Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams.

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Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams
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Transcript of Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams.

Page 1: Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams.

Silicon Data Acquisition

Steve Nahn

“Don’t Panic” D Adams

Page 2: Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams.

May 11, 2006 Silis on the Beach - S Nahn 2

Old buddy asks…Why is Silicon Different

• Easy: More Physics!

22tm

smSig e

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How CDF really takes Data• Whole Shebang run by

Trigger System Interface (TSI)– Trigger Supervisor = Brains– Trigger Crosspoint = TS output– Return Crosspoint = TS Input– Scalers = Deadtime Accounting

• and clocked by CDF Clock– 53 MHz clock aka TeV RF

• Only used by Silicon– CDF Clock (132 nS)– Bunch Crossing Clock (396 nS)– Bunch0 (one turn, 20 s)– Abort Gap (3/turn, ~2 s each)

• Supposed to be no beam here

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“Normal” DAQ scheme• Data sampled @ 132 (396)

ns• After L1A, Data 1 of 4 L2

Buffers still in Front End, awaiting L2 Decision

• After L2A– Readout by VME CPU – Sent through TRACER to VRBs – Sent from VRBS to L3 via the

EVB and REFORMATTED– Note ALL CDF uses VRBs, but

not all in the same way• After L3A, data sent to tape

and consumers

• Strip Q sampled every 132 ns– Stored in 46 deep capacitor ring

• Silicon reads out “at” L1A– capacitor x marked read only– Q is digitized, capacitor unmarked– ADC VRB buffer and SVT

• Why did you do that?– data SVT BEFORE L2– No separate path for Silicon

• After L2A, Data read out of VRB buffer through EVB to L3

• “Tracer Mode” == Post L2A processing

vs. the Silicon Way!

Page 5: Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams.

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Hardware Involved

• Silicon Readout Controller– Source of all Control/Clock

• Fiber Interface Board– Translator of SRC commands– Data Manipulator– 104 concentrator

• VME Readout Buffer– Bulk Storage for L3

• FIB Fanout/VRB Fanout– Fans in/out from SRC

Two SRCs

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Laundry list of differences• We readout between L1A and L2A in hardware

– SRC instead of many tracers• We have two locations of L2 Buffers

– In Chip: Taken on L1A, freed after DIGITIZE L1DONE– In VRB: Actually have up to 4 L2 Buffers, 8 Readout Buffers

• Our VRBs play an active role in L1 and L2– We must initialize/control/readout VRBs VRB CPUs

• We have the SVX3D ASIC (for better or worse)– Requires initialization rather than just power Handshake– Requires filter between bitsteams in HWDB and editing

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Some things learned the Hard way: Hardware

• FTM Buffing– Poor control signal quality at other end of 71’ cable– Change resistors around on all FTMs: Drive stronger signal– Same time: replace 5 A fuses with 10 A fuses

• DOIM Power connections– Bit Errors/“Dropped Readout” from power sag to DOIM Rx– “Gold Pinned” DOIM Rxs swapped in everywhere

• Superduper FIBs– “ISL Mod”: stretch out FECLK to avoid ringing (from gangcard)

• Applied to SVXII as preventative PRD2/FECLK phase issues

– OBDV daughter board: Increase tolerance in OBDV duty cycle

• …

Page 8: Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams.

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Some things learned the Hard way: firmware

• 2 SRCs is better than one (cf. CDF 6481)– Why wait for L00 (READALL = 15 μs) when it isn’t in the trigger?

• VRBs “Early READBUSY”– 2 μs off READOUT time for free

• Nibble Shifting– e01209fc 81→ c0e2190 cf18

• FIBs and 00f3: Fibs truncate after n identical bytes– Chips send 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 …

• …

Page 9: Silicon Data Acquisition Steve Nahn “Don’t Panic” D Adams.

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Dude! What does Run Control code do?• Initialization

– Register settings, Chip settings, etc– Either Hardware Database or

Calibration Database– Depends on Run type (PHYSICS,

CALIBRATION, …)• Diagnostic Readout

– Via the Software Event Builder• Monitoring

– Low rate publishing of Chip and Board parameters

– Undeveloped attempt Occupancy measurement at VRB

• Calibration– X-MODE: “Fast” in-crate calibration

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Why is the software different?

• Because the hardware and readout is different• But also, Run Control spec (yes there is one!)

emphasizes modularity– Not all things should depend on each other– Leverage work done for teststand into Run Control

• Data comes from different place, but actions underneath are the same

• Maintain modicum of stability

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Readout rates: Can we go faster?

• Speeding up DIGITIZE– “7 bit digitization”: Counting to a lower max ADC value

• How low can one go with DPS ON before “00f3” becomes a nightmare

• Speeding up READOUT ( == minimizing Occupancy)– Minimize noisy ladder problems

• Algorithm with fast turn-around time on optimized thresholds

– Nearest Neighbor Sparse• Trouble detecting bit errors – limit to known good ladders?

• Better use of available Bandwidth– “Asynchronous Digitize” (aka “Presend Digitize”)

• All require some manpower– especially studying effects and monitoring

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Asynchronous Digitize

• If L1A pending, send DIGITIZE process immediately after previous READOUT

• Relevant time from “Average longest” to “Longest average”

• Requires SRC firmware work and study!

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Summary?

• Silicon DAQ is complicated to get the most physics out of the detector– Is it really complicated? Not if you break it down – Seems a little overdesigned? Well

• Most things actually have a good reason for being that way, if you dig deep enough you discover why it is

• Various features “we’d never use” have been very handy

– Yet, devil is in the details, and the learning curve is not small• Confused, concerned, befuddled? Ask:

– Vince’s group at ESE (we owe them lots)– CDF DAQ group (beware their aversion to Silicon)– Your comrades

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• Bitstream is 197 bits x n Chips

– Not editable – need a tool to deal with it– Want to change many Chips at once

• Incorporate svxdaq Chip interface to allow editing of Hardware database parameters in sane manner– Also incorporate “cloning” tools to apply a single change to

pseudo-arbitrary subset of the ~6000 chips.

Changing Chip Parameters

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“Handshake” between FIB & CAEN crate

• Automagic initialization to avoid high current states in the OFF STANDBY transition– Procedure (using Smartsockets)

• CAEN CPU broadcasts “I want to turn on SB1W3 All”• FIB crate responds “OK, I can initialize”• CAEN CPU turns on ladder, sees current, and broadcasts “It’s on”• FIB crate responds “OK, I initialized it”

– Ladder gets turned off if protocol not followed– Error messsages:

• “No response from FIB”– Fib crate or Smartsockets not alive

• “did not turn on-tried 10 times”– CAEN CPU never sees current (Immediate Trip, or Interlocked OFF)

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2 SRC Gains