Six Core AMD Opteron Processor With AMD Chipset Platform

Six-Core AMD Opteron™ Processor with AMD Chipset Platform

Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST

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Six-Core AMD Opteron™ Processor with AMD Chipset Platform

• Unified server platforms with AMD on AMD – benefits of processor + chipset

• Enhanced platforms with chipset choices and key technologies

Ultra power efficient platform designed for cloud and dense deployments (using AMD Opteron™ EE processor and S5650 chipset)

First 4P x86 Platform with PCI Express® 2.0 for HPC applications

Three chipset solutions to optimize workloads

• Extends AMD Virtualization™ (AMD-V™) technology and AMD-P suite of features

• Wide availability from ODMs; OEMs are expected to introduce new chipsets as part of AMD’s 2010 processor lineup

SR56x0I/O Hub

SR56x0I/O Hub

AMD-V™AMD-V™

SP5100South Bridge


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Range and flexibilityof chipsets

(from high bandwidth to power efficient)

to meet the demandsof your workloads

Power efficiency beyond the processor

Key Benefits

Choice ofChipsets

Exceptional Virtualization capabilities

Only 4P x86 solution with Tagged TLB, RVI and I/O Virtualization

Increased performance and

throughput

(up to 2x for PCI Express® 2.0 vs. PCI

Express® 1.0)

Benefits

KeyTechnologies

Consistent Feature Set

AMD-P

AMD-V™

PCI Express® 2.0

HyperTransport™ 3.0 Technology

SR5690 SR5650SR5670


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TYAN S8208: Energy Efficient Server Platform

TYAN S8208 Overview

AMD and TYAN CollaborationTYAN S8208 = Six-Core AMD

Opteron™ EE + new AMD SR5650 & SP5100 server chipset

Ultra power efficient twin form-factor platform

designed for cloud and density deployments

Energy Efficient• Designed for the

Cloud

• Optimized for HE& EE

• Energy Efficient AMD Chipset

• AMD-P Technology

• Platform-level power management support

• Expected Nov. 09


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HPC University Implementation with PRACE

Customer: Swedish National Infrastructure for

Computing (SNIC), Royal Institute of Technology (KTH), Sweden, jointly with the Partnership for Advanced Computing in Europe (PRACE)

Need: A general purpose HPC cluster for energy efficiency and compute density using standard components

Buying Criteria: Superior performance/watt/density and ability

to control energy consumption depending on workload and performance based on flop/s and GB/s

x86 Platform Latest technology chipset supporting PCI

Express® 2.0

Collaborative effort between Supermicro UK office and AMD

AMD product: Six-Core AMD Opteron™ HE processor with new AMD SR5670 chipset using HyperTransport™ 3 technology and HT assist

Infrastructure: SuperMicro Highly dense 7U enclosure (with

10x 4P Blade Model) BHQIE QDR Switch incorporated inside the blade

enclosure Management per node including KVM/IP Redundant PSU’s capable of operating at ultra

high power efficiency

Quantity: 720 processors; 4320 cores

Challenge Solution

http://www.amd.com/


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OTOY and AMD Fusion Render Cloud

Customer: OTOY

Need: The ability to deliver large scale computational power to service the needs of many end users who rely on central computing in lieu of graphics cards in their own devices.

Buying Criteria: • FLOP/S capabilities in a small server

form factor• PCI Express® 2.0 chipset to drive high

end graphics• Maximum number of GPU's in a single

server• Highly dense solution of servers and

GPU's

AMD product: Six-Core AMD Opteron™ processor with Dual AMD 5690 chipsets and 4 AMD FireStream™ cards per node

Infrastructure: : Supermicro 2P with dual 5690’s and 2 HyperTransport™ technology links per socket

Quantity: 5 Racks; 120 nodes; 240 CPU’s and 480 GPU’s

Challenge Solution

http://www.amd.com/


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Tyan Planned Availability

Form FactorOptimal

Usage ModelPlanned

AvailabilityBarebone

Model

1U Dense Infrastructure/ SMB Sept 2009 GT24 B8212

1U Web/cloud Oct 2009 GT14 B8005

1U Web/cloud Nov 2009 YR190 B8208

Form FactorOptimal

Usage ModelPlanned

AvailabilityMotherboard

Model

MEB Dense Infrastructure/ SMB Sept 2009 S8212

ATX Web/cloud Oct 2009 S8005

Custom Web/cloud Nov 2009 S8208


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Supermicro Planned Availability

Form FactorOptimal

Usage ModelPlanned

AvailabilityBarebone

Model

2U Expandable Infrastructure Sept 2009 AS-2021A-32 R+F+

Blade HPC /dense environments Sept 2009 SBA-7141i-T

4URendering/ Technical

computingOct 2009 AS-4021GA-62R+F

1UHPC / Database /Virtualization

Oct 2009 AS-1041A-T2F

Form FactorOptimal

Usage ModelPlanned

AvailabilityMotherboard

Models

EATXExpandable Infrastructure Sept 2009 H8DI3+/i+

EATX Rendering/ Technical computing

Oct 2009 H8DA6+/i+

SWTX HPC / Database /Virtualization

Oct 2009 H8QI6/i(+)


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AMD Server Platforms: A Look Ahead

Virtualizationdrives the need for

more cores and greater scalability

Cloud computing and dense deployments

drivethe need for greater

energy efficiency

Performance/Expandability

Power/ Cost Efficiency

AMD Opteron™ 6000 series platform

Driving performance, consistency and value to the market

Six-Core AMD Opteron™ Processor

Quad-Core AMD Opteron™ Processor AMD Opteron™

4000 series platform


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AMD continues to execute the strategy to provide enhanced platforms to the market

Six-Core AMD Opteron™ processor with AMD chipset furthers AMD’s goal to drive performance, consistency and value in the market

Unified server platforms with AMD on AMD – benefits of processor and chipset

Platform Benefits

Range and flexibility of chipsets to meet varied demands of key workloads


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Disclaimer & AttributionDISCLAIMERThe information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.

The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.

AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.

AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

ATTRIBUTION

© 2009 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Opteron, AMD Virtualization, AMD-V, FireStream, and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft, Windows, and Windows Vista are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

Six Core AMD Opteron Processor With AMD Chipset Platform

Technology

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