2k x 8 / 1k x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8
CAT93C76 8 kb 1k x 8 / 512 x 16 1.8 5.5 3 SOIC-8, TSSOP-8
CAT93C76B 8 kb 1k x 8 / 512 x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8
CAT93C66 4 kb 512 x 8 / 256 x 16 1.8 5.5 2 SOIC-8, TSSOP-8
CAT93C56 2 kb 256 x 8 / 128 x 16 1.8 5.5 2 SOIC-8, TSSOP-8
CAT93C46 1 kb 128 x 8 / 64 x 16 1.8 5.5 2 SOIC-8, TSSOP-8
CAT93C46B 1 kb 128 x 8 / 64 x 16 1.8 / 1.65 5.5 4 SOIC-8, TSSOP-8, UDFN-8
* Organization for Microwire devices is selectable.
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Page 38 Internet of Things Solutions
Integrated Passive Devices ( IPD)• Combines multiple resistors, capacitors and inductors onto a film substrate; typical applications include RF baluns, filters, and
matching networks• Reduces PCB footprint and component height versus discrete implementations, while also improving performance (reduced parasitics)• Simplifies logistics, inventory managememt and pick-and-place assembly by elimination of multiple discrete passive SKUs• Based on 110 nm silicon process with high performance and tight process control
• Wafers manufactured on high precision equipment, designed for 110 nm transistor fabrication
• Very tight performance tolerances and low variation across wafers• ±4.3% tolerance 1K MIM caps• ±3.9% tolerance 2K MIM caps• < 1% variance between caps on common IPD
Integration of multiple R, L, and Cinto single IPD
Available Components
• MIM capacitors, 0.62 nF/mm2 , typical tolerance ±5%
• TiN resistors, 9 Ω/sq
• Copper inductors, minimum spacing 3 µm, minimum line width 5 µm, current handling >50 mA/µm, achieves Q-factors up to 45
Picked & Diced Wafer Edge
Inductor Within IPD (SEM Photo)
Sub-Micron Tolerances — Trace Spacing/Width Down to 3/5 μm
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Page 39ON Semiconductor
Logic TranslatorsDual supply voltage logic translators connect ICs and PCBs together that operate at different supply voltages.
Features• Industry’s first devices with independent power
supplies (VL < VCC, VL = VCC, or VL > VCC)• High 100 pF capacitive drive capability • Overvoltage tolerant enable and I/O pins • Non-preferential power-up sequencing • Power-off protection
Unidirectional Translator
Autosense BidirectionalTranslator
(Push-Pull Output)
Autosense BidirectionalTranslator
(Open-Drain Output)
BidirectionalTranslator
(with Direction Pin)
Block Diagram
VCCA VCCB
B
OE
A
POne−Shot
NOne−Shot
POne−Shot
NOne−Shot
VL
I/O VL I/O VCC
VCC
R1
R2
1k
1k
PU1
RPullup10 k
VL
I/O VL I/O VCC
VCC
One−ShotBlock
One−ShotBlock
PU2
GateBias
N
RPullup10 k
EN ENB
A
DIR
VCCA VCCB
Attributes• High Data Rate• Low Power Consumption
• High Data Rate• Low Power Consumption
• High Data Rate• Low Power Consumption• Flexible PCB Design
• High Data Rate• Low Power Consumption• Flexible PCB Design
Trade-Offs • Fixed Input & Output Pins • Modest Output Current • Modest Bandwidth • Directional Control Pin Required
Applications
• SPI• GPIO
• SPI• GPIO
• I2C, SMBus, PMBus• GPIO• SDIO Cards• 1-Wire Bus
• GPIO
Sample Device (I/O Channels, Package)
• NLSV1T34 (1-Bit, ULLGA-6)• NLSV1T240/244 (1-Bit, UDFN-6)• NLSV2T240/244 (2-Bit, UDFN-8)• NLSV4T240/244 (4-Bit, UDFN-12)• NLSV4T3234 (4-Bit, CSP-11)• NLSV8T240/244 (8-Bit, UDFN-20)
• NLSX3012 (2-Bit, UDFN-8)• NLSX3014 (4-Bit, UQFN-12)• NLSX3013 (8-Bit, CSP-20)• NLSX3018 (8-Bit, UDFN-20)• NLSX4014 (4-Bit, UQFN-12)• NLSX5011 (1-Bit, UULGA-6, UDFN-6)• NLSX5012 (2-Bit, UDFN-8)• NLSX5014 (4-Bit, UDFN-12)
• NLSX3373 (2-Bit, UDFN-8)• NLSX3378 (4-Bit, CSP-12)• NLSX4373 (2-Bit, UDFN-8)• NLSX4378 (4-Bit, CSP-12)
• NLSV1T45 (1-Bit, ULLGA-6)• NLSV2T245 (2-Bit, UQFN-10)• NLSV2T3236 (2-Bit, UQFN-10)• NLA16T245 (16-Bit, TSSOP-48)
Translator
EEPROM
Translator
Translator
On-boardtranslations• SPI• I2C• SMBus
PCB-to-PCBTranslation
PCB #1 PCB #2
μC #1 μC #2
BRD8075/DBRD8075-6 PRINTED IN USA 2/15 IRONWOOD XXXX 2K
ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local Sales Representative
PUBLICATION ORDERING INFORMATION
Sales and Design Assistance from ON Semiconductor
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Segyung Britestone Co. www.britestone.com (82) 2 3218 1511
Serial AMSC www.serialsystem.jp (81) 3 5795 1635
Serial Microelectronics, HK www.serialsys.com.hk (852) 2790 8220
World Peace Industries Co. www.wpi-group.com (852) 2365 4860
WT Microelectronics Co. www.wtmec.com (852) 2950 0820
Yosun Electronics www.yosun.com.tw (886) 2 2659 8168
ON SEMICONDUCTOR INTERNATIONAL SALES OFFICESGREATER CHINA Beijing 86-10-8577-8200
Hong Kong 852-2689-0088Shenzhen 86-755-8209-1128Shanghai 86-21-5131-7168Taipei, Taiwan 886-2-2377-9911
FRANCE Paris 33 (0)1 39-26-41-00GERMANY Munich 49 (0) 89-93-0808-0INDIA Bangalore 91-98-808-86706ISRAEL Raanana 972 (0) 9-9609-111ITALY Milan 39 02 9239311JAPAN Tokyo 81-3-5817-1050KOREA Seoul 82-31-786-3700MALAYSIA Penang 60-4-6463877SINGAPORE Singapore 65-6484-8603SLOVAKIA Piestany 421 33 790 2450UNITED KINGDOM Windsor 44 1753 62 6718
www.onsemi.com/supportON Semiconductor Technical Support For a comprehensive listing of
ON Semiconductor Sales Offices, Distributors, and Rep Firms, please visit:
Americas & EMEA: www.onsemi.com/sales
China: www.onsemi.cn/sales
Japan: www.onsemi.jp/salesFeb-15
ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. HART is a registered trademark of the HART Communication Foundation. KNX and the KNX logos are registered trademarks of KNX and its suppliers or licensors. Micro8 is a trademark of International Rectifier. OMS is a registered trademark of OMS Group, Germany. ZigBee is a registered trademark of ZigBee Alliance. All other brand names and product names appearing in this document are trademarks of their respective holders.