17 May 2011Matthias Bergholz DESY Zeuthen 1 Simulations with TCAD Tutorial.
SILICON DETECTOR PROJECTS @ DESY Zeuthen (up to now) By Wolfgang Lange, DESY Zeuthen
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Transcript of SILICON DETECTOR PROJECTS @ DESY Zeuthen (up to now) By Wolfgang Lange, DESY Zeuthen
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SILICON DETECTOR PROJECTS
@ DESY Zeuthen (up to now)By Wolfgang Lange, DESY Zeuthen
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
2OUTLINE
- Early Silicon Detectors in Zeuthen- Silicon Detectors in H1 (BST, CST, FST, BST-PAD)- Silicon Detectors in ZEUS (Barrel Detector)- HERMES Recoil Detector- Facilities and Collaborators
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
3EARLY SILICON DETECTORS
Development together with Werk für Fernsehelektronik Berlin (WF)- First silicon sensors in planar technology ~ 1987 DC coupled, 50µm pitch on 2” wafers (up to 25*25 mm2 sensors), discrete readout via fanout, electronics mounted on PCBs
- Soon switched to 4” technology: 50*50mm2 sensors
DC coupled, 50µm pitch, development of the first thick film hybrid, use of the first readout ASIC (MX-2, Stanford University) first application: calibration of the L3-central tracking chamber @ CERN
Development together with Halbleiterwerk Frankfurt/Oder (HFO)and Institut für Halbleiterphysik Frankfurt/Oder (IHP)
- May 1989 first own production of DELPHI type sensors (IHP FF/O)
AC coupled, 25µm pitch (one indermediate strip, polysilicon resistors), sensors used successfully until 1993 in different experiments
1991 we started the development of our own sensor types (strip, pad).
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
4SILICON DETECTORS IN H1 - OVERVIEW
CST (strips)
BST(strips, pads)
FST (strips)
electron beam proton beam
proton direction = forward direction
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
5SILICON DETECTORS IN H1 - DETAILS
- Three different sensor types: R-Strip, Phi-Strip, Pad- Two different readout hybrids: S-Hybrid, Pad-Hybrid
Mechanical design:Carbon fiber reinforced plastic
VERTEX
- Modular design of all components- Design as a “plug in” device with remotely operated contact ring (including all media connections for N2 and H2O)- Separate inner and outer shielding- Cable- and media connections are pre-installed to the contact ring
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
6S(tandard) - DETECTOR MODULE
- universal detector module for front and back side- low cost design with included strip line and heat distributing Al bottom layer- standard circuitry (using APC 128 /decoder) optimized for low common mode and low noise (including ground plane)- 220 modules (spares included) produced for both FST and BST
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
7CST BARREL (NOT ZEUTHEN [ZÜRICH] BUT H1)- CST barrel consists of two layers completely covering the vertex (beam pipe)
- Ladders consist of 6 double sided sensors with hybrids on both sides - hybrids are equipped with radhard readout chips APC128 (DMILL)
one ladder
CST hybrid
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
8BST PAD DETECTOR
- For the measurement of deep inelastic scattering one needs to trigger on such events (vertex pointing)
- Background suppression for SPACAL hits (photon background)
- Four planes (disks) with pad detectors which are read out by the trigger system of H1 (trigger level 1)
- Pad detector supplies trigger patterns (“masks” or classified tracks, L1) as well as hit patterns (level 3)
- Measurement of normalized counting rates per area allows the use as “radiation monitor”
Readout chain: sensor -> detector module -> repeater (pre-processing) -> H1 readout
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
9BST PAD DETECTOR MODULE
ASIC “PRO/A”:- 32 channels- preamp / shaper / discriminator- adjustable gain (four steps)- subtraction of neighboring channels possible- output ‘monostable’ or ‘time over threshold’- input current compensation optional- over all test feature
AC coupled sensors with 32 (4 * 8) pads
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
10PERFORMANCE PAD MODULE
- Tuning of all modules under HERA conditions with no beam -> ‘noise counts’- Threshold scale calibrated with MIPs in a test beam- Most critical part after design: depletion voltage of sensor -> careful decoupling and grounding mandatory- nearly 100% trigger efficiency with tuned system -> tracks defined already with two hits in two planes
“self triggered” spectrum of MIPs(pedestal added with external trigger)
Threshold scans for differentdepletion voltage supplies
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
11RESULTS - strip modules
Excellent performance of strip modules (S-hybrid equipped with sensors from CIS Erfurt):
S/N ≥ 30
spatial resolution ≤ 12 µm
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
12RESULTS (continued) - spatial resolution
FST alignmentbefore alignment after alignment
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
13ACTIVITIES FOR THE ZEUS Micro Vertex Detector
- No development of “real silicon” but development of parts: flex foils for the interconnection of sensors and r/o hybrids- design, production and application of special glueing techniques for flex foils on top of silicon (tooling included)- design and production of handling tools for double sided silicon- DC measurement of a large quantity of sensors
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
14HERMES RECOIL DETECTOR
Position ofRecoil Detector
Recoil Detector: Detection of low momentum ‘recoil’ protons
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
15HERMES RECOIL DETECTOR - REQUIREMENTS
R/O ELECTRONICS (R/O Chip)- An analog pipeline chip is needed to accommodate the HERMES trigger.- A dynamic range of 70 MIP ( 280 fC).- 10 MHz readout to match the HERA frequency.- Prefer a chip already used in HERMES (Lambda Wheels - HELIX 128).
REQUIREMENTS ON
Silicon Sensors- Detection area about 200*100mm2
- Spatial resolution in ‘phi’ about 1mm- low quantities needed (two layers) therefore look for sensors available- TIGRE Sensors (MICRON Ltd. UK)
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
16HERMES RECOIL DETECTOR - R/O TECHNIQUE (1)
1 “MIP” = 24 000 e-/h pairs+/- “MIP” = pos/neg charge on preamp
Conclusions:
- Linear response over +/-10 “MIP”- Saturated at ~15 “MIP”
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
17HERMES RECOIL DETECTOR - R/O TECHNIQUE (2)
Solution: charge division
charge division works nicely(and can be tuned to the needs)
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
18HERMES RECOIL DETECTOR - PROTOTYPE
ZEUS hybrid Sensor
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Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-
2003
19FACILITIES AND COLLABORATORS
At DESY Zeuthen we are able to perform (class 10k clean room):
- Ultrasonic wire bonding (Au, Al, down to 17.5 µm wires)- Glueing with high mechanical precision and/or special hardening procedures (silver epoxies)- Measurements of single and double sided sensors on different probe stations- long term measurements (darkness, special atmosphere: N2 or similar)- chip testing (delivered probe cards can be adapted) additional: electronics workshop with automatic SMD placement and soldering tools
mechanical workshop with NC machining/millingat DESY Hamburg a ‘state of the art’ programmable wire bonder
Companies / Institutions we are used to work with:
- Sensors: CiS Erfurt (D), Micron Ltd. (UK), SINTEF Oslo (N), Hamamatsu (J)- chip design: IDE AS, Oslo (N) and ASIC Laboratory of University of Heidelberg (D)- probe cards: Wentworth Deutschland GmbH, München (D)- high precision printed circuit boards: Würth GmbH, Roth am See (D), Optiprint (CH)- thick film hybrids: Elbau GmbH, Berlin (D)