Sincerity Cooperation Innovation Environmental. Sincerity Cooperation Innovation Environmental...

真诚合作创新环保 Sincerity Cooperation Innovation Environmental


Contents

HINNOTECH Introduction

HINNOTECH Culture

HINNOTECH Material Introduction

Laminate Property Benchmark

PCB Process Properties

Summary


HINNOTECH IntroductionJIANGMEN HINNO-TECH CO., LTD. is a professional manufacturer of CCL materials and optical materials, and a joint venture established by JIANGMEN YINGJIANG TRADING CO., LTD. and Hong Kong Well Bright International Development Co., Ltd. It owns independent production, marketing and development research.

HINNOTECH Basic Information

Established Date August 2009

Mass Production Date April 2010

Employee 50

Capacity

Prepreg: 600Km/month at present 1800Km/month in the end of 2010

Laminate: 300K SH/month in Q2 of 2011 600K SH/month in Q2 of 2012

Product Lead-free: H-840, H-850, H-880Lead-free and Halogen-free: H-850G


HINNOTECH Organization Chart

Manufacturing Dept.

Chairman

Industrial Safety

Finance AdministrationPE QAWarehouse R&DProducingEquipment

MaintenanceTechnical

servicePMC Sales Purchasing

Technical Dept.Marketing Dept.

Management Representative


HINNOTECH CultureCorporate culture:

Integrity Management, Pioneer Innovation, ECEP (Energy Conservation Environmental Protection), People-oriented.

Corporate values: Sincerity, Cooperation, Innovation, Environmental.

Quality policy: Create excellent quality, Exceed customer expectations.

Environmental Policy: Legislation compliance, Environmental protect implemention, Pollution prevention, Energy efficiency, Waste induction, Continuous improvement.

Vision: Technology innovation creates good lives.


HINNOTECH Materials Introduction

Product Properties

PCB Application

End-user Application


Product PropertiesItems Conditions Units H-840 H-850 H-880 H-850G

MaterialClassific-

ation

IPC-4101C - - 101 99 126 125

ANSI - - FR4(Normal)

FR4(Mid)

FR4(High) FR4(Mid)

Cure system - - PN PN PN PN

Halogen Free - - No No No Yes

Lead Free - - Yes Yes Yes Yes

General Charact-eristics

Tg DSC ℃ 145 155 180 155

Tg TMA ℃ 135 145 170 145

T260 TMA min 65 85 100 >120

T288 TMA min 12 18 20 >60

Td 5% wt loss ℃ 340 345 345 350

Z-CTE before Tg ppm/ ℃ 40 40 40 40

Z-CTE after Tg ppm/ ℃ 260 245 245 245

Z-CTE 50~260℃ % 3.5 3.2 2.8 3.2

Peel Strength HTE 1oz lb/in 9.0 9.0 9.0 9.0

Moisture Absorption D-24/23 % 0.09 0.09 0.08 0.14

Solder Heat Resistance(288 Floating, 10sec/cycle)℃ - - >6cycle >6cycle >6cycle >6cycle

Dk 1GHz - 4.8 4.8 4.8 4.8

Df 1GHz - 0.014 0.014 0.014 0.010

CAF 85 /85% ℃RH,50V hrs >2000 >2000 >2000 >2000


PCB ApplicationItems Conditions Units H-840 H-850 H-880 H-850G

PCB Process

Layer count - - 2-10 2-24 >20 2-24

Total thickness - - 0.4-2.4 0.4-3.2 0.4-6.0 0.4-3.2

Cu thickness (max) Inner OZ 4 6 6 6

Line/Space (Min)Inner mil 2/2 2/2 2/2 2/2

Outer mil 3/3 3/3 3/3 3/3

Through hole diameter (min) - mm 0.25 0.25 0.25 0.25

Through hole pitch (min) - mm 0.60 0.60 0.60 0.60

Aspect Ratio (max) - - 10:1 14:1 18:1 14:1

Lamination - - 40min/180℃ 60min/180℃ 60min/180℃ 60min/180℃

Drilling - - Lead Free FR4 Lead Free FR4 Lead Free FR4 Lead Free FR4

Desmear - - Lead Free FR4 Lead Free FR4 Lead Free FR4 Lead Free FR4

HINNOTECH Products have high performance /cost

ratio.


End-user Application

Items H-840 H-850 H-880 H-850G

Application Type

AV Equipment ◎ ◎ ○ ◎

Digital Camera ◎ ◎ ○ ◎

Game Machine ◎ ◎ ○ ◎

Personal Computer ◎ ◎ ○ ◎

Liquid Crystal Display ○ ○ ◎ ○

Server ○ ◎ ◎ ◎

Mobile Phone ◎ ◎ ◎ ◎

Exchanger ○ ◎ ◎ ◎

Semiconductor - ○ ◎ ○

Memory Module ◎ ◎ ◎ ◎

Semiconductor Testing Device - ○ ◎ ○

Auto Engine Control ○ ◎ ◎ ◎

Remark: excellent application, ○ good application.◎


Laminate Property Benchmark

Lead-free Normal Tg Benchmark

Lead-free Mid Tg Benchmark

Lead-free High Tg Benchmark

Lead-free & Halogen-free Benchmark


Lead-free Normal Tg BenchmarkItem Unit H-840 NP-140M S1141K

F IT-588

Tg (DSC) ℃ 145 135 140 138

T260(TMA) min >60 35 >60 >60

T288(TMA) min 12 7 >15 15

Decomposition Temperature(5% wt loss) ℃ 340 326 >350 345

Z-CTE (before Tg) ppm/ ℃ 40 60 56 50

Z-CTE (after Tg) ppm/ ℃ 260 285 256 260

Z-CTE(50~260 )℃ % 3.5 4.2 4.0 3.8

Peel Strength (HTE 1oz) lb/in 9.0 11.5 9.0 8.8

Moisture Absorption (D-24/23) % 0.09 0.13 0.10 0.11

Solder Heat Resistance(288 Floating, 10sec/cycle)℃ - >6cycle >6cycle >6cycle >6cycle

Dk(1GHz) - 4.8 4.4 4.7 4.7

Df(1GHz) - 0.014 0.016 0.015 0.015Remark: based on 1.6mm.

H-840 has higher Tg, lower CTE and lower moisture absorption, which shows it has better thermal resistance than other similar materials.


Lead-free Mid Tg BenchmarkItem Unit H-850 IS400 TU-662 EM-825 S1000 IT-158

Tg (DSC) ℃ 155 150 150 150 155 155

T260(TMA) min >60 60 >60 >60 60 >60

T288(TMA) min 18 10 15 15 10 17

Decomposition Temperature(5% wt loss) ℃ 345 330 340 340 335 345

Z-CTE (before Tg)ppm/ ℃

4030 50 50 49 46

Z-CTE (after Tg)ppm/ ℃

245250 260 260 250 255

Z-CTE(50~260 )℃ % 3.2 3.0 3.4 3.4 3.4 3.3

Peel Strength (HTE 1oz) lb/in 9.0 8.0 8.5 8.5 8.0 8.8

Moisture Absorption (D-24/23) % 0.09 0.13 0.13 0.09 0.10 0.10

Solder Heat Resistance(288 Floating, 10sec/cycle)℃ -

>6cycle >6cycle >6cycle >6cycle >6cycle >6cycle

Dk(1GHz) - 4.8 3.9 4.7 4.7 4.7 4.7

Df(1GHz) - 0.014 0.022 0.015 0.015 0.013 0.015Remark: based on 1.6mm.

H-850 has excellent thermal resistance, low CTE, high peel strength and low moisture absorption. Its properties are similar to the others’.


Lead-free High Tg BenchmarkItem Unit H-880 370HR TU-752 EM-827 S1000-2 IT-180A

Tg (DSC) ℃ 180 180 180 175 180 >170

T260(TMA) min >60 60 >60 >60 60 >60

T288(TMA) min 20 10 >15 30 20 20

Decomposition Temperature(5% wt loss) ℃ 345 330 350 345 345 350


4050 45 45 45 45


245270 255 255 250 250

Z-CTE(50~260 )℃ % 2.8 3.2 2.8 2.8 3.0 3.0

Peel Strength (HTE 1oz) lb/in 9.0 7.5 8.0 8.5 7.5 8.5

Moisture Absorption (D-24/23)

% 0.080.12 0.10 0.012 0.10 0.10


>6cycle >6cycle >6cycle >6cycle >6cycle >6cycle

Dk(1GHz) - 4.8 4.6 4.7 4.7 4.8 4.7

Df(1GHz) - 0.014 0.016 0.015 0.015 0.013 0.015Remark: based on 1.6mm.

H-880 also has high reliability as same as other high Tg materials.


Lead-free & Halogen-free BenchmarkItem Unit H-850G R-1566 MCL-E-67G DE-156 NPG EM-285 S1155 IT-150G

Tg (DSC) ℃ 155 150 - 155 150 150 135 156

Tg (TMA) ℃ 145 142 145 145 140 141 126 148

T260(TMA) min >120 >60 >60 >60 >60 >60 >60 >60

T288(TMA) min >60 >60 >60 >60 >60 >60 >60 >60

Decomposition Temperature(5% wt loss) ℃ 350 350 340 390 348 340 355 355


4040 50 45 35 50 45 45


245255 250 220 210 250 260 260

Z-CTE(50~260 )℃ % 3.2 3.2 3.1 2.8 3.1 3.1 3.5 3.3

Peel Strength (HTE 1oz) lb/in 9.0 9.5 8.0 7.0 8.0 8.5 8.0 >6.0

Moisture Absorption (D-24/23) % 0.14 0.13 0.08 0.10 0.29 0.08 0.015 <0.5


>6cycle >6cycle >6cycle >6cycle >6cycle >6cycle >6cycle >6cycle

Dk(1GHz) - 4.8 4.8 4.7 4.5 4.6 4.7 4.9 4.7

Df(1GHz) - 0.010 0.009 0.009 0.014 0.012 0.009 0.011 0.012Remark: based on 1.6mm. H-850G also has good thermal resistance, low CTE,

high peel strength and low Df properties.


PCB Process Properties

Inner Layer

Laminate

Drilling

Desmear

Punch or Routing


Inner layer

The first board test must be taken to find suitable parameter (dimension compensation) before mass production.

For Oxide treatment, we prefer to multibond and recommend to use lead free medicament.

Recommend to post-oxide baking for at least 40min at 120 to remove moisture. ℃


Lamination


Drilling

H-880 H-850GH-850H-840FR4

370HREM827

Remark: 2000hit, 1.6mm 2PNL/stack for Φ0.4mm hole.

HINNOTECH products have low drilling

loss that is close to traditional FR4


Desmear

Desmear cycles

Desmear

Loss

Desmear

Items

2

0.5

H-880

1

0.8

H-850

111

111

H-850GH-840FR4

H-840 and H-850G have good desmear properties as same as traditional FR4. But H-850 and H-880 are a little difficult to be desmeared comparing to traditional FR-4.


Punch or Routing

Material TypeH-840 Punch or RoutingH-850 RoutingH-880 Routing

H-850G Punch or Routing

Punch ability comparison (FR4 、 H-840 、 H-850G)

H-840 and H-850G are same as

traditional FR4 for punch.

Guideline for punch or routing

Based on 1.6mm thickness.


Summary

HINNOTECH lead-free or/and halogen-free materials have excellent performances such as high thermal resistance, high peel strength, low CTE, and so on.

The PCB process properties are quite excellent for HINNOTECH materials. Especially, their drilling loss are lower than similar materials in present market, which can help PCB to achieve cost down.

HINNOTECH products have high performance/cost ratio.

Based on the above information, it is absolutely optimal choice to use HINNOTECH lead-free or/and halogen-free materials for lead-free assembly application.


UL Certification

UL File No. E335867


Prepreg Manufacturing Process


Laminate Manufacturing Process


Thank you !

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